JPH06322560A - Nickel or nickel alloy coating film remover - Google Patents
Nickel or nickel alloy coating film removerInfo
- Publication number
- JPH06322560A JPH06322560A JP10660693A JP10660693A JPH06322560A JP H06322560 A JPH06322560 A JP H06322560A JP 10660693 A JP10660693 A JP 10660693A JP 10660693 A JP10660693 A JP 10660693A JP H06322560 A JPH06322560 A JP H06322560A
- Authority
- JP
- Japan
- Prior art keywords
- remover
- nickel
- acid
- hydrogen peroxide
- nitric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は銅基材上のニッケル又は
ニッケル合金皮膜用剥離剤に関する。FIELD OF THE INVENTION The present invention relates to a release agent for nickel or nickel alloy coatings on copper substrates.
【０００２】[0002]
【従来の技術】従来、銅基材上に形成したニッケル又は
ニッケル合金皮膜（特にプリント配線基板のメタルレジ
スト）の剥離には、硝酸酸性溶液、硝酸及び過酸化水素
を含有する酸性溶液、硝酸及びホウフッ酸を含有する酸
性溶液、硝酸及び硫酸を含有する酸性溶液、硝酸及びリ
ン酸を含有する酸性溶液、上記溶液に有機酸、無機酸、
銅インヒビター等を配合した酸性溶液等が使用されてい
る。しかしながら、これらの剥離剤は、長期間使用して
銅イオン等の溶解金属濃度が上昇すると、剥離速度が低
下するという欠点がある。この様な場合、酸化剤である
過酸化水素や硝酸の濃度を増加させることによって、剥
離速度を上昇させることは可能であるが、過酸化水素や
硝酸の濃度が増加すると、基材である銅のエッチング量
が増え、被処理物がプリント配線基板の場合には、銅回
路に対するサイドアタックやサイドエッチ等が生じて銅
回路としての機能が低下するという問題がある。2. Description of the Related Art Conventionally, a nickel or nickel alloy film (particularly a metal resist of a printed wiring board) formed on a copper substrate is peeled off by using an acidic solution of nitric acid, an acidic solution containing nitric acid and hydrogen peroxide, nitric acid and An acidic solution containing borofluoric acid, an acidic solution containing nitric acid and sulfuric acid, an acidic solution containing nitric acid and phosphoric acid, an organic acid, an inorganic acid in the above solution,
An acidic solution containing a copper inhibitor or the like is used. However, these stripping agents have a drawback that the stripping rate decreases when the concentration of dissolved metals such as copper ions increases after long-term use. In such a case, it is possible to increase the stripping rate by increasing the concentration of hydrogen peroxide or nitric acid, which is an oxidant. However, when the concentration of hydrogen peroxide or nitric acid is increased, copper as a base material is increased. When the object to be processed is a printed wiring board, there is a problem that the side attack or side etching of the copper circuit occurs and the function of the copper circuit deteriorates.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、剥離
剤中の溶解金属量が上昇した場合にも剥離速度の低下が
少なく、酸化剤濃度や酸濃度を増加させることなく長期
間使用可能なニッケル又はニッケル合金皮膜用剥離剤を
提供することにある。DISCLOSURE OF THE INVENTION The object of the present invention is that even if the amount of dissolved metal in the stripping agent increases, the stripping rate does not decrease much, and the stripping agent can be used for a long period of time without increasing the oxidizer concentration and the acid concentration. Another object is to provide a release agent for a nickel or nickel alloy film.
【０００４】[0004]
【課題を解決するために手段】本発明者は上記課題を解
決すべく鋭意研究を重ねてきた。その結果、硝酸と過酸
化水素とを含有する剥離剤に、更にアルコール化合物を
添加したニッケル又はニッケル合金皮膜用剥離剤では、
長期使用して剥離剤中の溶解金属濃度が上昇した場合に
も剥離速度の低下が非常に少なく、このため酸化剤濃度
や酸濃度を増加することなく剥離剤を長期間使用するこ
とが可能となり、プリント配線基板における銅回路のサ
イドアタックやサイドエッチ等の問題を防止し得ること
を見出し、ここに本発明を完成するに至った。Means for Solving the Problems The inventors of the present invention have conducted extensive studies to solve the above problems. As a result, in a release agent containing nitric acid and hydrogen peroxide, a nickel or nickel alloy film release agent with an alcohol compound added,
Even when the concentration of dissolved metal in the stripper increases after long-term use, the stripping rate decreases very little, which makes it possible to use the stripper for a long time without increasing the oxidizer concentration and the acid concentration. The inventors have found that problems such as side attack and side etching of a copper circuit in a printed wiring board can be prevented, and have completed the present invention.
【０００５】即ち、本発明は、硝酸、過酸化水素、及び
アルコール化合物を含有することを特徴とする銅基材上
のニッケル又はニッケル合金皮膜用剥離剤に係る。That is, the present invention relates to a stripper for a nickel or nickel alloy coating on a copper substrate, which contains nitric acid, hydrogen peroxide, and an alcohol compound.
【０００６】本発明の剥離剤では、硝酸の添加量は、６
２％硝酸として、１０〜７００ｇ／ｌ程度とすることが
好ましい。添加量がこの範囲を下回ると、ニッケル又は
ニッケル合金皮膜の剥離速度が不十分となり、更に溶解
金属の許容量が低下するので好ましくない。一方添加量
がこの範囲を上回ると、銅基材に対する侵食性が大きく
なるのでやはり好ましくない。In the stripping agent of the present invention, the amount of nitric acid added is 6
The 2% nitric acid is preferably about 10 to 700 g / l. If the amount added is less than this range, the peeling speed of the nickel or nickel alloy film becomes insufficient, and the allowable amount of the dissolved metal decreases, which is not preferable. On the other hand, if the amount added exceeds this range, the corrosiveness with respect to the copper base material increases, which is also undesirable.
【０００７】本発明の剥離剤では、過酸化水素の添加量
は、３５％過酸化水素水として、１０〜２００ｍｌ／ｌ
程度とすることが好ましい。添加量が１０ｍｌ／ｌ未満
ではニッケル又はニッケル合金皮膜の剥離速度が不十分
となり、一方２００ｍｌ／ｌを上回ると銅基材に対する
侵食が大きくなるので好ましくない。In the stripping agent of the present invention, the amount of hydrogen peroxide added is 10 to 200 ml / l as 35% hydrogen peroxide solution.
It is preferable to set the degree. If the amount added is less than 10 ml / l, the peeling rate of the nickel or nickel alloy coating will be insufficient, while if it exceeds 200 ml / l, the corrosion of the copper substrate will increase, which is not preferable.
【０００８】本発明の剥離剤では、アルコール化合物を
配合することが必要である。このようなアルコール化合
物を配合した剥離剤では、長期使用して溶解金属濃度
（特に銅イオン）が上昇した場合にも、従来の剥離剤の
ように剥離速度が大きく低下することはなく、過酸化水
素濃度や酸濃度を増加させることなく必要な剥離速度を
維持することができる。このため、基材である銅のエッ
チング量が増えることがなく、被処理物がプリント配線
基板の場合にも、銅回路に対するサイドアタックやサイ
ドエッチによる機能低下の問題が生じることはない。In the stripping agent of the present invention, it is necessary to blend an alcohol compound. With a stripping agent containing such an alcohol compound, even if the concentration of dissolved metal (especially copper ion) increases for a long period of time, the stripping rate does not decrease significantly as with conventional stripping agents, and the peroxide The required stripping rate can be maintained without increasing the hydrogen concentration and the acid concentration. For this reason, the etching amount of copper as the base material does not increase, and even when the object to be processed is a printed wiring board, there is no problem of functional deterioration due to side attack or side etching on the copper circuit.
【０００９】本発明の剥離剤に配合するアルコール化合
物としては、全炭素数１〜８個のアルコール化合物が適
当である。この様なアルコール化合物の具体例として
は、メタノール、エタノール、１−プロパノール、２−
プロパノール、１−ブタノール、２−ブタノール、ｔ−
ブタノール、１−ペンタノール、２−ペンタノール、３
−ペンタノール、１−ヘキサノール、２−ヘキサノー
ル、３−ヘキサノール、エチレングリコール、プロピレ
ングリコール、グリセリン、ジエチレングリコール、エ
チレングリコールモノメチルエーテル、エチレングリコ
ールモノエチルエーテル、エチレングリコールモノブチ
ルエーテル、ジエチレングリコールモノエチルエーテ
ル、ジエチレングリコールモノブチルエーテル等を挙げ
ることができる。これらのアルコール化合物のうちで、
特に、全炭素数２〜４個の脂肪族飽和アルコール化合物
が好ましい。As the alcohol compound to be added to the release agent of the present invention, an alcohol compound having a total of 1 to 8 carbon atoms is suitable. Specific examples of such alcohol compounds include methanol, ethanol, 1-propanol and 2-
Propanol, 1-butanol, 2-butanol, t-
Butanol, 1-pentanol, 2-pentanol, 3
-Pentanol, 1-hexanol, 2-hexanol, 3-hexanol, ethylene glycol, propylene glycol, glycerin, diethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether Etc. can be mentioned. Of these alcohol compounds,
Particularly, an aliphatic saturated alcohol compound having 2 to 4 total carbon atoms is preferable.
【００１０】本発明では、アルコール化合物の添加量
は、０．１〜２００ｇ／ｌ程度とすることが好ましく、
０．５〜１００ｇ／ｌ程度とすることがより好ましい。
添加量が０．１ｇ／ｌ未満では溶解金属濃度（特に銅イ
オン）の上昇により剥離速度が低下し、一方２００ｇ／
ｌを上回ると基材である銅のエッチング量が増加して外
観低下を引き起こすので好ましくない。In the present invention, the addition amount of the alcohol compound is preferably about 0.1 to 200 g / l,
More preferably, it is about 0.5 to 100 g / l.
If the amount added is less than 0.1 g / l, the peeling rate will decrease due to an increase in the concentration of dissolved metals (particularly copper ions), while 200 g / l
When it exceeds 1, the etching amount of copper as a base material increases and the appearance is deteriorated, which is not preferable.
【００１１】本発明の剥離剤には、その他、必要に応じ
て、従来の剥離剤と同様に、銅インヒビターとして、ト
リアゾール又はその誘導体等、過酸化水素の安定剤とし
て尿素やスルファミン酸等を添加することもできる。
又、硫酸、リン酸、ホウフッ酸等の硝酸以外の無機酸、
グリコール酸、クエン酸、リンゴ酸、乳酸、酒石酸、グ
ルコン酸、ヘプトン酸、コハク酸、アジピン酸、ギ酸、
酢酸、マレイン酸、マロン酸、フタル酸、サリチル酸等
の有機酸も添加できる。これらの無機酸及び有機酸は、
単独又は二種類以上組み合わせて使用できる。In addition to the conventional stripping agents, the stripping agent of the present invention may contain triazole or a derivative thereof as a copper inhibitor and urea or sulfamic acid as a stabilizer of hydrogen peroxide, if necessary. You can also do it.
In addition, inorganic acids other than nitric acid, such as sulfuric acid, phosphoric acid, and borofluoric acid,
Glycolic acid, citric acid, malic acid, lactic acid, tartaric acid, gluconic acid, heptonic acid, succinic acid, adipic acid, formic acid,
Organic acids such as acetic acid, maleic acid, malonic acid, phthalic acid and salicylic acid can also be added. These inorganic and organic acids are
They can be used alone or in combination of two or more.
【００１２】本発明の剥離剤は、上記した成分を含有す
る水溶液からなるものであり、これを用いた剥離方法は
従来と同様でよい。例えば、剥離剤の液温を５〜５０℃
程度とし、浸漬法、スプレー法等によってニッケル又は
ニッケル合金皮膜が剥離されるまで処理を行なえば良
い。The stripping agent of the present invention comprises an aqueous solution containing the above-mentioned components, and the stripping method using this may be the same as conventional methods. For example, the liquid temperature of the release agent is 5 to 50 ° C.
The treatment may be carried out by a dipping method, a spray method or the like until the nickel or nickel alloy film is peeled off.
【００１３】本発明剥離剤の処理対象となるニッケル又
はニッケル合金皮膜は、銅基材上に電気めっき法、無電
解めっき法等によって形成されたものであり、ニッケル
合金としてはニッケル−ホウ素、ニッケル−リン、ニッ
ケル−インジウム、ニッケル−コバルト、ニッケル−ス
ズ、ニッケル−鉄等を挙げることができる。また、銅基
材としては、銅金属の他に、リン青銅、無酸素銅、ベリ
リウム銅等の銅合金も適応対象となる。The nickel or nickel alloy film to be treated with the stripping agent of the present invention is formed on a copper substrate by an electroplating method, an electroless plating method, etc., and nickel alloys include nickel-boron and nickel. -Phosphorus, nickel-indium, nickel-cobalt, nickel-tin, nickel-iron, etc. can be mentioned. In addition to copper metal, copper alloys such as phosphor bronze, oxygen-free copper, and beryllium copper are also applicable as the copper base material.
【００１４】[0014]
【発明の効果】本発明の剥離剤では、剥離剤中の溶解金
属濃度が上昇しても、剥離速度の低下が少ないために、
過酸化水素濃度や酸濃度を増加する必要がなく、基材で
ある銅のエッチング量が増えることがない。このため、
被処理物がプリント配線基板の場合にも、銅回路に対す
るサイドアタックやサイドエッチによる機能低下の問題
が生じることはない。また、剥離剤の液寿命が長くなっ
て、作業性、経済性が向上し、危険物である過酸化水
素、強酸等の取り扱い回数が減り、安全性が増加すると
いう利点もある。EFFECTS OF THE INVENTION In the stripping agent of the present invention, even if the concentration of the dissolved metal in the stripping agent increases, the stripping rate does not decrease so much.
It is not necessary to increase the hydrogen peroxide concentration or the acid concentration, and the etching amount of copper as the base material does not increase. For this reason,
Even when the object to be processed is a printed wiring board, the problem of functional deterioration due to side attack or side etching on the copper circuit does not occur. Further, the liquid life of the release agent is extended, workability and economic efficiency are improved, the number of times of handling dangerous substances such as hydrogen peroxide and strong acid is reduced, and safety is increased.
【００１５】[0015]
【実施例】以下、実施例を挙げて本発明を更に詳細に説
明する。EXAMPLES The present invention will be described in more detail with reference to examples.
【００１６】実施例１ ５０×５０×０．３ｍｍの銅板に、１５μｍの硫酸銅め
っきを施し、その上にニッケルめっき（スルファミン酸
浴）によりニッケル皮膜を形成したものを試料とし、下
記の従来の剥離剤（従来浴）及び本発明の剥離剤（本発
明浴）を用いて、温度３０℃、スプレー圧１ｋｇ／ｃｍ
2 でスプレー法によりニッケルめっき皮膜の剥離を行な
った。Example 1 A copper plate of 50 × 50 × 0.3 mm was plated with 15 μm of copper sulfate, and a nickel film was formed thereon by nickel plating (sulfamic acid bath). Using the release agent (conventional bath) and the release agent of the present invention (invention bath), the temperature is 30 ° C. and the spray pressure is 1 kg / cm.
In 2 , the nickel plating film was peeled off by the spray method.
【００１７】使用した従来浴の組成は、以下の通りであ
る。The composition of the conventional bath used is as follows.
【００１８】 ６２％硝酸 ３５０ｇ／ｌ トリアゾール ０．０５ｇ／ｌ スルファミン酸 ５ｇ／ｌ ３５％過酸化水素水 ４０ｍｌ／ｌ また、本発明浴としては、上記従来浴にアルコール化合
物を添加したものを用いた。添加したアルコール化合物
の種類と添加量を下記表１に示す。また、従来浴及び本
発明浴について、剥離剤中の溶解金属濃度を変えて、ニ
ッケルめっき皮膜の剥離速度を測定した結果を下記表１
に併記する。62% nitric acid 350 g / l triazole 0.05 g / l sulfamic acid 5 g / l 35% hydrogen peroxide water 40 ml / l Further, as the bath of the present invention, the above conventional bath to which an alcohol compound was added was used. . Table 1 below shows the type and amount of the added alcohol compound. Further, the results of measuring the stripping rate of the nickel plating film by changing the concentration of the dissolved metal in the stripping agent for the conventional bath and the bath of the present invention are shown in Table 1 below.
Also described in.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表１の結果から判るように、従来浴の場合
には、溶解金属濃度がトータル３０ｇ／ｌの場合に剥離
速度がわずかに低下し、トータル５０ｇ／ｌでは初期の
剥離速度の１／３まで低下した。これに対して、本発明
浴では、溶解金属濃度がトータル７０ｇ／ｌとなった場
合にも剥離速度の低下はわずかであり、剥離速度は安定
していた。As can be seen from the results in Table 1, in the case of the conventional bath, the peeling rate was slightly decreased when the concentration of the dissolved metal was 30 g / l in total, and at the total of 50 g / l, the peeling rate was 1/1 / the initial peeling rate. Fell to 3. On the other hand, in the bath of the present invention, even when the total concentration of dissolved metals was 70 g / l, the decrease in the peeling rate was slight and the peeling rate was stable.
【００２１】実施例２ ５０×５０×０．３ｍｍの銅板に、１５μｍの硫酸銅め
っきを施し、その上に下記の各種ニッケルめっき浴を用
いてニッケルめっき皮膜を形成したものを試料とし、下
記表２に記載の配合の従来の剥離剤（従来浴）及び本発
明の剥離剤（本発明浴）を用いて、温度３０℃、スプレ
ー圧１ｋｇ／ｃｍ2 でスプレー法によりニッケルめっき
皮膜の剥離を行なった。使用したニッケルめっき浴の種
類は次の通りである。Example 2 A copper plate of 50 × 50 × 0.3 mm was plated with 15 μm of copper sulfate, and a nickel plating film was formed on the copper plate using various nickel plating baths described below. Using the conventional stripping agent (conventional bath) and the stripping agent of the present invention (inventive bath) having the composition described in 2 above , the nickel plating film was stripped by a spray method at a temperature of 30 ° C. and a spray pressure of 1 kg / cm 2. It was The types of nickel plating baths used are as follows.
【００２２】電気ニッケルめっき Ａ：スルファミン酸ニッケルめっき Ｂ：無光沢ニッケルめっき（ワット浴、光沢剤なし） Ｃ：光沢ニッケルめっき （ワット浴、光沢剤添加） Ｄ：半光沢ニッケルめっき（ワット浴、光沢剤添加） 無電解ニッケルめっき Ｅ：無電解ニッケル−リン合金めっき Ｆ：無電解ニッケル−ホウ素合金めっきElectric nickel plating A: Nickel sulfamate plating B: Matte nickel plating (Watt bath, no brightener) C: Bright nickel plating (Watt bath, brightener added) D: Semi-bright nickel plating (Watt bath, brightener) Additive) Electroless nickel plating E: Electroless nickel-phosphorus alloy plating F: Electroless nickel-boron alloy plating
【００２３】[0023]
【表２】 [Table 2]
【００２４】各剥離剤について、溶解金属が含まれない
場合及び溶解金属が含まれる場合の各々について、ニッ
ケルめっき皮膜の剥離速度を測定した結果を下記表３に
示す。Table 3 shows the results of measuring the stripping rate of the nickel plating film for each of the stripping agents in the case of not containing the dissolved metal and in the case of containing the dissolved metal.
【００２５】[0025]
【表３】 [Table 3]
【００２６】表３の結果から判るように、ニッケルめっ
き皮膜の種類により剥離速度に差は生じるが、従来浴を
使用した場合には、溶解金属濃度がトータル５０ｇ／ｌ
となると剥離速度がかなり低下するのに対して、本発明
浴を用いた場合には、溶解金属濃度がトータル５０ｇ／
ｌとなった場合にも剥離速度の低下はわずかであり、剥
離速度は安定していた。As can be seen from the results of Table 3, the peeling speed varies depending on the type of nickel plating film, but when the conventional bath is used, the total dissolved metal concentration is 50 g / l.
However, when the bath of the present invention is used, the total dissolved metal concentration is 50 g /
Even when it was 1, the peeling speed was slightly decreased, and the peeling speed was stable.
【００２７】[0027]
Claims (1)
物を含有することを特徴とする銅基材上のニッケル又は
ニッケル合金皮膜用剥離剤。1. A release agent for a nickel or nickel alloy film on a copper substrate, which contains nitric acid, hydrogen peroxide, and an alcohol compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10660693A JPH06322560A (en) | 1993-05-07 | 1993-05-07 | Nickel or nickel alloy coating film remover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10660693A JPH06322560A (en) | 1993-05-07 | 1993-05-07 | Nickel or nickel alloy coating film remover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06322560A true JPH06322560A (en) | 1994-11-22 |
Family
ID=14437786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10660693A Pending JPH06322560A (en) | 1993-05-07 | 1993-05-07 | Nickel or nickel alloy coating film remover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06322560A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009079902A (en) * | 2007-09-25 | 2009-04-16 | Yazaki Corp | Quantitative analysis method of nickel or nickel alloy plating layer |
| KR100938735B1 (en) * | 2002-05-30 | 2010-01-26 | 미츠비시 가스 가가쿠 가부시키가이샤 | Solution for Detaching Nickel or Nickel Alloy |
-
1993
- 1993-05-07 JP JP10660693A patent/JPH06322560A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100938735B1 (en) * | 2002-05-30 | 2010-01-26 | 미츠비시 가스 가가쿠 가부시키가이샤 | Solution for Detaching Nickel or Nickel Alloy |
| JP2009079902A (en) * | 2007-09-25 | 2009-04-16 | Yazaki Corp | Quantitative analysis method of nickel or nickel alloy plating layer |
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