KR20030084743A - 반도체 기판재를 코팅재로 코팅하는 방법과 코팅된 반도체기판 및 반도체 기판의 코팅 방법 - Google Patents

반도체 기판재를 코팅재로 코팅하는 방법과 코팅된 반도체기판 및 반도체 기판의 코팅 방법 Download PDF

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Publication number
KR20030084743A
KR20030084743A KR10-2003-0026221A KR20030026221A KR20030084743A KR 20030084743 A KR20030084743 A KR 20030084743A KR 20030026221 A KR20030026221 A KR 20030026221A KR 20030084743 A KR20030084743 A KR 20030084743A
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KR
South Korea
Prior art keywords
coating
semiconductor substrate
mixture
adhesion promoter
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR10-2003-0026221A
Other languages
English (en)
Korean (ko)
Inventor
진스알버트후아
메이핑
Original Assignee
휴렛-팩커드 디벨롭먼트 컴퍼니, 엘 피
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘 피 filed Critical 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘 피
Publication of KR20030084743A publication Critical patent/KR20030084743A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR10-2003-0026221A 2002-04-26 2003-04-25 반도체 기판재를 코팅재로 코팅하는 방법과 코팅된 반도체기판 및 반도체 기판의 코팅 방법 Withdrawn KR20030084743A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/133,724 2002-04-26
US10/133,724 US6762113B2 (en) 2002-04-26 2002-04-26 Method for coating a semiconductor substrate with a mixture containing an adhesion promoter

Publications (1)

Publication Number Publication Date
KR20030084743A true KR20030084743A (ko) 2003-11-01

Family

ID=28791024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0026221A Withdrawn KR20030084743A (ko) 2002-04-26 2003-04-25 반도체 기판재를 코팅재로 코팅하는 방법과 코팅된 반도체기판 및 반도체 기판의 코팅 방법

Country Status (6)

Country Link
US (2) US6762113B2 (https=)
EP (1) EP1357585A3 (https=)
JP (1) JP2004006815A (https=)
KR (1) KR20030084743A (https=)
CN (1) CN1453822A (https=)
TW (1) TW200305621A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762113B2 (en) * 2002-04-26 2004-07-13 Hewlett-Packard Development Company, L.P. Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
WO2005036645A1 (ja) * 2003-10-14 2005-04-21 Matsushita Electric Industrial Co., Ltd. トランジスタ集積回路装置及びその製造方法
US7635919B1 (en) 2005-05-26 2009-12-22 Rockwell Collins, Inc. Low modulus stress buffer coating in microelectronic devices
US20070298268A1 (en) * 2006-06-27 2007-12-27 Gelcore Llc Encapsulated optoelectronic device
JP4297943B2 (ja) * 2007-01-26 2009-07-15 中外炉工業株式会社 板状材の塗工方法
CN102906596B (zh) 2010-05-24 2015-09-16 皇家飞利浦电子股份有限公司 包括多层荧光带闪烁体并具有能切换的光谱灵敏度的ct探测器
US8753460B2 (en) 2011-01-28 2014-06-17 International Business Machines Corporation Reduction of edge chipping during wafer handling
DE102011114865B4 (de) 2011-07-29 2023-03-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US9746361B2 (en) * 2012-04-11 2017-08-29 University Of Virginia Patent Foundation Gaseous flow sensor and related method thereof
DE102016113162A1 (de) * 2015-07-28 2017-02-02 Schott Ag Bedienblende für ein Haushaltsgerät mit zumindest einer Benutzerschnittstelle, Haushaltsgerät und Verfahren zur Herstellung der Bedienblende mit Benutzerschnittstelle
CN108649192B (zh) * 2018-04-08 2019-08-16 河南大学 一种基于接触角测试制备电极材料表面均匀修饰层的方法
EP4350759A1 (en) 2022-10-06 2024-04-10 Nexperia B.V. A semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4183839A (en) 1976-04-08 1980-01-15 John V. Long Polyimide resin-forming composition
DE3107633A1 (de) 1981-02-27 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung duenner polyimidschichten"
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
DE3606266A1 (de) * 1986-02-27 1987-09-03 Basf Ag Lichtempfindliches aufzeichnungselement
US5024922A (en) * 1988-11-07 1991-06-18 Moss Mary G Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
US5133840A (en) 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
DE4119444A1 (de) * 1991-06-13 1992-12-17 Wolff Walsrode Ag Beschichtungssystem fuer wasserquellbare materialien
US5742075A (en) * 1994-10-07 1998-04-21 Iowa State University Research Foundation, Inc. Amorphous silicon on insulator VLSI circuit structures
US5635240A (en) * 1995-06-19 1997-06-03 Dow Corning Corporation Electronic coating materials using mixed polymers
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
US6300162B1 (en) 2000-05-08 2001-10-09 Rockwell Collins Method of applying a protective layer to a microelectronic component
US6762113B2 (en) * 2002-04-26 2004-07-13 Hewlett-Packard Development Company, L.P. Method for coating a semiconductor substrate with a mixture containing an adhesion promoter

Also Published As

Publication number Publication date
US7071548B2 (en) 2006-07-04
TW200305621A (en) 2003-11-01
JP2004006815A (ja) 2004-01-08
US6762113B2 (en) 2004-07-13
EP1357585A2 (en) 2003-10-29
CN1453822A (zh) 2003-11-05
US20040097097A1 (en) 2004-05-20
EP1357585A3 (en) 2005-04-20
US20030203621A1 (en) 2003-10-30

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