KR200231855Y1 - Semiconductor Wafer Cleaning Device - Google Patents
Semiconductor Wafer Cleaning Device Download PDFInfo
- Publication number
- KR200231855Y1 KR200231855Y1 KR2019970033686U KR19970033686U KR200231855Y1 KR 200231855 Y1 KR200231855 Y1 KR 200231855Y1 KR 2019970033686 U KR2019970033686 U KR 2019970033686U KR 19970033686 U KR19970033686 U KR 19970033686U KR 200231855 Y1 KR200231855 Y1 KR 200231855Y1
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- South Korea
- Prior art keywords
- boat
- wafer
- semiconductor wafer
- cleaning
- cleaning apparatus
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
본 고안은 반도체 웨이퍼 세정장치에 관한 것으로, 종래에는 케미컬에 웨이퍼를 담그고 화학적인 반응에 의해서 세정작업이 이루어 졌다. 본 고안 반도체 웨이퍼 세정장치는 웨이퍼(15)를 탑재한 보트(13)에 고속으로 회전시 웨이퍼의 이탈이 방지 되도록 웨이퍼 이탈방지대(16)를 구비하여 세정작업시 보트913)를 고속으로 회전시키도록 함으로서, 세정효과를 증대시키는 효과가 있다.The present invention relates to a semiconductor wafer cleaning apparatus, and in the related art, a cleaning operation is performed by immersing the wafer in a chemical reaction by chemical reaction. The semiconductor wafer cleaning apparatus of the present invention is provided with a wafer detachment guard 16 to prevent the wafer from being detached when rotating at a high speed in the boat 13 on which the wafer 15 is mounted so as to rotate the boat 913 at a high speed during the cleaning operation. By doing so, there is an effect of increasing the cleaning effect.
Description
본 고안은 반도체 웨이퍼 세정장치에 관한 것으로, 특히 세정시 웨이퍼를 회전시켜서 세정효과를 증대시키도록 하는데 적합한 반도체 웨이퍼 세정장치에 관한 것이다.The present invention relates to a semiconductor wafer cleaning apparatus, and more particularly, to a semiconductor wafer cleaning apparatus suitable for increasing the cleaning effect by rotating the wafer during cleaning.
일반적으로 웨이퍼 제조공정 중 현상공정을 마친 웨이퍼는 베이크한 다음, 케미컬에 웨이퍼를 담가서 식각과 동시에 이물질을 제거하기 위한 세정공정을 실시하게 되는데, 이와 같은 이와 같은 세정공정을 실시하는 세정장치가 제1도에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In general, after the development process is completed during the wafer manufacturing process, the wafer is baked and then immersed in the chemical to perform a cleaning process to remove foreign substances at the same time as etching, wherein the cleaning apparatus performing such cleaning process is the first. As shown in FIG. 1, this is briefly described.
제1도는 종래 웨이퍼 세정장치의 구성을 개략적으로 보인 정면도로서, 도시된 바와 같이, 종래 세정장치는 케미컬(CHEIMICAL)(1)이 수납되어 있는 베스(BATH)(2)와, 그 베스(2)의 내측에 설치되며 웨이퍼(WAFER)(3)들을 탑재하기 위한 보트(B0AT)(4) 및 웨이퍼(3)들을 이송하기 위한 이송로봇(5)으로 구성되어 있다.FIG. 1 is a front view schematically showing the structure of a conventional wafer cleaning apparatus. As shown in the drawing, a conventional cleaning apparatus includes a bath 2 in which a CHEIMICAL 1 is housed, and a bath 2 thereof. It is installed on the inside and consists of a boat (B0AT) 4 for mounting the wafers WAFER 3 and a transfer robot 5 for transferring the wafers 3.
상기와 같이 구성되어 있는 종래 세정장치는 베스(2)의 내측에 케미컬(1)이 수납되어 있는 상태에서 이송로봇(5)을 이용하여 웨이퍼(3)를 50장 파지한 다음, 베스(2)의 내측에 설치되어 있는 보트(4)에 탑재한다. 그런 다음, 일정시간을 경과시켜서 식각 및 이물질 제거가 되도록 한 다음, 다시 이송로봇(5)을 이용하여 보트(4)에 탑재되어 있는 50장을 주변에 설치되어 있는 베스(미도시)로 이송하여 웨이퍼(3)에 묻어 있는 케미컬(1)을 제거하기 위한 린스작업을 진행한다.The conventional cleaning apparatus configured as described above holds 50 wafers 3 using the transfer robot 5 in a state where the chemical 1 is stored inside the bath 2, and then the bath 2 It is mounted on the boat 4 provided inward. Then, after a certain period of time to etch and remove the foreign matter, using the transfer robot (5) again transfers 50 sheets mounted on the boat (4) to a vessel (not shown) installed around A rinse operation is performed to remove the chemicals 1 deposited on the wafer 3.
그러나, 상기와 같이 구성되어 있는 종래 반도체 웨이퍼 세정장치는 케미컬(1)이 담겨있는 베스(6)에 웨이퍼(3)를 일정시간 담그는 것으로 공정이 진행되므로, 화학적인 반응에 의하여 일정양의 식각과 이물질제거 작업이 이루어질뿐, 완전한 세정효과가 이루어지지는 못하는 문제점이 있었다.However, in the conventional semiconductor wafer cleaning apparatus configured as described above, the process proceeds by immersing the wafer 3 in the bath 6 in which the chemical 1 is contained for a predetermined time, so that a certain amount of etching and There was a problem that only the removal of foreign matter is made, not a complete cleaning effect.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 세정시 웨이퍼를 고속으로 회전시켜서 세정효과를 향상시키도록 하는데 적합한 반도체 웨이퍼 세정장치를 제공함에 있다.The object of the present invention devised in view of the above problems is to provide a semiconductor wafer cleaning apparatus suitable for improving the cleaning effect by rotating the wafer at high speed during cleaning.
제1도는 종래 웨이퍼 세정장치의 구성을 개략적으로 보인 정면도.1 is a front view schematically showing the configuration of a conventional wafer cleaning apparatus.
제2도는 본 고안 반도체 웨이퍼 세정장치의 구성을 보인 사시도.Figure 2 is a perspective view showing the configuration of the semiconductor wafer cleaning apparatus of the present invention.
제3도는 본 고안 반도체 웨이퍼 세정장치의 구성을 보인 종단면도.Figure 3 is a longitudinal sectional view showing the configuration of the semiconductor wafer cleaning apparatus of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 케미컬 12 : 베스11: Chemical 12: Beth
13 : 보트 15 : 웨이퍼13: boat 15: wafer
16 : 웨이퍼 이탈 방지대 17 : 클램프16: wafer escape guard 17: clamp
18 : 보트회전수단 21 : 회전봉18: boat rotating means 21: rotating rod
22 : 회전모터 22a : 모터축22: rotating motor 22a: motor shaft
23 : 베어링23: bearing
상기와 같은 본 고안의 목적을 달성하기 위하여 케미컬이 수납되어 있는 베스의 내부에 다수개의 웨이퍼들이 탑재된 보트를 위치되고, 그 보트가 베스의 외측에 설치된 보트회전수단에 의하여 회전되며 세정이 이루어지도록 되어 있는 반도체 웨이퍼 세정장치에 있어서, 상기 보트의 회전시 웨이퍼의 이탈을 방지하기 위한 웨이퍼 이탈 방지대를 보트의 웨이퍼 입, 출구측에 착, 탈가능하게 고정하여 고속세정이 이루어지도록 한 것을 특징으로 하는 반도체 웨이퍼 세정장치가 제공된다.In order to achieve the object of the present invention as described above, a boat having a plurality of wafers mounted therein is positioned inside the bath in which the chemical is stored, and the boat is rotated by the boat rotating means installed on the outside of the bath to perform cleaning. In the semiconductor wafer cleaning apparatus, a wafer escape guard for preventing wafer detachment during rotation of the boat is attached to and detached from the boat's wafer inlet and outlet to enable high speed cleaning. A semiconductor wafer cleaning apparatus is provided.
이하, 상기와 같이 구성되는 본 고안 반도체 웨이퍼 세정장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to an embodiment of the semiconductor wafer cleaning apparatus of the accompanying drawings configured as described above.
제2도는 본 고안 반도체 웨이퍼 세정장치의 구성을 보인 사시도이고, 제3도는 본 고안 반도체 웨이퍼 세정장치의 구성을 보인 종단면도로서, 도시된 바와 같이, 본 고안 반도체 웨이퍼 세정장치는 상측이 개구되어 있으며, 케미컬(11)이 수납되어 있는 베스(12)의 내측에 보트(13)가 설치되어 있고, 그 보트(13)의 웨이퍼 입,출구측(14)에는 보트(13)의 회전시 웨이퍼(15)의 이탈을 차단하기 위한 웨이퍼 이탈 방지대(16)가 착,탈가능하도록 설치되어 있으며, 상기 보트(13)의 양단부에는 상기 웨이퍼 이탈 방지대(16)를 고정시키기 위한 클램프(17)가 각각 설치되어 있다.2 is a perspective view showing the configuration of the semiconductor wafer cleaning device of the present invention, Figure 3 is a longitudinal cross-sectional view showing the configuration of the semiconductor wafer cleaning device of the present invention, as shown, the upper surface of the semiconductor wafer cleaning device of the present invention is opened. The boat 13 is provided inside the bath 12 in which the chemical 11 is stored, and the wafer 15 at the wafer inlet / outlet side 14 of the boat 13 when the boat 13 rotates. Wafer escape guard 16 to block the separation of the) is installed to be detachable, the clamp 17 for fixing the wafer escape guard 16 on both ends of the boat (13), respectively It is installed.
그리고, 상기 보트(13)의 양측으로는 보트(13)를 일정 높이로 지지함과 동시에 회전시키기 위한 보트회전수단(18)이 설치되어 있다.On both sides of the boat 13, boat rotating means 18 for supporting the boat 13 at a predetermined height and rotating the boat 13 are provided.
상기 보트회전수단(18)은 베스(12)의 양측벽에 관통되도록 보트(13)의 양측면 중앙에 각각 고정설치되는 회전봉(21)과, 상기 베스(12)의 일측면에 근접되도록 설치되며 회전봉(21)에 모터축(22a)에 연결설치되는 회전모터(22)와, 상기 회전봉(21)에 삽입되도록 베스(12)의 양측면에 고정설치되는 베어링(23)으로 구성되어 있다. 도면중 미설명 부호 24는 메카니컬 실이다.The boat rotating means 18 is a rotary rod 21 which is fixed to the center of both sides of the boat 13 so as to penetrate both side walls of the bath 12, and is installed to be close to one side of the bath 12, the rotating rod It consists of a rotary motor 22 connected to the motor shaft 22a at 21 and a bearing 23 fixed to both sides of the base 12 so as to be inserted into the rotary rod 21. In the drawings, reference numeral 24 denotes a mechanical seal.
상기와 같이 구성되어 있는 본 고안 반도체 웨이퍼 세정장치의 동작을 설명하면 다음과 같다.The operation of the inventive semiconductor wafer cleaning apparatus configured as described above is as follows.
먼저, 보트(13)에 설치되어 있는 웨이퍼 이탈 방지대(16)를 제거한 상태에서 세정하고자 하는 웨이퍼(15)들을 보트(13)에 장착한다. 그런 다음, 웨이퍼 이탈 방지대(16)를 장착하고 클램프(17)로 클램핑하여 웨이퍼 이탈 방지대(16)의 양단부를 보트(13)에 고정시킨다. 그런 다음, 베스(12)에 케미컬(11)을 공급하여 보트(13)가 잠기도록 한다.First, the wafers 15 to be cleaned are attached to the boat 13 in a state in which the wafer detachment guard 16 provided in the boat 13 is removed. Then, the wafer escape guard 16 is mounted and clamped with the clamp 17 to secure both ends of the wafer escape guard 16 to the boat 13. Then, the chemical 11 is supplied to the bath 12 so that the boat 13 is locked.
상기와 같은 상태에서 회전모터(22)를 회전시키면 모터축(22a)에 연결되어 있는 회전봉(21)이 회전을 하고, 그 회전봉(21)에 연결되어 있는 보트(13)가 고속으로 회전을 하며 웨이퍼(15)들의 식각 및 이물질 제거가 이루어 진다. 그리고, 상기와 같이 동작이 진행되는 동안 회전봉(21)이 삽입되도록 베스(12)의 양측벽에 설치되어 있는 메카니컬 실(24)에 의하여 케미컬(11)의 누출이 차단된다.When the rotary motor 22 is rotated in the above state, the rotating rod 21 connected to the motor shaft 22a rotates, and the boat 13 connected to the rotating rod 21 rotates at high speed. The wafers 15 are etched and debris removed. Then, the leakage of the chemical 11 is blocked by the mechanical seal 24 provided on both side walls of the base 12 so that the rotating rod 21 is inserted during the operation as described above.
이상에서 상세히 설명한 바와 같이 본 고안 반도체 웨이퍼 세정장치는 웨이퍼를 탑재한 보트가 웨이퍼 이탈 방지대에 의하여 웨이퍼의 이탈이 방지되도록 하여, 세정 작업시 보트를 고속으로 회전시킬 수 있도록 함으로써, 보트의 고속회전에 따른 웨이퍼의 세정효과가 증대되는 효과가 있다.As described in detail above, the semiconductor wafer cleaning apparatus of the present invention allows the boat on which the wafer is mounted to prevent the wafer from being detached by the wafer escape guard so that the boat can be rotated at high speed during the cleaning operation, thereby making the boat rotate at high speed. This has the effect of increasing the cleaning effect of the wafer.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970033686U KR200231855Y1 (en) | 1997-11-25 | 1997-11-25 | Semiconductor Wafer Cleaning Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970033686U KR200231855Y1 (en) | 1997-11-25 | 1997-11-25 | Semiconductor Wafer Cleaning Device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990020234U KR19990020234U (en) | 1999-06-15 |
| KR200231855Y1 true KR200231855Y1 (en) | 2001-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970033686U KR200231855Y1 (en) | 1997-11-25 | 1997-11-25 | Semiconductor Wafer Cleaning Device |
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| KR (1) | KR200231855Y1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040000754A (en) * | 2002-06-25 | 2004-01-07 | 동부전자 주식회사 | Apparatus for cleaning a semiconductor wafer |
| CN110449401A (en) * | 2019-09-10 | 2019-11-15 | 徐松 | A kind of etch cleaning machine |
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1997
- 1997-11-25 KR KR2019970033686U patent/KR200231855Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR19990020234U (en) | 1999-06-15 |
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