JP3983355B2 - Semiconductor wafer cleaning apparatus and cleaning method - Google Patents

Semiconductor wafer cleaning apparatus and cleaning method Download PDF

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Publication number
JP3983355B2
JP3983355B2 JP32276297A JP32276297A JP3983355B2 JP 3983355 B2 JP3983355 B2 JP 3983355B2 JP 32276297 A JP32276297 A JP 32276297A JP 32276297 A JP32276297 A JP 32276297A JP 3983355 B2 JP3983355 B2 JP 3983355B2
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Prior art keywords
cleaning
semiconductor wafer
cleaning liquid
housing
wafer
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JP32276297A
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Japanese (ja)
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JPH11162912A (en
Inventor
範彦 日野
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Oki Electric Industry Co Ltd
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Oki Electric Industry Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、半導体集積回路の製造装置の一部である半導体ウエハ（以下、単にウエハという）の洗浄装置及び洗浄方法に関するものである。
【０００２】
【従来の技術】
一般に、従来のウエハ洗浄装置は、ウエハ数十枚を薬品洗浄槽へ浸漬させて洗浄を行い、隣接するリンス槽で濯ぎを行う。さらに、そのウエハを乾燥させるために、高速で回転させたり、揮発性の高い薬液に置換させて行うものであった。
【０００３】
【発明が解決しようとする課題】
しかしながら、上記した従来のウエハ洗浄装置では、洗浄液を１槽増やすと、リンス槽も合わせて設置しなくてはならない。また、ウエハの大口径化などにより、洗浄槽の大型化、使用薬液の増加をせざるを得ず、また、洗浄効果を上げるために洗浄液を高温で処理しなければならないという問題点がある。
【０００４】
本発明は、上記問題点を除去し、ウエハの洗浄を行う際に、洗浄液は上部ホイールが浸漬する量で洗浄を行うことができ、使用薬液の低減化を図ることができる半導体ウエハの洗浄装置及び洗浄方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、上記目的を達成するために、
〔１〕半導体ウエハの洗浄装置において、半導体ウエハを洗浄するための洗浄液が溜められるハウジングと、このハウジングの中で前記半導体ウエハを保持したまま回転するテーブルと、前記洗浄液を攪拌させるために回転する上部ホイールとを具備する半導体ウエハの洗浄装置であって、前記ハウジングに前記洗浄液を供給する給液口と、洗浄純水を供給する給水口と、前記ハウジング側面と前記ハウジング底面に設けられた排水口とを備え、前記ハウジング側面に設けられた排水口は前記給水口と対向する位置に設けられ、前記給水口は前記洗浄純水が前記上部ホイールと前記テーブルとの間を流れるように設置されるようにしたものである。
【０００６】
〔２〕上記〔１〕記載の半導体ウエハの洗浄装置において、前記上部ホイールと前記テーブルは互いに反対方向に回転する機構を有するようにしたものである。
【０００７】
〔３〕上記〔１〕記載の半導体ウエハの洗浄装置において、前記ハウジング内の洗浄液を冷却するための洗浄液冷却手段を有するようにしたものである。
【０００８】
〔４〕上記〔３〕記載の半導体ウエハの洗浄装置において、前記洗浄液冷却手段は前記洗浄液の冷却ユニットである。
【０００９】
〔５〕上記〔３〕記載の半導体ウエハの洗浄装置において、前記洗浄液冷却手段は薬液に添加される凝固剤である。
【００１０】
〔６〕半導体ウエハの洗浄方法において、ハウジング内の洗浄液の中に、半導体ウエハを浸漬する工程と、前記半導体ウエハを回転させながら、前記半導体ウエハ上の前記洗浄液を攪拌する工程とを有する半導体ウエハの洗浄方法であって、前記ハウジングに前記洗浄液を供給する給液口と、洗浄純水を供給する給水口と、前記ハウジング側面と前記ハウジング底面に設けられた排水口とを備え、前記ハウジング側面に設けられた排水口は前記給水口と対向する位置に設けられ、前記給水口は前記洗浄純水が前記上部ホイールと前記テーブルとの間を流れるように設置されるとともに、前記半導体ウエハは、前記半導体ウエハ上の前記洗浄液が攪拌される方向とは反対方向に回転するようにしたものである。
【００１１】
〔７〕上記〔６〕記載の半導体ウエハの洗浄方法において、前記半導体ウエハは、冷却された前記洗浄液によって洗浄されるようにしたものである。
【００１２】
【発明の実施の形態】
以下、本発明の実施の形態について図面を参照しながら詳細に説明する。
【００１３】
図１は本発明の第１実施例を示すウエハ洗浄装置の模式断面図、図２はそのウエハ洗浄装置の洗浄状態を示す模式構成図である。
【００１４】
これらの図に示すように、ウエハ洗浄装置１は洗浄液１０を溜めるハウジング２と、ウエハ９を保持することができ、なおかつ、回転機構を有するテーブル３、洗浄液１０を供給する給液口４、洗浄純水を供給する給水口５（この給水口５は洗浄純水がウエハ９側面から、上部ホイール７とテーブル３の間を流れるように設置する）、洗浄液１０を排出する排水口６、洗浄液１０を攪拌させるためにウエハ９面と対向する面に溝を付け、回転機構を有する上部ホイール７により構成されている。
【００１５】
次に、第１実施例のウエハ洗浄装置の動作について説明する。
【００１６】
まず、洗浄されるウエハ９はテーブル３に吸着される。この時、上部ホイール７はウエハ９移載と干渉しない位置に退避する（図１参照）。
【００１７】
次いで、給液口４より洗浄液１０をハウジング２内へ供給する。供給する液量は、図２に示すように、上部ホイール攪拌部が浸漬するまで供給する。また、同時に上部ホイール７もウエハ９直上に移動する。洗浄液１０の供給が終了したら、上部ホイール７とテーブル３が回転し、洗浄液１０の攪拌を行う。この時、上部ホイール７とテーブル３は反する方向へ回転させる。ウエハ９の洗浄が終了したら、薬液を排水口６から排出し、給水口５より洗浄純水を供給して濯ぎを行う。
【００１８】
このように、第１実施例によれば、ウエハの洗浄を行う時に、洗浄液は上部ホイールが浸漬する量で洗浄を行うことができるために、使用薬液の低減化を図ることができる。
【００１９】
また、上部ホイールとテーブルを反する方向に回転させることにより、ウエハ表面と洗浄液の界面に流れが生じ、その流れにより、汚染除去を常温で行うことが可能となる。
【００２０】
次に、本発明の第２実施例について説明する。
【００２１】
図３は本発明の第２実施例のウエハ洗浄装置の洗浄状態を示す模式構成図である。
【００２２】
この実施例では、ハウジング２内の洗浄液１０を冷却するための冷却ユニット８を設け、洗浄液１０を冷却することにより、洗浄液１０の粘度を高くし、ウエハ９表面と洗浄液１０界面に大きな摩擦を生じさせる。
【００２３】
図３に示すように、ウエハ洗浄装置１は洗浄液１０を溜めるハウジング２と、ウエハ９を保持することができ、なおかつ、回転機構を有するテーブル３、洗浄液を供給する給液口４、洗浄純水を供給する給水口５（この給水口５は洗浄純水がウエハ９側面から、上部ホイール７とテーブル３の間を流れるように設置する）、洗浄液１０を排出する排水口６、洗浄液１０を攪拌させるためにウエハ９面と対向する面に溝を付け、回転機構を有する上部ホイール７、ハウジング２内の洗浄液を冷却する冷却ユニット８により構成されている。
【００２４】
以下、第２実施例のウエハ洗浄装置の動作について説明する。
【００２５】
洗浄されるウエハ９はテーブル３に吸着される。この時、上部ホイール７はウエハ移載と干渉しない位置に退避する。次に、洗浄液１０をハウジング２内へ供給する。供給する液量は、図３に示すように、上部ホイール攪拌部が浸漬するまで供給する。また、同時に上部ホイール７もウエハ９直上に移動する。洗浄液１０の供給が終了したら、上部ホイール７とテーブル３が回転し、洗浄液１０の攪拌を行う。この時、上部ホイール７とテーブル３は反する方向へ回転させる。同時に洗浄液１０の冷却を開始する。ウエハ９の洗浄が終了したら、薬液を排水口６から排出し、給水口５より洗浄純水を供給して濯ぎを行う。
【００２６】
このように、第２実施例によれば、ウエハの洗浄を行う時に、洗浄液は上部ホイールが浸漬する量で洗浄を行うことができるために、使用薬液の低減化を図ることができる。
【００２７】
また、洗浄液を冷却することにより、洗浄液の粘度を高くし、ウエハ表面と洗浄液界面に大きな摩擦を生じさせる。この摩擦により、非接触でのスクライブ効果が得られる。さらに、上部ホイールとテーブルを反する方向に回転させることにより、ウエハ表面と洗浄液の界面に流れが生じ、その流れにより汚染除去を常温で行うことが可能となる。
【００２８】
この第２実施例では、洗浄液の粘度を高くするために、冷却ユニットを用いたが、薬液に凝固剤を添加することでも可能である。
【００２９】
なお、本発明は上記実施例に限定されるものではなく、本発明の趣旨に基づいて種々の変形が可能であり、これらを本発明の範囲から排除するものではない。
【００３０】
【発明の効果】
以上、詳細に説明したように、本発明によれば、次のような効果を奏することができる。
【００３１】
（１）ウエハの洗浄を行う時に、洗浄液は上部ホイールが浸漬する量で洗浄を行うことができるために、使用薬液の低減を図ることができる。
【００３２】
（２）上部ホイールとテーブルを反する方向に回転させることにより、ウエハ表面と洗浄液の界面に流れが生じ、その流れにより汚染除去を常温で行うことが可能となる。
【００３３】
（３）洗浄液を冷却することにより、洗浄液の粘度を高くし、ウエハ表面と洗浄液界面に大きな摩擦を生じさせることができる。この摩擦により、非接触でのスクライブ効果が得られる。
【図面の簡単な説明】
【図１】 本発明の第１実施例を示すウエハ洗浄装置の模式断面図である。
【図２】 本発明の第１実施例のウエハ洗浄装置の洗浄状態を示す模式構成図である。
【図３】 本発明の第２実施例のウエハ洗浄装置の洗浄状態を示す模式構成図である。
【符号の説明】
１ ウエハ洗浄装置
２ 洗浄液を溜めるハウジング
３ 回転機構を有するテーブル
４ 洗浄液を供給する給液口
５ 洗浄純水を供給する給水口
６ 洗浄液を排出する排水口
７ 上部ホイール
８ 冷却ユニット
９ ウエハ
１０ 洗浄液[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cleaning apparatus and a cleaning method for a semiconductor wafer (hereinafter simply referred to as a wafer) which is a part of a semiconductor integrated circuit manufacturing apparatus.
[0002]
[Prior art]
In general, a conventional wafer cleaning apparatus performs cleaning by immersing dozens of wafers in a chemical cleaning tank and rinsing in an adjacent rinse tank. Further, in order to dry the wafer, the wafer is rotated at a high speed or replaced with a highly volatile chemical solution.
[0003]
[Problems to be solved by the invention]
However, in the conventional wafer cleaning apparatus described above, if the cleaning liquid is increased by one tank, the rinsing tank must also be installed. In addition, there is a problem that due to an increase in the diameter of the wafer, the size of the cleaning tank must be increased and the amount of chemicals used must be increased, and the cleaning liquid must be processed at a high temperature in order to increase the cleaning effect.
[0004]
The present invention eliminates the above-mentioned problems, and when cleaning a wafer, the cleaning liquid can be cleaned in an amount so that the upper wheel is immersed, and the semiconductor wafer cleaning apparatus can reduce the chemical used. And a cleaning method.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
[1] In a semiconductor wafer cleaning apparatus, a housing for storing a cleaning liquid for cleaning the semiconductor wafer, a table that rotates while holding the semiconductor wafer in the housing, and a rotation for stirring the cleaning liquid A semiconductor wafer cleaning apparatus comprising an upper wheel, a liquid supply port for supplying the cleaning liquid to the housing, a water supply port for supplying cleaning pure water, and drainage provided on the side surface of the housing and the bottom surface of the housing A drain port provided on the side of the housing is provided at a position facing the water supply port, and the water supply port is installed so that the cleaning pure water flows between the upper wheel and the table. It was made to do.
[0006]
[ 2 ] The semiconductor wafer cleaning apparatus according to [1], wherein the upper wheel and the table have mechanisms that rotate in opposite directions.
[0007]
[ 3 ] The semiconductor wafer cleaning apparatus according to [1], further comprising cleaning liquid cooling means for cooling the cleaning liquid in the housing.
[0008]
[ 4 ] In the semiconductor wafer cleaning apparatus described in [ 3 ] above, the cleaning liquid cooling means is the cleaning liquid cooling unit.
[0009]
[ 5 ] In the semiconductor wafer cleaning apparatus according to [ 3 ], the cleaning liquid cooling means is a coagulant added to the chemical.
[0010]
[6] In the cleaning method of semiconductor wafer, in a cleaning liquid in the housing, a semiconductor having a step of immersing the semi-conductor wafer, while rotating the semiconductor wafer, and a step of agitating the cleaning solution on the semiconductor wafer A method for cleaning a wafer, comprising: a liquid supply port for supplying the cleaning liquid to the housing; a water supply port for supplying cleaning pure water; and a drain port provided on the side surface of the housing and the bottom surface of the housing. A drain port provided on a side surface is provided at a position facing the water supply port, and the water supply port is installed so that the cleaning pure water flows between the upper wheel and the table, and the semiconductor wafer is The cleaning liquid on the semiconductor wafer rotates in a direction opposite to the direction in which the cleaning liquid is stirred.
[0011]
[ 7 ] The semiconductor wafer cleaning method according to [ 6 ], wherein the semiconductor wafer is cleaned with the cooled cleaning liquid.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0013]
FIG. 1 is a schematic sectional view of a wafer cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic configuration diagram showing a cleaning state of the wafer cleaning apparatus.
[0014]
As shown in these drawings, the wafer cleaning apparatus 1 can hold a housing 2 for storing a cleaning liquid 10 and a wafer 9, and has a table 3 having a rotating mechanism, a liquid supply port 4 for supplying the cleaning liquid 10, a cleaning A water supply port 5 for supplying pure water (this water supply port 5 is installed so that the cleaning pure water flows between the upper wheel 7 and the table 3 from the side surface of the wafer 9), a drain port 6 for discharging the cleaning liquid 10, and a cleaning liquid 10 In order to stir the wafer, a groove is formed on the surface facing the wafer 9 surface, and the upper wheel 7 has a rotation mechanism.
[0015]
Next, the operation of the wafer cleaning apparatus of the first embodiment will be described.
[0016]
First, the wafer 9 to be cleaned is attracted to the table 3. At this time, the upper wheel 7 is retracted to a position where it does not interfere with the transfer of the wafer 9 (see FIG. 1).
[0017]
Next, the cleaning liquid 10 is supplied into the housing 2 from the liquid supply port 4. As shown in FIG. 2, the amount of liquid to be supplied is supplied until the upper wheel stirring section is immersed. At the same time, the upper wheel 7 also moves directly above the wafer 9. When the supply of the cleaning liquid 10 is completed, the upper wheel 7 and the table 3 are rotated, and the cleaning liquid 10 is stirred. At this time, the upper wheel 7 and the table 3 are rotated in opposite directions. When the cleaning of the wafer 9 is completed, the chemical solution is discharged from the drain port 6 and rinsed by supplying cleaning pure water from the water supply port 5.
[0018]
As described above, according to the first embodiment, when cleaning the wafer, the cleaning liquid can be cleaned in an amount that the upper wheel is immersed, so that the chemical solution used can be reduced.
[0019]
Further, by rotating the upper wheel and the table in the opposite direction, a flow is generated at the interface between the wafer surface and the cleaning liquid, and the contamination can be removed at room temperature by the flow.
[0020]
Next, a second embodiment of the present invention will be described.
[0021]
FIG. 3 is a schematic configuration diagram showing a cleaning state of the wafer cleaning apparatus according to the second embodiment of the present invention.
[0022]
In this embodiment, a cooling unit 8 for cooling the cleaning liquid 10 in the housing 2 is provided, and by cooling the cleaning liquid 10, the viscosity of the cleaning liquid 10 is increased and a large friction is generated between the surface of the wafer 9 and the cleaning liquid 10 interface. Let
[0023]
As shown in FIG. 3, the wafer cleaning apparatus 1 can hold a housing 2 for storing a cleaning liquid 10 and a wafer 9, and has a table 3 having a rotating mechanism, a liquid supply port 4 for supplying the cleaning liquid, and cleaning pure water. (This water supply port 5 is installed so that the cleaning pure water flows between the upper wheel 7 and the table 3 from the side of the wafer 9), the drain port 6 for discharging the cleaning solution 10, and the cleaning solution 10 For this purpose, a groove is formed on the surface opposite to the surface of the wafer 9, and an upper wheel 7 having a rotation mechanism and a cooling unit 8 for cooling the cleaning liquid in the housing 2 are constituted.
[0024]
The operation of the wafer cleaning apparatus according to the second embodiment will be described below.
[0025]
The wafer 9 to be cleaned is attracted to the table 3. At this time, the upper wheel 7 is retracted to a position where it does not interfere with wafer transfer. Next, the cleaning liquid 10 is supplied into the housing 2. The amount of liquid to be supplied is supplied until the upper wheel stirring section is immersed, as shown in FIG. At the same time, the upper wheel 7 also moves directly above the wafer 9. When the supply of the cleaning liquid 10 is completed, the upper wheel 7 and the table 3 are rotated, and the cleaning liquid 10 is stirred. At this time, the upper wheel 7 and the table 3 are rotated in opposite directions. At the same time, cooling of the cleaning liquid 10 is started. When the cleaning of the wafer 9 is completed, the chemical solution is discharged from the drain port 6 and rinsed by supplying cleaning pure water from the water supply port 5.
[0026]
As described above, according to the second embodiment, when cleaning the wafer, since the cleaning liquid can be cleaned in an amount that the upper wheel is immersed, it is possible to reduce the amount of chemicals used.
[0027]
Further, by cooling the cleaning liquid, the viscosity of the cleaning liquid is increased, and a large friction is generated between the wafer surface and the cleaning liquid interface. This friction provides a non-contact scribing effect. Further, by rotating the upper wheel and the table in the direction opposite to each other, a flow is generated at the interface between the wafer surface and the cleaning liquid, and contamination can be removed at room temperature by the flow.
[0028]
In this second embodiment, the cooling unit is used to increase the viscosity of the cleaning liquid, but it is also possible to add a coagulant to the chemical liquid.
[0029]
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.
[0030]
【The invention's effect】
As described above in detail, according to the present invention, the following effects can be obtained.
[0031]
(1) When cleaning the wafer, since the cleaning liquid can be cleaned with the amount that the upper wheel is immersed, the chemical solution used can be reduced.
[0032]
(2) By rotating the upper wheel and the table in a direction opposite to each other, a flow is generated at the interface between the wafer surface and the cleaning liquid, and contamination can be removed at room temperature by the flow.
[0033]
(3) By cooling the cleaning liquid, it is possible to increase the viscosity of the cleaning liquid and generate a large friction between the wafer surface and the cleaning liquid interface. This friction provides a non-contact scribing effect.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a wafer cleaning apparatus showing a first embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing a cleaning state of the wafer cleaning apparatus according to the first embodiment of the present invention.
FIG. 3 is a schematic configuration diagram showing a cleaning state of a wafer cleaning apparatus according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wafer cleaning apparatus 2 Housing which collects cleaning liquid 3 Table which has a rotation mechanism 4 Liquid supply port which supplies cleaning liquid 5 Water supply port which supplies cleaning pure water 6 Drain port which discharges cleaning liquid 7 Upper wheel 8 Cooling unit 9 Wafer 10 Cleaning liquid

Claims (7)

半導体ウエハを洗浄するための洗浄液が溜められるハウジングと、該ハウジングの中で前記半導体ウエハを保持したまま回転するテーブルと、前記洗浄液を攪拌させるために回転する上部ホイールとを具備する半導体ウエハの洗浄装置であって、前記ハウジングに前記洗浄液を供給する給液口と、洗浄純水を供給する給水口と、前記ハウジング側面と前記ハウジング底面に設けられた排水口とを備え、前記ハウジング側面に設けられた排水口は前記給水口と対向する位置に設けられ、前記給水口は前記洗浄純水が前記上部ホイールと前記テーブルとの間を流れるように設置されることを特徴とする半導体ウエハの洗浄装置。Cleaning a semiconductor wafer comprising: a housing in which a cleaning liquid for cleaning the semiconductor wafer is stored; a table that rotates while holding the semiconductor wafer in the housing; and an upper wheel that rotates to stir the cleaning liquid. An apparatus, comprising: a liquid supply port for supplying the cleaning liquid to the housing; a water supply port for supplying cleaning pure water; and a drain port provided on the side surface of the housing and the bottom surface of the housing. The semiconductor wafer cleaning is characterized in that the drainage port provided is provided at a position facing the water supply port, and the water supply port is installed so that the cleaning pure water flows between the upper wheel and the table. apparatus. 請求項１記載の半導体ウエハの洗浄装置において、前記上部ホイールと前記テーブルは互いに反対方向に回転する機構を有することを特徴とする半導体ウエハの洗浄装置。  2. The semiconductor wafer cleaning apparatus according to claim 1, wherein the upper wheel and the table have mechanisms that rotate in directions opposite to each other. 請求項１記載の半導体ウエハの洗浄装置において、前記ハウジング内の洗浄液を冷却するための洗浄液冷却手段を有することを特徴とする半導体ウエハの洗浄装置。  2. The semiconductor wafer cleaning apparatus according to claim 1, further comprising cleaning liquid cooling means for cooling the cleaning liquid in the housing. 請求項３記載の半導体ウエハの洗浄装置において、前記洗浄液冷却手段は前記洗浄液の冷却ユニットであることを特徴とする半導体ウエハの洗浄装置。4. The semiconductor wafer cleaning apparatus according to claim 3 , wherein the cleaning liquid cooling means is the cooling liquid cooling unit. 請求項３記載の半導体ウエハの洗浄装置において、前記洗浄液冷却手段は薬液に添加される凝固剤であることを特徴とする半導体ウエハの洗浄装置。4. The semiconductor wafer cleaning apparatus according to claim 3 , wherein the cleaning liquid cooling means is a coagulant added to the chemical solution. 半導体ウエハの洗浄方法において、ハウジング内の洗浄液の中に、半導体ウエハを浸漬する工程と、前記半導体ウエハを回転させながら、前記半導体ウエハ上の前記洗浄液を攪拌する工程とを有する半導体ウエハの洗浄方法であって、前記ハウジングに前記洗浄液を供給する給液口と、洗浄純水を供給する給水口と、前記ハウジング側面と前記ハウジング底面に設けられた排水口とを備え、前記ハウジング側面に設けられた排水口は前記給水口と対向する位置に設けられ、前記給水口は前記洗浄純水が前記上部ホイールと前記テーブルとの間を流れるように設置されるとともに、前記半導体ウエハは、前記半導体ウエハ上の前記洗浄液が攪拌される方向とは反対方向に回転することを特徴とする半導体ウエハの洗浄方法。In the cleaning method of semiconductor wafer, in a cleaning liquid in the housing, a step of immersing the semi-conductor wafer, while rotating the semiconductor wafer, the cleaning of the semiconductor wafer and a step of agitating the cleaning solution on the semiconductor wafer A method comprising: a liquid supply port for supplying the cleaning liquid to the housing; a water supply port for supplying cleaning pure water; and a drain port provided on the side surface of the housing and the bottom surface of the housing. The drain outlet provided is provided at a position facing the water supply port, and the water supply port is installed so that the cleaning pure water flows between the upper wheel and the table, and the semiconductor wafer is the semiconductor A method for cleaning a semiconductor wafer, wherein the cleaning liquid on the wafer rotates in a direction opposite to a direction in which the cleaning liquid is agitated. 請求項６記載の半導体ウエハの洗浄方法において、前記半導体ウエハは、冷却された前記洗浄液によって洗浄されることを特徴とする半導体ウエハの洗浄方法。7. The semiconductor wafer cleaning method according to claim 6 , wherein the semiconductor wafer is cleaned with the cooled cleaning liquid.
JP32276297A 1997-11-25 1997-11-25 Semiconductor wafer cleaning apparatus and cleaning method Expired - Fee Related JP3983355B2 (en)

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