KR20070058798A - Apparatus of treating a substrate in a single wafer type - Google Patents

Abstract

A substrate treating apparatus of a single wafer type is provided to prevent a substrate from being released from a substrate fixing member by using a groove formed on the substrate fixing member. A substrate support unit(120) has plural substrate fixing members(122) which are disposed on an upper surface of a fluid processing unit(130) to fix and support a portion of an edge of a substrate. The substrate fixing member has a drive pin connected to an angle adjusting member at one end thereof, a sliding portion extending from an outer periphery of the drive pin and having a slope surface, and a fixing groove formed on upper side of the sliding portion for receiving a portion of the edge of the substrate.

Description

Single wafer type processing apparatus {APPARATUS OF TREATING A SUBSTRATE IN A SINGLE WAFER TYPE}

1 is a configuration diagram schematically showing a sheet type substrate processing apparatus according to the present invention.

FIG. 2 is a cross-sectional view showing a cross section A-A 'shown in FIG. 1.

3 is a view for explaining in detail the configuration of the substrate holding member shown in FIG.

4A is a plan view showing a state in which the substrate holding member is in a locking standby state.

4B is a plan view showing a state in which the substrate holding member is in a locked state.

* Description of the symbols for the main parts in the drawings *

100: sheet type substrate processing apparatus 122c: drive pin

110 housing 130 fluid processing unit

112: blocking wall 132: nozzle part

114: fluid drain 132a: first nozzle

120: substrate support 132b: second nozzle

122: substrate holding member 132c: third nozzle

122a: sliding part 140: table

122b: Fixing groove

The present invention relates to an apparatus for processing a semiconductor substrate, and more particularly, to a sheet type substrate processing apparatus.

In general, semiconductor manufacturing apparatus are manufactured by repeated performance of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, drying, and the like. Among these unit processes, the cleaning process is a process of removing foreign substances or unnecessary films adhering to the surface of the semiconductor substrate during each unit process. In recent years, the pattern formed on the semiconductor substrate is miniaturized, and the aspect ratio of the pattern is reduced. As it grows, its importance is increasing.

The apparatus for performing the cleaning process is classified into a batch type cleaning apparatus for simultaneously cleaning a plurality of semiconductor substrates and a sheet type cleaning apparatus for cleaning the semiconductor substrates in sheets. The batch cleaning apparatus cleans a plurality of semiconductor substrates at once by immersing the plurality of semiconductor substrates in a cleaning tank containing a cleaning liquid for cleaning the semiconductor substrate. In this case, ultrasonic vibration may be applied to the cleaning liquid contained in the cleaning tank to improve the cleaning efficiency. The single wafer cleaning apparatus includes a chuck for supporting the semiconductor substrate and nozzles for supplying the cleaning liquid to the front or rear surface of the semiconductor substrate. The cleaning liquid supplied to the semiconductor substrate may be supplied in a state where ultrasonic vibration is applied, or ultrasonic vibration may be applied in a state where the cleaning liquid is supplied on the semiconductor substrate.

Such single sheet cleaning apparatus uses less cleaning chemical compared to the conventional batch cleaning method, enables uniform cleaning by single wafer processing, and the cleaning efficiency is much higher than that of the batch cleaning method. It also enables clustering along with other semiconductor process equipment such as etching, deposition, etc., and also significantly reduces equipment size compared to the batch method, resulting in smaller footprint and cleaning cycle times. The cycle time can be significantly reduced.

In particular, the introduction of large-diameter wafers such as 300 mm wafers and the removal of fine particles due to the fine patterns have increased in importance, and thus, the cleaning method of the semiconductor substrate is expected to be used in the future.

The single sheet type substrate processing apparatus according to the related art has a housing having an open top and a space in which a substrate is accommodated to provide a space for performing a predetermined processing process, a substrate support installed inside the housing to seat a substrate, and a substrate support mounted on the substrate support. At least one nozzle for supplying a processing fluid to the processing surface of the substrate. Here, the substrate support is rotated by a predetermined rotational force when the treatment process is started and the substrate is seated. Thus, the substrate is rotated by the rotation of the substrate support, and the nozzle sprays the processing fluid onto the processing surface of the rotating substrate to clean the substrate.

However, in the sheet type substrate processing apparatus as described above, a phenomenon occurs in which the substrate is separated from the substrate support by the rotational force of the substrate support. This is because the substrate holding member that substantially holds the substrate at the substrate support cannot accurately fix the substrate.

An object of the present invention for solving the above problems is to provide a sheet type substrate processing apparatus for preventing the substrate from being separated during the process.

A sheet type substrate processing apparatus according to the present invention for achieving the above object is a housing having a space therein to perform a predetermined processing process on the substrate, is installed in the housing, the inside of the housing A fluid processing unit including at least one nozzle for injecting a processing fluid into a processing surface of a received substrate, a substrate supporting unit having a plurality of substrate fixing members disposed on an upper surface of the fluid processing unit to fix and support a portion of an edge of the substrate; And a driving unit for rotating the substrate support, wherein the substrate fixing member has one end connected to an angle adjusting member, the driving pin being rotated at a process angle, and extending from an outer circumferential surface of the driving pin to seat the substrate. A sliding part having an inclined surface on which the substrate is slid by the rotation of the driving pin, and the slab And a fixing groove formed on an upper side of the riding part to insert a portion of an edge of the substrate slid by the sliding part to fix the substrate.

According to an embodiment of the present invention, when the substrate is seated on the sliding part, the angle adjusting member rotates the driving pin so that the substrate is raised along the inclined surface and inserted into the fixing groove.

According to an embodiment of the present invention, the substrate fixing members are arranged to support and fix a portion of the edge of the substrate accommodated at the edge of the substrate support.

According to an embodiment of the present invention, the nozzle unit includes a first nozzle for supplying ultrapure water to a processing surface of a substrate, a second nozzle for supplying chemicals such as hydrogen peroxide or hydrofluoric acid, and a third nozzle for injecting dry gas. .

Hereinafter, exemplary embodiments of a sheet type substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Portions denoted by like reference numerals denote like elements throughout the specification.

(Example)

1 is a configuration diagram schematically showing a sheet type substrate processing apparatus according to the present invention, and FIG. 2 is a cross-sectional view showing a cross section A-A 'shown in FIG.

1 and 2, the sheet type substrate processing apparatus 100 according to the present invention includes a housing 110, a substrate supporter 120, a fluid processor 130, and a table 140. The housing 110 has a space in which the substrate W is accommodated and performs a predetermined treatment process. The housing 110 is manufactured to surround the substrate support part 120 from the outside to be described later. In addition, the housing 110 has an open upper portion, and a substrate transfer device (not shown) provided at one side of the housing 110 through the opened upper portion carries a substrate into the housing 110, or a housing ( The substrate is taken out from the inside of 110.

An open upper portion of the housing 110 is formed with a blocking wall 112 extending from the inner circumferential surface of the housing 110. The blocking wall 112 prevents the processing fluids from escaping the housing 110 inside the housing 110. That is, the blocking wall 112 extends from the open upper portion of the housing 110 to the inside, so that the processing fluids injected into the processing surface of the substrate W to be rotated when the process is started are rotated due to the rotational force of the substrate W. Blocks the escape to the outside through the open top of 110.

In addition, the housing 110 is provided with a fluid drain 114 for discharging used processing fluids to the outside of the housing 130. For example, the fluid drainage part 114 is a space in which the processing fluid used in the process is drained along the inner circumferential surface of the housing 110, and the fluid drainage part 114 is a recovery tank provided outside the housing 110. Drain the used treatment fluid).

The substrate support part 120 is installed at the inner center of the housing 110. The substrate support 120 is located at a lower position than the blocking wall 112 of the housing 110. In addition, a nozzle unit 132, which will be described later, is disposed at the center of the substrate support unit 120, and a substrate fixing member 122 for mounting and fixing the substrate W is disposed at the edge of the substrate support unit 120.

The substrate support 120 is rotated horizontally by a predetermined driver (not shown). For example, the driving unit includes a gear interlocked with each other, a motor for driving the gears, and the like, and when the process is started and the substrate is accommodated in the substrate support unit 120, the substrate support unit 120 is rotated with a predetermined rotational force. Let's do it. Thus, the substrate support part 120 is installed to be rotatable by the above-described driving part, and when the process is started and the substrate W is fixed by the substrate fixing member 122, which will be described later, the substrate support part 120 is rotated at a predetermined rotational speed and the substrate ( W) is rotated at the process speed.

A plurality of substrate fixing members 122 are disposed at edges of the upper surface of the substrate supporter 120. Each substrate holding member 122 is disposed in an annular shape to support a portion of the edge of the substrate (W), wherein the substrate holding member 122 is eccentrically rotated at a predetermined rotation angle. Eccentric rotation of the substrate holding member 122 is a substrate holding member for guiding the substrate W seated on the sliding portion (reference numeral 122b of FIG. 4A) of the substrate holding member 122 to the fixing groove 122c ( 122). A detailed configuration and operation process of the substrate fixing member 122 will be described later with reference to FIGS. 4A and 4B.

The fluid processor 130 includes a nozzle unit 132. The nozzle unit 132 includes at least one nozzle to supply processing fluids used in the sheet type substrate processing apparatus 100. For example, the nozzle unit 132 includes first to third nozzles 132a, 132b, and 132c. The first nozzle 132a supplies ultrapure water, the second nozzle 132b supplies a predetermined chemical, and the third nozzle 132c injects dry gas. Thus, the first to third nozzles 132a, 132b, and 132c spray respective processing fluids onto one processing surface of the substrate W. As shown in FIG. Here, the outside of the housing 110 may be provided with fourth and fifth nozzles (10, 20) for injecting the processing fluid to the other processing surface of the substrate (W). The fourth nozzle 10 may supply ultrapure water, and the fifth nozzle 20 may supply a dry gas.

The nozzle unit 132 described above is for supplying a predetermined processing fluid to the substrate W. The configuration and coupling method of the nozzle unit 132 and the number of nozzles provided may be variously modified and changed.

The table 140 supports the substrate support 120. In addition, the table 140 may be provided with an angle adjusting device (not shown) for eccentrically rotating the driving unit (not shown) and the substrate fixing member 122 for rotating the substrate support part 120 therein. . That is, the driving unit is installed in the table 140, and when the substrate W is loaded into the substrate support 120, the substrate support 120 is rotated at a predetermined rotation speed. In addition, the angle adjusting device is to eccentrically rotate the substrate holding member 122 at a predetermined rotation angle, and the substrate W seated on the sliding 122b of the substrate holding member 122 is fixed to the fixing groove 122c. It is for sliding.

Hereinafter, the configuration of the substrate holding member 122 according to the present invention will be described in detail.

3 is a view for explaining a substrate holding member according to the present invention. Referring to FIG. 3, the substrate fixing member 122 includes a driving pin 122a, a sliding portion 122b, and a fixing groove 122b. The driving pin 122a is rotated at a predetermined rotation angle. To this end, an angle adjusting member (not shown) for rotating the driving pin 122a is installed in the table 140 to be described later, and the angle adjusting member is coupled to one end of the driving pin 122a to form a driving pin ( 122a) is operated within a predetermined angle range.

The sliding part 122b extends from the outer circumferential surface of the driving pin 122a. At this time, the sliding portion 122b seats a part of the edge of the substrate W, and the substrate W may slide along the inclined surface provided on the sliding portion 122b by the above-described rotation of the driving pin 122a. The upper surface is formed to be inclined. Thus, a part of the edge of the substrate W is seated on the sliding part 122b. When the process starts, the driving pin 122a is eccentrically rotated at a predetermined rotational angle so that the substrate W moves along the sliding part 122b. It slides in the direction to guide the substrate (W) to be located in the fixing groove (122c) to be described later.

The fixing groove 122c is formed so that the edge surface of the substrate W is inserted. That is, a part of the edge of the substrate W is inserted and fixed in the fixing groove 122c, and the substrate W slid along the inclined surface formed in the sliding part 122b is inserted. Thus, the fixing groove 122c prevents the substrate W from being separated from the substrate fixing member 122 when the substrate supporting part 120 is rotated after receiving the substrate W during the process.

Hereinafter, an operation process and effects of the substrate fixing member 122 having the above configuration will be described in detail.

4A is a plan view showing a state in which the substrate holding member is in a locked state, and FIG. 4B is a plan view showing a state in the locking state of the substrate holding members.

Referring to FIG. 4A, when the process of the sheet type substrate processing apparatus 100 is started, a substrate transfer device (not shown) installed outside of the sheet type substrate processing apparatus 100 is connected to the inside of the housing 110. The substrate W is mounted on the sliding portions 122b of each of the plurality of substrate fixing members 122 disposed on the substrate support 120. At this time, the substrate holding member 122 is in a locking standby state. The locking standby state is a process of the substrate holding member 122 for allowing the substrate W to be seated on the sliding part 122b of the substrate holding member 122. The location of the statue.

Referring to FIG. 4B, when the substrate W is seated on the sliding part 122b of the substrate fixing member 122, the angle adjusting member (not shown) rotates the substrate fixing member 122 eccentrically at a predetermined angle. In this way, the substrate holding member 122 is converted from the locking standby state to the locked state. Here, the locked state means that the substrate W seated on the sliding portion 122b of the substrate fixing member 122 is moved along the inclined top surface of the sliding portion 122b to be inserted into the fixing groove 122c. It is a process position of the member 122. When the substrate support part 120 is converted into the locked state, the substrate W is raised along the inclined top surface of the sliding part 122b and inserted into the fixing groove 122c. Thus, a portion of the edge of the substrate W is inserted into and fixed to the fixing groove 122c formed in each substrate fixing member 122.

When the substrate W is fixed to the fixing groove 122c of each substrate fixing member 122, the substrate supporting part 120 is rotated horizontally. At this time, since the substrate W is fixed by the fixing groove 122c of the substrate fixing member 122, the substrate W is not separated from the substrate support 120. When the substrate W is rotated, a predetermined processing fluid is supplied from the nozzle unit 132 of the fluid processing unit 130.

Here, referring to FIG. 1 and FIG. 2 in parallel. When the substrate W is rotated, the second nozzle 132b of the nozzle unit 132 sprays a predetermined chemical onto the processing surface of the substrate W to perform a predetermined cleaning process on the surface of the substrate W. When the cleaning process of the substrate W is completed by the second nozzle 132b, the first nozzle 132a sprays ultrapure water onto the surface of the substrate W, and the chemicals and particles remaining on the surface of the substrate W. A rinse process is performed to remove the back. At this time, the fourth nozzle 10 installed outside the housing 110 also sprays ultrapure water onto the surface of the substrate W to remove chemicals or particles remaining on the surface of the substrate W. Process fluids injected by the first and second nozzles 132a and 132b to the surface of the substrate W are drained out of the housing 110 through the fluid drain 114 provided in the housing 110.

When the rinsing process of the substrate W is completed by the first nozzle 132a, the third nozzle 132c sprays a dry gas toward the substrate W to dry the substrate W. At this time, the fifth nozzle 20 installed outside the housing 110 also sprays a dry gas onto the surface of the substrate W to dry the substrate W.

When the above-described processing of the substrate W by the nozzle unit 132 is completed, the rotation of the substrate support unit 120 is stopped, and the substrate fixing member 122 is rotated again to return to the locked standby state. That is, the substrate holding member 122 rotated in the locked state returns to the locking standby state, and at this time, the substrate W is slid from the fixing groove 132c to the sliding part 122b. When the substrate W is slid by the sliding part 122b, the substrate transfer device (not shown) provided outside the housing 110 unloads the substrate W from the substrate support part 120 and then processes the sheet type substrate. It is taken out of the device 100.

As described above, the sheet type substrate processing apparatus 100 according to the present invention is provided with a fixing groove 122c in the substrate fixing member 122 on which the substrate is loaded, so that the substrate is separated from the substrate fixing member 122 during the process. Prevent it.

In the above description, the sheet type substrate processing apparatus according to the present invention has been described with reference to the drawings, but this is merely an example, and various changes and modifications can be made without departing from the spirit of the present invention.

As described above, the sheet type substrate processing apparatus according to the present invention is provided with a substrate fixing member for fixing and supporting the substrate, thereby preventing the substrate from being separated from the substrate holding member during the process.

Claims (2)

In the apparatus for processing a wafer, A housing accommodating the substrate therein and having a space for performing a predetermined treatment process on the substrate; A fluid processing unit installed in the housing and including at least one nozzle for injecting a processing fluid to the processing surface of the substrate accommodated in the housing; A substrate support part disposed on an upper surface of the fluid processing part and having a plurality of substrate fixing members for fixing and supporting a part of an edge of the substrate; A driver for rotating the substrate support; The substrate fixing member, A driving pin having one end connected to the angle adjusting member and rotating at a process angle; A sliding part extending from an outer circumferential surface of the driving pin so that the substrate is seated and having an inclined surface in which the substrate slides upward by the rotation of the driving pin; And a fixing groove formed on an upper side of the sliding part to insert a portion of an edge of the substrate slid by the sliding part to fix the substrate. The method of claim 1, The angle adjustment member, When the substrate is seated on the sliding portion, the substrate type substrate processing apparatus, characterized in that the driving pin is rotated so that the substrate is raised along the inclined surface and inserted into the fixing groove.

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