KR20020092695A - System for stacking semiconductor package - Google Patents

Abstract

PURPOSE: A semiconductor package stack system is provided to improve operation efficiency by unifying an inputting direction of a package and an adhesive, and an outputting direction of a stacked package. CONSTITUTION: The first to the six circulation hole(102-110) are formed in a predetermined interval on a work table. The second robot arm(132) is installed at an upper portion of the first and the second circulation hole(102,104). The third robot arm(134) is installed at an upper portion of the second and the third circulation hole(104,106). The first robot arm(130) is installed at an upper portion of the fifth and the sixth circulation hole(110,112). The first to the third robot arm(130,132,134) are used for transferring 16 packages or adhesives by using a vacuum method. In addition, the first to the third robot arm(130,132,134) have a photographing device such as a 3D vision or a laser beam scanner, respectively. An adhesive aligner(114) and an upper package aligner(116) are installed at rear parts of the first and the second circulation hole(102,104). A lower package aligner(118) is installed at rear parts of the fifth and the sixth circulation hole(110,112). The first to the fourth nest picture(120,122,126,128) are arranged on rear parts of each aligner(114,116,118). A package adhesion portion(124) is installed between the second and the third nest picture(122,126).

Description

Semiconductor package stacking system {System for stacking semiconductor package}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package stacking system, and more particularly, to a semiconductor package stacking system in which adhesive materials are embedded between upper and lower packages and laminated to each other.

In general, a semiconductor chip is formed on a wafer by repeating a series of wafer processing processes such as an oxidation process, a diffusion process, a photolithography process, and a metal process, and the chips formed on the wafer are EDS (Electrical Die Sorting). The chip is tested by a normal process, and the chip tested as good by the testing is sliced and then packaged.

In addition, the packaged chip package doubles the capacity by vertically stacking two or more packages as a method for increasing more memory density within a limited surface mount area. Such chip package stacking is performed by embedding an adhesive material between the package and the package, and then pressing the chip package at a high temperature.

Conventional semiconductor package stacking systems have an index table (2) that can rotate a predetermined angle as shown in FIG.

Here, the index table 2 is divided into a first region 10, a second region 12, and a third region 14, and the first region 10 is rotated by a predetermined angle of the index table 2. ) Index table 2 moves to second region 12, index table 2 of second region 12 moves to third region 14, and index table of third region 14 Denoted at 2 is the first region 10.

In addition, a first nest picture 16 and a second nest picture in which a plurality of packages are formed on the first area 10 and the third area 14 may be stacked in a plurality of packages with an adhesive therebetween. 18 are provided respectively.

In addition, the lower surface of the pockets of the nest pictures 16 and 18 provided in the first region 10 and the third region 14 are open, and the index table of the first region 10 and the third region 14 ( 2) As a part of the package adapter 42 provided in the third region 12 therein, as shown in FIG. 2, it protrudes above the index table 2 by the driving of the driving source 50, and the next picture 16, A plurality of lower pressing portions 56 for pushing and pressing the lower surface of the material stored in the pocket 18 are provided.

Here, the lower pressurizing portion 56 is formed on the lower pressurizing body 54 connected to the piston 52 driven by the driving source 50, and inside the lower pressurizing body 54 in which the lower pressurizing portion 56 is formed. In each of the springs 55 of the elastic material is built in, the lower pressing portion 56 is formed to be able to flow up and down.

In the second region 12, another part of the package jointer 42 for stacking the lower package and the upper package stored in the pockets of the nest pictures 16 and 18 by high pressure with an adhesive therebetween is provided. .

Here, the package adapter 42 has two supports 66 installed on the base around the index table 2 of the second region 12 and one support 66 at the center of the index table 2 rotation. The top plate 58 supported by) is provided.

In addition, a plurality of upper pressurizing parts 60 are provided with upper pressurizing bodies 60 in which heating means such as coils 62 are installed below the upper plate 58, and surface temperatures of the upper pressurizing bodies 60 are controlled by heating means. 64 is formed to protrude outward.

In addition, a first lower package tray 20 in which a plurality of lower packages such as TSOP (Thim Small Out Line Package) is accommodated on the front surface of the index table 2 and an upper package tray 22 in which a plurality of upper packages such as TSOP are accommodated. ) Is installed.

And one side of the index table 2 is provided with the adhesive material tray 26 in which adhesive materials, such as a flexible circuit, were accommodated, and the 2nd lower package tray 24 in which several lower packages, such as TSOP, were accommodated.

In addition, a first laminated package tray 28 and a second laminated package tray 30, which can accommodate a laminated package in which a lower package, an adhesive, and an upper package are sequentially stacked on the other side of the index table 2, are respectively installed. have.

The upper package aligner 40 is installed between the index table 2 and the upper package tray 22, and the adhesive aligner 36 is provided between the index table 2 and the adhesive tray 26. The lower package aligner 38 is provided between the index table 2 and the second lower package tray 24.

Here, each package aligner 38 and 40 and the adhesive aligner 36 perform a function of aligning in one direction before being introduced into the nested pictures 16 and 18 of the index table 2.

In addition, one side of the index table 2 transfers the lower packages stored in the first lower package tray 20 and the second lower package tray 24 to the pockets of the nest pictures 16 and 18 of the index table 2. The 1st robot arm 32 which transfers the some adhesive material accommodated in the adhesive material tray 26 to the pocket of the nest pictures 16 and 18 of the index table 2 is provided.

In addition, on the other side of the index table 2, the upper package loaded on the upper package tray 22 is transferred to the pockets of the nest pictures 16 and 18 of the index table 2, and stored in the nest pictures 16 and 18. The 2nd robot arm 34 which transfers the laminated package to the 1st laminated package tray 28 or the 2nd laminated package tray 30 is provided.

Here, the first robot arm 32 and the second robot arm 34 can transfer eight packages or adhesive materials by one transfer operation.

Therefore, the first robot arm 32 is fixed to the eight lower packages received in the first lower package tray 20 or the second lower package tray 24 at one time and indexed via the lower package aligner 38. It transfers to the pocket of the 1st nest picture 16 provided in the 1st area | region 10 of the table 2. As shown in FIG.

By the repetitive lower package transfer operation of the first robot arm 32, all of the lower packages are introduced into the pockets of the first nested picture 16, and the lower packages are stored in all the pockets of the first nested picture 16. When is input, an alarm occurs in the device to call the operator, the operator called by the alarm to check whether or not the lower packager is normally stored inside the pocket of the first nested picture (16). do.

Next, the first robot arm 32 sucks and fixes the eight adhesive materials housed in the adhesive tray 26 again on the first area 10 of the index table 2 via the adhesive sorter 36. It is placed on the lower package present in the pocket of the provided first nested picture 16.

By the repetitive adhesive material transfer operation of the first robot arm 32, all of the adhesive material is introduced into the lower package housed in the pocket of the first nested picture 16, and all of the inside of the pocket of the first nested picture 16 is filled. When the adhesive material is injected, an alarm occurs in the device to call the operator, and the operator called by the alarm checks whether the adhesive material is normally stored in the pocket of the first nested picture 16.

Subsequently, the second robot arm 34 is provided on the first area 10 of the index table 2 via the upper package aligner 40 by suction fixing and fixing the eight upper packages stored in the upper package tray. It puts on the adhesive material accommodated in the pocket of the 1st nest picture 16 which was taken.

By the repetitive upper package transfer operation of the second robot arm 34, the upper package is put on the adhesive material stored in all the pockets of the first nested picture 16, and inside the pocket of the first nested picture 16. When all of the upper package is finished, an alarm occurs in the device to call the operator, and the operator called by the alarm determines whether the upper packager is normally stored inside the pocket of the first nested picture 16. You will be confirmed.

Next, the index table 2 is rotated by a predetermined angle in one direction, so that the index table 2 of the first region 10 moves to the second region 12, and the index table of the second region 12 ( 2) moves to the third region 14, and the index table 2 of the third region 14 moves to the first region 10. FIG.

Subsequently, all the pockets of the second nested picture 18 moved to the first region 10 are subjected to the lower package transfer operation and the adhesive transfer operation of the first robot arm 32 as described above. The adhesive material is injected, and the upper package is put on the adhesive material of the pocket of the second nested picture 18 by the upper package transfer operation of the second robot arm 34.

In addition, in the index table 2 of the second region 12, as shown in FIG. 2, the lower pressing part 56 provided below the index table 2 protrudes upward when the driving source 50 is driven. The lower package, the adhesive, and the upper package stored in all the pockets of the first picture 16 are pressed by the upper pressing portion 64 and the lower pressing portion 56. At this time, the coil 62 in the upper pressurized body 60 generates heat so that the heat generated from the coil 62 is transferred to the laminated package through the upper pressurized portion 64 to be easily laminated to each other.

Next, the index table 2 is rotated by a predetermined angle again in one direction, so that the first next picture on the second region 12 of the index table 2 is moved to the third region 14, and the index table 2 The second nested picture 18 of the first region 10 moves to the second region 12.

Lastly, the second robot arm 34 stores the stacked package received in the pocket of the first nested picture 16 moved to the third region 14 by the rotation of the index table 2. 28) or the transfer operation to the second laminated package tray 30.

However, in the conventional semiconductor package stacking system, the supplying and discharging directions of the package and the adhesive material and the discharge direction of the laminated package are divided into the front side or both sides of the apparatus, which is responsible for the input and discharge of the trays in which the package, the adhesive and the laminated package are accommodated. There was a problem that the working radius of the worker is wide, the working efficiency is low.

And, the phenomenon in which the receiving direction of the package or adhesive material accommodated in the tray is reversed due to the error of the preceding process is frequently generated, but the package and adhesive material contained in the tray are supplied to the index table by the robot arm without checking for this. Thereby, there was a problem in that package stacking failure occurred.

In addition, when the lower package, the adhesive and the upper package are all accommodated in the pocket of the nest picture of the index table, the equipment generates an alarm each time to call the operator so that the operator can store the lower package, the adhesive and the upper package in the pocket of the nest picture, respectively. There was a problem that the work efficiency is lowered by checking each time whether it is normally stored.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor package stacking system capable of improving the process efficiency by reducing the work radius of an operator by unifying the direction of injecting the package and the adhesive and the discharge direction of the laminated package.

Another object of the present invention is to provide a semiconductor package stacking system capable of preventing a defect in the process by early removal of a tray in a poor state of storage by allowing the storage state of the package and adhesive material accommodated in the tray to be checked. There is.

It is still another object of the present invention to provide a semiconductor package stacking system that can improve work efficiency by checking an accommodating state of a package and an adhesive material accommodated in a nested picture so that an operator can be called only in an improper storing state.

It is still another object of the present invention to provide a semiconductor package stacking system in which feeding and discharging of a tray automatically proceeds within a limited area.

1 is a schematic configuration diagram of a conventional semiconductor package stacking system.

FIG. 2 is a cross-sectional view for explaining the configuration of the package fitter shown in FIG.

3 is a block diagram illustrating a semiconductor package stacking system in accordance with an embodiment of the present invention.

4 is a cross-sectional view for explaining the internal structure of the work table shown in FIG.

<Explanation of symbols for the main parts of the drawings>

2: index table 10: first region

12: second region 14: third region

16, 120: first nested picture 18, 122: second nested picture

20: first lower package tray 22: upper package tray

24: second lower package tray 26: adhesive material tray

28: first laminated package tray 30: second laminated package tray

32, 34, 130, 132, 134: Robot Arm 36, 114: Adhesive Aligner

38, 118: lower package aligner 40, 116: upper package aligner

42, 124: package adapter 50: drive source

52: piston 54: lower pressurized body

56: lower pressing portion 58: the upper plate

60: upper pressurized body 62: coil

64: upper press 66: support

100: work table

102, 104, 106, 108, 110, 112: distribution hall

126: third nested picture 128: fourth nested picture

136, 138, 140, 142, 144, 146: fixed plate

148 and 150 transfer

152: Storage bin for recovering the adhesive bin

154: Package bin tray retractor

156: Reservoir for recovering defective adhesive tray

158: Reservoir for Feeding Tray Filled with Adhesive

160: a reservoir for supplying a package full tray

162: Reservoir for recovering defective package tray

164: Empty Tray Storage Box for Stacked Packages

166: Receptor for Stacked Package Tray

According to an aspect of the present invention, there is provided a semiconductor package stacking system including: a work table having a plurality of distribution holes through which a tray moves; A plurality of tray reservoirs arranged in a row on a bottom surface of the work table; A transfer installed in the work table to load and unload a tray from the tray storage; A fixed plate provided in the work table below the distribution hole to perform shanghai movement and to transfer the tray from the transfer; A robot arm installed at an upper portion of the distribution hole and equipped with photographing means for loading and unloading a material stored in the tray into a predetermined portion and photographing a state of the material stored in the tray; An aligner installed on the work table around the distribution hole to align the material in one direction; A plurality of nest pictures installed in an elliptical shape on the work table at the periphery of the aligner, and moving at a predetermined interval by one moving means; And a package adapter installed between specific nested pictures among the plurality of nested pictures.

Here, the tray storage device is a storage container for supplying the adhesive filling tray, a storage container for supplying the package filling, a storage container for recovering the adhesive empty tray, a storage container for recovering the empty packaging tray, the empty tray storage for storing the laminated package, and the lamination package filling It may comprise a tray reservoir.

The tray reservoir may further include a bad adhesive tray recovery reservoir and a bad package tray recovery reservoir.

In addition, the moving means may be made of a conveyor system.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a configuration diagram illustrating a semiconductor package stacking system according to an exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating an internal configuration of a work table illustrated in FIG. 3.

The semiconductor package stacking system according to the present invention has a work table 10 as shown in FIG. Here, on the work table 100, a first distribution hole 102, a second distribution hole 104, a third distribution hole 106, a fourth distribution hole 108, and a fifth distribution hole having a size that a tray can move. The hole 110 and the sixth distribution hole 110 are formed at predetermined intervals.

The second robot arm 132 is spaced apart from the first distribution hole 102 and the second distribution hole 104 by a predetermined interval, and the third distribution hole 106 and the fourth distribution hole 108 are provided. ) And the third robot arm 134 is spaced apart from the upper portion by a predetermined interval, and the first robot arm 130 is spaced apart from the fifth distribution hole 110 and the sixth distribution hole 112 by a predetermined interval. It is installed.

Here, each robot arm (130, 132, 134) is capable of transporting a total of 16 packages or adhesives at a time by vacuum adsorption, each robot arm (130, 132, 134) to a 3D Vision or laser beam syringe, etc. The same photographing means is provided to check the storage state of the material such as the kind of material stored in the tray protruding into each of the distribution holes 102, 104, 106, 108, 110, 112 and the storing direction of the material.

In addition, an adhesive material aligner 114 and an upper package aligner 116 are installed at the rear surfaces of the first and second distribution holes 102 and 104 of the work table 100. The lower package aligner 118 is installed at the rear surfaces of the fifth distribution hole 110 and the sixth distribution hole 112.

Here, the adhesive aligner 114 and the upper package aligner 116 is made to align the adhesive or package carried in one direction by the second robot arm 132, the lower package aligner 118 is made of 1 Alignment of the package conveyed by the robot arm 130 in one direction is made.

In addition, the first nested picture 120, the second nested picture 122, the third nested picture 124, and the fourth nested picture 126 move by the conveyor system on the rear surface of each aligner 114, 116, 118. ) Is arranged in an oval shape at a predetermined interval, and the package is placed between the second nested picture 122 and the third nested picture 126 with the adhesive material interposed therebetween in the same manner as the driving principle of the package jointer shown in FIG. The package bonding machine 124 which laminates each other and forms a laminated package by high temperature and high pressure is provided.

Here, each nest picture (120, 122, 124, 126) is formed with a plurality of pockets for accommodating the package and the adhesive material, the lower surface of each pocket is open.

Hereinafter, the internal structure of the work table 100 will be described in more detail with reference to FIG. 4. An adhesive blank tray recovery storage unit 152 for recovering a tray in which all of the adhesive material has been discharged is disposed on the bottom surface of the work table 100. , A package empty tray recovery reservoir 154 for recovering a tray in which all the packages have been released, a poor adhesive tray recovery reservoir 156 for recovering an adhesive tray having a poor orientation of the adhesive, a storage state of the adhesive, and the like. Adhesive filled tray supply reservoir 158 for supplying the trays, the adhesive is stored in all pockets, package filled tray supply reservoir 160 for supplying the trays packaged in all pockets, the direction of the package, Poor package tray retrieval storage 162 for retrieving a package tray in which the package is in poor condition, etc. The empty tray storage 164 for storing a laminated package with empty jackets, and the stacked package tray storage 166 for collecting the tray in which the laminated package is accommodated are arranged in a line.

In addition, a first fixing plate 136 and a second fixing plate 138, which are vertically movable by a piston or the like, are disposed under each of the distribution holes 102, 104, 106, 108, 110, and 112 formed in the work table 100. The third fixing plate 140, the fourth fixing plate 142, the fifth fixing plate 144, and the sixth fixing plate 146 are respectively provided.

And, the bottom of each fixing plate (136, 138, 140, 142, 144, 146) to move the trays stored in the adhesive filling tray supply reservoir 158 and the package filling tray supply reservoir 160 up, down, left and right, Transfer to each fixed plate (136, 138, 140, 142, 144, 146) or move the tray located on the fixed plate (136, 138, 140, 142, 144, 146) back, up, down, left and right to save the adhesive empty tray 152, a package bin tray retrieval storage 154, a poor adhesive bin tray retrieval storage 156, a bad package bin tray retrieval storage 162, a defective laminated package bin tray retrieval storage ( 164 and the first transfer 148 and the second transfer 150 to perform the operation of transferring to the reservoir 166 for stack package tray is installed.

Accordingly, the trays stored in the package-filling tray supply reservoir 160 in which the packages such as TSOPs are accommodated may be moved by the third fixing plate 140 by the up, down, left, and right movements of the first transfer 148 or the second transfer 150. It is carried to the fourth fixing plate 142.

In addition, the third fixed plate 140 or the fourth fixed plate 142 is moved upward by the drive of the piston or the like to accommodate the package located on the third fixed plate 140 or the fourth fixed plate 142. The tray is protruded above the third distribution hole 106 or the fourth distribution hole 108 of the work table 100.

Next, the third robot arm 134 photographs the package tray protruding upward from the third distribution hole 106 or the fourth distribution hole 108 to determine whether the package is accommodated in the pocket of the package tray in the forward direction, It checks whether there is an empty pocket.

Subsequently, if the package tray is abnormal due to the imaging of the third robot arm 134, the third fixing plate 140 or the fourth fixing plate 142 moves downward by driving the piston or the like. 140 or the tray positioned on the fourth fixing plate 142 is moved into the work table 100. Next, the first transfer 148 or the second transfer 150 to grab the package tray located on the third fixed plate 140 or the fourth fixed plate 142 to the reservoir 162 for collecting the defective package tray. Will be committed.

Then, if the package tray is normal by imaging of the third robot arm 134, the third fixing plate 140 or the fourth fixing plate 142 is moved downward by driving the piston or the like, so that the third fixing plate ( 140 or the tray positioned on the fourth fixing plate 142 is moved into the work table 100. Next, the fifth fixed plate 144 or the sixth fixed by holding the package tray on which the first transfer 148 or the second transfer 150 is located on the third fixed plate 140 or the fourth fixed plate 142. Transfer to plate 146.

Next, the fifth fixed plate 144 or the sixth fixed plate 146 is moved upward by the driving of a piston or the like, so that the package located on the fifth fixed plate 144 or the sixth fixed plate 146 is fixed. The received tray protrudes above the fifth distribution hole 110 or the sixth distribution hole 112 of the work table 100.

Subsequently, the first robot arm 130 sucks and fixes the package stored in the tray and transfers the package to the lower package aligner 118 to align the packages in one direction, and then suctions and fixes the package to the fourth nested picture 128. To perform the operation. Here, the package transfer operation of the first robot arm 130 is repeatedly performed so that all the packages accommodated in the tray are transferred to the fourth nested picture 128. In addition, the first robot arm 130 transfers all the packages to the fourth nested picture 128 and then photographs by photographing means to check whether the package is properly seated on the fourth nested picture 128. do. At this time, only when the seating state of the package is poor, the device generates an alarm to call the operator to correct it.

Next, the fourth nest picture 128 is moved to the position where the first nested picture 120 is installed by the conveyor system, and the first nested picture 120 is moved to the position where the second nested picture 122 is installed. The second nested picture 122 is moved between the upper pressurization part and the lower pressurization part of the package adapter 124, and the nested picture is not shown inside the package adapter 124 where the third nested picture 126 is installed. The third nested picture 126 is moved to the position where the fourth nested picture 128 is installed.

Subsequently, the tray stored in the adhesive-filling tray supply reservoir 158 containing the adhesive material is moved by the third fixing plate 140 or the fourth by vertical movement of the first transfer 148 or the second transfer 150. It is carried to the fixing plate 142.

Then, the third fixing plate 140 or the fourth fixing plate 142 is moved upward by the driving of the piston or the like, the adhesive material located on the third fixing plate 140 or the fourth fixing plate 142 is accommodated. The tray is protruded above the third distribution hole 106 or the fourth distribution hole 108 of the work table 100.

Next, the third robot arm 134 photographs the adhesive tray protruding above the third distribution hole 106 or the fourth distribution hole 108 to determine whether the adhesive material is stored in the pocket of the adhesive tray in the forward direction, It checks whether there is an empty pocket.

Subsequently, if the adhesive tray is abnormal due to the imaging of the third robot arm 134, the third fixing plate 140 or the fourth fixing plate 142 is moved downward by driving the piston or the like. 140 or the tray positioned on the fourth fixing plate 142 is moved into the work table 100. Next, the first transfer 148 or the second transfer 150 to grab the package tray located on the third fixed plate 140 or the fourth fixed plate 142 to the reservoir 156 for collecting the defective adhesive tray. Will be committed.

Then, when the adhesive tray is normal by imaging of the third robot arm 134, the third fixing plate 140 or the fourth fixing plate 142 is moved downward by driving the piston or the like. 140 or the tray positioned on the fourth fixing plate 142 is moved into the work table 100. Next, the first fixing plate 136 or the second fixing is grasped by holding the adhesive tray in which the first transfer 148 or the second transfer 150 is positioned on the third fixing plate 140 or the fourth fixing plate 142. Transfer to plate 138.

Next, the first fixing plate 136 or the second fixing plate 138 is moved upward by the drive of the piston or the like, the adhesive material located on the first fixing plate 136 or the second fixing plate 138 is The received tray protrudes above the first distribution hole 102 or the second distribution hole 104 of the work table 100.

Subsequently, the second robot arm 132 sucks and fixes the adhesive stored in the tray and transfers the adhesive to the adhesive sorter 114 to align the adhesive in one direction. It will be put on the bottom package. Here, the adhesive material transfer operation of the second robot arm 132 is repeatedly performed so that all the adhesive material contained in the tray is transferred to the upper package of the fourth nested picture 128. Then, the second robot arm 132 transfers all the adhesive to the fourth nested picture 128, and photographs by photographing means to check whether the adhesive material is normally seated on the fourth nested picture 128. do. At this time, only when the seating state of the adhesive is poor, the device generates an alarm to call the operator to correct it.

Next, the package tray accommodated in the package filling tray supply reservoir 160 is transferred onto the adhesive material accommodated in the fourth nest picture 128 through the same process as the transfer operation of the package tray described above.

Subsequently, the fourth nested picture 128 is moved to the package jointer 124 via the position where the second nested picture 122 is installed in the drawing.

Here, in the package jointer 124, the lamination is performed by the high temperature pressurization of the lower pressurization portion that rises by the piston or the like through the pocket through hole of the fourth nested picture 128 and the upper pressurization portion located thereon.

Next, the fourth nested picture 128 inside the package jointer 124 is transferred to the fourth nested picture 128 in the package jointer 124 by the transfer system, and the fourth nested picture 128 is installed in the drawing. Will be moved to.

Subsequently, the stack tray for storing the stack package of the stack package storage bin 162 for storage of the stack package 162 is the fifth fixed plate 144 or the sixth fixed plate by the first transfer 148 or the second transfer 150. After being transferred to 146, the fifth fixing plate 144 or the sixth fixing plate 146 is raised to protrude upward from the work table 100.

Next, the stacked package accommodated in the fourth nested picture 128 is the fifth fixing plate 144 protruding from the fifth distribution hole 110 or the sixth distribution hole 112 by the first robot arm 130. Or the empty tray for storing the laminated package located on the sixth fixing plate 146.

Lastly, the empty tray for stacking package containing the stacked packages is transferred into the work table 100 by the lowering of the fifth fixing plate 144 or the sixth fixing plate 146, and then the first transfer 148. Or by the second transfer 150, the laminated package tray is transferred to the receiving reservoir 166.

According to the present invention, the input direction of the package and the adhesive material and the discharge direction of the laminated package can be unified to reduce the working radius of the operator to improve the process efficiency, and the robot arm can be stored in the receiving state such as the receiving direction of the package and the adhesive material stored in the tray. By taking a photographing means provided in the by removing the defective tray early there is an effect that can be prevented in advance in the package bonding failure.

In addition, by checking the storage state of the package and the adhesive material stored in the nest picture, the operator is called only in a poor storage state, thereby reducing the work efficiency due to frequent worker calls.

In addition, the supply and discharge of the tray automatically proceeds within a limited area, thereby reducing the footprint of the apparatus.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims.

Claims (4)

A work table having a plurality of distribution holes through which trays are moved; A plurality of tray reservoirs arranged in a row on a bottom surface of the work table; A transfer installed in the work table to load and unload a tray from the tray storage; A fixed plate provided in the work table below the distribution hole to perform shanghai movement and to transfer the tray from the transfer; A robot arm installed at an upper portion of the distribution hole and equipped with photographing means for loading and unloading a material stored in the tray into a predetermined portion and photographing a state of the material stored in the tray; An aligner installed on the work table around the distribution hole to align the material in one direction; A plurality of nest pictures installed in an elliptical shape on the work table at the periphery of the aligner, and moving at a predetermined interval by one moving means; And A package jointer installed between specific nested pictures among the plurality of nested pictures; The semiconductor package stacking system comprising a. The tray storage of claim 1, wherein the tray storage device is a storage container for supplying a full-filled adhesive, a storage container for supplying a full-package tray, a storage container for recovering adhesive blanks, a storage container for recovering empty packages, and a storage tray for stacking stacked packages And a stacked package full tray reservoir. The semiconductor package stacking system of claim 2, wherein the tray storage device further comprises a storage device for recovering the defective adhesive tray and a storage device for recovering the defective package tray. The semiconductor package stacking system according to claim 1, wherein said moving means comprises a conveyor system.