CN215401685U

CN215401685U - Vacuum adsorption conveying device

Info

Publication number: CN215401685U
Application number: CN202120833095.0U
Authority: CN
Inventors: 曾晶; 王昌焱; 房用桥; 吕启涛; 谢圣君; 王习文; 徐新峰; 潘明铮; 张海泉; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Han s Laser Technology Industry Group Co Ltd
Priority date: 2021-04-22
Filing date: 2021-04-22
Publication date: 2022-01-04
Anticipated expiration: 2031-04-22

Abstract

The utility model relates to a vacuum adsorption conveying device. Which comprises a transmission disc, a vacuum suction nozzle and a pressure alarm. The transmission disc is provided with a sample groove, the sample groove is used for placing the cut circuit board, and the circuit board and the sample groove can form a closed cavity; the vacuum suction nozzle is arranged on the surface of the sample tank and used for adsorbing the circuit board, and the vacuum suction nozzle can monitor the vacuum degree in the closed cavity; the pressure alarm is connected with the vacuum suction nozzle, and when the vacuum degree in the closed cavity is lower than a preset value, the pressure alarm can give an alarm. Through this vacuum adsorption transmission device, the effectual in-process of accomodating in the transmission of having avoided, the circuit board from the sample cell in fly out or the relative sample cell periphery the warping condition appear, also make the circuit board in the follow-up letter sorting in-process be difficult to appear losing or by the condition that mechanical hand pressed bad, reduced the cost of circuit board processing.

Description

Vacuum adsorption conveying device

Technical Field

The utility model relates to the technical field of processing and transportation of circuit boards, in particular to a vacuum adsorption transmission device.

Background

PCB is one of the important components in the electronic industry, and is used as a support for electronic components, and is widely used in the production of electronic products in recent years. When the PCB having a large size is cut into a PCB having a small size, the PCB after the cutting operation needs to be transferred and received. In the prior art, generally, the transmission and storage are carried out in a manual or full-automatic mode, when manual operation is selected for carrying out transmission and storage, the health of workers is inevitably affected due to the problems of production environment, and the number of workers to be input is large, so that the processing cost is increased; when the circuit board is selected to be transported and stored in a full-automatic mode, the size of the circuit board after cutting is small, the circuit board is easy to fly out of the sample tank or warp relative to the periphery of the sample tank in the transporting and storing process, the circuit board is easy to lose or be damaged by mechanical hand pressure in the subsequent sorting process, and the processing cost of the circuit board is increased invisibly.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to carry out the transmission after the cutting to the circuit board and accomodate the in-process, when accomodating through the transmission of full automatization mode, because the circuit board easily flies out or the relative sample cell periphery warp condition appears from the sample cell in, and then leads to the circuit board to appear losing or the technical problem that is damaged by mechanical hand very easily in follow-up letter sorting process, provides a vacuum adsorption transmission device.

A vacuum adsorption transfer device, comprising:

the transmission disc is provided with a sample groove, the sample groove is used for placing the cut circuit board, and the circuit board and the sample groove can form a closed cavity;

the vacuum suction nozzle is arranged on the surface of the sample groove and used for adsorbing the circuit board, and the vacuum suction nozzle can monitor the vacuum degree in the closed cavity;

and the pressure alarm is connected with the vacuum suction nozzle, and can give an alarm when the vacuum degree in the closed cavity is lower than a preset value.

In one embodiment, the number of the sample grooves is multiple, the multiple sample grooves are arranged at intervals along the length direction and the width direction of the transmission plate, and the number of the vacuum suction nozzles is adapted to the number of the sample grooves.

In one embodiment, the vacuum adsorption conveying device further comprises a moving assembly, the conveying disc is connected with the moving assembly, and the moving assembly is used for moving the conveying disc to a preset position.

In one embodiment, the moving assembly includes a slide rail, a slider, and a first driving member, the slider is slidably connected to the slide rail, the first driving member is connected to the slider, the first driving member is configured to drive the slider to slide to a predetermined position along a length direction of the slide rail, the transmission disc is mounted on the slider, and the transmission disc and the slider move synchronously.

In one embodiment, the vacuum adsorption conveying device further comprises a receiving tray and a sorting assembly, and when the conveying tray moves to the preset position, the sorting assembly is used for grabbing the circuit boards on the conveying tray onto the receiving tray.

In one embodiment, a plurality of accommodating grooves are formed in the accommodating tray, the accommodating grooves are distributed on the accommodating tray in an array manner, and each accommodating groove is used for accommodating one circuit board.

In one embodiment, the sorting assembly comprises a spider hand unit and a sucker, the sucker is connected with the spider hand unit, the spider hand unit can drive the sucker to move in a preset track, and the sucker is used for grabbing the circuit board in the sample groove into the accommodating groove.

In one embodiment, the vacuum adsorption conveying device further comprises a receiving assembly, the receiving tray is arranged on the receiving assembly, and the receiving assembly is used for moving the receiving tray to a preset receiving position.

In one embodiment, the receiving assembly comprises a feeding unit, a conveying unit and a discharging unit;

the feeding unit is installed on one side of the conveying unit, the discharging unit is installed on the other side of the conveying unit, the feeding unit is used for bearing empty storage trays, the feeding unit can move the empty storage trays to the conveying unit, when the conveying unit conveys the empty storage trays to a preset position, the circuit boards in the sample grooves are grabbed to the storage grooves by the suckers, the conveying unit conveys the storage trays to the discharging unit, and the discharging unit is used for moving the storage trays to the preset storage position.

In one embodiment, the feeding unit and the discharging unit respectively comprise flange clamping plates, the flange clamping plates are arranged on two opposite sides of the storage tray, the flange clamping plates can move close to and away from the storage tray, and the baffle clamping plates are used for clamping the storage tray.

The utility model has the beneficial effects that:

according to the vacuum adsorption transmission device provided by the utility model, when the circuit board is transmitted and stored after being cut, the cut circuit board is firstly placed in the sample groove on the transmission disc, the vacuum suction nozzle is arranged on the surface of the sample groove, so that the circuit board can be firmly adsorbed in the sample groove, and the vacuum suction nozzle can monitor the vacuum degree of the sealed cavity formed by the circuit board placed in the sample groove and the sample groove, so that when the circuit board warps relative to the periphery of the sample groove, the vacuum value in the sealed cavity is lower than a preset value, and at the moment, the pressure alarm connected with the vacuum suction nozzle can give a warning to remind a worker. Through this vacuum adsorption transmission device, the effectual in-process of accomodating in the transmission of having avoided, the circuit board from the sample cell in fly out or the relative sample cell periphery the warping condition appear, also make the circuit board in the follow-up letter sorting in-process be difficult to appear losing or by the condition that mechanical hand pressed bad, reduced the cost of circuit board processing.

Drawings

Fig. 1 is a schematic view of a vacuum adsorption transfer device according to an embodiment of the present invention;

FIG. 2 is a schematic view of a transfer plate of the vacuum adsorption transfer device shown in FIG. 1;

FIG. 3 is a schematic view of the vacuum chuck transport apparatus of FIG. 1 with the transport plate mounted to the movable assembly;

FIG. 4 is a schematic view of the internal structure of the vacuum adsorption transfer device shown in FIG. 1;

FIG. 5 is a schematic view of the sorting module of the vacuum adsorption transfer device shown in FIG. 1;

FIG. 6 is a schematic view of a receiving assembly of the vacuum adsorption transfer device shown in FIG. 1;

FIG. 7 is a front view of the receiving assembly shown in FIG. 6;

fig. 8 is a schematic structural view of a transfer unit in the receiving assembly shown in fig. 6.

Reference numerals: 100-a transport tray; 110-a sample cell; 111-a vacuum nozzle; 210-a slide rail; 220-a slide block; 230-a first driver; 240-a mounting seat; 300-a storage tray; 310-a receiving groove; 400-a sorting assembly; 410-spider hand unit; 411-a second drive member; 420-a sucker; 510-a feeding unit; 511-a first lifting drive; 520-a transfer unit; 521-a third driver; 522-a base plate; 523-first fixed plate; 524-second fixing plate; 525-a transport rail; 530-a blanking unit; 531-second lifting drive; 600-flange clamping plates; 700-retaining bars; 800-outer shell.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, fig. 1 is a schematic view illustrating a vacuum adsorption transfer device according to an embodiment of the present invention, which includes a transfer plate 100, a vacuum suction nozzle 111, and a pressure alarm. The transmission plate 100 is provided with a sample groove 110, the sample groove 110 is used for placing a cut circuit board, and the circuit board and the sample groove 110 can form a closed cavity; the vacuum suction nozzle 111 is arranged on the surface of the sample tank 110, the vacuum suction nozzle 111 is used for adsorbing the circuit board, and the vacuum suction nozzle 111 can monitor the vacuum degree in the closed cavity; the pressure alarm is connected with the vacuum suction nozzle 111, and when the vacuum degree in the closed cavity is lower than a preset value, the pressure alarm can give an alarm.

In this embodiment, the circuit board is a PCB, in the actual use process of the vacuum adsorption transmission device, when the PCB is cut and then transmitted and stored, the cut PCB is placed in the sample groove 110 on the transmission tray 100, because the surface of the sample groove 110 is provided with the vacuum suction nozzle 111, the PCB can be firmly adsorbed in the sample groove 110, and the vacuum suction nozzle 111 can monitor the vacuum degree of the sealed cavity formed by the PCB placed in the sample groove 110 and the sample groove 110, when the PCB warps around the sample groove 110, the vacuum value in the sealed cavity is lower than the preset value, and the pressure alarm connected with the vacuum suction nozzle 111 sends an alarm to remind the worker. Through this vacuum adsorption transmission device, the effectual in-process of accomodating of having avoided in the transmission, the PCB circuit board flies out or the relative sample cell 110 periphery condition of warping appears in the sample cell 110, also makes the PCB circuit board be difficult to appear losing or by the condition that mechanical hand pressed badly in the follow-up letter sorting process, has reduced the cost of PCB circuit board processing.

The structure of the vacuum adsorption transfer device is described in detail below, please refer to fig. 2-8, fig. 2 shows a schematic view of the transfer plate 100 of the vacuum adsorption transfer device shown in fig. 1; FIG. 3 shows a schematic view of the vacuum adsorption transfer device of FIG. 1 with the transfer plate 100 mounted to the moving assembly; FIG. 4 is a schematic view showing an internal structure of the vacuum adsorption transfer device shown in FIG. 1; FIG. 5 is a schematic diagram of the sorter assembly 400 of the vacuum adsorption transfer device of FIG. 1; FIG. 6 is a schematic view of a receiving assembly of the vacuum adsorption transfer device shown in FIG. 1; FIG. 7 illustrates a front view of the receiving assembly shown in FIG. 6;

fig. 8 is a schematic view illustrating a structure of the transfer unit 520 in the receiving assembly shown in fig. 6.

Referring to fig. 1 to 4, in the vacuum adsorption transfer device according to an embodiment of the present invention, the number of the sample grooves 110 is plural, the plural sample grooves 110 are arranged at intervals along the length direction and the width direction of the transfer tray 100, and the number of the vacuum nozzles 111 is adapted to the number of the sample grooves 110.

Referring to fig. 3, the vacuum adsorption transfer device according to an embodiment of the present invention further includes a moving assembly, wherein the transfer tray 100 is connected to the moving assembly, and the moving assembly is configured to move the transfer tray 100 to a predetermined position. Specifically, the moving assembly includes a slide rail 210, a slider 220 and a first driving member 230, the slider 220 is slidably connected to the slide rail 210, the first driving member 230 is connected to the slider 220, the first driving member 230 is used for driving the slider 220 to slide to a predetermined position along the length direction of the slide rail 210, the transmission disc 100 is mounted on the slider 220, and the transmission disc 100 and the slider 220 move synchronously.

Referring to fig. 1, the vacuum adsorption transmission device according to an embodiment of the present invention further includes a housing 800 and a mounting seat 240, the mounting seat 240 is connected to a side of the slide rail 210 away from the transmission disc 100, and the mounting seat 240 can mount the moving assembly on the housing 800, so that the transmission and storage of the cut PCB circuit board can be completed in the housing 800, and the operation is safer.

Specifically, the transmission disc 100 is installed on the slider 220, the cut PCB circuit board is placed in the sample slot 110, and since the transmission disc 100 is installed on the slider 220, when the first driving member 230 drives the slider 220 to slide along the length direction of the slide rail 210, the slider 220 can drive the cut PCB circuit board to move to a preset position.

Referring to fig. 4, 5 and 6, the vacuum adsorption transfer device according to an embodiment of the present invention further includes a receiving tray 300 and a sorting assembly 400, wherein when the transfer tray 100 moves to a predetermined position, the sorting assembly 400 is used to pick the PCB circuit board on the transfer tray 100 onto the receiving tray 300. Specifically, a plurality of storage grooves 310 are formed in the storage tray 300, the plurality of storage grooves 310 are distributed in an array manner on the storage tray 300, and each storage groove 310 is used for placing a cut PCB.

Referring to fig. 4 and 5, in one embodiment, the sorting assembly 400 includes a spider-hand unit 410 and a suction cup 420, the suction cup 420 is connected to the spider-hand unit 410, the spider-hand unit 410 can drive the suction cup 420 to move within a predetermined track, and the suction cup 420 is used for grabbing the PCB circuit board in the sample well 110 into the receiving well 310.

Specifically, the predetermined trajectory of the spider-hand unit 410 carrying the suction cup 420 is within a circular area below the suction cup 420 in fig. 4 and 5. The spider-hand unit 410 includes a second driving member 411 and a spider-arm, and the second driving member 411 can drive the spider-arm to move along a predetermined track in a circular area under the suction cup 420.

Referring to fig. 4 and 6-8, in one embodiment, the vacuum adsorption transfer device further includes a receiving assembly, on which the receiving tray 300 is disposed, for moving the receiving tray 300 to a preset receiving position. Specifically, the receiving assembly includes a feeding unit 510, a transferring unit 520, and a discharging unit 530. The feeding unit 510 is installed at one side of the conveying unit 520, the discharging unit 530 is installed at the other side of the conveying unit 520, the feeding unit 510 is used for bearing the empty receiving tray 300, the feeding unit 510 can move the empty receiving tray 300 to the conveying unit 520, when the conveying unit 520 conveys the empty receiving tray 300 to a preset position, the suction cup 420 captures the PCB circuit board in the sample tank 110 to the receiving tank 310, the conveying unit 520 conveys the receiving tray 300 to the discharging unit 530, and the discharging unit 530 is used for moving the receiving tray 300 to the preset receiving position.

Specifically, referring to fig. 8, the feeding unit 510 according to an embodiment of the present invention includes a first lifting driving member 511; the transferring unit 520 includes a third driving member 521, a bottom plate 522, a first fixing plate 523, a second fixing plate 524, and a transferring guide 525, wherein the third driving member 521, the first fixing plate 523, the second fixing plate 524, and the transferring guide 525 are all mounted on the bottom plate 522; the discharging unit 530 includes a second lifting driver 531.

Specifically, when the cut PCB is placed in the sample slot 110 of the transmission disc 100, the first driving member 230 drives the sliding block 220 to move, so that the cut PCB can be moved to a preset position through the sliding block 220, and the second driving member 411 drives the spider arm to drive the suction cup 420 to move, so as to capture the PCB in the sample slot 110. At this time, the first lifting driving member 511 drives the empty receiving tray 300 to move in the vertical direction, the clamp clamps the empty receiving tray 300 moved to the preset position and places the empty receiving tray 300 above the transferring unit 520, the third driving member 521 drives the transferring guide 525 to move in the horizontal direction, the empty receiving tray 300 and the transferring guide 525 can move synchronously, when the empty receiving tray 300 moves to the preset position, the spider-hand unit 410 puts the PCB circuit board grabbed by the suction cup 420 into the receiving slot 310, when the receiving slot 310 in the receiving tray 300 is completely put into the PCB circuit board, the third driving member 521 continues to drive the receiving tray 300 to move to the blanking unit 530 in the horizontal direction, at this time, the second lifting driving member 531 drives the blanking unit 530 to move downwards, so that the receiving tray 300 can be put above the blanking unit 530, when the receiving tray 300 moves to the lower part of the blanking unit 530 through the transferring guide 525, at this time, the second lifting/lowering driver 531 drives the discharging unit 530 to move upward, and finally moves the receiving tray 300 to a preset receiving position. Specifically, the feeding unit 510 is mounted to the first fixing plate 523, and the discharging unit 530 is mounted to the second fixing plate 524. Through the vacuum adsorption transmission device that this embodiment provided for the very simple and convenient of work is accomodate in the transmission of the PCB circuit board after the cutting, also need not the manual work to accomodate the operation, has improved the efficiency of accomodating transmission work greatly.

Referring to fig. 4, 6 and 7, the feeding unit 510 and the discharging unit 530 of the vacuum adsorption conveying apparatus according to an embodiment of the present invention each include a flange clamp 600, the flange clamps 600 are disposed at two opposite sides of the receiving tray 300, the flange clamps 600 can move toward and away from the receiving tray 300, and the baffle clamps are used for clamping the receiving tray 300.

In one embodiment, the number of the rib clamping plates 600 is two, the two rib clamping plates 600 are symmetrically arranged at two sides of the receiving tray 300, when the rib clamping plates 600 move close to the receiving tray 300, the receiving tray 300 can be clamped, and at this time, the receiving tray 300 on the feeding unit 510 and the discharging unit 530 is not easy to move; when the flange clamping plate 600 moves away from the receiving tray 300, the receiving tray 300 can be clamped by the clamp and moved to the upper side of the conveying unit 520, so that the receiving tray 300 can be moved to a preset position and the receiving work of the cut PCB circuit board can be completed.

Referring to fig. 6 and 7, in the retaining bars 700 of the vacuum adsorption conveying device according to an embodiment of the present invention, the retaining bars 700 are disposed around the feeding unit 510 and the discharging unit 530, and when a plurality of receiving trays 300 are placed in the feeding unit 510 and the discharging unit 530, the retaining bars 700 can fix the stacked receiving trays 300, thereby effectively preventing the receiving trays 300 from moving relative to each other.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A vacuum suction transfer device, characterized in that the vacuum suction transfer device comprises:

2. The vacuum adsorption conveying device according to claim 1, wherein the number of the sample grooves is plural, the plural sample grooves are arranged at intervals along the length direction and the width direction of the conveying disc, and the number of the vacuum suction nozzles is adapted to the number of the sample grooves.

3. The vacuum suction transfer device of claim 1, further comprising a moving assembly, wherein the transfer plate is connected to the moving assembly, and the moving assembly is configured to move the transfer plate to a predetermined position.

4. The vacuum suction conveying device according to claim 3, wherein the moving assembly comprises a slide rail, a slide block and a first driving member, the slide block is slidably connected to the slide rail, the first driving member is connected to the slide block, the first driving member is used for driving the slide block to slide to a preset position along the length direction of the slide rail, the conveying disc is mounted on the slide block, and the conveying disc and the slide block move synchronously.

5. The vacuum suction transfer device of claim 1, further comprising a receiving tray and a sorting assembly, wherein when the transfer tray moves to a predetermined position, the sorting assembly is configured to grab the circuit board on the transfer tray onto the receiving tray.

6. The vacuum suction transfer device of claim 5, wherein the receiving tray is provided with a plurality of receiving grooves, the plurality of receiving grooves are distributed on the receiving tray in an array, and each receiving groove is used for accommodating one circuit board.

7. The vacuum suction conveying apparatus according to claim 6, wherein the sorting assembly includes a spider hand unit and a suction cup, the suction cup is connected to the spider hand unit, the spider hand unit can drive the suction cup to move in a predetermined track, and the suction cup is used for grabbing the circuit board in the sample groove into the receiving groove.

8. The vacuum suction transfer device of claim 7, further comprising a receiving assembly on which the receiving tray is disposed, the receiving assembly being configured to move the receiving tray to a preset receiving position.

9. The vacuum suction transfer device of claim 8, wherein the receiving assembly comprises a loading unit, a conveying unit and a blanking unit;

10. The vacuum suction conveying device according to claim 9, wherein the feeding unit and the discharging unit each include a rib clamp, the rib clamps are disposed at opposite sides of the receiving tray, the rib clamps can move toward and away from the receiving tray, and the baffle clamps are used for clamping the receiving tray.