KR20020080367A - 동적접촉지향식 만능회로그래버 - Google Patents
동적접촉지향식 만능회로그래버 Download PDFInfo
- Publication number
- KR20020080367A KR20020080367A KR1020027008945A KR20027008945A KR20020080367A KR 20020080367 A KR20020080367 A KR 20020080367A KR 1020027008945 A KR1020027008945 A KR 1020027008945A KR 20027008945 A KR20027008945 A KR 20027008945A KR 20020080367 A KR20020080367 A KR 20020080367A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- circuit
- cam
- deflectable
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004020 conductor Substances 0.000 claims description 96
- 230000004913 activation Effects 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 32
- 239000012212 insulator Substances 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims description 15
- 238000007906 compression Methods 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 230000013011 mating Effects 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000012190 activator Substances 0.000 claims 13
- 230000003993 interaction Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 238000002788 crimping Methods 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 13
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/479,956 | 2000-01-10 | ||
| US09/479,956 US6375489B1 (en) | 2000-01-10 | 2000-01-10 | Dynamic contact orientating universal circuit grabber |
| PCT/US2000/010668 WO2001052361A1 (en) | 2000-01-10 | 2000-04-19 | Dynamic contact orientating universal circuit grabber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20020080367A true KR20020080367A (ko) | 2002-10-23 |
Family
ID=23906103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020027008945A Abandoned KR20020080367A (ko) | 2000-01-10 | 2000-04-19 | 동적접촉지향식 만능회로그래버 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6375489B1 (https=) |
| EP (1) | EP1254493A4 (https=) |
| JP (1) | JP2003520401A (https=) |
| KR (1) | KR20020080367A (https=) |
| CN (1) | CN1256791C (https=) |
| AU (1) | AU2000242509A1 (https=) |
| CA (1) | CA2397058C (https=) |
| MX (1) | MXPA02006811A (https=) |
| RU (1) | RU2233019C2 (https=) |
| WO (1) | WO2001052361A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008004695B4 (de) * | 2008-01-16 | 2012-10-25 | Airbus Operations Gmbh | Individuelle Temperierung von Luftfahrzeugkabinenbereichen durch Heizen und Verdunstungskühlung |
| US9583438B2 (en) | 2014-12-26 | 2017-02-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Interconnect structure with misaligned metal lines coupled using different interconnect layer |
| US10784553B2 (en) * | 2018-09-07 | 2020-09-22 | International Business Machines Corporation | Well thermalized stripline formation for high-density connections in quantum applications |
| CN109687191B (zh) * | 2018-12-07 | 2020-02-25 | 金华送变电工程有限公司 | 一种便捷式个人保安线 |
| FR3100984B1 (fr) * | 2019-09-20 | 2021-09-03 | Technoflex | Connecteur monobloc pour poche de perfusion souple |
| CN113156292A (zh) * | 2020-01-23 | 2021-07-23 | 旭景科技股份有限公司 | 用于测试电子装置的接触器 |
| TWI819451B (zh) * | 2021-12-29 | 2023-10-21 | 唐虞企業股份有限公司 | 連接器總成及其母端連接器與公端連接器 |
| CN114572123B (zh) * | 2022-04-29 | 2022-07-01 | 江苏英拓动力科技有限公司 | 一种电动卡车用动力总成域控制器 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1209452A (en) * | 1967-01-24 | 1970-10-21 | Mcmurdo Instr Company Ltd | Improvements in or relating to tape cable connectors |
| US3605073A (en) * | 1969-09-05 | 1971-09-14 | United Carr Inc | Connector for flat cable |
| US4606594A (en) * | 1985-04-22 | 1986-08-19 | Amp Incorporated | ZIF connector with wipe |
| EP0336994A1 (de) * | 1988-04-14 | 1989-10-18 | INOVAN GmbH & Co. KG Metalle und Bauelemente | Verbinder für Flachleiterbandkabel |
| US5096426A (en) * | 1989-12-19 | 1992-03-17 | Rogers Corporation | Connector arrangement system and interconnect element |
| US5163834A (en) * | 1990-12-17 | 1992-11-17 | International Business Machines Corporation | High density connector |
| US5220725A (en) * | 1991-04-09 | 1993-06-22 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
| SE470370B (sv) * | 1992-06-22 | 1994-01-31 | Pricer Norden Ab | Metod och anordning vid en prismärkningsanordning |
| US5895207A (en) | 1993-06-17 | 1999-04-20 | Itt Automotive Europe, Gmbh | Electric motor-pump assembly |
| GB9508690D0 (en) | 1995-04-28 | 1995-06-14 | Amp Gmbh | Zero insertion force connector with wiping action |
| DE19516338C1 (de) * | 1995-05-04 | 1996-08-22 | Vera Feistkorn | Verbindungsklemme für elektrische Leiter |
| US5791912A (en) * | 1995-12-01 | 1998-08-11 | Riechelmann; Bernd | Contactor with multiple redundant connecting paths |
| JP3362591B2 (ja) * | 1996-02-23 | 2003-01-07 | 住友電装株式会社 | フレキシブルプリント基板用コネクタ |
| US5759047A (en) * | 1996-05-24 | 1998-06-02 | International Business Machines Corporation | Flexible circuitized interposer with apertured member and method for making same |
| US5939672A (en) * | 1997-03-10 | 1999-08-17 | Antronix, Inc. | Hermetically sealed electrical connection to a junction box |
| US5938451A (en) | 1997-05-06 | 1999-08-17 | Gryphics, Inc. | Electrical connector with multiple modes of compliance |
| DE69735253T2 (de) * | 1997-07-04 | 2006-07-27 | Agilent Technologies Inc., A Delaware Corp., Palo Alto | Komprimierbares elastomerisches Kontaktelement und mechanischer Zusammenbau mit einem solchen Kontaktelement |
| US5921794A (en) | 1997-09-25 | 1999-07-13 | Tru-Connector Corporation | Connector with integral switch actuating cam |
| US5913699A (en) * | 1997-11-03 | 1999-06-22 | Molex Incorporated | Laminated spring structure and flexible circuitry connector incorporating same |
| US6118072A (en) * | 1997-12-03 | 2000-09-12 | Teledyne Technologies Incorp. | Device having a flexible circuit disposed within a conductive tube and method of making same |
| US5938458A (en) | 1998-06-17 | 1999-08-17 | Molex Incorporated | Lever type electrical connector |
| US6727115B2 (en) * | 2001-10-31 | 2004-04-27 | Hewlett-Packard Development Company, L.P. | Back-side through-hole interconnection of a die to a substrate |
-
2000
- 2000-01-10 US US09/479,956 patent/US6375489B1/en not_active Expired - Fee Related
- 2000-04-19 AU AU2000242509A patent/AU2000242509A1/en not_active Abandoned
- 2000-04-19 WO PCT/US2000/010668 patent/WO2001052361A1/en not_active Ceased
- 2000-04-19 CN CNB008193045A patent/CN1256791C/zh not_active Expired - Fee Related
- 2000-04-19 EP EP00922305A patent/EP1254493A4/en not_active Withdrawn
- 2000-04-19 CA CA002397058A patent/CA2397058C/en not_active Expired - Fee Related
- 2000-04-19 RU RU2002121506/09A patent/RU2233019C2/ru not_active IP Right Cessation
- 2000-04-19 MX MXPA02006811A patent/MXPA02006811A/es active IP Right Grant
- 2000-04-19 JP JP2001552477A patent/JP2003520401A/ja active Pending
- 2000-04-19 KR KR1020027008945A patent/KR20020080367A/ko not_active Abandoned
-
2001
- 2001-11-16 US US09/991,592 patent/US6756250B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1254493A1 (en) | 2002-11-06 |
| US6756250B2 (en) | 2004-06-29 |
| RU2002121506A (ru) | 2004-02-20 |
| CA2397058C (en) | 2009-01-20 |
| RU2233019C2 (ru) | 2004-07-20 |
| CA2397058A1 (en) | 2001-07-19 |
| JP2003520401A (ja) | 2003-07-02 |
| US6375489B1 (en) | 2002-04-23 |
| MXPA02006811A (es) | 2004-01-27 |
| WO2001052361A1 (en) | 2001-07-19 |
| CN1451192A (zh) | 2003-10-22 |
| EP1254493A4 (en) | 2004-10-06 |
| US20020081891A1 (en) | 2002-06-27 |
| AU2000242509A1 (en) | 2001-07-24 |
| CN1256791C (zh) | 2006-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20020710 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20030407 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20050418 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20060929 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20070628 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20080227 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |