KR20020038592A - Substrate, stage device, method of driving stage, exposure system and exposure method - Google Patents

Abstract

The stage device 4 can move on the support part 8 in the one direction by the reaction force provided by the support part 8 provided vibratingly independent of the surface plate 3 and the driving of the stage main body 2. A reaction force stage 17 is provided.

As a result, problems such as vibration return due to reaction force can be avoided, so that the settling time can be shortened, the productivity can be improved, and the residual vibration of the support portion can be suppressed from being transmitted to the surface plate.

Description

Substrate, stage device, stage driving method, exposure apparatus and exposure method {SUBSTRATE, STAGE DEVICE, METHOD OF DRIVING STAGE, EXPOSURE SYSTEM AND EXPOSURE METHOD}

Conventionally, in a lithography process, which is one of the manufacturing processes of a semiconductor device, a circuit pattern formed on a mask or a reticle (hereinafter referred to as a reticle) is transferred onto a substrate such as a wafer or glass plate coated with a resist (photosensitive agent). Various exposure apparatuses are used. For example, as an exposure apparatus for a semiconductor device, the pattern of a reticle is reduced and transferred onto a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of the pattern due to the recent high integration of integrated circuits. A reduction projection exposure apparatus is mainly used.

As this reduced-projection exposure apparatus, the step-and-repeat-type static exposure type reduced-projection exposure apparatus (so-called stepper) or this stepper which sequentially transfers a pattern of a reticle to a plurality of shot regions (exposure regions) on the wafer. Is a step-and-scan scanning exposure type that transfers the reticle pattern to each shot region on the wafer by synchronously moving the reticle and the wafer in one-dimensional directions as disclosed in Japanese Patent Application Laid-Open No. 8-166043. An apparatus (so-called scanning stepper) is known.

In these reduced projection exposure apparatuses, as a stage apparatus, a base plate serving as a reference for the apparatus is first provided on a floor surface, and a reticle stage, a wafer stage, and a projection optical system (projection) are provided thereon with a dustproof table for blocking floor vibration. The main body column which supports a lens) etc. is arrange | positioned widely. In recent stage apparatuses, as said dustproof stand, actuators, such as an air mount which can control internal pressure, a voice coil motor, etc., are attached to a main body column (main frame), for example, the measured value of six accelerometers On the basis of this, an active dustproof stand for controlling the vibration of the body column by controlling the voice coil motor or the like is adopted.

By the way, in the above stepper and the like, exposure is repeated one after another with respect to a predetermined shot area on the wafer, so that the wafer stage (stepper) or the reticle stage and the wafer stage (scanning stepper) The reaction force generated by the acceleration and deceleration movements of the case becomes a vibration factor of the main body column, which causes a relative position error between the projection optical system and the wafer. The relative position error during alignment or exposure results in image blur when the pattern is transferred to a position different from the design value on the wafer or includes a vibration component in the position error (increase in pattern line width). There was a drawback to cause. Therefore, in order to suppress such a fault, it is necessary to sufficiently damp the vibration of a main body column by said active shake table etc. For example, in the case of a stepper, it is necessary to wait for the wafer stage to be positioned at a desired position and to be sufficiently corrected to start an alignment operation or an exposure operation. Moreover, in the case of a scanning stepper, it was necessary to perform exposure in the state which fully secured the synchronous correction of a reticle stage and a wafer stage. Therefore, it became a factor which worsens throughput.

Therefore, in order to remedy such drawbacks, for example, as described in Japanese Patent Laid-Open No. 8-166475, the reaction force generated by the movement of the wafer stage is mechanically transferred to the floor using the frame member. As disclosed in Japanese Patent Application Laid-Open No. Hei 8-330224, for example, the invention in which the reaction force generated by the movement of the reticle stage is mechanically escaped to the floor using the frame member is disclosed. Known.

However, the following problems exist in the conventional stage apparatus and exposure apparatus as mentioned above.

With the recent increase in the size of a reticle or wafer, both stages are enlarged, and even if the invention described in JP-A-8-166475 or JP-A-8-330224 is used, the floor side is along the frame member. The frame member itself vibrates due to the reaction force that escapes, or the reaction force that escapes the floor is transmitted to the main body column (main body) that holds the projection optical system through the vibration isolation zone, so that vibration is returned. There is a risk of return. Therefore, it becomes difficult to perform high-precision exposure, ensuring the productivity to some extent.

So, for example, Japanese Unexamined Patent Application Publication No. 8-63231 discloses a technique in which a stage main body and a drive frame supported by a support are mounted on a base, and the drive frame is retracted by reaction force caused by the forward movement of the stage main body. have. According to this technique, the law of conservation of momentum acts between the stage main body and the drive frame, and the center position of the device on the base is maintained, so that the influence of vibration on the frame member can be reduced. By the way, even when this technique was adopted, it was impossible to completely eliminate the influence of the reaction force when the stage was enlarged or increased in speed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object thereof is to provide a stage apparatus, a stage driving method, an exposure apparatus, and an exposure method capable of maintaining position controllability of a stage even when a large stage or a high speed stage is used. It is done. Another object of the present invention is to provide an exposure apparatus and an exposure method capable of performing high-precision exposure while securing a certain degree of productivity even when using a large stage or a high speed stage. Further, another object of the present invention is to provide a substrate on which a pattern is exposed with high accuracy.

The present invention provides a stage apparatus, a driving method thereof, and a stage apparatus, in which a substrate to which a pattern of a mask is exposed, such as a glass substrate or a wafer, and a stage main body holding the substrate moves in a plane on a surface plate. An exposure apparatus and an exposure method for performing an exposure process using a mask and a substrate held in a substrate, and particularly, a substrate and a stage which are very suitable for use in a lithography process when manufacturing a device such as a semiconductor integrated circuit or a liquid crystal display device. An apparatus, a stage driving method, an exposure apparatus, and an exposure method.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of this invention, and is a schematic block diagram of the exposure apparatus in which the reticle stage, the wafer stage, and the projection optical system are arrange | positioned independently with respect to vibration.

2 is an external perspective view of a stage apparatus having the reticle stage described above.

It is a figure which shows 1st Embodiment of this invention, The side view of the stator with the spring connected to both sides.

4 is a partially enlarged view of a stage apparatus having a wafer stage.

5 is an enlarged view of a main portion of a linear motor for driving a wafer stage;

FIG. 6 is a diagram showing a second embodiment of the present invention, wherein a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are disposed independently of vibration; FIG.

7 is an external perspective view showing another embodiment of the stage apparatus having the wafer stage described above.

8 is a flowchart showing an example of a process of manufacturing a semiconductor device.

In order to achieve the said objective, this invention employ | adopts the following structures corresponding to FIGS. 1-7 which show embodiment.

The stage device of the present invention is a stage device (4, 7) having a stage body (2, 5) capable of driving on at least one direction on the surface (3, 6), vibrating with respect to the surface (3, 6) Reactive support stages 17 and 37 which can be moved independently in the one direction by supporting forces 8 and 10 independently installed, and reaction forces caused by the driving of the stage bodies 2 and 5, respectively. It is characterized by including. In addition, the stage driving method of the present invention is a stage driving method including the first stages 2 and 5 capable of driving on the surface plates 3 and 6 in at least one direction. The second stages 17 and 37 which can move in one direction by the reaction force according to the driving are supported on the support parts 8 and 10 which are vibratingly independent of the surface plates 3 and 6. Therefore, in the stage apparatus and stage driving method of the present invention, when the stage main bodies 2 and 5 serving as the first stage are driven in one direction on the base plates 3 and 6, the stage main bodies 2 and 5 are driven by the driving of the stage main bodies 2 and 5. Since the reaction force stages 17 and 37 which are the second stages move in the opposite directions to the stage bodies 2 and 5 by the reaction force, the momentum is preserved between the stage bodies 2 and 5 and the reaction force stages 17 and 37. The law works. Since the reaction force stages 17, 37 move on the support parts 8, 10 which are vibrationally independent with respect to the table 3, 6, the vibrations of the support parts 8, 10 are not transmitted to the table 3, 6. Therefore, it can be prevented from affecting the position controllability of the stage main bodies 2 and 5.

Moreover, the exposure apparatus of this invention is a mask in the exposure apparatus 1 which exposes the pattern of the mask R hold | maintained at the mask stage 2 to the board | substrate W hold | maintained at the board | substrate stage 5, The mask The stage apparatuses 4 and 7 according to any one of claims 1 to 9 of the claims are used as at least one of the stage 2 and the substrate stage 5. Moreover, the exposure method of this invention is an exposure method which exposes the pattern of the mask R hold | maintained at the mask stage 2 to the board | substrate W hold | maintained at the board | substrate stage 5, The mask stage 2 And the stage driving method according to any one of claims 17 to 20 as a driving method of at least one stage of the substrate stage 5. Therefore, in the exposure apparatus and exposure method of this invention, the settling time of the stage main bodies 2 and 5 holding the mask R or the board | substrate W is shortened, productivity improves, and stage main bodies 2 and 5 are improved. Since the position controllability can be maintained by suppressing the influence of the vibration added to), high-precision exposure can be performed. In addition, by vibrating the mask stage 2, the substrate stage 5, and the projection optical system PL independently from each other, vibration caused by the driving of the mask stage 2 and the substrate stage 5 is caused by the projection optical system PL. Since it can also be prevented from being transmitted to, the imaging characteristic of the mask R pattern can also be improved. The pattern of the mask R is transferred to the substrate W exposed by such an exposure method with high accuracy.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of the board | substrate, the stage apparatus, the stage drive method, the exposure apparatus, and the exposure method of this invention is demonstrated with reference to FIGS. Here, for example, a description will be given using an example in which a scanning stepper for transferring a circuit pattern of a semiconductor device formed on a reticle onto a wafer while synchronously moving the reticle and the wafer as the exposure apparatus. In this exposure apparatus, the stage apparatus of the present invention is applied to both the reticle stage and the wafer stage.

[First embodiment]

First, the first embodiment will be described with reference to FIGS. 1 to 5. The exposure apparatus 1 shown in FIG. 1 is an illumination optical system that illuminates a rectangular (or arc-shaped) illumination region on a reticle (mask) R with uniform illumination by exposure illumination light from a light source (not shown). (IU), a stage including a reticle stage (stage main body, first stage) 2 as a mask stage holding the reticle R, and a reticle surface plate (support) 3 supporting the reticle stage 2. Wafer stage (stage body, first) as a projection stage for holding the wafer W and the projection optical system PL for projecting the illumination light emitted from the apparatus 4, the reticle R onto the wafer (substrate) W A stage device 7 including a stage 5 and a wafer surface plate 6 holding the wafer stage 5, a reaction frame supporting the stage device 4 and the projection optical system PL. (Support part) is composed of approximately (8) have. Here, the optical axis direction of the projection optical system PL is made Z direction, the synchronous movement direction of the reticle R and the wafer W is made Y direction as a direction orthogonal to this Z direction, and the asynchronous movement direction is X direction. It is done. Moreover, let the rotation directions around each axis be (theta) Z, (theta) Y, (theta) X.

The illumination optical system IU is supported by a support column 9 fixed to the upper surface of the reaction frame 8. Moreover, as exposure illumination light, for example, far ultraviolet light such as ultraviolet rays (g-ray, i-ray) and KrF excimer laser light (wavelength 248 nm) in the ultraviolet region emitted from the ultra-high pressure mercury lamp ( DUV light) or vacuum ultraviolet light (VUV) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm). The reaction frame 8 is provided on the base plate 10 arranged horizontally on the floor surface, and end portions 8a and 8b protruding inward are formed on the upper side and the lower side, respectively.

The reticle surface plate 3 of the stage apparatus 4 is supported substantially horizontally through the dustproof unit (dustproof mechanism) 11 at the edge part 8a of the reaction frame 8 at each corner (in addition, inside the ground). (Not shown), and an opening portion 3a through which a pattern image formed in the reticle R passes. The dustproof unit 11 has a configuration in which an air mount 12 and a voice coil motor 13 capable of adjusting internal pressure are arranged in series on an end portion 8a. By these dustproof units 11, the minute vibration transmitted to the reticle base 3 via the base plate 10 and the reaction frame 8 is insulated at the micro G level.

The reticle stage 2 is supported on the reticle base 3 so as to be movable in two dimensions along the reticle base 3. A plurality of air bearings (air pads) 14, which are non-contact bearings, are fixed to the bottom of the reticle stage 2, and the reticle stage 2 is placed on the reticle surface 3 by these air bearings 14. Injury is supported through a degree of clearance. Moreover, the opening part 2a which communicates with the opening part 3a of the reticle base plate 3, and passes the pattern image of the reticle R in the center part of the reticle stage 2 is formed. In addition, the reticle stage 2 is capable of driving the reticle base 3 on the reticle base 3 in a predetermined stroke range by the two sets of linear motors (drive mechanisms) 15 in the Y direction, which is the scanning direction. In addition, the reticle stage 2 is connected to the reticle microscopic stage (not shown) which adsorbs-holds the reticle R, and micro-drives in a non-scanning direction (X direction) and (theta) Z direction, and this fine movement stage, Although there are coarse motion stages movable in X and Y directions, these are shown here as one stage. Therefore, the reticle stage 2 is configured to be linearly driven with a long stroke in the Y direction and to permit micro-driving in the X direction and the θZ direction.

As shown in Fig. 2, a pair of Y moving mirrors 18a and 18b made of corner cubes are fixed to the -Y direction end of the reticle stage 2, and to the + X direction end of the reticle stage 2 in the Y direction. An X moving mirror 19 made of an extended planar mirror is fixed. And three laser interferometers (not shown) which irradiate a side beam to these moving mirrors 18a, 18b, and 19 measure the distance from each moving mirror, so that X of the reticle stage 2, Positions in the Y and θZ (rotations around the Z axis) directions are measured with high accuracy.

As shown in FIG. 1, in the Z direction substantially center position of the X direction both sides of the reticle stage 2, the movable part 16 which incorporates a coil and extends in a Y direction is respectively provided integrally. A pair of stators 17 in a cross-sectional U-shape as reaction force stages (second stages) are disposed to face the movable elements 16, respectively. The stator 17 is comprised by the stator yoke and many permanent magnets which generate the alternating magnetic field arrange | positioned at predetermined intervals along the extending installation direction of this stator yoke. That is, the linear coil 15 of the moving coil type | mold is comprised by the movable part 16 and the stator 17, and the movable part 16 is Y by the electromagnetic interaction with the stator 17. As shown in FIG. It is made to drive in the direction (one direction). The weight ratio between the reticle stage 2 side including the mover 16 and the stator 17 side is set to approximately 1: 4.

As shown in FIG. 2, the rolling guide 20 is remodeled between each stator 17 and the upper surface of the reaction frame 8, respectively. The rolling guide 20 has a configuration in which a plurality of rollers (motors) 21 whose axes extend in the X direction and are rotated around each axis are arranged at regular intervals in the Y direction, and the stator 17 is a roller. It is possible to move in the Y direction with respect to the reaction frame 8 by the rotation of 21. In addition, as shown in FIG. 3, one end of a pair of springs (pressure parts) 22 and 22 constituting a return device for returning the stator 17 to the initial position on both sides in the Y direction of each stator 17. These are connected, respectively. These springs 22 have the other ends fixed to the reaction frame 8, and press the stators 17 at approximately the same force in opposite directions along the Y direction, respectively (for example, attracting). will be. Moreover, as for each spring 22, sufficient curvature amount (deformation amount) is set so that even when the stator 17 moves, it will deform | transform in an elastic range. In addition, this reticle stage 2 is a guideless stage which does not have a guide member for guiding the movement of the reticle stage 2 in the X and Y directions as can be clearly seen from FIGS. 1 and 2. It is.

As shown in Fig. 1, as the projection optical system PL, both of the object surface (reticle R) side and the image surface (wafer W) side are circularly telecentric. A refractive optical system with a 1/4 (or 1/5) reduction magnification, which has a projection field of view and is made of a refractive optical element (lens element) made of quartz or fluorite as an optical base material, is used. Therefore, when illumination light is irradiated to the reticle R, an imaging light beam from a portion of the circuit pattern on the reticle R illuminated by the illumination light is incident on the projection optical system PL, and The partial inverted image is confined to the slit shape at the center of the circular field of view on the projection optical system PL image side and formed. Thereby, the partial inverted image of the projected circuit pattern is reduced and transferred to the resist layer on the surface of one shot region among the plurality of shot regions on the wafer W disposed on the imaging surface of the projection optical system PL.

In FIG. 4, the lower side is shown enlarged from the projection optical system PL of the exposure apparatus 1. As shown in FIG. 4, the flange 23 integrated with the said barrel part is provided in the outer peripheral part of the barrel part of the projection optical system PL. And the projection optical system PL makes an optical axis direction to the barrel surface plate 25 which consists of casting etc. which were supported substantially horizontally through the dustproof unit 24 in the edge part 8b of the reaction frame 8 through. The flange 23 is engaged while being inserted from above in the Z direction. As the material of the flange 23, a low thermal expansion material, for example, Invar (36% nickel, 0.25% manganese, and a low-expansion alloy made of iron containing trace amounts of carbon and other elements) is used. The flange 23 constitutes a so-called kinematic support mount for supporting the projection optical system PL at three points with respect to the barrel surface plate 25 through a point, a surface, and a V groove. By adopting such a kinematic support structure, it is easy to install the projection optical system PL to the barrel surface plate 25, and stresses caused by vibrations, temperature changes, etc. of the barrel surface plate 25 and the projection optical system PL after installation are easily achieved. The advantage is that it can be most effectively alleviated.

The dustproof unit 24 is disposed at each corner of the barrel surface plate 25 (not shown for the dustproof unit inside the ground), and the air mount 26 and the voice coil motor 27 that can adjust the internal pressure are provided. Is arranged in series on the end 8b. By these dustproof units 24, minute vibration transmitted to the barrel surface plate 25 (moreover, projection optical system PL) via the base plate 10 and the reaction frame 8 is insulated by micro G level. It is supposed to be.

The stage device 7 mainly consists of a wafer stage 5 holding a wafer W and a wafer surface plate 6 supporting the wafer stage 5 so as to be movable in a two-dimensional direction along the XY plane. It is. As shown in FIG. 4, a plurality of air bearings (air pads) 28, which are non-contact bearings, are fixed to the bottom of the wafer stage 5, and the wafer stages 5 are wafers by these air bearings 28. On the surface plate 6, for example, floating is supported through a clearance of about several microns.

The wafer surface plate 6 is supported substantially horizontally via a dustproof unit (dustproof mechanism) 29 above the base plate (support portion) 10. The dustproof unit 29 is disposed at each corner of the wafer surface plate 6 (not shown for the dustproof unit inside the paper), and the air mount 30 and the voice coil motor 31 which can adjust the internal pressure are provided. Is arranged in parallel on the base plate 10. By these dustproof units 29, the minute vibration transmitted to the wafer surface plate 6 via the base plate 10 is insulated at the micro G level.

The wafer stage 5 includes a pair of linear motors 32 (the linear motor in front of the paper rather than the wafer stage 5 is not shown) that drives the wafer stage 5 in the X direction, and the wafer stage 5. The pair of linear motors 33 (drive mechanism) for driving the Y in the Y direction can move the wafer surface plate 6 in the XY two-dimensional direction. The stator of the linear motor 32 extends along the X direction on both outer sides of the Y direction of the wafer stage 5, and is connected to both ends by a pair of connecting members 34 to form a rectangular frame 35. ) Is configured. The mover of the linear motor 32 protrudes so as to oppose the stator on both side surfaces of the wafer stage 5 in the Y direction.

In addition, on the lower end surfaces of the pair of connecting members 34 or the linear motor 32 constituting the frame 35, movers 36 and 36 made of an armature unit are provided, respectively. Stators (reaction stages) 37 and 37 as second stages having magnet units corresponding to 36 are provided extending in the Y direction. As shown in FIG. 5, the rolling guide 38 is each provided between each stator 37 and the base plate 10. As shown in FIG. The rolling guide 38 has a configuration in which a plurality of rollers (motors) 39 whose axes extend in the X direction and are rotated around each axis are arranged at regular intervals in the Y direction, and the stator 37 has a roller The rotation of the 39 makes it possible to move in the Y direction with respect to the base plate 10 as the support portion.

In addition, as shown in FIG. 3, a pair of springs (pressing portions) constituting a return device for returning the stator 37 to the initial position on both sides of the stator 37 in the Y direction similarly to the stator 17. One end of 40 and 40 is connected, respectively. These springs 40 have the other ends fixed to the base plate 10 and each presses (eg, pulls) the stator 37 with approximately the same force in directions opposite to each other along the Y direction. will be. In addition, each spring 40 has a sufficient amount of deflection so as to deform in the elastic range even when the stator 37 moves.

Then, the movable coil 36 and the stator 37 constitute a linear coil 33 of the movable coil type, and the movable element 36 is in the Y direction by electromagnetic interaction with the stator 37. It is driven to (one direction). That is, the wafer stage 5 is driven in the Y direction integrally with the frame 35 by the linear motor 33. 4, the wafer stage 5 is a guideless stage having no guide member for movement in the Y direction. In addition, the X-direction movement of the wafer stage 5 can also be appropriately used as a guideless stage.

On the upper surface of the wafer stage 5, the wafer W is fixed by vacuum suction or the like via the wafer holder 41. In addition, the X-direction position of the wafer stage 5 is based on the reference mirror 42 fixed to the lower end of the barrel of the projection optical system PL, and the movement mirror 43 fixed to a part of the wafer stage 5 is fixed. The laser interferometer 44, which is a position measuring device for measuring the position change, is measured in real time with a predetermined resolution, for example, a resolution of about 0.5 to 1 nm. Further, the wafer stage is provided by a reference mirror (not shown), a moving mirror (not shown), and a laser interferometer (not shown) disposed so as to be substantially orthogonal to the reference mirror 42, the moving mirror 43, and the laser interferometer 44. The Y-direction position of (5) is measured. At least one of these laser interferometers is a multi-axis interferometer having two or more side axes, and not only the XY position of the wafer stage 5 (or wafer W) based on the measured values of these laser interferometers, but also θ. The amount of rotation or the leveling amount together with them can also be obtained.

The reticle plate 3, the wafer plate 6, and the barrel plate 25 include three vibration sensors (for example, an accelerometer (not shown)) for measuring the Z-direction vibration of each plate and an XY in-plane direction. Three vibration sensors (for example, an accelerometer (not shown)) which measure the vibration of each are attached. Two of the latter vibration sensors measure the Y-direction vibration of each plate and the remaining vibration sensors measure the X-direction vibration (hereinafter, these vibration sensors are referred to as vibration sensor groups for convenience). Based on the measured values of these vibration sensor groups, vibrations of the six degrees of freedom (X, Y, Z, θX, θY, θZ) of the reticle plate 3, the wafer plate 6 and the barrel plate 25 are respectively obtained. You can get it.

As shown in Fig. 4, three laser interferometers 45, which are position detection devices, are fixed to three flanges 23 of the projection optical system PL (however, among these laser interferometers in Fig. 4). One is representatively shown). Openings 25a are formed in portions of the barrel surface plate 25 which face each laser interferometer 45, and the side beams in the Z direction from the respective laser interferometers 45 are passed through the openings 25a. 6) is irradiated toward. Reflecting surfaces are formed at opposite positions of the respective side beams on the upper surface of the wafer surface plate 6. Thus, the three laser interferometers 45 measure the three different Z positions of the wafer surface 6 on the basis of the flange 23 (but, in FIG. 4, on the wafer stage 5). Since the state where the shot area in the center of the wafer W is located just below the optical axis of the projection optical system PL is shown, the length beam is blocked at the wafer stage 5). In addition, an interferometer may be provided on the upper surface of the wafer stage 5 to measure the three different Z-direction positions on the reflective surface with respect to the projection optical system PL or the flange 23. have.

Next, among the stage apparatuses 4 and 7 of the said structure, the operation | movement of the stage apparatus 4 is demonstrated first.

When the reticle stage 2 is moved in the scanning direction (for example, + Y direction) by the driving of the linear motor 15, the stator 17 is driven by the rolling guide 20 by the reaction guide frame due to the reaction force caused by the driving. 8) Relatively move upward in the opposite direction (-Y direction). At this time, since the roller 21 rotates in the rolling guide 20, the stator 17 moves smoothly.

Here, when the trilateral friction between the reticle stage 2, the stator 17, and the reticle base 3 is zero, the law of momentum conservation works, and the stator according to the movement of the reticle stage 2 is applied. The amount of movement of the 17 is on the reticle stage 2 side (including the Y moving mirrors 18a and 18b, the X moving mirrors 19, the mover 16, the reticle R, etc.) and the stator 17 side. It is determined by the weight ratio of and. Specifically, since the weight ratio between the reticle stage 2 side and the stator 17 side is about 1: 4, for example, a 30 cm movement in the + Y direction of the reticle stage 2 is the stator 17. Move 7.5 cm in -Y direction.

Therefore, the reaction force at the time of acceleration and deceleration of the reticle stage 2 in the scanning direction is absorbed by the movement of the stator 17, and the center position in the stage apparatus 4 is substantially fixed in the Y direction. In addition, since the reaction frame 8 on which the stator 17 is supported supports the reticle base 3 via the dustproof unit 11, these reaction frame 8 and the reticle base 3 are vibrated. It becomes independent. Therefore, even when the reticle stage 2 is driven, it is possible to effectively suppress the reticle base plate 3 from vibrating due to the reaction force. In addition, as the stator 17 moves in the -Y direction, the balance of the pressing force with respect to the stator 17 of the pressurizing section 22 shown in FIG. 3 collapses, and the force for pressing the stator 17 in the + Y direction is reduced. Increases. Thus, the stator 17 quickly returns to the position where the pressing force is balanced, that is, the initial position (initial position).

In the antivibration unit 11, a force (resistance force) that invalidates the effect of the center change due to the movement of the reticle stage 2 is based on the measured value of the laser interferometer by feedforward. And the air mount 12 and voice coil motor 13 are driven to generate this force. In addition, the friction between the reticle stage 2 and the stator 17 and the reticle surface 3 is not zero, or the moving direction of the reticle stage 2 and the stator 17 is slightly different. Even when minute vibrations in the six degrees of freedom of the reticle surface plate 3 remain, the air mount 12 and the voice coil motor 13 are fed back to remove the residual vibrations based on the measured values of the vibration sensor group. To control.

On the other hand, the same operation as the stage device 4 occurs in the stage device 7 as well.

When the wafer stage 5 moves in the scanning direction (+ Y direction) by driving the linear motor 33, the stator 37 moves on the base plate 10 by the rolling guide 38 in response to the driving force. Relative movement in the opposite direction (-Y direction). At this time, since the roller 39 rotates in the rolling guide 38, the stator 37 moves smoothly. When the trilateral friction between the wafer stage 5, the stator 37, and the wafer surface plate 6 is zero, the law of momentum conservation works, and the stator 37 according to the movement of the wafer stage 5 operates. The amount of movement is determined by the weight ratio between the wafer stage 5 side and the stator 37 side. Therefore, reaction force at the time of the acceleration / deceleration of the scanning stage of the wafer stage 5 is absorbed by the movement of the stator 37, and the center position in the stage apparatus 7 is fixed substantially in the Y direction. In addition, since the base plate 10 on which the stator 37 is supported supports the wafer surface plate 6 via the dustproof unit 29, these base plates 10 and the wafer surface plate 6 are vibrated violently. It becomes independent. Therefore, even when the wafer stage 5 is driven, the vibration of the wafer surface plate 6 can be effectively suppressed by the reaction force. In addition, as the stator 37 moves in the -Y direction, the balance of the pressing force with respect to the stator 37 of the pressurizing portion 40 shown in FIG. 3 is collapsed, and the force for pressing the stator 37 in the + Y direction is reduced. Increases. Thus, the stator 37 quickly returns to the position where the pressing force is balanced, that is, the initial position (initial position).

In the vibration isolator 29, a counterforce is given by the feedforward to invalidate the influence of the center change caused by the movement of the wafer stage 5 based on measured values such as the laser interferometer 44. The air mount 30 and the voice coil motor 31 are driven to generate this force. In addition, the friction between the wafer stage 5, the stator 37, and the wafer surface plate 6 is not zero, or the movement direction of the wafer stage 5 and the stator 37 is slightly different. Even when minute vibrations in the six degrees of freedom of the wafer surface plate 6 remain, the air mount 30 and the voice coil motor 31 are fed back to remove the residual vibrations based on the measured values of the vibration sensor group. To control.

Moreover, in the barrel surface plate 25, even if the stator 17 and 37 move by reaction force by the movement of the reticle stage 2 and the wafer stage 5, and a slight vibration generate | occur | produces in the reaction frame 8, The dustproof unit 24 is fitted between the reaction frame 8 and is independent of vibration. In addition, even when a slight vibration occurs in the barrel surface plate 25, the vibration in the six degrees of freedom direction is obtained based on the measured value of the vibration sensor group provided with the barrel surface plate 25, and the air mount 26 and the voice coil motor are obtained. By feedback control of (27), this small vibration can be invalidated and the barrel surface plate 25 can be normally maintained at a stable position. Therefore, the projection optical system PL supported by the barrel surface plate 25 can be maintained at a stable position, and effectively prevents the occurrence of misalignment or image blur of the pattern transfer position due to vibration of the projection optical system PL, and the exposure accuracy. Can be improved.

Next, the exposure operation | movement in the exposure apparatus 1 of the said structure is demonstrated below. It is assumed that various exposure conditions for preliminarily scanning the shot region on the wafer W with the appropriate exposure amount (target exposure amount) are set. Then, preparatory operations such as reticle alignment and baseline measurement using a reticle microscope (not shown) and an off-axis alignment sensor or the like are performed. Then, fines of the wafer W using the alignment sensor are performed. ) The alignment (EGA (Enhanced Global Alignment, etc.)) is completed, and the arrangement coordinates of the plurality of shot regions on the wafer W can be obtained.

In this way, when the preparation operation for exposing the wafer W is completed, the linear motors 32 and 33 are controlled to monitor the measured values of the laser interferometer 44 based on the alignment result. The wafer stage 5 is moved to the scanning start position for exposing the first shot. Then, the scanning for the reticle stage 2 and the wafer stage 5 is started through the linear motors 15 and 33, and when both stages 2 and 5 reach the respective target scanning speeds, the exposure illumination The pattern region of the reticle R is illuminated by light, and scanning exposure is started.

In this scanning exposure, the Y-direction movement speed of the reticle stage 2 and the Y-direction movement speed of the wafer stage 5 are the speeds corresponding to the projection magnification (1/5 times or 1/4 times) of the projection optical system PL. To maintain the ratio, the reticle stage 2 and the wafer stage 5 are synchronously controlled via the linear motors 15 and 33. Then, different regions of the reticle R pattern region are sequentially illuminated by the illumination light, and the illumination of the entire surface of the pattern region is completed, thereby completing the scanning exposure of the first shot on the wafer W. As a result, the pattern of the reticle R is reduced and transferred to the first shot region on the wafer W via the projection optical system PL.

In this manner, when the scanning exposure of the first shot is completed, the wafer stage 5 is moved stepwise in the X and Y directions via the linear motors 32 and 33, and is moved to the scanning start position for the exposure of the second shot. Is moved. In this step movement, the X, Y, and θZ directions of the wafer stage 5 are adjusted based on the measured values of the laser interferometer 44 which detects the position of the wafer stage 5 (the position of the wafer W). Measure in real time. Based on this measurement result, the linear motors 32 and 33 are controlled to control the position of the wafer stage 5 so that the XY position displacement of the wafer stage 5 is in a predetermined state. In addition, about the displacement of the wafer stage 5 in the (theta) Z direction, the reticle stage 2 is rotationally controlled so that the rotation displacement error of the wafer W side may be correct | amended based on this displacement information. After that, scanning exposure is performed on the second shot region in the same manner as the first shot region.

In this way, the scanning exposure of the shot region on the wafer W and the step movement for the next shot exposure are repeatedly executed, and the pattern of the reticle R is sequentially transferred to all the exposure target shot regions on the wafer W. do.

In the stage apparatus and the exposure apparatus of the present embodiment, the law of conservation of momentum acts because the stators 17 and 37 move in opposite directions, respectively, by reaction forces when the reticle stage 2 and the wafer stage 5 are driven. In addition, since the reaction force can be prevented from being transmitted to the reaction frame 8 or the base plate 10, and furthermore, the floor, and problems such as vibration return can be avoided, the reticle R or the wafer W Even in the case of increasing the size or moving at a high speed, the settling time can be shortened and the productivity and the exposure accuracy can be improved. In addition, the reaction frame 8 supports the reticle surface 3 via the vibration isolation unit 11, and the base plate 10 supports the wafer surface 6 via the vibration isolation unit 29. Residual vibrations of the frame 8 and the base plate 10 can be suppressed from being transmitted to the reticle plate 3 and the wafer plate 6, so that the position controllability of each stage 2, 5 can be maintained.

In addition, in this embodiment, the stator 17, 37 which comprises a part of the linear motors 15, 33 which drive each said stage 2, 5 has reaction force according to the drive of each stage 2, 5, respectively. Since it moves, it is not necessary to separately install a mechanism for excluding this reaction force, and it is also possible to realize miniaturization and low cost of the device. And when these stators 17 and 37 move by the said reaction force, since the rollers 21 and 39 are performed by the simple operation which rotates around an axis line, the apparatus can be simplified.

In addition, in this embodiment, since the springs 22 and 40 press the stators 17 and 37 in the mutually opposite directions, even when each stator 17 and 37 moves by reaction force, it is easy by a simple mechanism. Can be returned to the initial position.

Moreover, in the exposure apparatus of this embodiment, since the reticle stage 2, the wafer stage 5, and the projection optical system PL are vibratingly independent by the dustproof units 11, 24, 29, the reticle stage ( 2) and the vibration resulting from the drive of the wafer stage 5 can be prevented from being transmitted to the projection optical system PL, and the occurrence of misalignment or image blur of the pattern transfer position resulting from the vibration of the projection optical system PL is generated. Can be effectively prevented and the exposure accuracy can be improved.

Second Embodiment

It is a figure which shows 2nd Embodiment of the stage apparatus and exposure apparatus of this invention. In FIG. 6, the same code | symbol is attached | subjected about the element same as the component of 1st Embodiment shown in FIGS. 1-5, and the description is abbreviate | omitted. Since the difference of 2nd Embodiment and the said 1st Embodiment is a structure of the stage apparatus 7, this is mentioned later.

As shown in FIG. 6, the stage apparatus 7 mainly comprises the wafer stage 5, the wafer surface plate 6, and the support plate (reaction stage) 46 which supports them from below. The stator 37 is configured to move in the Y direction with respect to the support plate 46 by the rolling guide 38 interposed between the support plate 46. In addition, the wafer surface plate 6 also has a structure independent of vibration with respect to the support plate 46 by the dustproof unit 29 arranged between the support plate 46. Therefore, the support plate 46 plays the role of a support part about reaction force movement of the stator 37. As shown in FIG.

Between the support plate 46 and the base plate 10, the rolling guide 48 which consists of a some roller (motor) 47 is remodeled. The rollers 47 are rotated around an axis line extending in the Y direction, and are arranged at regular intervals in the X direction. The support plate 46 is movable in the X direction with respect to the base plate 10 by the rotation around the axis line of the roller 47. The other structure is the same as that of the said 1st Embodiment.

In the stage apparatus and exposure apparatus of the present embodiment, the same effects and effects as those of the first embodiment can be obtained, and even when the wafer stage 5 moves in the + X direction, the reaction force caused by the movement of the wafer stage 5 is achieved. The support plate 46 moves in the -X direction so that the law of conservation of momentum acts. Therefore, not only when the wafer stage 5 is moved for scanning exposure but also when the wafer stage 5 is stepped to change the shot region, problems such as vibration return due to reaction force due to the step movement can be avoided. As a result, the settling time can be further shortened, whereby the productivity and the exposure accuracy can be further improved. Moreover, also in this embodiment, it can suppress that the residual vibration of the base plate 10 or the support plate 46 is transmitted to the wafer surface plate 6, and the position controllability of the wafer stage 5 can be maintained.

[Third Embodiment]

It is a figure which shows 3rd Embodiment of the stage apparatus and exposure apparatus of this invention. In FIG. 7, the same code | symbol is attached | subjected about the element same as the component of 1st Embodiment shown in FIGS. 1-5, and the description is abbreviate | omitted. Since the difference of 3rd embodiment and the said 1st embodiment is a structure of the wafer stage 5, this is mentioned later.

As shown in FIG. 7, off-axis alignment sensors 49a and 49b are provided at both sides of the Y-direction of the projection optical system PL at predetermined intervals, and two along the direction in which the alignment sensors 49a and 49b are arranged. Wafer stages 5 and 5 are provided. Each wafer stage 5 includes a magnet unit (not shown) constituting a mover of a moving coil type linear motor. The wafer stage 5 is a stator having an armature unit, each of which can move independently on the wafer surface plate 6 along the linear guide 50 extending in the X direction.

At both ends of the linear guide 50, the movable element 36 made of an armature unit is provided to protrude downward, and the stator 37 corresponding to both the movable elements 36 and 36 of both wafer stages 5 and 5 is provided. ) Extends in the Y direction. Therefore, each wafer stage 5 moves in the X direction along the linear guide 50 and moves independently in the Y direction along the stator 37. In addition, in FIG. 7, illustration of the movement mirror, the indicator member, etc. which are provided on the wafer stage 5 is abbreviate | omitted.

In the exposure apparatus of the above structure, as shown in FIG. 7, while performing the exposure operation on the wafer W on the wafer stage 5 located on the -Y side through the projection optical system PL, the exposure apparatus is placed on the + Y side. Alignment is performed with respect to the wafer W on the wafer stage 5 located. Specifically, first, the alignment mark (not shown) formed on the indicator member and the wafer W is measured using the + Y side alignment sensor 49a, and the alignment of the wafer W is based on the measurement result. Is done. Next, a fine alignment for obtaining the arrangement of each shot region on the wafer W, for example using EGA, is executed while moving the wafer stage 5. Then, the wafer stage 5 in which the exposure sequence is completed is moved in the -Y direction to perform wafer replacement immediately below the alignment sensor 49b, and then the alignment sequence is executed. In addition, the wafer stage 5 on which alignment is performed by the alignment sensor 49a also moves in the -Y direction, and an exposure sequence is executed immediately below the projection optical system PL.

In the present embodiment, the same effects as those of the first embodiment can be obtained, and the two wafer stages 5 and 5 are moved independently, wafer exchange and alignment operations are performed on one stage, and the exposure operation is performed on the other stage. Since it is performed in parallel, productivity can be improved significantly. In addition, since the stator 37 used when each stage moves in the Y direction is shared by the movers 36 of both stages, it is possible to realize the reduction of parts, that is, the simple and low cost of the device.

In addition, in this embodiment, although the rollers 21, 39, 47 were provided as a movement means of the stator 17, 37 to the Y direction, it is not limited to this, For example, an air bearing Non-contact bearings, such as these, can also be provided. In this case, the same action and effect as in the case of using the roller are obtained, and the stators 17 and 37 move without friction, so that the friction is prevented, such as vibration of the reaction frame 8 or the base plate 10. Disturbance caused by this can be eliminated, and more accurate exposure treatment can be performed. In addition, the roller or the air bearing may be installed on the stator, or may be installed on the reaction frame 8 or the base plate 10 supporting the stator. In addition, although illustration is abbreviate | omitted, the reticle stage 2 can also be set as the mechanism which can support the some reticle R like 3rd Embodiment. In this case, the coarse motion stages constituting the reticle stage 2 are common, and a plurality of fine motion stages holding the reticle R may be provided independently. Thereby, the whole reticle stage 2 can be made into the compact structure.

In addition, in the said embodiment, although the stator 17 and 37 are moved by reaction force in both the reticle stage 2 and the wafer stage 5, the stator may move reaction force only in either stage. In addition, in the said embodiment, although all the dustproof units set it as the structure which actively performs dust-proof, all of these may be the structure like any one of these, or arbitrary plurality performs a dustproof passively. In addition, the reticle stage 2 may be a two-stage configuration of the coarse motion stage and the fine motion stage, and may be configured such that a member (for example, a stator) that is moved by reaction force due to the movement of the stage is provided on either or both sides. have. In addition, in the said embodiment, although the stage apparatus of this invention was set as the structure which applies to the exposure apparatus 1, it is not limited to this, In addition to the exposure apparatus 1, the writing apparatus and mask pattern of a transfer mask. It is also applicable to precision measuring instruments such as position coordinate measuring apparatus.

In addition, as the substrate of this embodiment, not only the semiconductor wafer W for semiconductor devices but also the glass substrate for liquid crystal display devices, the ceramic wafer for thin film magnetic heads, or the original plate of the mask or reticle used in the exposure apparatus ( Synthetic quartz, silicon wafer) and the like. As the exposure apparatus 1, in addition to the step-and-scan scanning exposure apparatus (scanning stepper; USP5, 473, 410) in which the reticle R and the wafers W and PW are synchronously moved to scan-expose the pattern of the reticle R, In addition, the pattern of the reticle R is exposed while the reticle R and the wafer W are stopped, and the projection and exposure apparatus (stepper) of the step and repeat method of stepping the wafers W and PW in sequence can also be applied. Can be. As the kind of exposure apparatus 1, it is not limited to the exposure apparatus for semiconductor device manufacture which exposes a semiconductor device pattern to the wafer W, The exposure apparatus for liquid crystal display element manufacture, or a thin film magnetic head, an imaging element (CCD), It can be applied to a wide range of exposure apparatuses for manufacturing reticles and the like.

In addition, as a light source of the illumination light for exposure, a bright line (g line (436 nm), h line (404.7 nm), i line (365 nm) generated from an ultra-high pressure mercury lamp, KrF excimer laser (248 nm), ArF excimer laser ( Not only 193 nm) and F ₂ laser (157 nm) but also charged particle beams such as X-rays or electron beams can be used. For example, when using an electron beam, lanthanum hexaborite (LaB ₆ ) and tantalum (Ta) of a hot electron radiation can be used as an electron gun. In addition, when using an electron beam, it can also be set as the structure using a reticle R, and can also be set as the structure which forms a pattern directly on a wafer without using the reticle R. FIG. In addition, a high frequency wave such as a YAG laser or a semiconductor laser may be used.

As the magnification of the projection optical system PL, not only a reduction system but also an equal magnification system and a magnification system can be used. Further, the projection optical system (PL) as the case when using a far ultraviolet rays such as excimer lasers using a material which transmits far ultraviolet rays such as quartz or calcium fluoride as chojae, and take advantage of a F ₂ laser or X-rays are reflected refractometer or a refractometer It is preferable to use the optical system of (the reticle R also uses a reflecting-reflective type), and when using an electron beam, it is preferable to use an electron optical system composed of an electron lens and a deflector as the optical system. In addition, the optical path through which the electron beam passes must be in a vacuum state. Moreover, it is applicable also to the proximity exposure apparatus which exposes the pattern of the reticle R by bringing the reticle R and the wafer W into close contact, without using the projection optical system PL.

When using a linear motor (see USP5,623,853 or USP5,528,118) for the wafer stage 5 or the reticle stage 2, either the air floating type using the air bearing and the magnetic floating type using the Lorentz force or the resistive force are used. You may use it. In addition, each stage 2 and 5 may be a type which moves along a guide, or may be a guideless type which does not have a guide. As a driving mechanism of each stage 2 and 5, a magnet unit (permanent magnet) in which magnets are arranged in two dimensions and an armature unit in which coils are arranged in two dimensions are opposed to each other and the stages 2 and 5 are moved by an electromagnetic force. It is also possible to use a planar motor for driving. In this case, one of the magnet unit and the armature unit is preferably connected to the stages 2 and 5, and the other of the magnet unit and the armature unit is provided on the moving surface side (base) of the stages 2 and 5.

As described above, the exposure apparatus 1 of the present embodiment is manufactured by assembling various subsystems including each component described in the claims of the present application so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to secure these various accuracy, before and after this assembly, adjustment for achieving optical precision for various optical systems, adjustment for achieving mechanical precision for various mechanical systems, and electrical precision for various electric systems are performed. Adjustment is performed. The assembling process from the various subsystems to the exposure apparatus includes mechanical connection of various subsystems, wiring connection of electric circuits, piping connection of pneumatic circuits, and the like. Prior to the assembling process from these various subsystems to the exposure apparatus, there is an assembling process for each subsystem. When the assembling process from the various subsystems to the exposure apparatus is finished, comprehensive adjustment is performed to ensure various accuracy as the whole exposure apparatus. In addition, it is preferable to manufacture an exposure apparatus in the clean room where temperature, cleanliness, etc. were managed.

As shown in Fig. 8, the semiconductor device includes step 201 for designing the function and performance of the device, step 202 for manufacturing a mask (reticle) based on this design step, step 203 for manufacturing a wafer made of a silicon material, and the like. Manufactured via wafer processing step 204, device assembly step (including dicing step, bonding step, package step) 205, inspection step 206, etc., by which the exposure apparatus 1 of one embodiment exposes the pattern of the reticle to the wafer. do.

The present invention provides a stage apparatus, a method of driving the substrate, and a method of driving the substrate, to which a pattern of a mask is exposed, such as a glass substrate or a wafer, and a stage main body holding the substrate to move in a plane on a surface plate, and the stage apparatus TECHNICAL FIELD The present invention relates to an exposure apparatus and an exposure method for performing an exposure process using a mask and a substrate, and in particular, when manufacturing a device such as a semiconductor integrated circuit or a liquid crystal display device, a substrate, a stage device, and a stage drive that are very suitable for use in a lithography process. It relates to a method, an exposure apparatus and an exposure method.

According to the stage apparatus and the stage driving method of the present invention, since the support portion is provided vibratingly independent of the surface plate and the reaction force stage moves on the support portion by reaction force caused by the driving of the stage main body, it is possible to obtain vibration or the like. The problem can be avoided, the settling time can be shortened, the productivity can be improved, and the residual vibration of the support can be prevented from being transmitted to the surface plate, thereby maintaining the position controllability of the stage main body. In addition, since the surface plate is supported by the support unit via the vibration isolator mechanism, the residual vibration of the support portion can be suppressed from being transmitted to the surface plate, and the effect of maintaining the position controllability of the stage main body is also obtained. In addition, since the reaction force stage constitutes at least a part of the drive mechanism for driving the stage main body in one direction, it is not necessary to separately install a mechanism for excluding the reaction force, and the device can be miniaturized and reduced in price. And since the rolling element which rotates around an axis line and moves the reaction force stage with respect to a support part is retrofitted between a reaction force stage and a support part, when a reaction force stage moves, it is performed by the simple operation of rotating a rolling element around an axis line, Simplification can be realized. In addition, since the non-contact bearing is opened between the reaction force stage and the support portion, the reaction force stage moves without friction, so that disturbance due to friction, such as vibration of the support portion, can be eliminated. Moreover, the effect which can return a reaction force stage to an initial position easily with a simple mechanism is also acquired by a return apparatus, such as a press part which presses reaction force stages in the mutually opposite directions, respectively. In addition, since the stage main body can move in a direction substantially perpendicular to each other, and the reaction force stage is provided in each of the substantially orthogonal directions, the vibration returns due to the reaction force caused by the movement even when the stage main body moves in two dimensions. The problem such as the above can be avoided, and the settling time can be further shortened to further improve the productivity.

And according to the exposure apparatus and the exposure method of this invention, it is at least one stage of a mask stage and a board | substrate stage, The stage apparatus in any one of Claims 1-9 of a claim, or Claim 17-20 of a claim. Since the stage driving method described in any one of the above is used, the settling time can be shortened, the productivity and exposure accuracy can be improved, and the residual vibration of the support portion can be suppressed from being transmitted to the surface plate. Maintain controllability. In addition, since the mask stage, the substrate stage, and the projection optical system are installed vibratingly independent of each other, it is possible to prevent the vibration due to the driving of the stage from being transmitted to the projection optical system, and therefore, the pattern transfer position resulting from the vibration of the projection optical system. It is possible to effectively prevent occurrence of misalignment or blurring of the image, and to improve the exposure accuracy. In addition, since the mask stage can perform a plurality of masks and the substrate stage hold a plurality of substrates, the exchange and alignment operations and the exposure operations can be performed in parallel, thereby greatly improving the productivity. In addition, when the stator is shared by a plurality of movable members, it is possible to realize the reduction of parts, that is, the simple and low cost of the device.

On the other hand, according to the board | substrate of this invention, since a pattern is exposed using the said exposure method, superimposition of a pattern, line | wire width, etc. are maintained with high precision, and it becomes possible to express predetermined apparatus characteristic.

Claims (25)

A stage device having a stage main body capable of driving on a surface plate in at least one direction, A support part vibrating independently of the surface plate, And a reaction force stage capable of moving on the support part in the one direction by reaction force caused by the driving of the stage main body. The method of claim 1, The said surface plate is supported by the said support part through the dustproof mechanism, The stage apparatus characterized by the above-mentioned. The method according to claim 1 or 2, The reaction force stage constitutes at least a part of a drive mechanism for driving the stage main body in the one direction. The method of claim 3, wherein The drive mechanism includes a stator for driving the mover in one direction by electromagnetic interaction between the mover provided in the stage main body and the mover. And the reaction force stage has the stator. The method of claim 1, And a rolling element is mounted between the reaction force stage and the support portion to rotate around an axis to move the reaction force stage in the one direction with respect to the support portion. The method of claim 1, A non-contact bearing is mounted between the reaction force stage and the support portion. The method of claim 1, And a return device for returning the reaction force stage to an initial position. The method of claim 7, wherein The return device comprises a pressing unit for pressing the reaction force stages in directions opposite to each other in the one direction, respectively. The method of claim 1, The stage main body is movable in a direction substantially perpendicular to each other, The reaction force stage is provided for each direction in the orthogonal direction. An exposure apparatus for exposing a pattern of a mask held on a mask stage to a substrate held on a substrate stage, The stage apparatus according to any one of claims 1 to 9 is used as at least one of the mask stage and the substrate stage. The method of claim 10, And a projection optical system provided between the mask stage and the substrate stage to project the pattern of the mask onto the substrate. The method of claim 11, And the mask stage, the substrate stage, and the projection optical system are provided vibratingly and independently of each other. The method of claim 10, The mask stage has a microscopic stage, which holds the mask and is movable in a first direction, and a roughening stage, which is connected to the microscopic stage and is movable in a second direction different from the first direction. There is an exposure apparatus characterized by the above-mentioned. The method of claim 10, At least one of the mask stage and the substrate stage is a guideless stage. The method of claim 10, The mask stage can hold a plurality of masks. The method of claim 10, The substrate stage can hold a plurality of substrates. A stage driving method comprising a first stage capable of driving a surface on at least one direction, And a second stage, which is movable in the one direction by a reaction force caused by the driving of the first stage, to support a support unit vibratingly independent of the surface plate. The method of claim 17, And the second stage moves in a direction opposite to the first stage. The method of claim 17, Returning the second stage to an initial position. The method of claim 17, The weight of the second stage is heavier than the weight of the first stage. An exposure method for exposing a pattern of a mask held on a mask stage to a substrate held on a substrate stage, The stage driving method in any one of Claims 17-20 is used as a driving method of the said mask stage and the at least one stage of the said board | substrate stage. The method of claim 21, Exposing the pattern during movement of the mask stage and the substrate stage. The method of claim 21, And holding a plurality of masks in the mask stage. The method of claim 21, And holding a plurality of substrates on the substrate stage. A pattern is exposed using the exposure method of Claim 21. The board | substrate characterized by the above-mentioned.