CN1260772C - Stage device, method of driving stage, exposure device and exposure method - Google Patents

Stage device, method of driving stage, exposure device and exposure method Download PDF

Info

Publication number
CN1260772C
CN1260772C CNB99816934XA CN99816934A CN1260772C CN 1260772 C CN1260772 C CN 1260772C CN B99816934X A CNB99816934X A CN B99816934XA CN 99816934 A CN99816934 A CN 99816934A CN 1260772 C CN1260772 C CN 1260772C
Authority
CN
China
Prior art keywords
stage
direction
exposure
substrate
wafer
Prior art date
Application number
CNB99816934XA
Other languages
Chinese (zh)
Other versions
CN1373900A (en
Inventor
高桥正人
Original Assignee
株式会社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社尼康 filed Critical 株式会社尼康
Priority to PCT/JP1999/005539 priority Critical patent/WO2001027978A1/en
Publication of CN1373900A publication Critical patent/CN1373900A/en
Application granted granted Critical
Publication of CN1260772C publication Critical patent/CN1260772C/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70766Reaction force control means, e.g. countermass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression

Abstract

载物台装置(4)包括:支撑部(8),相对于固定盘(3)可振动地独立配置;以及反作用力载物台(17),通过随着载物台本体(2)的驱动产生的反作用力沿所述一个方向在支撑部(8)上自由移动。 Stage device (4) comprising: a support portion (8), with respect to the fixed plate (3) may be independently configured vibrations; and a reaction force of the stage (17), through the body with the stage (2) is driven reaction force generated to move freely on the support portion (8) in the one direction. 由此,由于可以避免反作用力造成的摇晃等问题,所以可以实现调整时间短、生产率提高,同时可以抑制将支撑部的残留振动传送到固定盘。 Accordingly, since the reaction can be avoided due to problems such as shaking, it can be adjusted to achieve a short time, improve productivity, and to suppress the residual vibration transmitting portion to the fixed disk support.

Description

载物台装置、载物台驱动方法和曝光装置及曝光方法 The stage device, a stage drive method and an exposure apparatus and exposure method

技术领域 FIELD

本发明涉及将玻璃基底或晶片等的曝光掩模图形的基底和保持该基底的载物台本体在固定盘上的平面内移动的载物台装置及其驱动方法,以及使用该载物台装置中保持的掩模和基底来进行曝光处理的曝光装置及其曝光方法,特别涉及制造半导体集成电路或液晶显示器等器件时,适合光刻工序使用的基底、载物台装置、载物台驱动方法和曝光装置及其曝光方法。 The present invention relates to an exposure mask or a pattern such as glass substrate and a substrate wafer holding station apparatus and a driving method of a mobile loading plane of the stage in the main body of the disc on the fixed base, and means for using the stage an exposure apparatus and an exposure method for an exposure process the mask and the substrate held, particularly relates to the production of a semiconductor integrated circuit device or a liquid crystal display, a substrate for use in photolithography process, stage device, a stage drive method and the exposure apparatus and exposure method.

背景技术 Background technique

以往,在作为半导体器件的制造工序之一的光刻工序中,使用将掩模或原版(以下称为原版)上形成的电路图形复制在涂敷了抗蚀剂(感光剂)的晶片或玻璃板等基底上的各种曝光装置。 Conventionally, in a lithography process as one of the manufacturing process of a semiconductor device, a mask or the original plate (hereinafter referred to as precursor) formed on the circuit pattern coated copy resist (photosensitive agent) or a glass wafer various exposure devices on the substrate plate or the like. 例如,作为半导体器件使用的曝光装置,随着近年来集成电路的高集成化,按照图形的最小线宽(器件规则)的微细化,主要使用缩小投影曝光装置,该装置使用投影光学系统将原版的图形缩小复制在晶片上。 For example, a semiconductor device using the exposure apparatus, with the recent high integration of integrated circuits, in accordance with the minimum line width of the pattern (device rule) of fine, mainly using a reduced projection exposure apparatus using a projection optical system master reducing copy pattern on the wafer.

作为该缩小投影曝光装置,已知将原版的图形依次复制在晶片上的多个拍摄区域(曝光区域)的分步重复方式的静止曝光型的缩小投影曝光装置(所谓的逐次移动式曝光装置),或对其进行了改进的披露于日本第166043/1996号专利公开公报等的将原版和晶片沿一维方向同步移动,并将原版图形复制在晶片上的各拍摄区域的分步扫描方式的扫描曝光型的曝光装置(所谓的扫描逐次移动式曝光装置)。 Static exposure type reduction projection exposure apparatus (a so-called stepper apparatus) as the plurality of imaging regions of the reduction projection exposure apparatus known in the original pattern is sequentially transferred on the wafer (exposure area) of the step and repeat mode , or make a scanning step each shot area improved disclosed in Japanese Patent Publication No. 166043/1996 or the like and the synchronous mobile original one-dimensional direction along the wafer and the original pattern on the wafer of replication the scanning exposure type exposure apparatus (so-called scanning stepper apparatus).

在这些缩小投影曝光装置中,作为载物台装置,大多使用在地面上首先设置作为装置的基准的基座框架,在其上通过用于隔离地面振动的防振台来装载支撑原版载物台、晶片载物台和投影光学系统(投影透镜)的本体座。 In such reduction projection exposure apparatus, a stage device, frequently used in the base frame is provided on the first floor as a reference device, a support on which to load the master stage via a vibration isolating floor vibration isolators , the wafer stage and a projection optical system (projection lens) of the seat body. 在目前的载物台装置中,作为所述防振台, 采用包括可控制内压的空气支架、音圈电机等致动器,安装在本体座(主框架)上,例如通过根据6个加速度计的计测值来控制所述音圈电机,从而控制本体座的振动的有源防振台。 In the present stage apparatus, as the anti-vibration table using the bracket including an air actuator, a voice coil motor or the like can control the pressure, seat mounted on the body (main frame), for example, by acceleration in accordance 6 meter measured value to control the voice coil motor, thereby controlling the vibration of the body of an active vibration isolating base station.

但是,在上述的逐次移动式曝光装置等中,在对晶片上的某个拍摄区域进行曝光后,由于对其他拍摄区域依次重复进行曝光,所以因晶片载物台(逐次移动式曝光装置的情况)、或原版载物台和晶片载物台(扫描逐次移动式曝光装置的情况)的加速、减速运动产生的反作用力成为本体座的振动因素,存在产生投影光学系统和晶片的相对位置误差这样的不良情况。 However, in the above-described stepper device, etc., after a shot of exposure regions on a wafer, since the shooting area is sequentially repeated for other exposure, the wafer stage by (stepper apparatus case ), or accelerate master stage and the wafer stage (the case of scan type stepper exposure device), and a reaction force generated by the vibrational deceleration factor seat body, the presence of a relative position of the projection optical system and the wafer so that error the bad situation. 对准时或曝光时的上述相对位置误差最终在晶片上与设计值不同的位置上复制图形,在该位置误差中包含振动分量的情况下,是成为导致图像模糊(图形线宽增大)原因的不良状况。 The final copy of the relative position error of the exposure time or on a different wafer positions from the design value on the graph, the case where the vibration component contained in the position error, the cause of image blur is to be (pattern width is increased) in poor condition. 因此,为了抑制这种不良状况,需要通过上述的有源防振台等使本体座的振动充分衰减。 Therefore, to suppress this undesirable situation, the above-described need by active vibration isolators, etc. of the vibration damping body holder sufficiently. 例如,在逐次移动式曝光装置的情况下,需要等待使晶片载物台处于期望位置的充分的位置调整,再开始对准操作或曝光操作。 For example, in the case of stepper apparatus, it is necessary to wait for the wafer stage is sufficient to adjust the position of a desired position, and then starts the alignment operation or exposure operation. 而在扫描逐次移动式曝光装置的情况下,需要在充分确保原版载物台和晶片载物台的同步调整的状态下进行曝光。 Under exposure in the case of a scanning stepper apparatus, it is necessary to ensure adequate synchronization adjustment precursor loading stage and the wafer stage status. 因此,成为使生产率恶化的主要原因。 Therefore, to become the main reason for the deterioration of productivity.

因此,作为改善这种不适状况的发明,例如日本第166475/1996号专利公开公报所披露的,使用框架部件将通过晶片载物台的移动产生的反作用力机械地躲避到地面(大地),或例如日本第330224/1996号专利公开公报等所披露的,使用框架部件将通过原版载物台的移动产生的反作用力机械地躲避到地面(大地)。 Therefore, the invention is to improve this situation does not apply, for example, Japanese Patent Publication No. 166475/1996 disclosed, using a frame member produced by the movement of the wafer stage reaction force mechanically escape to the floor (ground), or For example, Japanese Patent Publication No. 330224/1996 and the like as disclosed, to avoid the use of frame members to the floor (ground) mechanically moving the original by the reaction force of the stage generated.

但是,在上述的现有载物台装置和曝光装置中,存在以下问题。 However, in the conventional stage device and the exposure device, the following problems.

随着近年来的原版或晶片的大型化,两个载物台都大型化,即使使用披露于日本第166475/1996号或第330224/1996号专利公开公报中的发明,因通过框架部件躲避到地面侧的反作用力造成框架部件本身振动,躲避到地面的反作用力通过防振台传送到保持投影光学系统的本体座(主体),使其起振,有产生所谓的摇摆的危险。 With recent size of the original or wafer stage are two large, even if disclosed in Japanese Patent No. 166475/1996 or No. 330224/1996 Patent Laid the invention, due to escape through the frame member the ground-side reaction caused by vibration of the frame member itself, to avoid ground reaction forces transmitted to the seat body holding the projection optical system (the body) through the anti-vibration table, vibrating it, there is the risk of a so-called swing. 因此,难以确保某种程度的生产率,并难以进行高精度的曝光。 Thus, it is difficult to ensure a certain degree of productivity, and is difficult to perform high-precision exposure.

因此,例如在日本第63231/1996号专利公开公报中披露了以下技术:在基座上设置浮置支撑的载物台本体和驱动框架,随着载物台本体的前进移动,以反作用力使驱动框架后退。 Thus, for example, disclosed in Japanese Patent Publication No. 63231/1996 in the following technologies: setting the stage floating body and the drive frame is supported on the base, the forward movement of the stage with the body, so that the reaction force to drive frame back. 根据该技术,由于在载物台本体和驱动框架之间动量守恒法则起作用,维持基座上的装置的重心位置,所以可以减小对框架部件的振动的影响。 According to this technique, since the law of conservation of momentum acting between the stage and the drive frame body, means maintaining the position of the center of gravity on the base, it is possible to influence on the vibration of the frame member is reduced. 但是,即使在采用该技术的情况下,如果载物台大型化、高速化,那么不能完全除去上述反作用力的影响。 However, even in the case where this technique, if the stage size, high speed, it can not completely remove the effect of the above-described reaction.

考虑到以上方面,本发明的目的在于提供一种载物台装置、载物台驱动方法、曝光装置和曝光方法,即使在使用大型的载物台或高速的载物台的情况下,也可以维持载物台的位置控制特性。 Taking into account the above aspects, an object of the present invention is to provide a stage apparatus, loading stage drive method, an exposure apparatus and an exposure method, even in the case where a large high-speed stage or the stage, may be maintaining stage position control characteristics. 本发明的另一目的在于提供一种曝光装置、曝光方法,即使在使用大型的载物台或高速的载物台的情况下,也可以确保某种程度的生产率,并可以进行高精度的曝光。 Another object of the present invention is to provide an exposure apparatus, exposure method, even when the stage of a large-sized or high-speed stage, can ensure a certain degree of productivity, and high precision exposure can be . 本发明的再一目的在于提供对图形进行了高精度曝光的基底。 A further object of the present invention is to provide a high precision graphics exposed substrate.

发明内容 SUMMARY

为了实现上述目的,本发明采用与表示实施例的图1至图7对应的以下结构。 To achieve the above object, the present invention adopts the following configuration diagram indicating an example of an embodiment corresponding to FIG.

本发明的载物台装置包括在固定盘3、6上沿至少一个方向驱动的载物台本体2、5的载物台装置4、7,其特征在于,该载物台装置4、7包括:支撑部8、10,相对于所述固定盘3、6独立振动地配置;以及反作用力载物台 17、37,随着所述载物台本体2、5的驱动,通过反作用力在所述支撑部8、10上沿所述一个方向自由移动。 Stage device according to the present invention comprises a stage main body along at least one direction of the drive stage device 2,5 4,7 3,6 on the fixed plate, wherein the stage means comprises 4,7 : support portions 8, 10, fixed with respect to the vibration plate disposed independently 3,6; 17,37 and reaction stage, driving the stage with the main body 2 and 5, by the reaction force in the a freely movable along the direction of said support portion 8,10. 本发明的载物台驱动方法用于载物台驱动,该载物台包括在固定盘3、6上沿至少一个方向驱动的第1载物台2、5,其特征在于,随着所述第1载物台2、5的驱动,通过反作用力,将沿所述一个方向自由移动的第2载物台17、37支撑在相对于所述固定盘3、6独立振动的支撑部8、10上。 The stage drive method according to the present invention for driving the stage, the stage comprising a first stage in at least one direction of the drive 2,5 of the fixed plate 3,6, characterized in that, as the a first drive stage 2 and 5, by the reaction force, the free movement in the one direction in the second stage 17, 37 is supported relative to the support portion of the fixed plate 8, vibration is independently 3,6, 10. 因此,在本发明的载物台装置和载物台驱动方法中,在将第1载物台的载物台本体2、5在固定盘3、6上沿一个方向驱动时,随着载物台本体2、5的驱动,通过反作用力,第2载物台的反作用力载物台17、37沿与载物台本体2、5的相反方向移动,所以在载物台本体2、5和反作用力载物台17、37之间动量守恒法则起作用。 Accordingly, the stage device and the stage drive method according to the present invention, when the driving direction of the stage in a first stage main body 2 and 5 on the fixed plate 3,6, as carrier material 2,5 stage main drive, the reaction force of the second stage of the stage 17, 37 moved in a direction opposite to the stage main body 2 and 5 by the reaction force, so the stage body 5, and reaction between a loading station 17,37 momentum conservation law function. 由于反作用力载物台17、37相对于固定盘3、6在独立振动的支撑部8、10上移动,所以支撑部8、10的振动不传送到固定盘3、6,可以防止对载物台本体2、5的位置控制性产生影响。 Since the reaction force of the stage relative to the fixed plate 17, 37 move in the independent 3,6 vibrating support portions 8 and 10, the support portions 8, 10 of the vibration is not transmitted to the fixed plate 3,6, loading can be prevented 2,5 position of the stage main body controllability impact.

本发明的曝光装置对基底载物台5上保持的基底W曝光掩模载物台2上保持的掩模R的图形,其特征在于,在该曝光装置1中,作为所述掩模载物台2和所述基底载物台5的至少一个载物台,使用权利要求1至9的任何一项所述的载物台装置4、7。 The exposure apparatus of the invention the substrate W held on the substrate stage 5 carrying the exposure mask pattern on a mask stage holding R 2 thereof, wherein, in the exposure apparatus 1, as the mask stage table 2 and the substrate stage 5 at least one stage, stage of any one of claims 1 to 9 using the apparatus as claimed in claim 4,7. 本发明的曝光方法用于对基底载物台5上保持的基底W曝光掩模载物台2上保持的掩模R的图形,其特征在于,作为所述掩模载物台2和所述基底载物台5的至少一个的载物台驱动方法,使用权利要求17至20的任何一项所述的载物台驱动方法。 The exposure method of the present invention for exposure of the substrate W held on the substrate stage 5 holding a mask pattern of the mask R 2 on the loading table, wherein, as said mask stage and said 2 at least one stage drive method of a substrate stage 5, the use of any of claims stage drive method according to any one 17 to 20 of. 因此,在本发明的曝光装置和曝光方法中,由于可以缩短保持掩模R或基底W的载物台本体2、5的调整时间,提高生产率,同时抑制施加在载物台本体2、5上的振动的影响并维持位置控制性,所以可以进行高精度的曝光。 Thus, in the exposure apparatus and the exposure method of the present invention, since the mask can be shortened to maintain the substrate W or R a stage main body 2 and 5 to adjust the time, improve productivity, while suppressing the stage is applied to the body 2,5 Effects of vibrations and to maintain the position controllability, high-precision exposure can be performed. 通过使掩模载物台2、基底载物台5和投影光学系统PL相互独立振动,可以防止因掩模载物台2和基底载物台5的驱动造成的振动传送到投影光学系统PL,所以可以提高掩模R的成像特性。 By making the mask stage 2, the substrate stage 5 and the projection optical system PL independent vibration, the vibration can be prevented by the mask stage and the substrate 2 of the drive station 5 is transferred to the loading caused by the projection optical system PL, imaging characteristics can be improved reticle R. 而且,在根据这些曝光方法进行曝光的基底W上,可高精度地复制掩模R的图形。 Further, on the substrate W is exposed under the exposure method, a mask pattern with high accuracy R replication.

本发明涉及将玻璃基底或晶片等的曝光掩模图形的基底和保持该基底的载物台本体在固定盘上的平面内移动的载物台装置及其驱动方法,以及使用该载物台装置中保持的掩模和基底来进行曝光处理的曝光装置及其曝光方法,特别涉及制造半导体集成电路或液晶显示器等器件时,适合光刻工序使用的基底、载物台装置、载物台驱动方法和曝光装置及其曝光方法。 The present invention relates to an exposure mask or a pattern such as glass substrate and a substrate wafer holding station apparatus and a driving method of a mobile loading plane of the stage in the main body of the disc on the fixed base, and means for using the stage an exposure apparatus and an exposure method for an exposure process the mask and the substrate held, particularly relates to the production of a semiconductor integrated circuit device or a liquid crystal display, a substrate for use in photolithography process, stage device, a stage drive method and the exposure apparatus and exposure method.

根据本发明的载物台装置和载物台驱动方法, 由于包括相对于固定盘振动上独立配置的支撑部、以及通过随着载物台本体的驱动产生的反作用力在支撑部上移动的反作用力载物台,所以可以避免摇摆等问题,缩短调整时间,提高生产率,同时可以抑制将支撑部的残留振动传送到固定盘,可以维持载物台本体的位置控制性。 The stage device and the stage drive method according to the present invention, the upper portion comprising a support fixed with respect to the vibrating plate configured independently, and by the reaction with a reaction force driving the stage of generating moving body on the support portion power stage, and other problems can be avoided swing, shorten the adjustment time, improve productivity, and to suppress the residual vibration transmitted to the fixed disk support portion can be maintained, the position controllability of the stage body. 由于固定盘通过防振机构来支撑支撑部,所以可以抑制将支撑部的残留振动传送到固定盘,也可获得能够维持载物台本体的位置控制性的效果。 Since the fixed plate supported by the vibration isolating mechanism supporting portion, it is possible to suppress the residual vibration transferred to the fixed disk support portion, the effect can be obtained to maintain the position controllability of the stage body. 而且,由于反作用力载物台成为将载物台本体向一个方向驱动的驱动结构的至少一部分的结构,所以不需要另外设计用于排除反作用力的机构,实现装置的小型化和低价格化。 Further, since the reaction force of the stage will be at least a portion of the structure of the driving mechanism of the stage to a driving direction of the body, there is no need to exclude additional reaction mechanism is designed to achieve miniaturization and cost reduction of the apparatus. 而且,在反作用力载物台和支撑部之间,由于插装使围绕轴线旋转的反作用力载物台相对于支撑部移动的转动体,所以在反作用力载物台移动时,转动体进行围绕轴线旋转这样简单的操作,可以实现装置的简化。 Further, the reaction force between the stage and the support portion, the insertion reaction force since the stage is rotated about an axis relative to the rotational movement of the body supporting portion, the reaction force when the stage moves, rotates around the body the rotational axis of a simple operation, simplification of the apparatus can be realized. 此外,通过在反作用力载物台和支撑部之间插装非接触轴承,使反作用力载物台在没有摩擦下移动,所以可以排除支撑部的振动、随摩擦带来的外部干扰。 Further, the reaction force by the loading station between the insertion portion and the support of non-contact bearings, so that the reaction force of the stage moved without friction, it is possible to exclude the vibrating supporting portion, with the friction caused by external interference. 而且,通过对反作用力载物台沿相互相反的方向分别施力的施力部等的返回装置,还可获得以简单的机构能够容易地将反作用力载物台返回到初始位置的效果。 Further, like urging portion by the reaction force of the stage in mutually opposite directions along respective biasing return means, the effect can also be obtained in a simple reaction mechanism can be easily returned to the initial stage position. 此外,由于具有载物台本体沿移动的大致垂直方向可自由移动,将反作用力载物台设置在每个这种大致垂直的方向上的结构,所以即使在载物台本体两维移动的情况下,也可以避免随着移动因反作用力造成的摇摆等问题,可以进一步缩短调整时间,提高生产率。 Further, since a direction substantially perpendicular to the stage along the moving body can move freely, the reaction force of the stage in a direction substantially perpendicular to each such structure, even if the stage moves two-dimensionally in the main body under can be avoided with the movement of the reaction force due to swing so on, can further shorten the adjustment time and increase productivity.

而且,根据本发明的曝光装置和曝光方法,作为掩模载物台和基底载物台的至少一个载物台,由于使用权利要求1至权利要求9的任何一项所述的载物台装置,或权利要求1 7至权利要求20的任何一项所述的载物台驱动方法,所以可以缩短调整时间,提高生产率和曝光精度,同时可以抑制支撑部的残留振动传送到固定盘,可以维持载物台本体的位置控制性。 Further, according to exposure apparatus and the exposure method of the present invention, as a mask and the substrate stage at least one stage of the loading station, due to the use of claims 1 to stage apparatus as claimed in claim any one of claims 9 as claimed in claim 17 to a stage drive method according to any one of claim 20 or claim, it is possible to shorten the adjustment time, the exposure accuracy and improve productivity, and to suppress the residual vibration transmitted to the support portion fixed disk, can be maintained loading position controllability of the stage body. 通过掩模载物台、基底载物台和投影光学系统在振动上相互独立配置,可以防止因载物台的驱动造成的振动传送到投影光学系统,所以有效地防止因投影光学系统的振动造成的图形复制位置的偏差或产生图像模糊等,提高曝光精度。 By a mask stage, the substrate stage and the projection optical system is disposed independently of each other in the vibration can be prevented due to the vibration caused by driving the stage is transmitted to the projection optical system, it is effectively prevented due to the vibration caused by the projection optical system transferring position deviation pattern or generate image blurring, exposure accuracy is improved. 而且,通过掩模载物台保持多片掩模,基底载物台保持多片基底,交换和对准操作与曝光操作同样进行,所以可以大幅度地提高生产率。 Further, the mask held by the mask stage multi-chip, multi-substrate stage holding the substrate sheet, the exchange and the alignment operation and the exposure operation in the same manner, it is possible to greatly improve productivity. 而且,如果使定子由多个转子共用,那么可以实现部件的削减、即实现装置的简化、低价格化。 Further, if the stator is shared by a plurality of rotors, the reduction may be achieved member, i.e. to achieve simplification of the apparatus, cost reduction.

另一方面,根据本发明的基底,使用上述曝光方法来进行图形曝光,能够使图形的重叠、线宽维持高精度,显现规定的器件特性。 On the other hand, according to the present invention, the substrate, the exposure method using the pattern exposure, the pattern can be made to overlap, to maintain the line width accuracy, the predetermined characteristics of the device appears.

附图说明 BRIEF DESCRIPTION

图1是表示本发明第1实施例的图,是将原版载物台、晶片载物台和投影光学系统在振动上相关联并独立配置的曝光装置的示意结构图。 FIG 1 shows a first embodiment of the present invention, is a precursor stage, wafer stage a schematic configuration diagram of an exposure apparatus stage and the projection optical system and the vibration associated with the independently configured.

图2是配有该原版载物台的载物台装置的外观斜视图。 FIG 2 is equipped with the stage device of the master stage of the appearance of a perspective view in FIG.

图3是表示本发明第1实施例的图,是两侧连接弹簧的定子的侧面图。 FIG. 3 shows a first embodiment of the present invention, FIG, is a side view of the spring attached to both sides of the stator.

图4是配有晶片载物台的载物台装置的局部放大图。 FIG 4 is a partial stage with the wafer stage apparatus in an enlarged FIG.

图5是驱动晶片载物台的线性电机的主要部分的放大图。 FIG 5 is an enlarged view of a main portion of the linear motor driving the wafer stage.

图6是表示本发明第2实施例的图,是将原版载物台、晶片载物台和投影光学系统在振动上相关联并独立配置的曝光装置的示意结构图。 FIG 6 is a diagram illustrating an example of a second embodiment of the present invention, it is a precursor stage, wafer stage a schematic configuration diagram of an exposure apparatus stage and the projection optical system and the vibration associated with the independently configured.

图7是表示配有该晶片载物台的载物台装置的另一实施例的外观斜视图。 7 is a perspective view of another appearance with the stage device of the wafer stage embodiment.

图8是表示半导体器件的制造工序示例的流程图。 FIG 8 is a flowchart showing a manufacturing process of an example of a semiconductor device.

具体实施方式 Detailed ways

以下,参照图1至图7来说明本发明的基底、载物台装置、载物台驱动方法和曝光装置及其曝光方法的实施例。 Hereinafter, with reference to FIGS. 1 to 7 will be described embodiments of the present invention, the substrate, the stage device, a stage drive method and an exposure apparatus and exposure method. 这里,例如作为曝光装置,说明使原版和晶片同步移动,并且使用在晶片上复制在原版上形成的半导体器件的电路图形的扫描载物台情况的实例。 Here, for example, as an exposure apparatus, explaining a wafer and the original synchronous movement, and using scanning on the wafer stage replicated instance the case of a semiconductor device circuit pattern formed on the original plate. 在该曝光装置中,假设在原版载物台和晶片载物台双方都采用本发明的载物台装置。 In this exposure apparatus, it is assumed in the original stage and the wafer stage used for both the stage device of the present invention.

[第1实施例]首先,根据图1至图5来说明第1实施例。 [First Embodiment] First, according to FIGS. 1 to 5 of the first embodiment will be described. 图1所示的曝光装置1大致如下构成:通过来自光源(未图示)的曝光用的照明光对原版(掩模)R上的矩形状(或圆弧状)的照明区域以均匀的照度进行照明的照明光学系统IU;包括作为保持原版R的掩模载物台的原版载物台(载物台本体、第1载物台)2和支撑该原版载物台2的原版固定盘(固定盘)3的载物台装置4;将从原版R发射的照明光投影到晶片(基底)W上的投影光学系统PL;包括作为保持晶片W的基底载物台的晶片载物台(载物台本体、第1载物台)5和保持该晶片载物台5的晶片固定盘(固定盘)6的载物台装置7;以及支撑上述载物台装置4和支撑投影光学系统PL的反应框架(支撑部)8。 The exposure apparatus 1 shown in FIG. 1 configured as follows: exposure from a light source (not shown) with illumination light of the original (mask) a rectangular shape (or arc shape) on the R illumination region with uniform illuminance illumination of the illumination optical system IU; precursor includes a mask stage holding the original R a stage (stage main body, a first stage) 2 and the support of the fixed plate precursor original loading table 2 ( fixed disk) stage device 3, 4; R illumination light projected from the original emitted to the wafer (substrate) in the projection optical system PL W; wafer includes a substrate stage holding the wafer W stage (contained stage main body, a first stage) 5 and holds the wafer stage holding a wafer disk table 5 (fixed disk) stage device 76; and supporting the stage device 4 and supports the projection optical system PL. The reaction frame (support portion) 8. 这里,设投影光学系统PL的光轴方向为Z方向,在与该Z方向垂直的方向上原版R和晶片W的同步移动方向为Y方向,非同步移动方向为X方向。 Here, the optical axis direction of projection optical system PL provided for the Z direction, in a direction perpendicular to the Z direction, the synchronous movement direction R and the original wafer W is Y-direction, the non-synchronous movement direction is the X direction. 此外,设各个旋转轴的旋转方向为θZ、θY、θX。 Further, the rotation direction of each rotation shaft is provided θZ, θY, θX.

照明光学系统IU由固定于反应框架8上面的支撑座9支撑。 The illumination optical system IU is fixed to the reactor by a frame 8 supporting base 9 above. 作为曝光照明光,例如使用从超高压汞灯发射的紫外频域的辉线(g线、i线)和KrF准分子激光(波长248nm)等远紫外光(DUV光)、ArF准分子激光(波长193nm)和F2激光(波长157nm)等的真空紫外光(VUV)等。 As the exposure illumination light, for example, field violet FSB of ultrahigh pressure mercury lamp emitted from the emission line (g-ray, i-ray) and a KrF excimer laser (wavelength of 248 nm) and the like, far ultraviolet beams (DUV light), an ArF excimer laser ( wavelength 193 nm) and F2 laser (wavelength 157 nm) like vacuum ultraviolet light (VUV) and the like. 将反应框架8设置在水平装载于底面的底座框架10上,在其上部侧和下部侧,分别形成向内侧突出的台阶部8a和8b。 The reaction frame 8 is provided on the bottom surface of horizontal base mounted on the frame 10, in its upper and lower sides, are formed inwardly projecting step portions 8a and 8b.

载物台装置4中,原版固定盘3在各角部中反应框架8的台阶部8a上通过防振组件(防振机构)11被大致水平地支撑(对于纸面里侧的防振组件未图示),在其中央部上形成于原版R上形成的图形图像通过的开口3a。 The loading table device 4, the master disk 3 fixed to each of the corner portion 11 is substantially horizontally supported via a vibration isolating unit (anti-vibration means) of the stepped portion 8a of the frame 8 the reaction (for the back side of the paper is not vibration-proof assembly shown), an image pattern formed on the original plate R is formed at its central portion through the opening 3a. 防振组件11成为将可调整内部压力的空气支架12和音频线圈电机13串联配置在台阶部8a的结构。 The vibration isolating unit 11 is an adjustable air pressure inside the bracket 12 and the voice coil motor 13 are arranged in series in the stepped portion 8a of the structure. 通过这些防振组件11,通过基座框架10和反应框架8,使传送到原版固定盘3的微振动以微G水平被绝缘。 These vibration isolating unit 11, the base frame 10 and through the reaction frame 8, the transfer to the master micro-vibration plate 3 is fixed to the micro G level are insulated.

在原版固定盘3上,将原版载物台2沿该原版固定盘3可两维移动地支撑。 3 fixed on a master disc, the master stage of the master 2 in the fixed platen 3 may be two dimensional movement is supported. 在原版载物台2的底面中,将作为非接触的轴承的多个空气轴承(空气衬垫)14固定,通过这些空气轴承14,使原版载物台2在原版固定盘3上由几微米左右的间隙来浮动支撑。 In the original bottom surface of the loading table 2, the non-contact bearing as a plurality of air bearings (air pads) 14 is fixed, through which the air bearing 14, the upper stage 3 precursor 2 in the fixed disk by a few microns master floating support to the right and left gaps. 在原版载物台2的中央部中,形成与原版固定盘3的开口3 a连通、原版R的图形图像通过的开口2a。 In the central portion of the original loading station 2, the fixed platen with the original form of the opening 3 communicates 3 A graphic image R by the original opening 2a. 原版载物台2通过两组线性电机(驱动机构)15沿作为扫描方向的Y方向在规定冲程范围内于原版固定盘3上被驱动。 Precursor stage 2 is driven within a predetermined stroke range by two linear motors (driving means) 15 in the Y direction as the scanning direction on the fixed master plate 3. 原版载物台2有吸附保持原版R并沿非扫描方向(X方向)和θZ方向进行微小驱动的未图示的原版微动载物台、以及与该微动载物台连接的沿X、Y方向可移动的粗动载物台,但这里将它们作为一个载物台来图示。 Precursor stage 2 holding precursor has adsorbed precursor and R minute drive non-scanning direction (X direction) and θZ directions unillustrated fine movement stage, and is connected to the fine movement stage along the X, Y coarse movement direction of the movable stage, but here they are as a stage is illustrated. 因此,原版载物台2成为沿Y方向以长冲程直线驱动,而沿X方向和θZ方向可微小驱动的结构。 Thus, the original stage 2 in the Y direction becomes the long-stroke linear drive, in the X direction and the θZ direction of the minute drive structure.

如图2所示,在原版载物台2的-Y方向的端部上,固定着由角部立方体组成的一对Y移动镜18a、18b,而在原版载物台2的+X方向的端部上,固定着沿Y方向延伸的由平面镜组成的X移动镜19。 2, the upper end portion of the original loading table 2 -Y direction, and is fixed to a pair of Y movable mirror 18a by the corner portion of the cubes, 18b, and in the + X direction original loading table 2 end portion is fixed by the flat mirrors X movable mirror 19 extending in the Y direction. 而且,对于这些移动镜18a、18b、19,通过照射测长光束的三个激光干扰计(均未图示)计测与各移动镜的距离,来高精度地计测原版载物台2的X、Y、θZ(Z轴周围的旋转)方向的位置。 Moreover, these movable mirrors 18a, 18b, 19, measured by irradiating three laser wavelength beam interference meter (not shown) with the measurement distance movable mirror to accurately measure the precursor stage 2 X, position Y, θZ (Z around the axis) direction.

如图1所示,在原版载物台2的X方向两侧面的Z方向大致中心位置上,分别一体地设置内置线圈并沿Y方向延伸的转子16。 As shown in FIG. 1, in a substantially central position of the original loading both sides of the Z-direction in the X direction on the table 2, are integrally built-in coil and a rotor 16 disposed extending in the Y direction. 而且,相对于各个这些转子16,配置作为反作用力载物台(第2载物台)的剖面コ字状的一对定子17。 Further, the rotor 16 with respect to each of these, a cross-sectional configuration as a reaction force of the stage (the second stage) of the U-shaped pair of stators 17. 定子17由定子轭铁和沿该定子轭铁的延伸方向以规定间隔配置的产生交变磁场的多个永久磁铁构成。 The stator 17 and the stator yoke in the extending direction of the stator yoke at predetermined intervals a plurality of permanent magnets arranged in alternating magnetic field configuration. 即,由转子16和定子17来构成动圈式的线性电机15,通过与定子17之间的电磁的相互作用,沿Y方向(一方向)驱动转子16。 That is, the rotor 16 and stator 17 constitute moving coil type linear motor 15, by electromagnetic interaction with the stator 17, the drive rotor 16 in the Y direction (a direction). 包含转子16等的原版载物台2侧和定子17侧的重量比大约设定为1∶4。 Wt precursor comprises a rotor 16 like the stage 2 side and the side of the stator 17 is set to approximately 1:4 ratio.

如图2所示,在各定子17和反应框架8的上表面之间,分别插装转动导轨20。 As shown in FIG 2, between the stator 17 and the upper surface of each reaction frame 8, each insertion guide 20 is rotated. 转动导轨20成为沿X方向延伸并将各围绕轴线旋转的多个滚轮(转动体)21在Y方向上以一定的间隔来配置的结构,定子17通过滚轮21的旋转相对于反应框架8在Y方向上可自由移动。 21 becomes rotatable rail 20 extending in the X direction and the structure of each of the plurality of rollers rotatable about an axis (rotation member) in the Y-direction at constant intervals arranged, the stator 17 by the rotation of the roller relative to the reaction frame 21 in the Y-8 freely movable direction. 如图3所示,在各定子17的Y方向两侧上,分别连接构成将定子17返回到初始位置的返回装置的一对弹簧(施力部)22、22的一端。 As shown in FIG. 3, both sides in the Y-direction of the stator 17, the stator 17 constituting respectively connected to the initial position of a pair of spring return means (biasing portion) 22, 22 at one end. 这些弹簧22的另一端被固定在反应框架8上,在沿Y方向的相互相反的方向上,将大致相同的力分别施力(例如,拉伸)给定子17。 The other end of spring 22 is fixed to the frame 8 on the reaction, in the opposite directions to each other in the Y direction, respectively, the biasing force approximately the same (e.g., stretch) to the stator 17. 各弹簧22设定充分的弯曲量,以便定子17移动时也在弹性范围内变形。 Each spring 22 is set a sufficient amount of bending, deformation within the elastic range so that also the stator 17 move. 从图1、2可知,该原版载物台2在X、Y方向的移动时成为没有导轨原版载物台2的移动的导轨部件的无导轨载物台。 Seen from FIG. 1, the original plate stage 2 becomes no no guide rail precursor stage loading rail member movable table 2 is moved in the X, Y directions.

返回到图1,作为投影光学系统PL,这里使用物体面(原版R)侧和成像面(晶片 W)侧两方在远心下有圆形的投影视野,由石英或萤石作为光学玻璃材料的折射光学元件(透镜元件)构成的缩小倍率为1/4(或1/5)的折射光学系统。 Returning to Figure 1, as the projection optical system PL, as used herein, the object plane (the original R) and the imaging plane side (wafer W) side both of a circular projection field of view at telecentric, quartz glass or fluorite as an optical material, refractive optical element (lens element) constituting the reduction magnification is 1/4 (or 1/5) of the refractive optical system. 因此,如果将照明光照射到原版R上,那么在原版R上的电路图形中,来自照明光照明部分的成像光束入射到投影光学系统PL,该电路图形的部分倒立像以受限于缝隙状成像于投影光学系统PL的成像面侧的圆形视野的中央。 Therefore, if the illumination light to the original R, then the circuit pattern on the original plate R, the imaging light beam from the illumination light incident to the portion of the projection optical system PL, which circuit pattern portion image to be limited to the inverted slit-like central circular field of view imaged on the image plane side of projection optical system PL. 由此,投影的电路图形的部分倒立像在配置于投影光学系统PL的成像面的晶片W上的多个拍摄区域中,被缩小复制在一个拍摄区域表面的抗蚀剂层上。 Thus, portions of the circuit pattern projected inverted image on a plurality of shot areas arranged in the imaging plane of the projection optical system PL of the wafer W is reduced and transferred on a shot area of ​​the resist layer surface.

在图4中,由曝光装置1的投影光学系统PL将下方放大表示。 In FIG. 4, the projection optical system PL by the exposure apparatus 1 is represented enlarged downward. 如图所示,在投影光学系统PL的镜筒部的外周上设置与该镜筒部一体化的凸缘23。 As shown, a flange 23 integral with the barrel portion on the outer peripheral portion of the lens barrel of the projection optical system PL. 而且,将投影光学系统PL以光轴方向作为Z方向从上方插入在反应框架8的台阶部8b上通过防振组件24大致水平支撑的铸造物等构成的镜筒25中,并且连接凸缘23。 Further, the projection optical system PL in the optical axis direction as a lens barrel constituting the Z direction upward from the stepped portion 8b is inserted in the frame 8 is supported by the reaction assembly 24 substantially horizontal vibration isolating casting or the like 25, and the connection flange 23 . 作为凸缘23的材料,可使用低膨胀的材质,例如殷钢(Invar;由36%的镍、0.25%的锰、以及微量的碳和包含其他元素的铁构成的低膨胀的合金)。 As the material of the flange 23, use of low expansion material such as Invar (of Invar; from 36% nickel, 0.25% manganese, trace amounts of carbon and other elements containing low-expansion alloy composed of iron). 该凸缘23将投影光学系统PL对于镜筒固定盘25通过点、面和V槽由三点支撑,形成所谓的活动(kinematic)支撑支架的结构。 The flange 23 of the lens barrel for the projection optical system PL by the fixed point plate 25, and the V-groove surface is supported by a three-point, a so-called activity (Kinematic) a support structure of the stent. 采用这样的活动支撑构造时,投影光学系统PL的镜筒固定盘25的组装容易,而且具有可以最有效地减轻因组装后的镜筒固定盘25和投影光学系统PL的振动、温度变化等引起的应力的优点。 When such a mobile support structure, the projection optical system PL of the barrel assembly 25 is easily fixed disk, and has most effectively alleviate the fixed barrel after assembly to cause vibration plate, 25 a temperature change and the like of the projection optical system PL advantage of stress.

防振组件24被配置在镜筒固定盘25的各角部(未图示纸面进深侧的防振组件),成为将可调整内压的空气支架26和音圈电机27串联配置在台阶部8b上的结构。 The vibration isolating unit 24 is arranged at each corner portion of the lens barrel 25 fixed platen (not shown paper feed side of the vibration isolating unit depth) as the pressure of the air within the adjustable bracket 26 and the voice coil motor 27 are arranged in series in the stepped portion 8b structure on. 通过这些防振组件24,可以以微小G等级来绝缘通过基座框架10和反应框架8传送到镜筒固定盘25(或投影光学系统PL)的微振动。 Through these anti-vibration assembly 24 may be a slight level G transmitted through the insulating base frame and reaction frame 8 to 10 micro-vibration plate fixed to the lens barrel 25 (or the projection optical system PL) of.

载物台装置7以保持晶片W的晶片载物台5、沿XY平面可两维移动支撑该晶片载物台5的晶片固定盘6为主体来构成。 Stage device 7 to the wafer stage 5 holding the wafer W along the XY plane may be two-dimensional movement of the wafer stage supporting the wafer table 5 of the fixed plate body 6 is constituted. 如图4所示,在晶片载物台5的底面上,固定着作为非接触轴承的多个空气轴承(空气衬垫)28,通过这些空气轴28,将晶片载物台5例如通过几微米左右的间隙浮动支撑在晶片固定盘6上。 4, the bottom surface of the wafer loading table 5, a plurality of fixed air bearings (air pads) 28, through which air noncontact bearing shaft 28, the wafer stage 5, for example, by several microns gap left floating support plate 6 is fixed on the wafer.

晶片固定盘6通过防振组件(防振机构)29大致水平地支撑在基座框架(支撑部)10的上方。 Wafer holder plate 6 is supported above the base frame (support portion) 10 by vibration isolating assembly (anti-vibration unit) 29 substantially horizontally. 防振组件29配置在晶片固定盘6的各角部(未图示纸面里侧的防振组件),成为将可调整内压的空气支架30和音圈电机31并联配置在基座框架10上的结构。 The vibration isolating unit 29 is disposed at each corner portions of the wafer holding plate 6 (not shown in the drawing side of the vibration isolating unit), become the air pressure within the adjustable holder 30 and voice coil motor 31 are arranged in parallel on the base frame 10 Structure. 通过这些防振组件29,可以以微小G等级来绝缘通过基座框架10传送到晶片固定盘6的微振动。 Through these anti-vibration assembly 29 may be a slight level G transmitted through the insulating base frame 10 to the micro-vibration of the wafer holding plate 6.

晶片载物台5通过沿X方向驱动该晶片载物台5的一对线性电机32(未图示比晶片载物台5靠纸面这侧的线性电机)、以及沿Y方向驱动晶片载物台5的一对线性电机(驱动机构)33在晶片固定盘6上沿XY两维方向可自由移动。 The wafer stage 5 is driven by the X-direction of the wafer loading station 5 a pair of linear motors 32 (not shown than the wafer stage 5 of the linear motor on the side of the drawing), and a drive in the Y direction of the wafer loading table 5 a pair of linear motor (drive mechanism) 33 is freely movable in the XY two-dimensional directions on the wafer holding plate 6. 线性电极32的定子沿X方向延伸设置在晶片载物台5的Y方向两外侧,通过一对连接部件34使两端部相互间连接,构成矩形的框体35。 The stator linear electrodes extending in the X direction 32 is provided at both outer sides of the wafer loading table 5 in the Y direction, so that both end portions 34 by a pair of connecting members connected to each other to form a rectangular frame body 35. 线性电机32的转子被突出设置在晶片载物台5的Y方向两侧面上,以便面对定子。 The rotor of the linear motor 32 is provided protruding in the Y-direction both sides of the wafer stage 5, so as to face the stator.

在构成框体35的一对连接部件34或线性电机32的下端面上,分别设置电枢组件构成的转子36、36,作为与这些转子36、36对应的具有磁铁组件的第2载物台的定子(反作用力载物台)37、37沿Y方向延伸。 In the frame body 35 constituting a linear motor 34 or the lower end surface of the connecting member 32 respectively constitute a rotor armature assembly 36, 36, 36 and 36 as those corresponding to the second rotor having a magnet carrier assembly station a stator (reaction stage) 37, 37 extending in the Y direction. 如图5所示,在各定子37和基座框架10之间,分别插装旋转导轨38。 5, between each of the stator 37 and the base frame 10, the rotation guide means 38 are inserted. 旋转导轨38成为将轴线沿X方向延伸,各围绕轴线旋转的多个滚轮(转动体)39沿Y方向以一定的间隔配置的结构,定子37通过滚轮39的旋转相对于作为支撑部的基座框架10沿Y方向自由移动。 The guide rail 38 becomes the rotation axis extends in the X direction, each axis of rotation about a plurality of rollers (rolling bodies) 39 structures arranged at certain intervals in the Y direction, the stator 37 by rotation of the roller 39 with respect to a base support portion frame 10 is free to move in the Y direction.

如图3所示,与定子17同样,在各定子37的Y方向两侧,分别连接构成将定子37返回到初始位置的返回装置的一对弹簧(施力部)40、40的一端。 As shown in FIG. 3, the same, both sides of the stator 17 in the Y direction, the stators 37 are respectively connected to form one end of the stator 37 to the initial position of a pair of spring return means (biasing portion) 40, 40. 这些弹簧40的另一端固定于基座框架10上,使定子37在沿Y方向的相互相反的方向上分别以大致相同的力施力(例如拉伸)。 Another end of the spring 40 is fixed to the base frame 10, the stator 37 are at substantially the same biasing force (e.g., stretched) in the opposite directions to each other in the Y direction. 将各弹簧40设定充分的弯曲量,以便定子37移动时也在弹性范围内变形。 Also the deformation when the elastic range 40 set a sufficient amount of bending springs, so as to move the stator 37.

然后,通过这些转子36和定子37来构成动圈式的线性电机33,将转子36通过与定子37之间的电磁相互作用沿Y方向(一方向)来驱动。 Then, the rotor 36 and stator 37 constitute moving coil type linear motor 33, the solenoid 36 between the rotor 37 by interaction with the stator is driven in the Y direction (a direction). 即,通过该线性电机33,沿Y方向驱动与框体35一体的晶片载物台5。 That is, the linear motor 33, 35 integral with the drive housing in the Y direction of the wafer stage 5. 从图4可知,晶片载物台5成为在Y方向的移动上没有导轨部件的无导轨载物台。 Seen from FIG. 4, the wafer stage 5 becomes no stage guide rail member is not moved in the Y direction. 再有,有关晶片载物台5的X方向的移动,也可以适当形成无导轨载物台。 Further, the mobile station about the wafer stage 5 in the X direction, the guide rails may suitably be formed without stage.

在晶片载物台5的上面,通过晶片支架41,利用真空吸附等来固定晶片W。 In the above wafer stage 5 through the wafer holder 41 by vacuum suction or the like is fixed to the wafer W. 晶片载物台5的X方向的位置以固定于投影光学系统PL的镜筒下端的参照镜42为基准,通过计测固定于晶片载物台5的一部分上的移动镜43的位置变化的位置计测装置的激光干扰计44,以规定的分辨率、例如0.5~1nm左右的分辨率进行实时计测。 Wafer X-direction position of the stage 5 is fixed to the lower end of the barrel of projection optical system PL as a reference of the reference mirror 42, by measuring the position of the wafer stage fixed to the movable mirror 5 on the stage portion 43 of the change in the position of laser interference measurement device 44 gauge, at a predetermined resolution, for example, about 0.5 ~ 1nm resolution measured in real time. 通过与上述参照镜42、移动镜43、激光干扰计44大致垂直配置的未图示的参照镜、移动镜、激光干扰计来计测晶片载物台5的Y方向的位置。 By the position of the reference mirror 42, the movable mirror 43, a laser interference meter 44 arranged substantially perpendicular to the reference mirror (not shown), the movable mirror, a laser interference meter for measuring wafer stage 5 in the Y direction stage. 这些激光干扰计中的至少一个是测长轴为两轴以上的多轴干扰计,根据这些激光干扰计的计测值,不仅晶片载物台5(或晶片W)的XY位置,而且旋转量θ或除了它们以外,还可以求调整量。 The laser interference meter is a measuring axis of the at least two axes or more multi-axis disturbance count, based on the measurement values ​​of the laser interference meter, not only the wafer stage 5 (or wafer W) XY position, and the rotation amount θ or in addition to them, also in order to adjust the amount.

在上述原版固定盘3、晶片固定盘6、镜筒固定盘25上,分别安装计测各固定盘的Z方向振动的三个传感器(例如加速度计,未图示)和计测XY平面内方向的振动的三个传感器(例如加速度计,未图示)。 3, the wafer holding plate 6, the plate 25 fixed to the lens barrel, three sensors are attached to respective fixed Z direction measuring vibration plate (such as an accelerometer, not shown) In the above master disc and the stationary measuring XY plane direction the three vibration sensors (e.g., an accelerometer, not shown). 后者的振动传感器中的两个传感器计测各固定盘Y方向的振动,剩余的振动传感器计测X方向的振动(以下,为了简便,将这些振动传感器称为振动传感器组)。 Two vibration sensors each fixed disk is measured in the Y direction in which vibration sensor, vibration sensor remaining measured in the X direction (hereinafter, for simplicity, these will be referred to as a vibration sensor vibration sensor group). 而且,根据这些振动传感器组的计测值,可以分别求原版固定盘3、晶片固定盘6、镜筒固定盘25的6个自由度(X、Y、Z、θX、θY、θZ)的振动。 Further, based on the measurement values ​​of the vibration sensor groups, can find the original fixed plate 3, the vibration plate fixed to the lens barrel 6 degrees of freedom (X, Y, Z, θX, θY, θZ) of the fixed plate 25 of the wafer 6, respectively, .

而且,如图4所示,在投影光学系统PL的凸缘23上,在不同的三个地方固定着作为位置检测装置的三个激光干扰计45(其中,在图4中,在这些激光干扰计中有代表性地示出一个)。 Further, as shown, the flange 23 of the projection optical system PL, 4 fixed at three places as three different laser interference meter position detecting means 45 (which, in FIG. 4, in which the laser interference meter representatively shown). 在面对各激光干扰计45的镜筒固定盘25的部分上,分别形成开口25a,通过这些开口25a,从各激光干扰计45将Z方向的测长光束照射到晶片固定盘6。 In the face of each laser interference meter barrel portion 45 of the fixed plate 25 are respectively formed openings 25a, through the openings 25a, the count from each of the interference laser beam 45 is irradiated to the measured length in the Z direction of the wafer fixed plate 6. 在晶片固定盘6的上面的各测长光束的对置位置上,分别形成反射面。 In the opposite positions of the measuring beam above the wafer holding plate 6, a reflecting surface are formed. 因此,通过上述三个激光干扰计45,晶片固定盘6的不同的三点的Z位置以凸缘23为基准来分别计测(其中,在图4中,晶片载物台5上的晶片W的中央拍摄区域表示处于投影光学系统PL的光轴的正下方,所以测长光束处于被晶片载物台5遮挡的状态)。 Therefore, by the three laser interference meter 45, the wafer holding plate different Z positions of three of the flange 6 to 23 were measured as a reference (which in Figure 4, the wafer W on the wafer stage 5 represents a region in the center directly below the photographing optical axis of projection optical system PL, the measuring beam is occluded state of the wafer stage 5). 在晶片载物台5的上面形成反射面,也可以设置以投影光学系统PL或凸缘23为基准来计测该反射面上的不同三点的Z方向位置的干扰计。 The reflecting surface is formed on top of the wafer stage 5 may be provided to count the interference projection optical system PL as a reference or flange 23 on the reflecting surface measured in the Z direction in different positions of the three points.

下面,在上述结构的载物台装置4、7中,首先说明载物台装置4的工作情况。 Next, in the stage device of the above-described configuration 4, 7, described first operation stage device 4.

原版载物台2通过线性电机15的驱动沿扫描方向(例如+Y方向)移动时,在驱动产生的反作用力下定子17通过旋转导轨20在反应框架8上沿反方向(-Y方向)相对移动。 When the master carrier 2 by a linear motor driving the scan direction (e.g., + Y direction) movement of the stage 15, the reaction force generated in the drive lower stator 1720 in the opposite direction (-Y direction) by rotating the guide frame 8 in the opposite reaction mobile. 此时,在旋转导轨20中,由于滚轮21旋转,所以定子17平滑地移动。 At this time, the guide rail 20 in the rotation, the rotation roller 21, the stator 17 to move smoothly.

这里,在原版载物台2和定子17及原版固定盘3的三者间的摩擦为零的情况下,动量守恒法则起作用,随着原版载物台2的移动,定子17的移动量按原版载物台2侧(包括Y移动镜18a、18b、X移动镜19、转子16、原版R等)和定子17侧的重量比来决定。 Here, under the original table 2 and loading the friction between zero and three stator 17 fixed master disk 3, the law of conservation of momentum acts, with the movement of the mobile station 2 an amount of a stator 17 according to the original loading precursor stage 2 side (including Y movable mirror 18a, 18b, X movable mirror 19, the rotor 16, the original R, etc.) and weight of the stator 17 side determined ratio. 具体地说,由于原版载物台2侧和定子17侧的重量比约为1∶4,所以例如原版载物台2的+Y方向的30cm的移动使定子17沿-Y方向移动7.5cm。 Specifically, since the weight of the original carrying table 2 side and the stator 17 side than about 1:4, the precursor such as a mobile stage 2 + Y direction of the stator 17 of 30cm in the -Y direction 7.5cm.

因此,原版载物台2的扫描方向的加减速时的反作用力通过定子17的移动被吸收,载物台装置4中的重心的位置实质上被固定在Y方向上。 Accordingly, the reaction force when the deceleration stage scanning direction of the original 2 is absorbed by moving the stator 17, the center of gravity position of the stage means 4 is substantially fixed in the Y direction. 由于支撑定子17的反应框架8通过防振组件11来支撑原版固定盘3,所以这些反应框架8和原版固定盘3在振动上成为独立状态。 Because reaction frame 17 supporting the stator 811 is fixed to the support plate precursor by vibration isolating assembly 3, these reaction frame 8 and the fixed disc 3 as an independent master on the vibration state. 因此,在原版载物台2被驱动时,通过上述反作用力,也可以有效地抑制原版固定盘3的振动。 Thus, when the original stage 2 is driven by the above reaction, the vibration can be effectively suppressed master disk 3 fixed. 通过定子17沿-Y方向移动,图3所示的施力部22对定子17的施力的均衡被破坏,增加对定子17沿+Y方向施力的力。 Moves in the -Y direction by the stator 17, the biasing portion 22 is shown in FIG. 3 equalized damage urging the stator 17, increasing force on the stator 17 along the Y + direction urging. 因此,定子17迅速返回到上述施力均衡的位置、即初始位置。 Thus, the stator 17 quickly returns to the urging position of equilibrium, i.e., the initial position.

然后,防振组件11根据激光干扰计的计测值,以前馈赋予消除随着原版载物台2的移动因重心的变化造成的影响的力(反作用力),驱动气体支架12和音圈电机13来产生该力。 Then, the vibration isolating unit 11 based on the measurement value of the laser interference meter, the feedforward force imparted to eliminate the influence of the original loading as the mobile station 2 due to a change caused by gravity (reaction force), the gas holder 12 and voice coil drive motor 13 to generate the force. 依据原版载物台2和定子17及原版固定盘3的三者之间的摩擦为零,仅是原版载物台2和定子17的移动方向有所不同等的理由,在原版固定盘3的6个自由度方向的微小振动残留的情况下,根据振动传感器组的计测值,为了除去上述残留振动,还对空气支架12和音圈电机13进行反馈控制。 Based on the friction between the original three loading station 2 and the fixed stator 17 and the master disk 3 is zero, and only the moving direction of the original reasons for carrying the stator 17 and the like differ from stage 2 was in the original fixed disk 3 a case where the minute vibration directions of six degrees of freedom remaining, based on the measured values ​​of the vibration sensor group, for removing the residual vibration, air bracket 12 and also the voice coil motor 13 performs feedback control.

另一方面,在载物台装置7中也产生与载物台装置4相同的操作。 On the other hand, in the stage device 7 also produces the same operation as the stage device 4.

晶片载物台5通过线性电机33的驱动沿扫描方向(+Y方向)移动时,在驱动产生的反作用力下,定子37通过旋转导轨38在基座框架10上沿反方向(-Y方向)相对移动。 Wafer stage 5 by driving the scanning direction (+ Y direction) of the linear motor 33 moves, the driving reaction force generated at the stator 3738 on the base frame 10 in the reverse direction by the rotation of the guide rail (-Y direction) relative movement. 此时,在旋转导轨38中,由于滚轮39旋转,所以定子37平滑地移动。 In this case, the rotary guide 38, since the roller 39 is rotated by the stator 37 to move smoothly. 而且,在晶片载物台5、定子37和晶片固定盘6三者间的摩擦为零的情况下,动量守恒法则起作用,随着晶片载物台5的移动,定子37的移动量按晶片载物台5侧和定子37侧的重量比来决定。 Further, when the friction between the wafer stage 5, the stator 37 and the three wafer holding plate 6 is zero, the momentum conservation law function, with the movement of the wafer loading station 5, the stator 37 by an amount of movement of the wafer by weight of the stage 5 and the side 37 of the stator determined ratio. 因此,晶片载物台5的扫描方向的加减速时的反作用力通过定子37的移动被吸收,载物台装置7的重心位置实质上固定于Y方向上。 Accordingly, the reaction force when the deceleration of the wafer stage 5 in the scanning direction is absorbed by moving the stator 37, the position of the center of gravity of the stage device 7 is substantially fixed to the Y-direction. 由于定子37支撑的基座框架10通过防振组件29来支撑晶片固定盘6,所以这些基座框架10和晶片固定盘6成为振动独立状态。 Since the base frame 37 supporting a stator 10 supported by a fixed disk vibration isolating wafer assembly 296, the base frame 10 and the wafer holding plate 6 becomes independent vibration state. 因此,在驱动晶片载物台5时,通过上述反作用力也可以有效地抑制晶片固定盘6的振动。 Accordingly, when the driving of the wafer stage 5, the above reaction may effectively suppress vibration of the wafer holding plate 6. 通过定子37沿-Y方向移动,图3所示的施力部40对定子37的施力的均衡被破坏,增加对定子37沿+Y方向施力的力。 -Y direction by moving the stator 37, the stator 40 pairs of balanced urging the urging portion 37 shown in Figure 3 is broken, the force increases in the + direction of the Y urging the stator 37. 因此,定子37迅速返回到上述施力均衡的位置、即初始位置。 Thus, the stator 37 quickly return to the position of the force balance, i.e., the initial position.

然后,防振组件29根据激光干扰计44等的计测值,通过前馈赋予消除随着晶片载物台5的移动因重心的变化造成的影响的反作用力,驱动气体支架30和音圈电机31来产生该力。 Then, the vibration isolating unit 29 based on the measurement values ​​of the laser interference meter 44 or the like, eliminate the influence by the feedforward imparting mobile station 5 as the wafer stage focus variation caused by a reaction force driving the voice coil motor 30 and the gas holder 31 to generate the force. 依据晶片载物台5和定子37及原版固定盘6的三者之间的摩擦不为零,仅是晶片载物台5和定子37的移动方向有点不同等的理由,在晶片固定盘6的6个自由度方向的微小振动残留的情况下,根据振动传感器组的计测值,为了除去上述残留振动,还对空气支架30和音圈电机31进行反馈控制。 The friction between the three wafer stage 5 and the stator 37 and the fixed plate precursor 6 is not zero, only the stage 5 and the moving direction of the stator 37 is somewhat different reasons such as wafer stage, the wafer holding plate 6 a case where the minute vibration directions of six degrees of freedom remaining, based on the measured values ​​of the vibration sensor group, for removing the residual vibration, air bracket 30 also performs feedback control and the voice coil motor 31.

在镜筒固定盘25中,通过原版载物台2、晶片载物台5的移动产生的反作用力来移动定子17、37,即使在反应框架8上产生微振动,在反应框架8之间插装防振组件24来使振动独立。 In the lens barrel 25 fixed disk, the original stage 2, stage moving wafer stage 5 a reaction force generated to move the stator 17, 37, even when micro-vibration is generated on the reaction frame 8, interposed between the reaction frame 8 means for vibrating the vibration isolating unit 24 independently. 即使在镜筒固定盘25上产生微振动,根据在镜筒固定盘25上设置的振动传感器组的计测值来求6个自由度方向的振动,通过对空气支架26和音圈电机27进行反馈控制来消除该微振动,可以使镜筒固定盘25常常维持在稳定的位置。 Generating micro-vibrations even if a fixed disk on the lens barrel 25, the vibration at the vibration sensor measurement value group 25 provided on the fixed disk to find barrel 6 degrees of freedom by the air motor bracket 26 and feedback coil 27 control removes the micro-vibration plate can be fixed lens barrel 25 are often maintained in a stable position. 因此,可以将镜筒固定盘25上支撑的投影光学系统PL维持在稳定的位置,有效地防止因投影光学系统PL的振动产生的图形复制位置的偏差或图像模糊等,提高曝光精度。 Thus, the projection optical system of the lens barrel 25 is supported on the fixed platen PL may be maintained in a stable position, or to effectively prevent the image pattern transfer position deviation due to vibration of the projection optical system PL is produced by blurring, exposure accuracy is improved.

下面,说明上述结构的曝光装置1中的曝光操作。 Next, an exposure operation of the exposure apparatus 1 in the above-described configuration. 预先设定用于以适当曝光量(目标曝光量)对晶片W上的拍摄区域进行扫描曝光的各种曝光条件。 Various exposure conditions previously set for an appropriate exposure amount (exposure target) to the shot area on the wafer W for scanning exposure. 然后,使用未图示的原版显微镜和偏轴对准线传感器等来进行原版对准、基线计测等准备作业,然后使用对准传感器来结束晶片W的精密对准(EGA;增强整体对准等),求晶片W上的多个拍摄区域的排列坐标。 Then, using a microscope (not shown) of the precursor and off-axis alignment sensor to align the original baseline measurement preparation operation and the like, and then use the end of the alignment sensor to the alignment precision of the wafer W (EGA; enhanced integral alignment etc.), seeking the coordinates of the plurality of shot areas arranged on the wafer W.

于是,如果用于晶片W的曝光准备操作结束,那么根据对准线结果来监视激光干扰计44的计测值,同时控制线性电机32、33使晶片载物台5移动到用于晶片W的第1拍摄的曝光扫描开始位置。 Thus, if the preparation for an exposure operation of the wafer W is ended, the alignment according to the result of monitoring the laser interference meter 44 of the measured value, while controlling the linear motor 32, the wafer stage 5 is moved to a wafer W exposure scanning start position of the first shot. 然后,通过线性电机15、33开始进行原版载物台2和晶片载物台5的Y方向的扫描,如果两个载物台2、5达到各自的目标扫描速度,那么通过曝光用的照明对原版R的图形区域进行照明,开始扫描曝光。 Then, the linear motor 15, 33 begins by loading the original scanning direction Y stage 5 and the wafer loading table 2, if the two stage 2,5 reach their target scanning speed, then illuminated by exposure of R graphics area of ​​the original is illuminated, scanning exposure begins.

在该扫描曝光时,通过线性电机15、33来对原版载物台2和晶片载物台5进行同步控制,使得原版载物台2的Y方向的移动速度和晶片载物台5的Y方向的移动速度维持与投影光学系统PL的投影倍率(1/5倍或1/4倍)对应的速度。 When the scanning exposure, the precursor of the linear motors 15, 33 to the stage 2 and the wafer stage 5 are synchronously controlled, so that the original loading the wafer in the Y direction and the moving speed of the stage 2 in the Y direction of the loading station 5 moving speed and maintaining the projection magnification of the projection optical system PL (1/5 or 1/4 times) corresponding to the speed. 然后,用照明光逐渐照明原版R的图形区域的不同区域,通过结束对图形区域整个表面的照明,来结束晶片W上的第1拍摄的扫描曝光。 Then, gradually illumination light illuminating different areas of the original pattern regions R by the end of the entire surface area of ​​the illumination pattern to the end of the scan of imaging on the wafer W exposure. 由此,原版R的图形通过投影光学系统PL被缩小复制在晶片W上的第1拍摄区域中。 Thus, the original pattern R is reduced and transferred on the wafer W in the first imaging region by the projection optical system PL.

于是,如果第1拍摄的扫描曝光结束,那么通过线性电机32、33将晶片载物台5沿X、Y方向分步移动,移动至用于第2拍摄的曝光的扫描开始位置。 Thus, if the scanning exposure of the first shot is completed, then the linear motor 32, 33 by the wafer stage 5 in the X, Y direction stepwise movement, moved to the exposure start position for scanning in the second shot. 在该分步移动时,根据检测晶片载物台5的位置(晶片W的位置)的激光干扰计44的计测值,实时计测晶片载物台5的X、Y、θZ方向的位置。 When the sub-movement step, according to the detected wafer stage position (wafer W position) 5 laser interference meter measured values ​​44, measured in real time wafer loading position X, Y, θZ direction table 5. 然后,根据该计测结果,来控制线性电机32、33,并控制晶片载物台5的位置,使得晶片载物台5的XY位置的位移为规定的状态。 Then, based on the measurement result, controls the linear motors 32, 33, and controls the position of the wafer loading table 5, so that the displacement of the wafer stage 5 in XY-position a predetermined state. 对于晶片载物台5的θZ方向的位移,根据该位移的信息来旋转控制原版载物台2,使得可校正晶片W侧的旋转位移的误差。 For θZ direction of displacement of the wafer loading table 5 according to the displacement information of the rotation control precursor stage 2, so that the error can be corrected rotational displacement of the wafer W side. 然后,与上述第1拍摄区域同样,对第2拍摄区域进行扫描曝光。 Then, the above-described first imaging region Similarly, the second scanning exposure shot region.

于是,重复进行晶片W上的拍摄区域的扫描曝光和用于下次拍摄曝光的分步移动,在晶片W上的整个曝光对象拍摄区域上依次复制原版R的图形。 Thus, repeated scanning exposure shot areas on the wafer W and the moving step for dividing next shot exposure, the entire wafer W subject to exposure on the imaging area of ​​the original plate R is sequentially transferred.

在本实施例的载物台装置和曝光装置中,以驱动原版载物台2、晶片载物台5时的反作用力使定子17、37分别沿反方向移动的动量守恒法则起作用,可以防止这些反作用力被传送到反应框架8或基座框架10,进而传送到地面,可以避免摇摆等问题,所以即使在原版R或晶片W大型化,并且高速移动的情况下,也可以使调整时间短,提高生产率和曝光精度。 In the stage device and the exposure device according to the present embodiment, to drive the original stage 2, the reaction force of the wafer 5, the stator stage 17, 37 are moved in the opposite direction of the law of conservation of momentum acts, may be prevented these reaction forces transmitted to the frame 8 or the reaction base frame 10, and further transmitted to the surface, to avoid problems such as rocking, even if the original size of the wafer W or R, and moves at a high speed, it is also possible to adjust the short time to improve the productivity and accuracy of exposure. 反应框架8通过防振组件11来支撑原版固定盘3,基座框架10通过防振组件29支撑晶片固定盘6,所以可以抑制反应框架8和基座框架10的残留振动传送到原版固定盘3和晶片固定盘6,可以维持各载物台2、5的位置控制性。 The reaction frame 811 is supported by a fixed disk original vibration isolating unit 3, the base frame 10 through the vibration isolating unit 29 supporting the wafer holding plate 6, it is possible to suppress the residual vibration of the base frame and the reaction frame 8 is transmitted to the master 10 fixed disk 3 the fixed plate 6 and the wafer can be maintained, the position controllability of each stage 2,5.

在本实施例中,由于分别构成驱动上述各载物台2、5的线性电机15、33的一部分的定子17、37随着各载物台2、5的驱动以反作用力移动,所以不需要另外设计用于排除该反作用力的结构,可以实现装置的小型化和低价格化。 In the present embodiment, since each carrier constituting the above-described stage driving the respective linear motor 15, 33, 5 of the stator portion 17, 37 with the respective driving stage reaction of 2,5 to move, there is no need Further design configuration for excluding the reactive force, miniaturization and low price of the apparatus can be realized. 而且,这些定子17、37以上述反作用力移动时,由于滚轮21、39进行在围绕轴线旋转这样简单的操作,所以可以实现装置的简化。 Further, the stator 17, 37 to move when the above-described reaction, since the rollers 21, 39 in rotation about the axis of a simple operation, so that simplification of the apparatus can be realized.

而且,在本实施例中,弹簧22、40在相互相反的方向上对定子17、37分别施力,所以各定子17、37以反作用力移动时,也可以用简单的机构容易地返回到初始位置。 Further, in the present embodiment, the springs 22, 40 urging the stator 17, 37 respectively in mutually opposite directions, so that the reaction force when the stators 17, 37 to move, with a simple mechanism can be easily returned to the initial position.

在本实施例的曝光装置中,原版载物台2、晶片载物台5和投影光学系统PL通过防振组件11、29、24单独振动,所以可以防止原版载物台2和晶片载物台5的驱动造成的振动传送到投影光学系统PL,可以有效地防止投影光学系统PL的振动造成的图形复制位置的偏差或产生图像模糊等,提高曝光精度。 The exposure apparatus in the present embodiment, the original stage 2, the wafer stage 5 and the projection optical system PL via the vibration isolating unit 11,29,24 vibration alone, it is possible to prevent the original stage 2 and the wafer stage 5 causes the drive vibration transmitted to the projection optical system PL, can effectively prevent position deviation of the vibration pattern transfer projection optical system PL caused by image blur or the like is generated, exposure accuracy is improved.

[第2实施例]图6是表示本发明的载物台装置和曝光装置的第2实施例的图。 [Second Embodiment] FIG. 6 is a diagram showing a second embodiment of the stage device and the exposure device of the present invention. 在该图中,与图1至图5所示的第1实施例的结构部件相同的部件附以相同标号,并省略其说明。 In this figure, the same as the structure of FIG. 1 to 5 of the first member illustrated embodiment are denoted by the same reference member, and the description thereof will be omitted. 第2实施例和上述第1实施例的不同点在于载物台装置7的结构,所以进行以下说明。 2 differs from the first embodiment and the second embodiment in that the structure of the stage device 7, it will be explained below.

如图所示,载物台装置7以晶片载物台5、晶片固定盘6和从下方支撑它们的支撑框架(反作用力载物台)46为主体来构成。 As shown, the stage device 7 to the wafer stage 5, the wafer holding plate 6 and the support from below the support frame thereof (reaction stage) to the main body 46 is constituted. 而且,上述定子37通过插装在支撑框架46之间的旋转导轨38,成为相对于支撑框架46沿Y方向移动的结构。 Further, by the stator 37 interposed between the support frame 46 of the rotary guides 38, 46 become movable in the Y direction relative to the support frame structure. 晶片固定盘6也通过配置在支撑框架46之间的防振组件29,成为相对于支撑框架46独立振动的结果。 Wafer 6 is also fixed plate by a support frame 46 disposed between the vibration isolating unit 29, the results become independent with respect to the support frame 46 vibrations. 因此,支撑框架46对于定子37的反作用力移动来说起到作为支撑部的作用。 Thus, a reaction force for moving the support frame 46 for the stator 37 functions as a support portion.

在支撑框架46和基座框架10之间,插装多个滚轮(转动体)47组成的旋转导轨48。 Between the support frame 46 and base frame 10, a plurality of insertion rollers (rotating bodies) 47 48 consisting of rotating guides. 滚轮47分别在沿Y方向延伸的围绕轴线旋转,沿X方向以一定间隔来配置。 Roller 47 respectively extending in the Y direction about the axis, the X-direction arranged at fixed intervals. 而且,支撑框架46通过滚轮47的围绕轴线的旋转,相对于基座框架10在X方向上可自由移动。 Further, the support frame 46, 10 are free to move relative rotation about an axis through the rollers 47 with respect to the base frame in the X-direction. 其它结构与上述实施例1相同。 Other configurations are the same as in Example 1.

在本实施例的载物台装置和曝光装置中,除了可获得与上述第1实施例相同的作用和效果以外,在晶片载物台5沿+X方向移动时,以随着晶片载物台5的移动的反作用力使支撑框架46沿-X方向移动,使动量守恒法则也起作用。 Stage device and the exposure apparatus in the present embodiment, in addition to the above-described first embodiment can be obtained with the embodiment and effects other than the same, the wafer stage 5:00 moves in the + X direction to the wafer stage with moving the support 5, the reaction force frame 46 is moved in the -X direction, so that the law of conservation of momentum also play a role. 因此,为了扫描曝光,不仅在晶片载物台5移动时,而且为了变更拍摄区域使晶片载物台5分步移动时,都可以避免随着分步移动的反作用力造成的摇摆等问题,所以可以进一步缩短调整时间,进一步提高生产率和曝光精度。 Thus, for the scanning exposure, not only when wafer stage 5 is moved, and in order to change the imaging area of ​​the wafer stage 5 moves stepwise, can be avoided problems such as the rocking movement of the step caused by the reaction force, so that the adjustment time can be further shortened, and productivity is further improved exposure accuracy. 在本实施例中,还可以抑制将基座框架10或支撑框架46的残留振动传送到晶片固定盘6,可以维持晶片载物台5的位置控制性。 In the present embodiment, the transfer can be suppressed residual vibration of the base frame 10 or the supporting frame 46 to the wafer holding plate 6 can be maintained, the position controllability of the wafer loading table 5.

[第3实施例] [Third Example]

图7是表示本发明的载物台装置和曝光装置的第3实施例的图。 FIG. FIG. 7 is a third embodiment of the stage device and the exposure device of the present invention. 在该图中,与图1至图5所示的第1实施例的结构部件相同的部件附以相同标号,并省略其说明。 In this figure, the same as the structure of FIG. 1 to 5 of the first member illustrated embodiment are denoted by the same reference member, and the description thereof will be omitted. 第3实施例和上述第1实施例的不同点在于晶片载物台5的结构,所以进行以下说明。 It differs from the first embodiment and Example 1 of the third embodiment in that the structure of the wafer loading table 5, it is described below.

如图所示,在投影光学系统PL的Y方向两侧,每隔规定的间隔来配置偏轴对准传感器49a、49b,该对准传感器49a、49b沿排列方向设置两个晶片载物台5、5。 As shown, in the Y-direction on both sides of the projection optical system PL, arranged at predetermined intervals to off-axis alignment sensor 49a, 49b, the alignment sensor 49a, 49b provided two wafer stage 5 in the arrangement direction 5. 在各晶片载物台5中,内装构成可动式线性电机的转子的磁铁组件(见图示)。 In each of the wafer stage 5, the interior components of the rotor magnet constituting the movable linear motor (see illustration). 而且,晶片载物台5沿作为有电枢组件的定子的X方向延伸设置的直线导轨50可分别独立在晶片固定盘6上自由移动。 Further, the wafer stage 5 in the X direction along linear guide rail as the stator armature assembly 50 may be independently provided to extend on the wafer holding plate 6 are free to move.

在直线导轨50的两端,向下方突出设置电枢组件组成的上述转子36,沿Y方向延伸设置与两个晶片载物台5、5的转子36、36双方对应的定子37。 At both ends of the linear guide 50, protruding downward is provided an armature assembly consisting of the rotor 36, extending in the Y direction is provided with two wafer loading station 37 of the stator 36, 36 of the rotor 5, 5 corresponding to both sides. 因此,各晶片载物台5成为沿直线导轨50在X方向上移动,同时定子37沿Y方向分别独立移动的结构。 Thus, each of the wafer stage 5 along the linear guide 50 be moved in the X direction, the Y direction while the stator is independently movable structure 37. 在图7中,省略了晶片载物台5上设置的移动镜、标识部件等的图示。 In FIG. 7, the movable mirror is not shown, such identification means provided on the wafer stage 5.

在上述结构的曝光装置中,如图7所示,在对-Y位置的晶片载物台5上的晶片W通过投影光学系统PL进行曝光操作期间,对于+Y侧位置的晶片载物台5上的晶片W实施对准。 In the exposure apparatus of the structure shown in Figure 7, on the wafer stage 5 pairs -Y position of the wafer W during the exposure operation by projection optical system PL, for the + Y side of wafer stage position 5 aligning the wafer W on the embodiment. 具体地说,用+Y侧的对准传感器49a首先计测标识部件、晶片W上形成的对准标记(未图示),根据该计测结果来进行晶片W的预对准。 Specifically, with the + Y side alignment sensor measuring the first identification member 49a, the alignment marks (not shown) formed on the wafer W, pre-aligning the wafer W is performed based on the measurement result. 接着,例如使用EGA求出的精细对准使晶片载物台5移动,同时进行晶片W上的各拍摄区域的排列。 Next, for example, determined so that fine alignment EGA wafer stage 5 is moved while being arranged in each shot area on the wafer W. 然后,顺序曝光结束的晶片载物台5沿-Y方向移动,在对准传感器49b的正下方进行了晶片交换后,执行上述顺序对准。 Then, the order table 5 in the -Y direction end of the exposure of the wafer loading is performed by moving the wafer exchange directly below the alignment sensor 49b, the Executive aligned in this order. 由对准传感器49a进行过对准的晶片载物台5也沿-Y方向移动,在投影光学系统PL的正下方执行顺序曝光。 Aligned by the wafer alignment sensor 49a through the stage 5 is also moved in the -Y direction, the exposure execution sequence directly below the projection optical system PL.

在本实施例中,除了可获得与上述第1实施例相同的效果以外,由于使两个晶片载物台5、5独立移动,在一个载物台上进行晶片交换和对准操作,用另一个载物台同时进行曝光操作,所以可以大幅度地提高生产率。 In the present embodiment, in addition to the above-described first embodiment can be obtained the same effects as in Example except that since the two wafer stage 5, 5 move independently, the wafer exchange and alignment operation in the stage one with another a stage while exposure operation, it is possible to greatly improve productivity. 而且,由于两个载物台的转子36共用在各载物台沿Y方向移动时使用的定子37,所以能够实现削减部件,即装置的简化、低价格。 Further, since the rotor 36 of the two stage stator common use is moved in the Y direction of each stage 37, it is possible to reduce components, i.e. apparatus can be simplified, low price.

在上述实施例中,作为定子17、37的向Y方向的移动部件,设置滚轮21、39、47的结构,但并不限于此,例如也可以设置空气轴承等非接触轴承。 In the above embodiment, a stator 17, 37 as a moving member in the Y direction is provided in the structure of the rollers 21,39,47, but are not limited to, for example, air bearings may be provided a non-contact bearings. 这种情况下,除了可获得与使用滚轮时同样的作用和效果以外,由于定子17、37在没有摩擦下移动,所以还可以排除反应框架8或基座框架10的振动、摩擦带来的外部干扰,可以实施精度更高的曝光处理。 In this case, in addition to the same actions and effects can be obtained when using the wheel, since the stator 17, 37 moved without friction, so that the reaction may also exclude external frame vibrations, friction, or 8 of the base frame 10 is brought interference may be implemented with higher accuracy exposure process. 上述滚轮或空气轴承可设置在定子中,也可设置在支撑定子的反应框架8或基座框架10的任何一个中。 Roller or air bearings described above may be provided in the stator, it may be provided in any of a reaction frame supporting the stator 8 or the base frame 10. 尽管省略图示,但原版载物台2如第3实施例那样,也可以形成能够支撑多片原版R的结构。 Although not shown, the original stage 2 as in the third embodiment above, the support structure may be capable of forming multi-plate precursor of R. 这种情况下,构成原版载物台2的粗动载物台进行公用,独立设置多个保持原版R的微动载物台就可以。 In this case, the original configuration loading stage coarse movement stage 2 is common, independently of R provided a plurality of retaining the original fine movement stage can. 由此,可以将原版载物台2整体形成紧凑的结构。 Thus, the original carrier may be integrally formed compact 2 stage structure.

在上述实施例中,在原版载物台2、晶片载物台5双方中形成定子17、37以反作用力移动的结构,但不用说,仅在其中一个载物台中定子进行反作用力移动也可以。 In the above embodiment, the original stage 2, the reaction force of the stator 17, 37 to move a structure wafer stage 5 is formed in both sides, but needless to say, only in a loading station where the reaction force of the stator can be moved . 而且,在上述实施例中,所有防振组件形成主动进行防振的结构,但所有这些组件也可以是它们中的某一个组件或任意多个组件进行被动防振那样的结构。 Further, in the above embodiment, all of the active vibration isolating vibration isolation for the components forming the structure, but all of these components may be any of a plurality of components or a component thereof in passive vibration isolation structure such as. 将原版载物台2形成粗动载物台、微动载物台的两级结构,在其中一个或双方中设置随着载物台的移动以反作用力移动的部件(例如定子)那样的结构也可以。 The stage 2 is formed precursor coarse movement stage, fine movement stage of two-stage structure, in which one or both are provided with movement of the stage to move the reaction member (e.g., stators) configuration as It is also available. 在上述实施例中,形成将本发明的载物台装置应用于曝光装置1的结构,但并不限于此,除了曝光装置1以外,还可以应用于复制掩模的扫描装置、掩模图形的位置坐标测定装置等的精密测定设备。 In the above embodiment, the stage device is formed according to the present invention is applied to a structure of an exposure apparatus is not limited to this, in addition to the exposure apparatus 1 can also be applied to a scanning device of a copying mask, a mask pattern accurate determination device position coordinate measurement device or the like.

作为本实施例的基底,不仅可使用半导体器件使用的半导体晶片W,还可以使用液晶显示器使用的玻璃基底、薄膜磁头使用的陶瓷晶片、或曝光装置中使用的掩模或原版的原版(合成石英、硅晶片)等。 As the substrate of the present embodiment, not only a semiconductor device using the semiconductor wafer W may also be a glass substrate used in a liquid crystal display, a mask or original plate precursor thin film magnetic head used in a ceramic wafer, or used in exposure apparatus (synthetic quartz , a silicon wafer). 作为曝光装置1,除了使原版R和晶片W、PW同步移动并对原版R的图形进行扫描曝光的分步扫描方式的扫描型曝光装置(扫描逐次移动式曝光装置;USP5473410)以外,还可使用在使原版R和晶片W静止状态下对原版R的图形进行曝光,将晶片 W、PW依次分步移动的分步重复方式的投影曝光装置(逐次移动式曝光装置)。 Scanning type exposure apparatus as an embodiment of the step and scan exposure apparatus 1, except that the original R and the wafer W, PW and the sync pattern of the original plate R for moving the scanning exposure (scanning stepper apparatus; USP5473410) outside, can also be used R is on the original plate exposure original plate R, and a stationary state of the wafer W, the wafer W, the PW sequentially divided projection exposure apparatus (stepper apparatus) step movement of the step and repeat mode. 作为曝光装置1的种类,不限于在晶片W上对半导体器件图形进行曝光的半导体器件制造使用的曝光装置,也可以广泛应用于液晶显示元件制造使用的曝光装置,或用于制造薄膜磁头、摄像元件(CCD)或原版等的曝光装置。 The semiconductor device manufacturing exposure apparatus is used as a kind of an exposure apparatus is not limited to semiconductor device pattern is exposed on the wafer W, can be widely applied to the liquid crystal display element manufactured using the exposure device, or for manufacturing a thin film magnetic heads, imaging other device (CCD) or a precursor exposure apparatus.

作为曝光用照明光的光源,不仅可使用从超高压汞灯产生的亮线(g线(436nm)、h线(404.7nm)、i线(365nm))、KrF准分子激光(248nm)、ArF准分子激光(193nm)、F2激光(157nm),还可使用X线或电子线等电荷粒子线。 As the exposure light source of the illumination light, not only a bright line generated from the ultrahigh pressure mercury lamp (g-ray (436nm), h-line (404.7nm), i-line (365nm)), KrF excimer laser (248nm), ArF excimer laser (193nm), F2 laser (157nm), X-ray may be used other electron beam or charged particle beam. 例如,在使用电子线的情况下,作为电子枪,可以使用热电子发射型的硼化镧(LaB6)、钽(Ta)。 For example, in the case of using the electron beam, as the electron gun can be used thermionic emission type lanthanum hexaboride (of LaB6), tantalum (Ta). 而且,在使用电子线的情况下,形成使用原版R的结构就可以,而在不使用原版R时,也可以直接在晶片上形成图形。 Further, in the case where the electron beam to form a precursor of R configuration can be used, and when not in use the original R, pattern may be formed directly on the wafer. 另外,还可以使用YAG激光或半导体激光等的高频。 Further, also possible to use a high-frequency YAG laser or a semiconductor laser or the like.

投影光学系统PL的倍率不仅可以是缩小系统,而且也可以是等倍系统和放大系统。 Magnification of the projection optical system PL is not only a reduction system, but also a magnification system and the magnifying system. 作为投影光学系统,在使用准分子激光等远紫外线的情况下,作为玻璃材料,使用石英或萤石等透过远紫外线的材料,在使用F2激光或X线的情况下,使用反射折射系统或折射系统的光学系统(原版R也使用反射型类型),而在使用电子线的情况下,作为光学系统,使用电子透镜和偏转器组成的电子光学系统就可以。 As the projection optical system, in the case where the far-ultraviolet excimer laser, a glass material, a quartz material or the like through a fluorite or far ultraviolet rays, in the case of using F2 laser light or X-rays, or to use a catadioptric system system, the refractive optical system (also a reflection type original R type), whereas in the case of using the electron beam, an optical system, an electron lens and a deflector composed of the electron optical system can be. 不用说,通过电子线的光路处于真空状态。 Needless to say, the optical path through the electron beam in a vacuum state. 也可以采用使原版R和晶片W紧密接触,对原版R的图形进行曝光而不使用投影光学系统PL的邻近效应曝光装置。 Precursor may be used to make close contact with the wafer W and R, R for the original plate was exposed without using a proximity effect exposure apparatus with projection optical system PL.

在晶片载物台5或原版载物台2中使用线性电机(参照USP5,623,853或USP5,528,118)的情况下,也可以用使用了空气轴承的空气浮动型和使用了洛伦兹(Lorentz)力或电抗力的磁浮动型。 In the wafer stage 5 or stage 2 where the precursor linear motor (see USP5,623,853 or USP5,528,118), and may be used with the air bearing and an air floating type using Lorentz (LORENTZ) force or reactance force of the magnetic floating type. 各载物台2、5可以是沿导轨移动的类型,也可以是不设置导轨的无导轨类型。 Each stage 2,5 can be moved along the rail type, may not be provided without a guide rail type. 作为各载物台2、5的驱动机构,也可以使用通过使两维地配置了磁铁的磁铁组件(永久磁铁)、和两维地配置了线圈的电枢组件对置产生的电磁力来驱动各载物台2、5的平面电机。 As the drive mechanism of each of the stages 2,5, may also be used by the two-dimensionally arranged magnets magnet assembly (permanent magnets), two-dimensionally arranged, and the electromagnetic force of the armature coil assembly is generated by driving opposing each loading station 2,5 planar motor. 这种情况下,将磁铁组件和电枢组件的任何一个连接到载物台2、5,将磁铁组件和电枢组件的另一个设置在载物台2、5的移动面侧(基座)就可以。 In this case, any one magnet assembly and the armature assembly is connected to the stage 2 and 5, the magnet assembly and the other armature assembly disposed in the movement of the object side surface of the station 2,5 (base) can.

如以上,通过将包括本申请的权利要求范围中列举的各种结构部件的各种子系统以保证规定的机械精度、电气精度、光学精度来组装而制造本实施例的曝光装置1。 As described above, various structural components in the range recited in this application various subsystems including the claims to ensure mechanical accuracy, electrical accuracy and optical accuracy to a predetermined assembling the exposure apparatus 1 of the embodiment. 为了确保各种精度,在该组装的前后,对于各种光学系统进行用于达到光学精度的调整,对于各种机械系统进行用于达到机械精度的调整,对各种电气系统进行用于达到电气精度的调整。 In order to secure the various accuracies, before and after this assembly, for the various optical systems, adjustment for achieving the optical accuracy, adjustment for achieving the mechanical accuracy for various mechanical systems, the various electrical systems for achieving electrical adjustment accuracy. 从各种子系统组装成曝光装置的工序包括各种子系统的相互间的机械连接、电路的布线连接、气压回路的配管连接等。 Mechanical connection wiring connection circuit between the various subsystems to each other, piping connection of pressure circuits and the like is assembled from the various subsystems into the exposure apparatus comprises a step. 在从各种子系统组装成曝光装置的工序前,不用说,是各子系统的各个组装工序。 In the step before various subsystems into the exposure apparatus is assembled, needless to say, each of the subsystems assembling step. 如果各种子系统组装成曝光装置的工序结束,那么进行综合调整,确保作为曝光装置整体的各种精度。 If assembling various subsystems into the exposure apparatus of the completion of the process, the overall adjustment is performed to ensure that the exposure apparatus as a whole variety of precision. 曝光装置的制造最好在对温度和清洁度等进行管理的超净间中进行。 Manufacturing exposure apparatus is preferably performed in a clean room temperature and the cleanness are managed.

如图8所示,经过器件的功能和性能设计步骤201、制作基于该设计步骤的掩模(原版)的步骤202、由硅材料来制造晶片的步骤203、通过上述实施例的曝光装置1将原版的图形曝光于晶片上的晶片处理步骤204、器件组装步骤(包括划片(dicing)工序、焊接工序、封装工序)205、检查步骤206等来制造半导体器件。 As shown, after step function and performance design of device 201, the step of making a mask based on the design step (original) 202, the step of producing a silicon material of the wafer 2038, the above-described exposure apparatus of the embodiment 1 exposed to the original pattern on the wafer wafer processing step 204, the device assembly step (including dicing (dicing) step, welding step, a packaging step) 205, an inspection step 206, etc. to manufacture a semiconductor device.

Claims (24)

1.一种载物台装置,包括在固定盘上沿至少一个方向驱动的载物台本体,其特征在于,该载物台装置还包括:支撑部,相对于所述固定盘独立振动地配置;以及反作用力载物台,随着所述载物台本体的驱动,通过反作用力在所述支撑部上沿所述一个方向自由移动。 1. A stage apparatus comprising a stage body along at least one direction on the fixed disk drive, wherein the stage apparatus further comprising: a support portion, the vibration is arranged independently relative to the fixed plate ; and a reaction force of the stage, driving the stage with the body, in the one direction by the reaction force on the support portion is free to move.
2.如权利要求1所述的载物台装置,其特征在于,所述固定盘通过防振机构被支撑在所述支撑部上。 2. The stage apparatus according to claim 1, wherein said fixing plate is supported by the vibration isolating means on the support portion.
3.如权利要求1或2所述的载物台装置,其特征在于,所述反作用力载物台构成将所述载物台本体沿所述一个方向驱动的驱动机构的至少一部分。 The stage device according to claim 12, wherein at least a portion of said reaction stage driving mechanism configured to the stage body in the one direction of the drive.
4.如权利要求3所述的载物台装置,其特征在于,所述驱动机构包括在所述载物台本体上设置的转子,以及通过该转子之间的电磁相互作用将该转子沿所述一个方向驱动的定子,所述反作用力载物台具有所述定子。 4. A stage apparatus according to claim 3, wherein said driving means includes a rotor provided on the stage main body, and the rotor by electromagnetic interaction between the rotor along a a driving direction of said stator, said reaction stage with the stator.
5.如权利要求1所述的载物台装置,其特征在于,在所述反作用力载物台和所述支撑部之间,插装转动体,该转动体沿轴线旋转,并使所述反作用力载物台相对于所述支撑部沿所述一个方向移动。 5. The stage apparatus according to claim 1, wherein the reaction force between the stage and the support portion, the insertion member is rotated, the rotatable member along the axis of rotation, and the reaction stage with respect to the support portion in the one direction.
6.如权利要求1所述的载物台装置,其特征在于,在所述反作用力载物台和所述支撑部之间,插装非接触轴承。 6. The stage apparatus according to claim 1, wherein the reaction force between the stage and the support portion, a non-contact bearing cartridge.
7.如权利要求1所述的载物台装置,其特征在于,包括使所述反作用力载物台返回到初始位置的返回装置。 7. The stage apparatus according to claim 1, characterized in that it comprises the reaction stage to return to the initial position return means.
8.如权利要求7所述的载物台装置,其特征在于,所述返回装置包括施力部,该施力部对所述反作用力载物台沿所述一个方向的相反方向施力。 8. The stage apparatus according to claim 7, wherein said urging means comprises a return portion, the reaction force of the urging portion urging the stage in a direction opposite to the one direction.
9.如权利要求1所述的载物台装置,其特征在于,所述载物台本体可沿相互垂直的方向自由移动,所述反作用力载物台被设置在所述相互垂直的方向中的任意一方向上。 9. The stage apparatus according to claim 1, wherein the stage is movable along the body is free to move mutually perpendicular directions, the reaction force of the stage are provided in the mutually perpendicular directions of any one direction.
10.一种曝光装置,其包括掩模载物台和基底载物台,用于将所述掩模载物台上保持的掩模的图形通过照明光学系统进行照明,将上述图形曝光在基底载物台上保持的基底上,其特征在于,所述掩模载物台和基底载物台中的至少之一包括:在固定盘上沿至少一个方向被驱动的载物台本体;相对于上述固定盘独立振动地配置的支撑部;通过随着上述载物台本体的驱动的反作用力,在上述支撑部上沿上述一个方向自由移动的反作用力载物台;使该反作用力载物台返回到初始位置的返回装置。 10. An exposure apparatus comprising a mask stage and the substrate stage, the mask pattern for the mask is held on the stage is illuminated by the illumination optical system, the exposure of the pattern in the substrate on the stage holding the substrate, wherein at least one of said mask stage and the substrate stage loading station comprising: a stage main body along at least one direction to be driven on the fixed plate; with respect to the fixing the vibrating plate supporting portion disposed independently; and by the reaction force of the stage main body with said stage driving reaction force on the supporting portion along the one direction freely movable; the return stage reaction return means to the initial position.
11.如权利要求10所述的曝光装置,其特征在于,包括投影光学系统,配置在所述掩模载物台和所述基底载物台之间,将所述掩模的图形投影到所述基底上。 11. The exposure apparatus according to claim 10, further comprising a projection optical system disposed between the mask stage and the substrate stage, the mask pattern is projected onto the said upper substrate.
12.如权利要求11所述的曝光装置,其特征在于,所述掩模载物台、所述基底载物台和所述投影光学系统相互可振动地独立配置。 12. The exposure apparatus according to claim 11, wherein said mask stage, said substrate stage and said projection optical system configured independently from each other may be vibrating.
13.如权利要求10所述的曝光装置,其特征在于,所述掩模载物台有保持所述掩模并沿第1方向可移动的微动载物台,以及与所述微动载物台连接的沿与所述第1方向不同的第2方向可移动的粗动载物台。 13. The exposure apparatus according to claim 10, wherein said mask stage for holding the mask and movable along a first direction fine movement stage and the fine movement stage stage connected to the second direction along said direction different from the first movable coarse movement stage.
14.如权利要求10所述的曝光装置,其特征在于,所述掩模载物台和所述基底载物台的至少一个是导轨载物台。 14. The exposure apparatus according to claim 10, wherein said mask stage and the substrate stage at least one stage guide rail.
15.如权利要求10所述的曝光装置,其特征在于,所述掩模载物台能够保持多片掩模。 15. The exposure apparatus according to claim 10, wherein said mask stage capable of holding multiple masks.
16.如权利要求10所述的曝光装置,其特征在于,所述基底载物台能够保持多片基底。 16. The exposure apparatus according to claim 10, wherein the substrate stage capable of holding multiple piece substrate.
17.一种载物台驱动方法,该载物台包括通过具有定子和转子的线性电机在固定盘上沿至少一个方向驱动的载物台本体,其特征在于,随着所述载物台本体的驱动,通过反作用力,将沿与所述一个方向相反的方向可移动的、且具有所述定子的反作用力载物台支撑在相对于所述固定盘独立振动的支撑部上,并且使上述反作用力载物台返回到初始位置。 17. A stage driving method, comprising the stage by a linear motor having a stator and a rotor body along the at least one stage in the direction of the fixed disk drive, wherein, as the stage body stage driving reaction force by the reaction force, the direction opposite to the direction of a movable, and having a stator supported on the fixed disk support portion independently with respect to the vibration, and the aforementioned reaction stage to return to the initial position.
18.如权利要求17所述的载物台驱动方法,其特征在于,所述反作用力载物台的重量比所述载物台本体的重量重。 18. The stage drive method according to claim 17, characterized in that the reaction stage a weight heavier than the weight of the stage body.
19.一种曝光方法,将掩模载物台上保持的掩模的图形曝光到基底载物台上保持的基底上,其特征在于,该方法采用下述的载物台驱动方法,通过具有定子和转子的线性电机,在固定盘上沿至少一个方向驱动所述掩模载物台和所述基底载物台中的至少一个的载物台本体,将具有上述定子的反作用力载物台支撑在相对于上述固定盘独立振动的支撑部上,通过上述载物台本体的驱动所产生的反作用力,向与上述载物台本体相反的方向移动。 19. A mask pattern exposure method, the stage holding the mask is exposed to a substrate held by the substrate on the stage, wherein the stage drive method using the following method of loading, by having a linear motor stator and rotor, at least one direction on the fixed disk drive the mask stage and the substrate carrier comprising at least one stage of the station body, having a reaction stage supporting the stator with respect to said fixed supporting plate independently of the vibrating portion, the reaction force generated by driving the stage main body, and moved to said stage main body in the opposite direction.
20.如权利要求19所述的曝光方法,其特征在于,包括在所述掩模载物台和所述基底载物台的移动中进行曝光所述图形的步骤。 20. The exposure method according to claim 19, wherein the step of exposing said pattern comprises moving said mask stage and the substrate loading station.
21.如权利要求19所述的曝光方法,其特征在于,包括在所述掩模载物台中保持多个掩模的步骤。 21. The exposure method according to claim 19, wherein said mask stage comprising the step of holding a plurality of masks station thereof.
22.如权利要求19所述的曝光方法,其特征在于,包括在所述基底载物台中保持多个基底的步骤。 22. The exposure method according to claim 19, characterized in that said substrate carrier comprises the step of holding the plurality of base stations thereof.
23.如权利要求10所述的曝光装置,其特征在于,上述至少之一的载物台是掩模载物台,所述反作用力载物台的重量大于所述载物台本体的重量。 23. The exposure apparatus according to claim 10, characterized in that the stage is at least one of said mask stage, the reaction stage is greater than the weight of the carrier body weight stage.
24.如权利要求10所述的曝光装置,其特征在于,上述至少之一的载物台是基底载物台,所述反作用力载物台的重量大于所述载物台本体的重量。 24. The exposure apparatus according to claim 10, characterized in that the stage is at least one of the substrate stage, the reaction stage is greater than the weight of the carrier body weight stage.
CNB99816934XA 1999-10-07 1999-10-07 Stage device, method of driving stage, exposure device and exposure method CN1260772C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/005539 WO2001027978A1 (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method

Publications (2)

Publication Number Publication Date
CN1373900A CN1373900A (en) 2002-10-09
CN1260772C true CN1260772C (en) 2006-06-21

Family

ID=14236940

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB99816934XA CN1260772C (en) 1999-10-07 1999-10-07 Stage device, method of driving stage, exposure device and exposure method

Country Status (3)

Country Link
CN (1) CN1260772C (en)
AU (1) AU6005499A (en)
WO (1) WO2001027978A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102880013A (en) * 2012-09-28 2013-01-16 清华大学 Reticle stage worktable
CN103543612A (en) * 2013-09-25 2014-01-29 清华大学 Moving-iron cableless six-degree-of-freedom magnetic levitation motion platform with vacuum cover

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546551B (en) * 1999-12-21 2003-08-11 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
US6686991B1 (en) 2000-11-06 2004-02-03 Nikon Corporation Wafer stage assembly, servo control system, and method for operating the same
CN1484850A (en) 2001-08-08 2004-03-24 尼康株式会社 Stage system exposure device and method of manufacturing device
JP2003059797A (en) * 2001-08-09 2003-02-28 Canon Inc Movement apparatus, stage device, and exposure system
JP2004128308A (en) * 2002-10-04 2004-04-22 Nikon Corp Stage device and aligner
CN100433253C (en) * 2003-02-26 2008-11-12 株式会社尼康 Exposure apparatus, exposure method, and method for producing device
KR101506408B1 (en) 2003-02-26 2015-03-26 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
JP4735258B2 (en) 2003-04-09 2011-07-27 株式会社ニコン Exposure method and apparatus, and device manufacturing method
CN101825847B (en) * 2003-04-11 2013-10-16 株式会社尼康 Cleanup method for optics in immersion lithography
EP1475668A1 (en) 2003-05-09 2004-11-10 ASML Netherlands B.V. Method of preparing components for a lithographic apparatus
WO2005006418A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
TWI609409B (en) 2003-10-28 2017-12-21 Nikon Corp The illumination optical apparatus, exposure apparatus, exposure method and device manufacturing method
JP4295712B2 (en) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー.ブイ. Lithographic apparatus and device manufacturing method
TWI512335B (en) 2003-11-20 2015-12-11 尼康股份有限公司 Light beam converter, optical illuminating apparatus, exposure device, and exposure method
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
TWI437618B (en) 2004-02-06 2014-05-11 尼康股份有限公司 Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
US7456527B2 (en) * 2004-03-04 2008-11-25 Asml Netherlands B.V. Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method
JP2005331402A (en) 2004-05-20 2005-12-02 Sumitomo Heavy Ind Ltd Stage device
KR20180128526A (en) 2005-05-12 2018-12-03 가부시키가이샤 니콘 Projection optical system, exposure apparatus and device manufacturing method
TWI454859B (en) 2006-03-30 2014-10-01 尼康股份有限公司 Mobile device, exposure device and exposure method, and component manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
WO2009050977A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
WO2009050976A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
CN101910817B (en) 2008-05-28 2016-03-09 株式会社尼康 An illumination optical system, exposure apparatus and device manufacturing method
US8544317B2 (en) * 2009-10-09 2013-10-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing apparatus with simultaneously movable stages
US10254659B1 (en) 2017-09-27 2019-04-09 Wuhan China Star Optoelectronics Technology Co., Ltd Exposure apparatus and method for exposure of transparent substrate
CN107450284B (en) * 2017-09-27 2019-06-07 武汉华星光电技术有限公司 The exposure method of exposure sources and transparent substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3266515B2 (en) * 1996-08-02 2002-03-18 キヤノン株式会社 Exposure apparatus, device manufacturing method and the stage apparatus
US6408045B1 (en) * 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102880013A (en) * 2012-09-28 2013-01-16 清华大学 Reticle stage worktable
CN102880013B (en) * 2012-09-28 2015-02-18 清华大学 Reticle stage worktable
CN103543612A (en) * 2013-09-25 2014-01-29 清华大学 Moving-iron cableless six-degree-of-freedom magnetic levitation motion platform with vacuum cover
CN103543612B (en) * 2013-09-25 2015-09-30 清华大学 A tape moving iron vacuum enclosure cable-DOF motion platform Maglev

Also Published As

Publication number Publication date
WO2001027978A1 (en) 2001-04-19
AU6005499A (en) 2001-04-23
CN1373900A (en) 2002-10-09

Similar Documents

Publication Publication Date Title
US6894449B2 (en) Vibration control device, stage device and exposure apparatus
US7301607B2 (en) Wafer table for immersion lithography
JP3971868B2 (en) Positioning devices, and lithographic projection apparatus comprising the device
US6788386B2 (en) Lithographic apparatus and device manufacturing method
CN100468624C (en) Exposure method and exposure apparatus, stage unit, and device manufacturing method
US7068350B2 (en) Exposure apparatus and stage device, and device manufacturing method
KR100570252B1 (en) Balanced positioning system for use in lithographic apparatus
JP4333033B2 (en) Exposure apparatus and an exposure method, and device manufacturing method
US7034920B2 (en) Balanced positioning system for use in lithographic apparatus
CN101216673B (en) Stage device, exposure device, and device manufacturing method
US6396566B2 (en) Stage system for exposure apparatus and device manufacturing method in which a stage supporting member and a countermass supporting member provide vibration isolation
JP3554186B2 (en) Exposure apparatus, device manufacturing method and reaction force receiving method
US6788385B2 (en) Stage device, exposure apparatus and method
TWI440982B (en) Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate
CN100565797C (en) Bearing apparatus and its manufacture method, bearing table apparatus, and exposure apparatus
US7087906B2 (en) Bellows with spring anti-gravity device
US9366974B2 (en) Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method
KR101607035B1 (en) Exposure apparatus and method for manufacturing device
US7589823B2 (en) Stage device, exposure apparatus, and method of manufacturing device
US6819404B2 (en) Stage device and exposure apparatus
US6710850B2 (en) Exposure apparatus and exposure method
US20020075467A1 (en) Exposure apparatus and method
JP4586367B2 (en) Stage apparatus and an exposure apparatus
JP3890136B2 (en) Exposure apparatus and device manufacturing method using the same, as well as the stage device
JPWO2003015139A1 (en) Stage system and an exposure apparatus, and device manufacturing method

Legal Events

Date Code Title Description
C10 Entry into substantive examination
C06 Publication
C10 Entry into substantive examination
C14 Grant of patent or utility model
C17 Cessation of patent right