KR20020023461A - A method for manufacturing of printed circuit board - Google Patents

Abstract

PURPOSE: A method for manufacturing silver through-hole type PCB is provided to obtain a high quality product by manufacturing a pattern film, solder mask film and silver through hole film in consideration of retraction ratio of the material. CONSTITUTION: A method comprises a first step(S30) of receiving design drawings from a customer; a second step(S31 to S34) of arranging a pattern layer, solder mask layer, silver through hole layer and over coat; a third step(S35) of applying a calibration ratio to the pattern layer, in such a manner that the calibration ratio increases in X-axis and Y-axis; a fourth step(S36) of applying a calibration ratio to the solder mask layer, in such a manner that the calibration ratio increases in X-axis and Y-axis; a fifth step(S37) of applying a calibration ratio to the silver through hole layer, in such a manner that the calibration ratio increases in X-axis and Y-axis; a sixth step(S38) of printing and outputting a pattern film, solder mask film and a silver through hole film where the calibration ratio is applied; and a seventh step(S39) of performing development process to the screen mesh, and manufacturing screen meshes for pattern, solder mask and silver through hole.

Description

Manufacturing method of silver through-hole type printed circuit board {A METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARD}

The present invention relates to a method for manufacturing a silver through-hole type printed circuit board, and more particularly, in consideration of the shrinkage of the substrate raw materials generated in the manufacturing process of the printed circuit board, applying a correction factor increased by a predetermined value in advance By manufacturing a solder mask film and a silver through-hole film, the present invention relates to a method for manufacturing a silver through-hole type printed circuit board in which the final finished product can be produced in a design drawing ordered by a customer even if shrinkage occurs in the process.

In general, a silver through-hole type printed circuit board (Silver Through Hole) is required to connect the circuits on both sides of the board using double side pcb, and is mainly used for high density of car audio, telephone, remote controller, etc. Applies to circuit configuration.

FIG. 1 is a manufacturing process diagram of a general printed circuit board, and FIG. 2 is a manufacturing process diagram of a film used for manufacturing a printed circuit board according to the prior art.

As shown in FIG. 2, a CAD drawing program is used to receive data from a customer through a design drawing of a printed circuit board (S1).

After that, the operator sequentially cleans the pattern layers of the printed circuit board design drawings received from the customer by the CAM program installed in his computer (S2), solder mask theorem (S3), and silver layer theorem (S4). , Overcoat theorem (S5).

Thereafter, the data generated by performing the steps S2, S3, and S4 are printed on the film using a printing means to produce a pattern film, a solder mask film, and a silver through hole film.

Then, after finally developing the screen net using the film produced as described above (S6), to produce a screen net for screens and solder mask screen net and silver through-hole screen net (S7).

After completing the operation of printing the film on the screen as described above to enter the manufacturing of the printed circuit board.

After that, the manufacturing process of the printed circuit board will be described with reference to FIG. 1.

First, a substrate raw material having a predetermined size is cut into a working size, that is, vertically and a predetermined length using a cutting machine (S10).

Subsequently, the substrate raw material is checked in the sub-direction of the product with a C.N.C drill to process a stack hole constantly (S11).

Subsequently, the component raw hole and the silver through hole are machined into the substrate raw material using a C.N.C drill (S12).

After the step (S12), the front and drying step of drying the cut substrate raw material before printing using the front face and removing the burrs inside the parts insertion holes and silver through-holes before printing (S13).

Subsequently, after performing the front and drying process, the substrate raw material is placed on the work table and the platemaking process for mounting the pattern screen net described in FIG. 2 is mounted on the substrate raw material (S14).

Subsequently, the UV ink (UV INK) is poured onto the screen screen for patterning, and then pattern printing and drying are performed using an apparatus such as a squeegee (S15).

After the step S15 is performed, the substrate raw material subjected to the pattern printing operation is etched with an etchant such as copper chloride or iron chloride to perform an etching process of etching the remaining copper except for the portion where the eu ink is applied (S16).

Thereafter, an ink peeling process of dissolving and peeling off the UV ink used in the pattern formation with the alkaline solution is performed (S17).

As described above, the P / T circuit inspection for inspecting the pattern circuit state formed on the raw material substrate is performed after the etching step S16 is completed (S18).

Thereafter, before the solder mask printing is performed, a front surface and a drying process of removing the contaminated state and the oxide of the substrate raw material are performed (S19).

When the above processes are all thickened, the formation of the pattern on the substrate raw material is completed.

Hereinafter, the process of forming a solder mask on the substrate raw material will be described.

First, the substrate raw material is fixedly installed on the work table, and then the screen for the solder mask described in FIG. 2 is installed on the substrate raw material, and then, using UV ink, solder parts, chips and component insertion holes, and silver through hole lands are used. Solder mask printing is applied to the excluded parts and then dried (S20).

Thereafter, before the through-hole printing, the front surface and drying process for removing the contamination state and the oxide on the surface of the substrate is performed (S21).

Thereafter, after the substrate raw material is fixedly installed on another work platform, the silver through hole printing described in FIG. 2 described above is installed on the substrate raw material, and then printed with a paste to conduct both sides of the substrate raw material. The process is carried out (S22).

Thereafter, drying is carried out for 30 minutes at 50 ° C. (degrees) to remove the paste solvent used for the formation of the silver through-holes, and a preliminary drying step 1 is performed as a preparatory step for obtaining a stable silver through-hole resistance (S23).

Thereafter, the printed paste is subjected to a preliminary two-step drying process for 30 minutes hot air drying at 70 ° C. (degree) so that the printed paste can be maintained in a stable state on the inner wall of the silver through hole (S24).

Subsequently, in order to completely cure the printed paste, the present drying is performed by performing hot air drying at 150 ° C. for 30 minutes (S25).

As described above, after the three-step drying process is completed, a process of inspecting the printing state of the silver through-holes is performed, and then a front and drying process of removing contamination and oxides on the surface of the substrate raw material before overcoating printing. It performs (S26).

Then, after finishing basic finishing processes such as overcoating, marking printing, carbon printing, cutting, pressing, and v-cutting, packaging and shipping are performed.

By the way, according to the prior art configured as described above, when the operator draws the design drawing of the printed circuit board transmitted from the customer, the pattern layer is arranged, solder mask arrangement, After the silver layer cleanup and overcoat cleanup, the pattern film, solder mask film, and silver through-hole film are produced. After printing on the screen net using the films, the screen net for pattern and the screen for solder mask are used. Using the net and silver through-hole screen net, shrinkage occurs when passing through each process such as pattern, solder mask and silver through-hole in the substrate raw material, so that the final product defects such as high density, high accuracy and high integration cannot be maintained. There was a lot of difficulty in mounting parts.

The present invention has been made to solve the above problems, in consideration of the shrinkage of the substrate raw materials generated in the manufacturing process of the printed circuit board by applying a predetermined increase of the correction rate in advance the pattern film, solder mask film and silver The purpose of the present invention is to provide a method for manufacturing a silver through-hole type printed circuit board that allows the final finished product to be produced in a design drawing ordered by a customer even if the substrate raw material shrinks in the process by manufacturing the through-hole film.

1 is a manufacturing process diagram of a typical printed circuit board.

2 is a manufacturing process diagram of the screen net used in the production of a printed circuit board according to the prior art.

Figure 3 is a manufacturing process of the screen net used in the manufacture of the silver through-hole type printed circuit board according to the present invention.

In order to achieve the above object, the present invention is to arrange a pattern layer, a solder mask layer, and a silver through hole layer by using a cam program in a design drawing of a printed circuit board prepared by a CAD program, respectively, a pattern film, a solder mask film, and a silver through A method of manufacturing a printed circuit board by manufacturing a screen screen for pattern, a screen for solder mask and a screen for silver through hole after printing the hole film, the pattern layer, the solder mask layer and the silver through Assuming the initial lengths of the X and Y axes of the hole layer are a and b, the pattern layer is increased by 0.06a to 0.09a and 0.06b to 0.09b in the X and Y axis directions, respectively, and the solder mask layer is X 0.04a to 0.07a and 0.04b to 0.07b increase in the axial and Y-axis directions, respectively, and the silver through-hole layer increases 0.01a to 0.04a and 0.01b to 0.04b in the X- and Y-axis directions, respectively. And the pattern film, the solder mask film, and the silver through-hole film are printed.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the method for manufacturing a silver through hole type printed circuit board according to the present invention will be described in detail.

3 is a manufacturing process diagram of the screen net used in the manufacture of the silver through-hole type printed circuit board according to the present invention.

As shown in the drawing, a CAD drawing program is used to receive data from a customer on a design drawing of a green printed circuit board (S30).

After that, the operator sequentially cleans the pattern layers of the printed circuit board design drawings received from the customer through the CAM program installed in his computer (S31), solder mask layer cleaning (S32), and silver through-hole layer cleaning. (S33) and overcoat theorem (S34).

After completing all the above operations, the operator arranges the pattern layer on the cam program by applying a correction rate so as to increase a predetermined value in the X-axis and Y-axis directions, respectively (S35).

In other words, assuming the initial lengths of the X and Y axes of the pattern layer are a and b, the pattern layers are respectively 0.06a to 0.09a and 0.06b to 0.09b at the initial lengths a and b in the X and Y axis directions, respectively. To increase.

Here, in the most preferable example, it arranges so that 0.08a and 0.08b may increase.

Subsequently, the solder mask layer is arranged by applying a correction rate so as to increase a predetermined value in the X-axis and Y-axis directions, respectively (S36).

In other words, assuming the initial lengths of the X and Y axes of the solder mask layer are a and b, the solder mask layers are respectively 0.04a to 0.07a and 0.04b to the X and Y axes in the initial lengths a and b, respectively. Clean it up by 0.07b.

Here, in the most preferable example, it arranges so that 0.06a and 0.06b may increase.

Thereafter, the silver through-hole layer is arranged by applying a correction rate so as to increase a predetermined value in the X-axis and Y-axis directions, respectively (S37).

In other words, assuming the initial lengths of the x- and y-axes of the silver through-hole layer are a and b, the silver through-hole layers are respectively 0.01a to 0.04a and 0.01 at the initial lengths a and b in the X- and Y-axis directions, respectively. Increase b ~ 0.04b.

Here, it arrange | positions so that it may become 0.03a and 0.03b as a most preferable example.

Thereafter, the data generated by performing the steps S35, S36, and S37 are printed on the film using a printing means, and the pattern film, the solder mask film, and the silver through-hole film are printed and output (S38).

Subsequently, after finally developing the screen net using the film produced as described above, a screen net for pattern, a screen net for solder mask, and a silver through-hole screen net are manufactured (S39).

After completing the operation of printing the film on the screen as described above to enter the manufacturing of the printed circuit board.

According to the present invention configured as described above, the substrate raw material shrinks by a predetermined value during the steps (S10 to S26) described in FIG. 1, in view of this, a pattern film, a solder mask film, and a silver through-hole film used in each process. Since 0.08, 0.06, and 0.03 layers are applied to the layers, the final printed circuit board can be manufactured according to the customer's design drawings.

As described above, according to the present invention, a pattern film, a solder mask film, and a silver through-hole film are manufactured by applying a correction factor, which is increased in advance, in consideration of the shrinkage rate of the raw materials of the substrate generated in the manufacturing process of the printed circuit board. As a result, even if the substrate raw material shrinks in the process, the final finished product can be produced by the customer's design drawings.

Claims (1)

Printed pattern board, solder mask layer, and silver through-hole layer are arranged by using cam program as design drawing of printed circuit board made by CAD program. After printing pattern film, solder mask film and silver through-hole film, In the method for manufacturing a printed circuit board by manufacturing a screen net for solder mask, a screen net for solder mask and a screen through the silver through-hole, Assuming the initial lengths of the X-axis and Y-axis of the pattern layer, the solder mask layer, and the silver through hole layer are a and b, The pattern layer is increased 0.06a to 0.09a and 0.06b to 0.09b in the X and Y axis directions, and the solder mask layer is 0.04a to 0.07a and 0.04b to 0.07b in the X and Y axis directions, respectively. The silver through-hole layer is increased by 0.01a to 0.04a and 0.01b to 0.04b in the X-axis and Y-axis directions, respectively, so that the pattern film, the solder mask film, and the silver through-hole film are printed. Method of manufacturing a through-hole type printed circuit board.