JPH08186338A - Aggregate printed wiring board - Google Patents

Abstract

PURPOSE: To judge a working procedure when an aggregate printed wiring board is manufactured from respective printed wiring boards, to reduce manufacturing costs and to increase the density of a wiring circuit. CONSTITUTION: A plurality of sets of slave boards of at least one kind are built in, a first slave board 2 is formed in a nearly half region in a slave-board formation part. A second slave board 3 in a state that the first slave board 2 has been reversed by 180 deg. as viewed from the rear side is formed in the remaining nearly half part, a wiring circuit pattern in an aggregate state arranged on the surface and a wiring circuit pattern in an aggregate state arranged on the rear are made identical, and a cutout part 8 and/or a though hole are formed in a part other than the wiring circuit pattern on at least one slave board out of the first slave board 2 and the second slave board 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collective printed wiring board in which a plurality of at least one kind of child boards are incorporated.

[0002]

2. Description of the Related Art Generally, when manufacturing a printed wiring board, a collective printed wiring board in which a plurality of printed wiring boards called sub-boards are incorporated into a large board is formed and divided into sub-boards. To obtain the final product, a printed wiring board.

As the above-mentioned aggregated printed wiring board, the same kind of aggregated printed wiring board in which a plurality of one kind of sub-boards having the same outer shape and wiring circuit pattern are incorporated and one or more kinds having different outer shape and wiring circuit pattern are provided. An example is a heterogeneous set printed wiring board incorporating a child board.

The following method can be given as a specific method for manufacturing the above-mentioned aggregated printed wiring board.

For example, in the above-mentioned aggregate printed wiring board of the same kind, as shown in FIG. 6A, for example, a wiring circuit pattern on the front side of the same kind of sub-boards 102 and 103 is formed on the surface 101a of a wide substrate 101 to be the aggregate printed wiring board. 102a,
103a are formed in a collective state, and the wiring circuit patterns 102b and 103b on the back sides of these child boards 102 and 103 are formed in a collective state on the back surface 101b as shown in FIG. 6B. In addition, in FIG.
Through hole 107 in (a) and through hole 107 in FIG. 6 (b)
Indicate the same hole.

Therefore, first, the design of the wiring circuit pattern that matches the wiring circuit pattern in the collective state of the front surface 101a and the design of the wiring circuit pattern that matches the wiring circuit pattern in the collective state of the back surface 101b are CAD (Computer).
Aided Design) or the like.

The front surface 101a and the back surface 101b
CAM (Computer) for forming a screen or a negative (positive) film for forming each wiring circuit pattern based on the design data of the wiring circuit pattern of
Aided Manufacturing) and the like.

Next, the screen or negative (positive)
A wiring circuit pattern is formed on the front surface and the back surface of the substrate by using a film, for example, by a method such as etching. In the wiring circuit pattern forming step,
A screen and a negative (positive) film are used depending on the fineness of the wiring circuit pattern. When the wiring circuit pattern is not relatively fine, the screen is used. When the wiring circuit pattern is relatively fine, the negative (positive) film is used. ) I try to use film.

Subsequently, the front surface 101a and the back surface 101b
A screen for applying the soldering paste is formed by CAM or the like on the basis of the design data of the wiring circuit pattern of 1. Printing is performed to form a soldering paste layer.

Next, based on the design data of the wiring circuit patterns on the front surface 101a and the back surface 101b, the parts are mounted on the front surface 10
A printed wiring board of the same kind is manufactured by mounting the wiring circuit patterns on the back surface 101a and the back surface 101b by CAM or the like.

On the other hand, the same applies to the case of manufacturing a heterogeneous set printed wiring board, that is, the design of the wiring circuit pattern matching the wiring circuit pattern of the front surface and the wiring circuit pattern matching the wiring circuit pattern of the back surface. Is designed by CAD or the like, and thereafter, a heterogeneous set printed wiring board is manufactured through the same steps as the same type printed wiring board.

However, when various assembled printed wiring boards are manufactured by the manufacturing method as described above, the wiring circuit patterns in the assembled state are different on the front surface and the back surface of the substrate, so that a screen or a negative (positive) for forming the wiring circuit pattern is formed. ) Two kinds of films are formed, and due to the deviation of these precisions, the formation positions of the wiring circuit patterns formed on the front surface and the back surface of the substrate are likely to be displaced, which leads to a reduction in the accuracy of the wiring circuit pattern formation and a reduction in the manufacturing yield. This causes a decrease, which causes a problem that productivity is decreased.

Further, in the above manufacturing method, since the wiring circuit pattern is different between the front surface and the back surface of the substrate, there are two kinds of screens for forming the wiring circuit pattern or a negative (positive) film and a screen for applying the soldering paste. It is necessary to prepare, the manufacturing cost becomes high, and it is difficult to reduce the manufacturing cost and improve the productivity.

Therefore, the inventors of the present invention form a first sub-board in a region approximately half the sub-board forming portion of the collective printed wiring board for the purpose of improving the accuracy of forming a wiring circuit pattern and reducing the manufacturing cost. Then, a second sub-board in which the first sub-board seen from the back side is inverted by 180 ° is formed in the remaining approximately half area, and the wiring in the collective state arranged on the surface of the collective printed wiring board is formed. We have proposed a set printed wiring board in which the circuit pattern and the set wiring circuit pattern on the back surface are the same.

As the collective printed wiring board as described above, for example, as shown in FIG. 7, a wide substrate 111 to be a collective printed wiring board has the same outer shape and the same wiring circuit pattern as the first sub-board of the same kind. 112 and the second child board 1
13 is arranged.

In the above-mentioned printed wiring board, the wiring circuit pattern 112a on the front side of the first child board 112 and the wiring circuit pattern 113b on the back side of the second child board 113 are arranged on the front surface 111a of the board 111 from the left in the figure. Are sequentially formed, and as shown in FIG. 7B, the back surface 111 of the substrate 111 is formed.
The wiring circuit pattern 112b on the back side of the first child board 112 and the wiring circuit pattern 113a on the front side of the second child board 113 are sequentially formed in FIG. In the printed wiring board, the through hole 114 in FIG. 7A and the through hole 114 in FIG. 7B are the same.

Therefore, when the wiring circuit patterns in the aggregated state are considered, the same wiring circuit pattern is formed on the front surface and the back surface. In addition, the first sub-board 112 is formed in a region approximately half of the sub-board formation portion of the substrate 111,
The first sub-board 1 seen from the back side in the remaining approximately half area
As a result, the second child substrate 113 in which 12 is inverted by 180 ° is formed.

[0018]

However, in the above-mentioned assembled printed wiring board, since the same wiring circuit pattern is formed on the front surface and the back surface of the substrate, it is difficult to distinguish between the front surface and the back surface. It is very difficult to judge the processing procedure by looking at the collective printed wiring board after it is completed as a printed wiring board.

Further, for example, when the printed wiring board is manufactured by dividing the first and second sub-boards 112 and 113 from the above-mentioned aggregated printed wiring board, the printed wiring boards are completely the same. Is the first and second child board 11
It is very difficult to determine which of the two, 113, and it is very difficult to determine the processing procedure for each printed wiring board.

Therefore, when a pattern defect or the like occurs in the collective printed wiring board shipped as a product and each printed wiring board, it is difficult to determine which processing step the part was formed in, and the collective printed wiring board is formed. This makes it difficult to investigate the cause in the plate manufacturing process.

Therefore, in the collective printed wiring board as described above, a symbol is displayed on each child board and board. For example, in the collective printed wiring board as shown in FIG. 7 described above, the first mark 115 and the wiring on the back side of the first child board 112 are formed on the surface of the first child board 112 on which the wiring circuit pattern 112a is formed. The second mark 116 is formed on the circuit pattern 112b forming surface, and the third mark 11 is formed on the front side wiring circuit pattern 113a forming surface of the second child board 113.
7, wiring circuit pattern 11 on the back side of the second child board 113
4b on the surface where 3b is formed, the surface 1 of the substrate 111
The fifth mark 119 on 11a, the back surface 111 of the substrate 111
A sixth mark 120 is formed on b so that the front and back surfaces of the collective printed wiring board and the daughter board can be distinguished from each other, and the processing procedure can be determined. In the case where there are three types of sub boards to be incorporated in the collective printed wiring board, as many as eight symbols will be formed.

However, in order to form the above-mentioned symbols on each child substrate and substrate, it is necessary to separately form a screen for forming these symbols and perform printing on the front and back surfaces of the substrate, which results in high manufacturing cost. Will be things.

Further, in recent years, due to the high density of the wiring circuit of the printed wiring board, it has been required to reduce the size of the symbol, but it is difficult to reduce the size of the symbol beyond the present condition.
This prevents the wiring circuit from becoming denser.

Therefore, the present invention has been proposed in view of the conventional circumstances, and it is possible to determine the processing procedure at the time of manufacturing from the collective printed wiring board and each printed wiring board, and it is possible to reduce the manufacturing cost. It is an object of the present invention to provide a collective printed wiring board that enables high density wiring circuits.

[0025]

In order to achieve the above-mentioned object, according to the present invention, a plurality of at least one kind of sub-boards are incorporated, and a first sub-board is formed in a region approximately half of a sub-board forming portion. , The first half seen from the back side in the remaining half of the area
A second sub-board in which the sub-board is reversed by 180 ° is formed, and the wiring circuit pattern in the collective state arranged on the front surface and the wiring circuit pattern in the collective state arranged on the back surface are the same. In the printed wiring board, a cutout portion and / or a through hole is formed in a portion other than the wiring circuit pattern of at least one of the child boards.

[0026]

According to the present invention, the first sub-board is formed in an approximately half area of the sub-board forming portion, and the first sub-board seen from the back side is inverted by 180 ° in the remaining approximately half area. Second
In the aggregate printed wiring board in which the sub-boards of the sub-boards are formed and the collective wiring circuit patterns arranged on the front surface and the collective state arranged on the back surface are the same, the wiring circuit of at least one of the sub-boards Since the cutout portion and / or the through hole is formed in a portion other than the pattern, even if the wiring circuit patterns in the gathered state on both surfaces are the same, the above wiring circuit pattern and the cutout portion and / or the through hole are formed. Combination, the wiring circuit pattern and notch and /
Alternatively, the front surface and the back surface of the collective printed wiring board can be easily distinguished by the combination with the formation position of the through hole, and the processing procedure thereof can be easily judged.

Also, when the above-mentioned printed wiring boards are divided to obtain the same type of printed wiring boards, the wiring circuit pattern and the notch and / or the through hole are combined, and the wiring circuit pattern and the notch are formed. Each printed wiring board can be easily distinguished by the combination with the portion and / or the formation position of the through hole, and the processing procedure for each printed wiring board can be easily determined.

By mechanically forming the notch and / or the through hole, it is not necessary to prepare a screen or the like, and the manufacturing cost can be reduced.

Further, since the notch and / or the through hole is formed smaller than the conventionally used symbol, it is suitable for high density wiring circuit.

[0030]

Embodiments to which the present invention is applied will be described below in detail with reference to the drawings.

Example 1 In this example, a collective printed wiring board in which a child board is provided with a notch will be described. In this example, an example in which the present invention is applied to a homogeneous printed wiring board will be described.

The collective printed wiring board of this embodiment is shown in FIG.
As shown in (a), a first sub-board 2 and a second sub-board 3 of the same type having the same outer shape and wiring circuit pattern are arranged on a wide board 1 which is a collective printed wiring board. . Cutout grooves 6 and 7 are provided around the first and second sub-boards 2 and 3 and are partly divided to serve as connecting portions between the sub-boards 2 and 3 and the board 1. Thus, the first and second daughter boards 2 and 3 can be separated from the cut grooves 6 and 7.

On the front surface 1a of the substrate 1, the wiring circuit pattern 2a on the front side of the first sub-board 2 and the second
The wiring circuit pattern 3b on the back side of the child board 3 is sequentially formed, and as shown in FIG. 1B, the wiring circuit pattern 2b on the back side of the first child board 2 and The wiring circuit pattern 3a on the front side of the second child board 3 is sequentially formed. Further, in FIG. 1, the through hole 4 in FIG. 1 (a) and the through hole 4 in FIG. 1 (b) are the same,
The through holes 5 in FIG. 1A and the through holes 5 in FIG. 1B are the same.

Therefore, when the wiring circuit patterns in the assembled state are considered, the same wiring circuit pattern is formed on the front surface and the back surface of the substrate 1. Further, the first sub-board 2 is formed in a region approximately half of the sub-board forming portion of the board 1.
The first sub-board 2 seen from the back side in the remaining approximately half area
The second sub-board 3 is formed in a state of being inverted by 180 ° in the horizontal direction in the figure. In the collective printed wiring board of this embodiment, it is assumed that components not shown are mounted at predetermined positions.

In particular, in the collective printed wiring board of this embodiment, the notch portion 8 is formed in the portion other than the front side wiring circuit pattern 2a and the back side wiring circuit pattern 2b of the first sub-board 2. . In this embodiment, the cutout portion 8 is formed so as to be continuous with the cutout groove 6.

Therefore, in the assembled printed wiring board of the present embodiment, even if the assembled wiring circuit patterns on both sides are the same, the surface on which the wiring circuit pattern 2a on the front side and the notch 8 are combined is the surface. 1a, the surface on which the wiring circuit pattern 2b on the back side and the cutout portion 8 are combined is determined to be the back surface 1b, and the front surface 1a and the back surface 1b can be easily distinguished from each other. Easily judged.

Further, even when the first and second sub-boards 2 and 3 of the collective printed wiring board of this embodiment are divided into the respective printed wiring boards, the notch portion 8 is preferably provided. The printed wiring boards are easily distinguished from each other, and the processing procedure thereof is also easily judged.

That is, in the collective printed wiring board and the divided printed wiring board of this embodiment, the processing procedure can be easily determined, so-called traceability is high, and even when a pattern defect or the like occurs, the collective printed wiring board The cause can be easily investigated in the manufacturing process.

Further, in the collective printed wiring board of the present embodiment, the notch is formed smaller than the conventionally used symbol, so that the wiring circuit pattern forming portion can be made wider than before, and the wiring can be formed. Higher circuit density is also achieved.

Next, a method for manufacturing the collective printed wiring board of this embodiment will be described. In order to manufacture the collective printed wiring board of this embodiment, first, a common wiring circuit pattern is designed on the front surface and the back surface by CAD.

That is, as shown in FIG. 2, on the front side of the sub-boards 2 and 3 in a region approximately half of the aggregate printed wiring board forming portion 11 on which the wiring circuit pattern of the aggregate printed wiring board on the CAD screen is to be formed. The front side wiring circuit pattern 12a to be the wiring circuit patterns 2a and 3a is formed.

Next, as shown in FIG. 3, wiring circuit patterns 2b and 3b on the back side of the sub-boards 2 and 3 are formed in the remaining approximately half area of the aggregate printed wiring board forming portion 11 on the CAD screen.
The wiring circuit pattern 12b on the back side is formed.

Subsequently, as shown in FIG. 4 together with the CAD screens shown in FIGS. 2 and 3, wiring circuits on the front side of the child board are formed in an approximately half area of the collective printed wiring board forming portion 11 on the CAD screen. A pattern 12a is formed, and a wiring circuit pattern 12b on the back side is formed in the remaining half of the area in a state where the wiring circuit pattern on the back side when the child board is viewed from the back side is inverted by 180 ° in the horizontal direction in the drawing. Design the wiring circuit pattern of the assembled printed wiring board.

Then, based on the data designed by the above CAD, a through hole to be a through hole is formed at a predetermined position of the substrate by drilling or the like.

Next, a screen or a negative (positive) film for forming a wiring circuit pattern is formed using CAM or the like by the data designed by the CAD. Then, a wiring circuit pattern is formed on the front surface of the substrate by etching using a screen or a negative (positive) film, and a wiring circuit pattern is also etched on the back surface of the substrate by using the same screen or negative (positive) film. Form. As a result, the same wired circuit pattern is formed on the front surface and the back surface of the substrate.

Next, screens for applying the soldering paste to the wiring circuit patterns on the front surface and the back surface of the substrate are formed using CAM or the like based on the same data designed by CAD. Then, using the above-mentioned screen, a soldering paste is screen-printed on the wiring circuit patterns on the front surface and the back surface of the substrate in the same pattern to form a soldering paste layer.

Subsequently, symbol printing is performed and press working is performed to finish the outer shape, thereby obtaining a printed wiring board.

At this time, in this embodiment, a notch portion is also formed at the time of the press working. Specifically, first, the notch formation data is incorporated into CAD design data for press working. Next, a die for press working is formed based on the above data. And by pressing the substrate with this mold,
Not only the outer shape is finished but also the notch is formed.

Finally, components such as electronic components are mounted on the front and rear wiring circuit patterns of the substrate using CAM or the like based on the same data designed by CAD, and the collective printed wiring board of this embodiment is completed. . At this time, since the same wiring circuit pattern is formed on the front surface and the back surface of the substrate,
The data used to mount the component on the front surface may be used as it is on the rear surface to mount the component in the same manner.

Further, as a method of manufacturing the collective printed wiring board of this embodiment, there are a method of forming the notch by drilling and a method of forming the notch by router processing.

When the notch is formed by drilling, the notch may be formed by drilling at an appropriate place in the above manufacturing method, and thereafter the manufacturing may be performed according to the above manufacturing method. However, the step of forming the notch in the press working is omitted. It should be noted that this method is suitable for forming a notch having a size that cannot be formed by press working.

Further, in this method, a through hole which becomes a through hole or the like may be formed in the substrate by drilling, and at the same time, the notch may be formed. Specifically, the notch forming data is incorporated into the CAD design data for forming the through hole, and the through hole and the notch are formed based on the data. The same applies when the above manufacturing method is applied to the manufacture of a multilayer printed wiring board.

When the notch is formed by router processing, router processing for finishing the outer shape is performed instead of the press processing in the above manufacturing method, and at the same time, the notch is formed and May be manufactured according to the above manufacturing method. Specifically, the notch forming data is incorporated into CAD design data for router processing for finishing the outer shape, and the outer shape is finished and the notch is formed based on the data.

Therefore, in the method for manufacturing the collective printed wiring board of the present embodiment described above, the notch is mechanically formed, and it is not necessary to prepare a screen or the like. That is, in the collective printed wiring board of this embodiment, the manufacturing cost is reduced.

Example 2 In this example, a collective printed wiring board having through-holes formed in a child board will be described. Also in this embodiment, an example in which the present invention is applied to a homogeneous printed wiring board will be described.

The collective printed wiring board of this embodiment has substantially the same structure as the collective printed wiring board described in the first embodiment, and as shown in FIG. 5A, the outer shape and the wiring circuit pattern. The same type of first sub-board 22 and second sub-board 23 of the same type are arranged on a wide board 21 which serves as a collective printed wiring board.

In the collective printed wiring board of this embodiment, the front side wiring circuit pattern 22a of the first sub-board 22 and the second sub-board 2 are provided on the surface 21a of the substrate 21.
The wiring circuit pattern 23b on the back side of FIG.
As shown in (b), a wiring circuit pattern 22b on the back side of the first child board 22 and a wiring circuit pattern 23a on the front side of the second child board 23 are formed on the back surface 21b of the board 21, and the wiring circuit in the assembled state is formed. In terms of patterns, the same wired circuit pattern is formed on the front surface and the back surface.

Further, the first sub-board 22 is formed in an approximately half area of the sub-board forming portion of the substrate 21, and the first sub-board 22 viewed from the back side is formed in the remaining approximately half area of the sub-board. Thus, the second child board 23 which is turned 180 degrees in the direction is formed.

In FIG. 5, the through hole 24 in FIG. 5 (a) and the through hole 24 in FIG. 5 (b) are the same, and the through hole 25 in FIG. The through holes 25 in 5 (b) are the same. Furthermore, in the collective printed wiring board of the present embodiment, it is assumed that components not shown are mounted at predetermined positions.

In particular, in the collective printed wiring board of the present embodiment, the through holes 28 are formed in the portions where the front side wiring circuit pattern 23a and the back side wiring circuit pattern 23b of the second child board 23 are not formed. .

Therefore, also in the collective printed wiring board of the present embodiment, similar to the collective printed wiring board of the first embodiment, even if the wiring circuit patterns in the assembled state on both sides are the same as the wiring circuit pattern 23a on the front side. The surface in which the through holes 28 are combined is determined as the back surface 21b, and the surface in which the wiring circuit pattern 23b on the back side and the through holes 28 are combined is determined as the front surface 21a, and the front surface 21a and the back surface 21b are easily distinguished. It is possible and the processing procedure can be easily judged.

Further, even when the first and second sub-boards 22 and 23 of the collective printed wiring board of this embodiment are divided into the respective printed wiring boards, it is the second one that the through holes 28 are provided. The printed wiring boards are easily distinguished from each other, and the processing procedure thereof is also easily judged.

That is, also in the collective printed wiring board and the divided printed wiring board of the present embodiment, the processing procedure can be easily determined, the so-called traceability is high, and the pattern defect or the like occurs, as in the first embodiment. Also in the case of (3), the cause can be easily investigated in the manufacturing process of the collective printed wiring board.

Further, also in the collective printed wiring board of this embodiment, since the through holes are formed smaller than the conventionally used symbols, the wiring circuit pattern forming portion can be made wider than before, and the wiring circuit can be formed. Higher density is also achieved.

Manufacturing of the collective printed wiring board of this embodiment is as follows.
The same procedure as in Example 1 may be performed, and instead of forming the cutout portion in the manufacturing method described in Example 1, a through hole may be formed.

Therefore, also in this embodiment, the through holes are mechanically formed, and it is not necessary to prepare a screen or the like. That is, also in the collective printed wiring board of this embodiment, the manufacturing cost is reduced.

In each of the above-described embodiments, the example in which the notch or the through hole is formed only in one child board has been described, but the notch and the through hole are formed in one child board. Notches and / or through holes may be formed in both child boards.

In this case, the surface of the collective printed wiring board is combined with the combination of the wiring circuit pattern and the notch and / or the through hole, and the combination of the wiring circuit pattern and the formation position of the notch and / or the through hole. And the back surface are distinguished, each printed wiring board is distinguished by the combination of the wiring circuit pattern and the cutout portion and / or the through hole, and the combination of the wiring circuit pattern and the formation position of the cutout portion and / or the through hole, It has the same effect as each of the above-mentioned embodiments.

Further, in each of the above-mentioned embodiments, the example in which the present invention is applied to the same type aggregate printed wiring board has been described, but it is needless to say that the present invention is applicable to the heterogeneous aggregate printed wiring board.

[0070]

As is apparent from the above description, according to the present invention, the first sub-board is formed in the substantially half area of the sub-board forming portion, and the remaining sub-half of the above-mentioned first sub-board is formed. A second sub-board in which the first sub-board is inverted by 180 ° is formed, and the wiring circuit pattern in the collective state arranged on the front surface and the wiring circuit pattern in the collective state arranged on the back surface are the same. In the assembled printed wiring board, since the cutout portion and / or the through hole is formed in a portion other than the wiring circuit pattern of at least one child board, even if the wiring circuit patterns in the assembled state on both sides are the same, The front surface and the back surface of the collective printed wiring board can be easily distinguished by the combination of the wiring circuit pattern and the notch and / or the through hole, and the combination of the wiring circuit pattern and the formation position of the notch and / or the through hole. Is, their processing steps is also easily determined.

Even when the above-mentioned printed wiring boards are divided to obtain the same type of printed wiring boards, the wiring circuit pattern and the notch and / or the through hole are combined, and the wiring circuit pattern and the notch are formed. Each printed wiring board can be easily distinguished by the combination with the portion and / or the formation position of the through hole, and the processing procedure of each printed wiring board can be easily determined.

Therefore, when a pattern defect or the like occurs in the collective printed wiring board and the divided printed wiring board of the present invention, the cause in the manufacturing process of the collective printed wiring board can be easily investigated and its industrial value is high. Very expensive.

By mechanically forming the notch and / or the through hole, it is not necessary to prepare a screen or the like, and the manufacturing cost can be reduced.

Further, since the notch and / or the through hole is formed smaller than the conventionally used symbol, it is suitable for high density wiring circuit.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of an assembled printed wiring board to which the present invention is applied.

FIG. 2 shows an example of a method of manufacturing a collective printed wiring board to which the present invention is applied in the order of steps, in which a wiring circuit pattern on the front side is formed in a region substantially half of a portion where a collective printed wiring board is formed on a CAD screen. It is a schematic diagram which shows a process.

FIG. 3 shows an example of a method of manufacturing a collective printed wiring board to which the present invention is applied in the order of steps, in which a wiring circuit pattern on the back side is provided in the remaining half of the area on the CAD screen where the collective printed wiring board is formed. It is a schematic diagram which shows the process of forming.

FIG. 4 shows an example of a method of manufacturing an aggregated printed wiring board to which the present invention is applied in the order of steps, and is a schematic view showing a step of designing a wiring circuit pattern of the aggregated printed wiring board on a CAD screen.

FIG. 5 is a plan view showing another embodiment of the collective printed wiring board to which the present invention is applied.

FIG. 6 is a plan view showing an example of a conventional aggregated printed wiring board.

FIG. 7 is a plan view showing another example of a conventional assembled printed wiring board.

[Explanation of reference numerals] 1, 21 ... Substrate 1a, 21a ... Front surface 1b, 21b ... Rear surface 2, 3, 22, 23 ... Sub-board 2a, 3a, 22a, 23a ... Front side Wiring circuit patterns 2b, 3b, 22b, 23b ... Wiring circuit pattern on the back side 8 ... Notches 28 ... Through holes

Claims (1)

[Claims] 1. A plurality of at least one type of sub-boards are incorporated, a first sub-board is formed in a substantially half area of a sub-board forming portion, and the first sub-board is viewed in the remaining approximately half area from the back side.
A second sub-board in which the sub-board is reversed by 180 ° is formed, and the wiring circuit pattern in the collective state arranged on the front surface and the wiring circuit pattern in the collective state arranged on the back surface are the same. In the printed wiring board, a cutout portion and / or a through hole is formed in a portion other than the wiring circuit pattern of at least one of the sub-boards.