KR200158853Y1 - Solder ball supply apparatus of bga package - Google Patents

Solder ball supply apparatus of bga package Download PDF

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Publication number
KR200158853Y1
KR200158853Y1 KR2019960026027U KR19960026027U KR200158853Y1 KR 200158853 Y1 KR200158853 Y1 KR 200158853Y1 KR 2019960026027 U KR2019960026027 U KR 2019960026027U KR 19960026027 U KR19960026027 U KR 19960026027U KR 200158853 Y1 KR200158853 Y1 KR 200158853Y1
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South Korea
Prior art keywords
solder ball
mask
bga
solder
ball
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KR2019960026027U
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Korean (ko)
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KR19980012464U (en
Inventor
김원규
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구자홍
엘지전자주식회사
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Priority to KR2019960026027U priority Critical patent/KR200158853Y1/en
Publication of KR19980012464U publication Critical patent/KR19980012464U/en
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Publication of KR200158853Y1 publication Critical patent/KR200158853Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

BGA 전극과 1 대 1 로 대응하는 격자구조의 솔러볼관통홀(13a)이 형성된 솔더볼 인쇄용 상판 마스크(13)와, 상기 상판마스크(13)의 각관통홀(13a)과 연통된 안착홈(14a)과 상기 안착홈(14a)과 연통된 흡착홀(14b)이 형성된 한편 상기 상판마스크(13)와 밀착설치된 하판마스크(14)와, 상기 하판마스크(14)와 밀착설치되어 상기 하판마스크(14)의 흡착홀(14b)를 통해 공기를 흡입하는 진공지그상, 하판(15)(16)으로 구성된 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치.Solder ball printing top plate 13 having a BGA electrode having a grid-shaped solar ball through hole 13a corresponding to one-to-one, and a seating groove 14a in communication with each through hole 13a of the top mask 13. ) And a suction hole 14b communicating with the seating groove 14a and the lower plate mask 14 installed in close contact with the upper plate 13 and the lower plate mask 14 in close contact with the lower plate mask 14. The solder ball supply device of the BGA (BALL GRID ARRAY) package consisting of a lower plate (15, 16) on the vacuum jig to suck air through the suction hole (14b) of the).

Description

BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치Solder Ball Supply in BGA (BALL GRID ARRAY) Package

제1도는 종래의 BGA(BALL GRID ARRAY) 패키지를 나타낸 측단면도Figure 1 is a side cross-sectional view showing a conventional BGA (BALL GRID ARRAY) package

제2도는 종래의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 개략구성도2 is a schematic configuration diagram of a solder ball supplying device of a conventional BGA (BALL GRID ARRAY) package

제3도는 종래의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼정열지그상판을 나타낸 것으로, a는 평면도, b는 측단면도3 is a top view of a solder ball alignment jig plate of a solder ball supply device of a conventional BGA (BALL GRID ARRAY) package, a is a plan view, b is a side cross-sectional view

제4도는 종래의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼정열지그하판을 나타낸 것으로, a는 평면도, b는 측단면도4 is a bottom view of a solder ball alignment jig of a solder ball supply device of a conventional ball grid array (BGA) package, a is a plan view and b is a side cross-sectional view.

제5도는 종래의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼정열지그에 솔더볼이 정열된 상태를 나타내는 도면,FIG. 5 is a view showing a state in which solder balls are arranged on a solder ball alignment jig of a solder ball supply device of a conventional ball grid array (BGA) package,

제6도는 본 고안에 따른 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 개략구성도.6 is a schematic configuration diagram of a solder ball supply apparatus of a BGA (BALL GRID ARRAY) package according to the present invention.

제7도는 본 고안에 따른 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼 인쇄용 상면 마스크를 나타낸 것으로, a는 평면도, b는 측단면도, c는 b의 A부의 상세도Figure 7 shows the top surface mask for solder ball printing of the solder ball supply device of the BGA (BALL GRID ARRAY) package according to the present invention, a is a plan view, b is a side cross-sectional view, c is a detailed view of part A of b

제8도는 본 고안에 따른 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼 인쇄용 하면 마스크를 나타낸 것으로, a는 평면도, b는 측단면도, c는 b의 B부의 상세도8 is a bottom mask for solder ball printing of a solder ball supply device of a BGA (BALL GRID ARRAY) package according to the present invention, a is a plan view, b is a side cross-sectional view, c is a detailed view of the portion B of b

제9도는 본 고안에 따른 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 솔더볼 인쇄용 마크스에 솔더볼이 정열된 상태를 나타내는 도면.9 is a view showing a state in which the solder ball is aligned on the solder ball printing mark of the solder ball supply apparatus of the BGA (BALL GRID ARRAY) package according to the present invention.

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

3 : 솔더볼 11 : 스퀴지홀더3: solder ball 11: squeegee holder

12 : 스퀴지 13 : 솔더볼 인쇄용 상면 마스크12: squeegee 13: upper surface mask for solder ball printing

14 : 솔더볼 인쇄용 하면 마스크 15 : 진공지그상판14: bottom surface mask for solder ball printing 15: vacuum jig top plate

16 : 진공지그하판16: vacuum jig lower plate

본 고안은 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치에 관한 것으로, 특히 전극과 대응하여 복수의 솔더볼을 일괄 공급할 수 있도록 한 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치에 관한 것이다.The present invention relates to a solder ball supply device of a BGA (BALL GRID ARRAY) package, and more particularly, to a solder ball supply device of a BGA (BALL GRID ARRAY) package to supply a plurality of solder balls in correspondence with electrodes.

BGA(BALL GRID ARRAY)는 기판에 솔더볼을 장착하여 기존의 PGA(PIN GRID ARRAY)를 대체하도록 고안된 칩부품 패키지로서, 제 1 도에 도시된 바와 같이, 기판(2)과, 기판상면의 집적회로칩(1)과, 칩을 포위하고 있는 모울드와, 기판하면의 솔더볼(3)로 이루어진다.Ball grid array (BGA) is a chip component package designed to replace a conventional pin grid array (PGA) by mounting solder balls on a substrate. As shown in FIG. 1, an integrated circuit on a substrate 2 and an upper surface of the substrate is provided. A chip 1, a mold surrounding the chip, and a solder ball 3 on the lower surface of the substrate.

이러한 BGA(BALL GRID ARRAY) 패키지의 기판(3)에 외부전극 리드를 형성하기 위한 격자구조의 솔더볼(3)의 공급방법은 솔더볼낙하형 공급장치를 이용하여 BGA 집적회로의 전극과 1 대 1 로 대응되도록 지그에 공급하고 있다.A method of supplying a solder ball 3 of a lattice structure for forming an external electrode lead on a substrate 3 of a BGA (BALL GRID ARRAY) package is one-to-one with an electrode of a BGA integrated circuit using a solder ball dropping supply device. It is supplied to the jig so as to correspond.

즉, 제 2 도에 도시된 바와 같이, 솔더볼(3)이 수용된 보관용기(4)에서 솔더볼을 호스(5)를 통하여 하나씩 솔더볼정열지그상하판(6)(7)에 낙하공급하고 바이브레이터(8)로 진동시키어 정렬한다. 지그상판(6)에는 제 3 도에 도시된 바와 같이, 솔더볼에 대응하는 격자구조의 관통홀(6a)이 형성되어 있고, 제 4 도에 도시된 바와 같이, 지그상판과 밀착되어 있는 지그하판(7)에는 상기 관통홀(6a)과 연통된 홈(7a)이 형성되어 있다.That is, as shown in FIG. 2, the solder balls are dropped into the solder ball alignment jig upper and lower plates 6 and 7 one by one through the hose 5 in the storage container 4 in which the solder balls 3 are accommodated, and the vibrator 8 Vibrate with) to align. As shown in FIG. 3, the jig upper plate 6 is formed with a through hole 6a having a lattice structure corresponding to the solder ball, and as shown in FIG. 4, the jig lower plate in close contact with the jig upper plate ( The groove 7a is formed in the communication hole 7a and communicates with the through hole 6a.

지그에 공급된 솔더볼은 지그상판(6)의 관통홀을 통하여 지그하판(7)의 홈(7a)에 안착된다.The solder ball supplied to the jig is seated in the groove 7a of the jig lower plate 7 through the through hole of the jig upper plate 6.

제 4 도는 지그하판(7)의 홈(7a)에 솔더볼(3)이 안착 정열된 상태를 나타낸다.4 shows a state in which the solder balls 3 are seated and aligned in the grooves 7a of the jig lower plate 7.

이와 같이 정열된 솔더볼은 흡착노즐로 흡착되어 기판(3)의 위치로 이동하여 장착접속되어 외부전극리드화된다.The solder balls arranged as described above are adsorbed by the adsorption nozzle, moved to the position of the substrate 3, and are connected and mounted to lead external electrodes.

이러한 종래의 솔더볼공급장치는 전극수만큼의 솔더볼공급용 호스(5)가 필요하다는 문제점과, 솔더볼이 자중낙하하므로 호스내부의 이물, 정전기 발생등으로 인하여 솔더볼이 원활히 낙하하지 못하게 되는 문제점과, 약 1200 내지 1500개의 솔더볼을 한 번에 동시에 공급해야하므로 공급에 대한 위험이 크고, 하나의 볼이라도 공급되지 않았을 경우 재작업을 해야한다는 문제점이 있었다.This conventional solder ball supply device requires a problem that the solder ball supply hose (5) as many as the number of electrodes, the solder ball falls down due to its own weight, the problem that the solder ball does not fall smoothly due to foreign matter, static electricity, etc., about 1200 Since 1500 to one solder ball must be supplied at the same time, the risk of supply is high, and if a single ball is not supplied, there is a problem of reworking.

본 고안은 이러한 종래기술의 문제점을 해결하기 위한 것으로, 전극과 대응한 마스크를 이용하여 복수의 솔더볼을 일괄공급하여 구조가 간단하고, 정도가 향상되어 생산성을 높일 수 있는 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치의 제공을 목적으로 한다.The present invention is to solve the problems of the prior art, the BGA (BALL GRID ARRAY) package that can simplify the structure, improve the accuracy and increase the productivity by supplying a plurality of solder balls by using a mask corresponding to the electrode To provide a solder ball supply device.

상기 목적을 달성하기 위하여 본 고안의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치는, BGA 전극과 1 대 1 로 대응하는 격자구조의 솔더볼안착부를 갖는 솔더볼 인쇄용 마스크와 상기 마스크에 공급된 솔더볼을 마스크에 흡착고정시키는 진공지그를 구비한 것을 특징으로 한다.In order to achieve the above object, a solder ball supply device of a BGA (BALL GRID ARRAY) package according to the present invention includes a solder ball printing mask having a solder ball seating portion having a BGA electrode and a one-to-one grid structure, and a solder ball supplied to the mask. It is characterized by comprising a vacuum jig to be fixed to the suction.

이하, 첨부도면에 의거하여 본 고안의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치를 상세히 설명한다.Hereinafter, a solder ball supply device of a BGA (BALL GRID ARRAY) package of the present invention will be described in detail with reference to the accompanying drawings.

본 고안의 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치는, 제 6 도 내지 제 8 도에 도시된 바와 같이, BGA 전극과 1 대 1로 대응하는 격자구조의 솔더볼관통홀(13a)이 형성된 솔더볼 인쇄용 상판 마스크(13)와, 상기 상판마스크(13)의 각관통홀(13a)과 연통된 안착홈(14a)과 상기 안착홈(14a)과 연통된 흡착홀(14b)이 형성된 한편 상기 상판마스크(13)와 밀착설치된 하판마스크(14)와, 상기 하판마스크(14)와 밀착설치되어 상기 하판마스크(14)의 흡착홀(14b)를 통해 공기를 흡입하는 진공지그상, 하판(15)(16)으로 구성되어 있다.The solder ball supply device of the BGA (BALL GRID ARRAY) package of the present invention, as shown in Figure 6 to 8, the solder ball through hole 13a of the grid structure corresponding to the BGA electrode 1 to 1 is formed A top plate mask 13 for printing, a seating groove 14a in communication with each of the through holes 13a of the top plate 13, and a suction hole 14b in communication with the seating groove 14a are formed, and the top plate mask is formed. The lower plate mask 14 installed in close contact with 13 and the lower plate mask 14 installed in close contact with the lower plate mask 14 to suck air through the suction hole 14b of the lower plate mask 14 and the lower plate 15 ( 16).

상기 솔더볼 인쇄용 상면 마스크(13)의 솔더볼관통홀(13a)의 상부는 솔더볼(3)를 원활하게 유도하도록 확대형성되어 있고, 상면마스크(13)의 두께는 솔더볼직경의 1/2정도로 형성된다.The upper portion of the solder ball through hole 13a of the upper surface mask 13 for solder ball printing is enlarged to guide the solder ball 3 smoothly, and the thickness of the upper surface mask 13 is about 1/2 of the solder ball diameter.

상기 솔더볼 인쇄용 하면 마스크(14)의 안착홈(14a)은 솔더볼(3)이 안착되었을시 1/2정도 올라올 수 있도록 반경(r)의 반원형으로 형성되어 있다.The mounting groove 14a of the lower surface mask 14 for solder ball printing is formed in a semicircle having a radius r so that the solder ball 3 may be raised by about 1/2 when seated.

제 6 도 내지 제 8 도와 같이, 솔더볼(3)을 솔더볼 인쇄용 상면 마스크(13)에 올려 놓고 스퀴지(12)를 이동시키면 솔더볼(3)은 솔더볼 인쇄용 상면 마스크(13)의 관통홀(13a)을 통하여 하면마스크(14)의 안착홈(14a)에 들어가게 되어 솔더볼의 상부반은 상면마스크에 그리고, 하부반은 하면마스크에 놓이게 된다.6 to 8, when the solder ball 3 is placed on the upper surface mask 13 for solder ball printing and the squeegee 12 is moved, the solder ball 3 opens the through hole 13a of the upper surface mask 13 for solder ball printing. Through the lower surface of the mask 14 to enter the seating groove (14a), the upper half of the solder ball is placed on the upper surface mask, the lower half is placed on the lower surface mask.

이렇게 전극과 1 대 1 로 대응하여 격자구조로 공급된 복수의 솔더볼은 진공지그(16)(17)에 의해 흡착되어 고정정열되고, 상면마스크(13)을 Z축방향으로 들어 이동시키면 제 9 도는 솔더볼 인쇄용 하면 마스크(14)에 솔더볼(3)이 정열된 상태가 된다.Thus, a plurality of solder balls supplied in a lattice structure corresponding to the electrodes in a one-to-one manner are attracted and fixed by vacuum jigs 16 and 17, and when the upper mask 13 is moved in the Z-axis direction, FIG. When solder ball printing is performed, the solder balls 3 are aligned with the mask 14.

이와 같이 정열된 솔더볼은 기판에 전사되어 외부전극리드를 형성하게 된다.The aligned solder balls are transferred to a substrate to form external electrode leads.

이상, 설명한 바와 같이, 본 고안에 따르면, BGA 전극과 1 대 1 로 대응하여 솔더볼을 인쇄할 수 있도록 제작된 마스크를 이용하여 복수의 솔더볼을 일괄 공급인쇄함으로서, 구조가 간단하게 되고, 정도가 향상되어 생산성을 향상시킬 수 있다.As described above, according to the present invention, by supplying a plurality of solder balls collectively using a mask made to print solder balls in a one-to-one correspondence with a BGA electrode, the structure is simplified and the accuracy is improved. The productivity can be improved.

Claims (1)

BGA 전극과 1 대 1 로 대응하는 격자구조의 솔더볼안착부를 갖는 솔더볼 인쇄용 마스크와 상기 마스크에 공급된 솔더볼을 마스크에 흡착고정시키는 진공지그를 구비하고, 상기 인쇄용마스크는 BGA 전그과 1 대 1 로 대응하는 격자구조의 솔더볼관통홀이 형성된 솔더볼 인쇄용 상판 마스크와, 상기 상판마스크의 각 관통홀과 연통된 안착홈과 상기 안착홈과 연통된 흡착홀이 형성된 한편 상기 상판마스크와 밀착설치된 하판마스크으로 이루어지고, 상기 진공지그는 상기 하판마스크와 밀착설치되어 상기 하판마스크의 흡착홀을 통해 공기를 흡입하는 진공지그상, 하판으로 이루어지고, 상기 솔더볼 인쇄용 상면 마스크(13)의 솔더볼관통홀(13a)의 상부는 솔더볼(3)을 원활하게 유도하도록 확대형성되어 있고, 상면마스크(13)의 두께는 솔더볼 직경의 1/2정도로 형성되고, 상기 솔더볼 인쇄용 하면 마스크(14)의 안착홈(14a)은 솔더볼(3)이 안착되었을시 1/2정도 올라올 수 있도록 솔더볼반경에 대응하는 반경(r)의 반원형으로 형성된 것을 특징으로 하는 BGA(BALL GRID ARRAY) 패키지의 솔더볼공급장치.A solder ball printing mask having a BGA electrode and a solder ball seat having a one-to-one lattice structure, and a vacuum jig for adsorbing and fixing the solder ball supplied to the mask to the mask, wherein the printing mask is one-to-one with a BGA tag. It consists of a top plate mask for solder ball printing formed with a solder ball through hole of the lattice structure, a seating groove communicating with each through hole of the top mask and a suction hole communicating with the seating groove and a bottom plate mask in close contact with the top mask. The vacuum jig is installed in close contact with the lower plate mask and is formed of a vacuum jig upper and lower plates which suck air through the suction holes of the lower plate mask, and an upper portion of the solder ball through hole 13a of the upper surface mask 13 for solder ball printing. Is enlarged to guide the solder balls 3 smoothly, and the thickness of the top mask 13 is about 1/2 of the diameter of the solder balls. When the solder ball is printed, the seating groove 14a of the mask 14 is formed in a semicircle having a radius r corresponding to the radius of the solder ball so that the solder ball 3 may rise by about 1/2 when seated. Solder ball supply in BGA (BALL GRID ARRAY) package.
KR2019960026027U 1996-08-27 1996-08-27 Solder ball supply apparatus of bga package KR200158853Y1 (en)

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KR200158853Y1 true KR200158853Y1 (en) 1999-10-15

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