JPH01321685A - Suction jig for substrate - Google Patents

Abstract

PURPOSE:To use the title suction jig in common with a plural kind of substrates by placing the substrates onto a plurality of suction pins erected into pin erecting holes at specified positions, closing the pin erecting holes except the specified positions by a closing means and sucking air from an intake vent. CONSTITUTION:A plurality of suction pins 28 are erected vertically into a plurality of pin erecting holes 25 at predetermined positions corresponding to the kind of a substrate 1, and residual pin erecting holes 25 are closed by closing means 26. Consequently, when the substrate 1 is put onto a plurality of the suction pins 28 and air is sucked from an intake vent 24, the substrate 1 is sucked to the noses of the hollow holes 30 of a plurality of the suction pins 28. The pin erecting holes 25 in which the suction pins 28 are not erected are closed by the closing means 26, and have no effect on suction. Accordingly, the substrate 1 can be sucked by erecting the suction pins 28 into the pin erecting holes 26 at positions corresponding to the fixed positions of suction of the substrate 1, thus generally using the title suction jig for a plurality of the substrates 1 only by changing the positions of the suction pins 28.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a substrate suction jig equipped with a plurality of suction pins and pinning holes that can change the suction position depending on the type of substrate, and is commonly used for multiple types of substrates. The purpose of this board suction jig is to provide a general-purpose board suction jig that can suction and hold a board during the process of applying solder paste to a conductive pattern formed on the surface of the board. a first block that forms an air space that is open on the inside leaving a peripheral edge of the block, and has an intake hole that communicates with the air space at one end; a second block that passes through the block and has a plurality of pin holes provided at predetermined intervals; a plurality of suction pins each having a small diameter portion formed at the negative end to be fitted into the pin holes, a hollow hole and a flat surface at the other end; and a closing means for closing the pinning holes, the substrate is placed on a plurality of suction pins set in the pinning holes at predetermined positions, and the pinning holes other than the predetermined positions are closed by the closing means. , the structure is such that air is taken in through the intake hole.

[Industrial application field]

The present invention relates to a suction jig used in the process of applying solder paste to a pattern on a printed circuit board, and particularly includes a plurality of suction pins and pin holes that can change the suction position depending on the type of board. The present invention relates to a substrate suction jig.

Recently, as a method of soldering components mounted on a printed circuit board (hereinafter referred to as a board), solder paste is applied to a pattern, the components are mounted, and the components are passed through an inert vapor. These processes are organized as a series of flow steps, and work and transportation are performed by adsorbing the substrate to a suction jig.

Suction jigs use specialized blocks for each substrate size and suction specification, and as the types of substrates are diversifying, it is uneconomical to prepare specialized blocks, and a method of generalization is desired. There is.

(Prior Art) FIGS. 6(a) and 6(b) show a suction jig 2 in the process of applying solder paste to a pattern on a substrate 1a.

As shown in the figure, both edges in the width direction of base +ff1la are held with the side on which solder paste is applied to facing conveyor rails 3a and 3b facing upward. Conveyor rail 3a
, 3b can be adjusted to the width of the substrate 1a by rotating the feed screw 4 with the handle 5.

A suction jig 2 is fixed on a base 6 that is moved up and down by a lifting mechanism (not shown) below the conveyor rails 3a, 3b.

The suction jig 2 has an upper block 20a and a lower block 21a placed one on top of the other, and the upper block 20a has suction holes 22a and 22b on its upper surface at positions corresponding to the suction positions of the substrate 1a.

-・ is provided, leaving the peripheral edge of the lower surface and air space 2
3a is formed.

The lower block 21a has an upper block 20 opened on the side.
An intake hole 24a communicating with the air space 23a of a is provided, and the intake hole 24a is connected from the side to an intake device (not shown) by an intake pipe 7.

The base 6 can be moved up and down and moved along the conveyor rails 3a and 3b by a moving device (not shown).

With such a configuration, when the base 6 is raised to bring the upper surface of the upper block 20a into contact with the lower surface of the substrate 1a and air is sucked in by the suction device, the suction hole 22a is removed.

22b, -- attracts the substrate 1a, and the substrate 1a is attracted to the suction jig 2. In this case, the adsorption force is 5kg/cm
``It's about.

Therefore, while the substrate 1a is being adsorbed to the adsorption jig 2, the substrate 1a is
Place the silk screen frame 8 on the top surface of a, and print the solder paste IO using a spatula 9.

When printing is completed, the base 6 moves and the substrate 1a is conveyed on the conveyor rails 3a and 3b to the next process position.
The parts are mounted, and in the next step, the solder paste 6 is melted by inert vapor and soldered.

When all the steps are completed, the suction by the suction device is released and the substrate 1a and the suction jig 2 are separated.

[Problem to be solved by the invention]

According to the above-mentioned conventional method, the pattern of the suction position of the substrate and the upper/lower blocks of the attached suction jig are prepared exclusively for each type of substrate. This is because the suction position differs depending on the type of substrate, and there are different types of substrates with different vertical and horizontal sizes, and there are also a wide variety of patterns. Furthermore, parts are mounted at a higher density, and parts are mounted on both sides, resulting in different mounting positions and different suction specifications.

Moreover, since the board and the block are in surface contact, high finishing accuracy is required for the block surface, and furthermore, in the case of a board where components are mounted on both sides, it is necessary to process the relief parts.

Therefore, it is uneconomical to prepare upper and lower blocks dedicated to each of these many types of substrates.

That is, ①Not only does the manufacturing cost of the jig increase, but it also takes a long time to procure it.

■It takes storage space to manage a large number of jigs and costs for transporting them in and out.

■Man-hours are required to set up each type of board during use.

There is a problem.

An object of the present invention is to provide a general-purpose substrate suction jig that can be commonly used for a plurality of types of substrates.

[Means to solve the problem]

FIG. 1 shows a diagram of the principle of the present invention.

In the figure, 1 is a substrate, 23 is an air space, 24 is an intake hole, 25 is a pin hole, 29 is a small diameter part, 30 is a hollow hole, and 21 is an air space 23 that is open on the inside leaving the peripheral edge of the upper surface. A first block 20 having an intake hole 24 communicating with the air space 23 at one end thereof is placed over the first block 21, penetrates into the air space 23 from the top surface, and has an air intake hole 24 at a predetermined interval. A plurality of pin holes 25 provided in
a second block, 28 having a pinning hole 25 at one end;
A suction pin 26 is formed with a small diameter portion 29 that is fitted into the hollow hole 30 and has a flat surface at the other end.

Therefore, a plurality of suction pins 28 set in the pin stand holes 25
Place the board 1 on top of the pin holes 25 other than the predetermined positions.
is closed by a closing means 26, and air is taken in through the intake hole 24.

[Effect]

A plurality of pin tags 25 at predetermined positions depending on the type of board 1
A plurality of suction pins 28 are vertically erected, and the remaining pin holes 25 are closed by a closing means 26.

Therefore, when the substrate 1 is placed on the plurality of suction pins 28 and air is taken in from the suction holes 24, the hollow holes 30 of the plurality of suction pins 27
The substrate 1 is attracted to the tip. The pin standing holes 25 where the suction pins 28 are not placed are closed by the closing means 26 and do not affect suction.

In this way, by setting the suction pin 28 in the pinning hole 25 at a position corresponding to a predetermined suction position of the substrate 1, suction can be performed. It can be used for general purposes.

〔Example〕 An embodiment of the present invention will be explained with reference to FIGS. 2 and 3.

The same reference numerals refer to the same objects throughout the design. In FIG. 2, parts corresponding to those in FIG. 1 are shown surrounded by a dashed line.

As shown in FIG. 2, the suction jig 2a is attached to the upper block 20b.
, a lower block 21b, a plurality of suction pins 28a, and a plurality of support pins 31 (see FIG. 3 (C1)).

The lower block 21b has an air space 23b that is open on the inside leaving the peripheral edge of the upper surface, and has an intake hole 24b communicating with the air space 23b on the -side. The upper block 20b is stacked on the lower block 21b, and has a plurality of pin holes 25a, 25b, - which penetrate in the vertical direction and communicate with the air space 23b at predetermined intervals (for example, at intervals of 10 m1) in the shape of a base grid. The pin holes 25, 25b, - are normally provided with the pin holes 2 inside.
5a, 25b, - are air valves 26a that are closed from below.
.

26b,...

The width dimensions of the upper block 20b and lower block 21b are set to a dimension that allows the pin holes 25, 25b, , -, to fit within the maximum width of the conveyor rails 3a, 3b explained in FIG. 6, and the length dimension is It is set approximately to the maximum dimension of base +H1a.

As shown in FIG. 3 (al), the air valves 26a, 26b, - are composed of elastic spring balls 27 that can withstand the pressure difference due to intake air.

As shown in FIG. 3(b), the suction pin 28a has a length of about 50 am, for example, and has a hollow hole 30a, a small diameter part 29a is formed at the lower end, and an O ring 3 is formed on the side surface of the small diameter part 29a.
4 is fitted, and a ventilation hole 33 is provided below it. The small diameter portion 29a is inserted into the pin hole 25a of the upper block 20b.
, 25b, -, the air valves 26a, 26b
, - are opened. The upper end has a ring-shaped end face perpendicular to the axis, and an elastic resin material 1, such as a rubber ring 35, is adhered to the end face.

As shown in FIG. 3(C), the support pin 31 has a small diameter portion 31a having the same diameter and shorter than the small diameter portion 29a at the lower end, and a rubber disk 31b is bonded to the upper end surface. Suction pin 28
a and the support pin 31 are pinned holes 25a, 25b,
- When inserted, the height will be the same. The support pins 31 may have components already mounted on one side of the double-sided component mounting board 1a, or depending on the state of the pattern, the pin holes 25a, 25b, - for setting the suction pins 28a may be uneven, for example, the suction pins may be placed in the center. When the board 28a cannot be erected, it is used to correct warpage of the board 1a, correct misalignment of the board 1a, and support stress from above applied to the board 1a during application of solder paste.

With such a configuration, as shown in FIGS. 2 and 4, an upper block 20b and a lower block 2 are placed on the base 6.
1b are placed one on top of the other, and the pin holes 25a are located at predetermined positions depending on the type of substrate 1a, etc.

The suction pins 28a are set up at 25b and -, respectively. The predetermined location for mounting the parts is designated as a location with no holes.

Then, the air valves 26a, 26 are opened by the tip of the small diameter portion 31a.
b.

... are respectively spaced between the hollow hole 30a and the air space 2.
3b is connected. Also, support pins 31 are erected at important points.

Next, the base +7i1a is set on the conveyor rails 3a and 3b, and the base 6 is raised to bring the upper surface of the suction pin 28a and the support pin 31 into contact with the lower surface of the substrate 1a, and when air is sucked by the air intake device, the hollow hole 30a is The substrate 1a is attracted to the suction jig 2a.

Therefore, at a position where the base 6 is further raised and the board 1a is spaced above the conveyor rails 3a and 3b, the solder paste 10 is printed on the top surface of the board 1a using a silk screen.

FIG. 5 shows different embodiments of the closure means. In place of the air valves 26a, 26b, - in the above example, a pin hole 25a is provided.

By providing a plurality of stepped-shaped dummy pins 260 that are inserted into the pin holes 25b and 25b, and
This is a method of closing a, 25b, -.

In this way, the board! By setting suction pins 28a in the pin holes 25a, 25b, - at predetermined positions according to the type of a, etc., and suctioning the substrate 1a with the upper end of the suction pins 28a, even when the base 6 is raised to the upper limit. , the upper block 20b does not come into contact with the conveyor rails 3a, 3b, and can be adsorbed regardless of the size of the board 1a, and after mounting the component B on one side, solder paste 10 is applied to the other side as shown in FIG. Including double-sided installation such as printing,
It can be commonly used for different types of substrates 1a.

〔Effect of the invention〕

As explained above, according to the present invention, the suction position can be easily changed and the suction position can be made general, so there is no need to prepare jigs for each type of substrate, and the tip of the suction pin can suction the substrate. Therefore, high finishing accuracy on the block surface is not required, the manufacturing cost of the jig is saved, and new substrates can be immediately applied.

■The storage space required for managing jigs and the cost of transporting them in and out are saved.

■The number of setup steps for each board type during use is significantly reduced.

There is an effect.

[Brief explanation of the drawing]

Fig. 1 is a diagram of the principle of the present invention, Fig. 2 is a side view showing an embodiment of the present invention, Fig. 3 is a side view showing the main parts of the embodiment, Fig. 4 is an explanatory diagram of the embodiment, Fig. 5 The figure is a side view showing a different embodiment, and FIG. 6 is a configuration diagram showing a conventional substrate suction jig. In the figure, 1.1a is the substrate, 20 is the second block,
20a and 20b are upper blocks, 21 is a first block,
21a, 21b are lower blocks, 23, 23a, 23b are air spaces, 24, 24a
, 24b is an intake hole, 25, 25a, 25b is a pin holding hole, 26 is a closing means, 26a, 26b
is air valve, 28.28a is suction pin, 29.29a
30.30a is a hollow hole, and 260 is a dummy pin. Fig. 2 < (1,) Air 4f (,shi) Mouth skin attachment pin (L) Support pin actual force is λ I row 6
mfJ @ 3rd ward actual situation) 4th row of Seishi Otoming ward, 4th row of Hui Shiba 1000 rows, △Kuchi No. 612]

Claims (1)

[Claims] A substrate suction jig that suctions and holds the substrate (1) during the process of applying solder paste to a conductive pattern formed on the surface of the substrate, the jig comprising: Air space with an open inside (2
3) and having an intake hole (24) at one end that communicates with the air space (23); A second block (25) that penetrates from the air space (23) and has a plurality of pin holes (25) provided at predetermined intervals.
20), and a small diameter portion (29) fitted into the pin hole (25) at one end.
) is formed, a plurality of suction pins (28) having a hollow hole (30) and a flat surface at the other end, and a closing means (26) for closing the pin stand hole (25), the pin stand at a predetermined position. The substrate (1) is placed on a plurality of suction pins (28) set up in the holes (25), and the pin stand holes (25) other than the predetermined positions are closed by the closing means (26). , a substrate suction jig characterized in that air is taken in through the air intake hole (24).