JPH11177204A - Jig for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig for mounting an electronic component capable of easily and accurately mounting the BGA(Ball Grid Array) package by hand with low cost and without touching the BGA package itself. SOLUTION: The mounting jig 21 is used to mount the BGA package comprising a number of lands 5 having a solder ball 7 for an electrical connection beneath itself on a printed circuit board 11. The mounting jig 21 comprises a frame body 23 restraining the movement in perpendicular direction to the mounting direction and allowing the movement to the mounting direction of the main part of the BGA package periphery. The pins 25 capable of fitting to the positioning hole 15 prepared on the printed circuit board 11 are made on the frame body 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball grid array (BGA) having a large number of electronic components, for example, lands (terminals) with solder balls for electrical connection on a lower surface.
(Ball Grid Array)) relates to a mounting jig used when a package is manually mounted on a predetermined substrate.

[0002]

2. Description of the Related Art A BGA package has a very large number of electrical connections (several hundreds to thousands) between the lower surface and the upper surface of a printed circuit board. It is common to perform mounting processing with high accuracy by using this. On the other hand, in the case of BGA package mounting work or small lot production with a small number of times, or in the case of mounting the BGA package as an experiment or prototype, or for repair or replacement, etc., it is necessary to rely on the manual work of the operator. That is the fact.

[0003] Since this manual operation requires considerable skill, various techniques have been proposed to improve the workability. For example, JP-A-7-249709 and JP-A-8-249709
Japanese Patent No. 340164 discloses a technique in which positioning pins are provided at (the center or four corners of the lower surface of) the BGA package itself, and the mounting and positioning of the BGA package are performed using the pins at the time of mounting.

[0004]

In the above-mentioned publication technology, it is necessary to provide positioning pins in the BGA package in anticipation of a manual mounting operation, which may increase the cost considerably. Therefore, in the present invention, without modifying the electronic component (BGA package) itself,
It is an object of the present invention to provide a mounting jig which allows an electronic component (BGA package) to be mounted at low cost, easily, and accurately by manual operation.

[0005]

According to the present invention, there is provided a mounting jig for mounting an electronic component having a plurality of electrical connection terminals on a lower surface thereof on a predetermined substrate. A frame body that can restrict a key point on the outer periphery of the electronic component so as to be movable in the mounting direction while restricting movement in a surface direction perpendicular to the mounting direction. A structural feature is that a pin that can be fitted into a positioning hole provided in the substrate is provided. At the time of mounting, the electronic component is suitably guided by the frame in which the pin is fitted into the positioning hole of the predetermined substrate, and the electronic component is accurately placed on the predetermined substrate.

[0006]

An embodiment of the present invention will be described below with reference to the drawings. Referring to FIG. 1, a BGA package 1 is made of glass epoxy resin, polyimide resin, or the like, and has multilayer wiring. For example, a rectangular substrate 3 as viewed from above and a component such as a semiconductor chip mounted on the upper surface of the substrate. (Not shown) and a plurality (for example, tens to thousands,
In the illustrated example, 7 × 7 soldering lands 5 (for example,
φ0.76 mm).

[0007] The components on the upper surface of the substrate are collectively covered and molded with a resin such as silicon rubber so as not to be seen from the outside. On each of the soldering lands 5 on the lower surface of the substrate,
A spherical solder ball 7 is welded. The printed board 11 on which the BGA package 1 is to be mounted is
Solder lands 13 are formed at positions corresponding to the solder lands 5 (solder balls 7) of the A package 1. The formation method will be described later.

As shown in FIGS. 1 and 2, the mounting jig 21 for rationally mounting the BGA package 1 on the printed circuit board 11 is composed of a rectangular frame 23, and the inside of the frame 23 The one side surface 23a forms a guide (contact / sliding) surface for guiding the corresponding four side surfaces of the BGA package 1 (substrate 3) during mounting. Mounting jig 21 (frame 23)
Pins 25 which can be fitted into jig fixing positioning holes 15 formed in the printed circuit board 11 are provided upright at two diagonally opposite corner portions of the lower surface of the printed circuit board 11.

The BG according to this embodiment having the above configuration
At the time of A package mounting, first, the mounting jig 21 is mounted on the printed circuit board 11 on which the soldering lands are formed.
Is set. Next, the BGA package is inserted into a rectangular opening at the center of the mounting jig 21 (frame 23). BGA
The package is constrained at a key point on the outer periphery by the side surface 23a of the frame 23, and movement in a surface direction perpendicular to the mounting direction is regulated. As a result, the solder balls 7 are held while being placed on the corresponding soldering lands 13 of the printed circuit board 11.

Then, heat is applied to at least the printed circuit board portion, which is the BGA package mounting area (for example, by applying warm air or heating in a reflow furnace) to melt the solder (the solder cream of the soldering land 13 and the like). Let
The BGA package is fixed (electrically connected) to the printed circuit board 11. Thereafter, the mounting jig 21 is connected to the printed circuit board 1.
1 is removed upward, thereby completing the mounting operation.

As described above, in this embodiment, the BGA package can be mounted extremely easily, but with high accuracy, by a manual operation by an operator without using any dedicated and expensive automatic mounting machine. In particular, it can be said that this mounting jig is very suitable for small-lot production, experimental / prototype manufacturing (mounting), or BGA package replacement / repair.

An example of a method for forming the soldering lands 13 at predetermined positions on the printed circuit board 11 will be briefly described below. In this forming method, the positioning holes 15 for fixing the jig provided on the printed board 11 described above are used.
Is used. As shown in FIGS. 3 and 4, the paste printing jig 31 has a round hole 33 formed at a position where soldering lands are to be formed (for example, tens to thousands, 7 × 7 in the illustrated example). A pin 37 substantially the same as the pin 25 of the mounting jig 21 is erected at a mask portion corresponding to the two positioning holes 15 of the printed board 11 described above. Have been.

At the time of forming the soldering land, as shown in FIG. 5, a paste printing jig 31 is set on the printed circuit board 11 before the BGA package is mounted, and the solder cream H is placed from above. By extending it with a spatula or the like, a soldering land (the soldering land 13 in FIG. 1) can be easily formed at a predetermined position on the printed circuit board 11.

As described above, according to the present paste printing jig 31, the operator can easily and easily mechanically form the soldering land. That is, there is no need to manufacture and prepare a dedicated and expensive paste printer. And B
Since the positioning hole 15 of the printed circuit board 11 which is a reference when mounting the GA package also serves as a reference when forming the soldering land, the positional accuracy of the soldering land forming position is considerably high. That is, the mounting accuracy of the BGA package (the soldering land) on the printed board (the soldering land) can be made high.

[0015]

As described above, according to the present invention, it is possible to mount electronic components by hand with high precision, at low cost and simply, without any modification to the electronic components. Further, the burden on the operator can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a side view showing a relationship between a mounting jig and a BGA package for a printed circuit board.

FIG. 2 is a perspective view of a mounting jig.

FIG. 3 is a top view of the paste printing jig.

FIG. 4 is a side view of the paste printing jig.

FIG. 5 is a side view showing a relationship of a paste printing jig to a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... BGA package 3 ... Board 5 ... Solder land 7 ... Solder ball 11 ... Printed circuit board 15 ... Positioning hole 21 ... Mounting jig 23 ... Frame 23a ... Side 25, 37 ... Pin 31 ... Paste printing jig 33 ... Round hole 35 ... Mask H ... Solder cream

Claims (1)

[Claims] 1. A mounting jig used when mounting an electronic component having a plurality of terminals for electrical connection on a lower surface on a predetermined substrate, wherein the jig restricts movement in a plane direction perpendicular to a mounting direction. And a frame capable of restraining a key point on the outer periphery of the electronic component so as to be movable in the mounting direction. The frame is provided with pins that can be fitted into positioning holes provided in the predetermined substrate. A jig for mounting electronic components, characterized in that: