KR20010106963A - Inspection apparatus and method for PDP electrode pattern adapted to a scanning technique employing non-contact probe used a timer IC - Google Patents

Abstract

The present invention relates to an apparatus and method for inspecting a non-contact PDP electrode pattern using a non-contact probe by a timer IC, wherein an inexpensive timer in which a frequency value changes according to a change in capacitance when measuring electrical characteristics of the PDP electrode pattern Expensive capacitive proximity sensor by measuring whether the PDP electrode pattern is opened or not by using a non-contact probe composed of IC, and measuring the voltage value measured by applying power to the adjacent electrode pattern. The cost of the test can be reduced by measuring whether the PDP electrode pattern is opened or shorted without using a probe.

Description

Inspection apparatus and method for PDP electrode pattern adapted to a scanning technique employing non-contact probe used a timer IC

The present invention relates to an apparatus and method for inspecting a non-contact PDP electrode pattern using a non-contact probe by a timer IC. More particularly, the frequency value is changed according to the change of capacitance when measuring the electrical characteristics of the PDP electrode pattern. Non-contact scan using non-contact probe by timer IC to measure whether the PDP electrode pattern is open by using non-contact probe by changing timer IC, and measure the voltage value measured by applying power to adjacent electrode pattern. It relates to a PDP electrode pattern inspection apparatus and method of the method.

In general, PDP (Plasma Display panel) is neon by putting a voltage such as Ne + Ar, Ne + Xe between the top glass and the bottom glass and the glass sealed by the partition between them It refers to an electronic display device that emits light to use as display light.

Accordingly, the plasma display displays various characters or patterns by forming a discharge point between discharge electrodes formed between the vertical electrode patterns and the horizontal electrodes of the upper and lower glass plates facing each other, as the discharge cells.

PDP has been widely used for FA (factory automation) because it is possible to display large size with clear light, but now it is widely used for OA (office automation) such as personal computer with small size, light weight and high performance of display device. As the display quality is high and the response speed is fast, demand is increasing rapidly as it is adopted as a wall-mounted TV.

Since the PDP is configured to emit light by discharge due to plasma generation at the intersection of the electrode patterns formed on the upper glass and the lower glass, the yield of the finished product is determined according to the electrical characteristics of the electrode patterns formed on the upper glass and the lower glass.

Therefore, in the present invention, an apparatus and method for inspecting whether a short circuit of an electrode pattern wiring and a short circuit with another electrode pattern wiring are examined among electrical characteristics of the electrode patterns formed on the upper glass and the lower glass of the PDP.

FIG. 1 is a view illustrating electrode patterns formed on a top glass and a bottom glass of a general PDP. (A) is an electrode pattern formed on a top glass, and (B) is an electrode pattern formed on a bottom glass.

As shown here, it can be seen that a plurality of electrode patterns 10a, 10b, 11a, and 11b are formed on the top glass 10 and the bottom glass 11. Further, connector patterns 10c and 11c for supplying power and the like to the electrode patterns 10a, 10b and 11a and 11b are formed.

The electrode patterns 10a, 10b, 11a and 11b are typically 50 m in line width and 200 m in pitch in the case of 42-inch PDP, whereas the line length reaches 1 m. In the manufacturing process, such as heat treatment (10b), (11a) and (11b), as well as subsequent repeated heat treatment, the wiring is frequently opened or shorted with other adjacent wiring.

Therefore, the electrode patterns 10a, 10b, 11a and 11b are formed through the connector patterns 10c and 11c formed on both sides of the electrode patterns 10a, 10b, 11a and 11b in the middle of the PDP manufacturing process. The pattern inspection process for inspecting the electrical characteristics of the () is essential to increase the yield of the finished PDP by inspecting whether the electrode patterns 10a, 10b, 11a, and 11b are short-circuited and short-circuited.

2 is a conventional test pin block for inspecting electrical characteristics of a PDP electrode pattern.

As shown here, a plurality of test pins 12a are formed on the side of the test pin block 12 to match the line width and pitch of the PDP electrode pattern to be inspected.

Therefore, when the electrode patterns 10a, 10b, 11a, and 11b formed on the upper glass 10 or the lower glass 11 of the PDP having the electrode pattern shown in FIG. 1 are to be inspected, the corresponding electrode pattern 10a The test pins 12a are pressed into the connector patterns 10c and 11c formed at one side of the 11a and the other ends of the electrode patterns 10a and 11a, and then the voltage is applied to the connector patterns 10c and 11c. After applying the voltage and measuring the voltage at the other end to check whether the electrode pattern (10a) open and short.

In addition, the test pins 12a are pressed to both ends of the electrode patterns 10a and 11a, and then voltages are alternately applied to measure the voltage at both ends of the adjacent electrode patterns 10b and 11b. The short circuit between the patterns 10a and 11a and the adjacent electrode patterns 10b and 11b is examined.

However, the inspection method of the electrode pattern by the test pin block as described above has the following problems.

First, because the test by the test pin block is a pressure contact method between the test pin and the connector pattern, there is a problem that expensive and durable test pins are not only easily damaged during pressure contact but also require a large cost due to replacement.

Second, if the position and pitch of the electrode pattern is changed due to the change in the product model or design of the PDP, the position and pitch of the test pin of the test pin block are fixed. There is a problem that can not be used universally because there is no correspondence to changes.

Third, when the electrode patterns are formed in the manner as shown in FIG. Therefore, there is a problem that another defective factor is generated due to damage of the electrode pattern due to scratches due to contact.

Fourthly, when the top plate and the bottom plate glass panel having the electrode pattern are not good, the test pin of the test pin block does not contact the electrode pattern accurately. In addition to fixing with a vacuum chuck, there is a problem in that manufacturing costs are increased, such as requiring a precise servo mechanism of three axes of xy-θ for precise xy positioning of the electrode pattern.

Therefore, in order to solve the above problems, it can be used universally for all types of patterns, and not only reduce the occurrence factor of scratch or the increase of manufacturing cost, but also improve the inspection accuracy and even after additional thin film work is done on the electrode pattern. Applicant has filed a patent application for "Inspection type inspection apparatus and method using a capacitive proximity sensor probe" (Patent Application No. 10-2000-5664) dated February 02, 2000 to examine the electrical characteristics of the electrode pattern. It was.

Referring to the scanning method using a patent-applied capacitive proximity sensor probe by the block diagram of Figure 3, the entire system includes a control unit 20 for controlling the overall operation of the inspection device, a touch panel or a keyboard or An input unit 21 for inputting a command to the control unit 20 and a TFT-LCD, etc., and a display unit 22 for displaying an operation state of the inspection apparatus under the control of the control unit 20. And a bus network 23 that provides an interface between the controller 20 and an external device, and scans the electrode pattern by bringing the wire into contact with the electrode pattern under the control of the controller 20. According to the control of the rolling wire module 24 and the control unit 20 that provide the information to the control unit 20, the electrostatic pattern scans the electrode pattern in a non-contact manner and provides the scanned information to the control unit 20. Close-up consists of a sensor module (25).

The capacitive proximity sensor module 25 is composed of a non-contact capacitive proximity sensor probe, a loading / unloading actuator, and an air pressure pad, which in turn inspect the electrical characteristics of the electrode pattern by using the capacitance of the electrode pattern.

As shown in FIG. 5, the capacitive proximity sensor probe 120 belonging to the previously applied capacitive proximity sensor module is connected to the AC power supply 121 supplying an AC current i and the AC power supply 121 in parallel. When the capacitive proximity sensor probe 120 is close to the glass panel, the electrode 122 forming the capacitor C together with the electrode pattern 101 on the glass panel is connected in parallel with the electrode 122 and the electrode pattern ( The amplifier 123 generates an output voltage Vo by amplifying an input voltage that varies according to the open and short states of 101. Here, the output voltage Vo is supplied to the controller 20 described above.

The output voltage Vo of the capacitive proximity sensor probe 120 is defined as d / A, where “d” is the distance between the electrode pattern 101 and the electrode 122, and “A” is the electrode 122. It means the effective area of.

In the state in which the capacitive proximity sensor probe 120 configured as described above is in a non-contact manner corresponding to the grounded target surface, that is, the electrode pattern 101, the AC power source i is applied to the electrode 122. A voltage proportional to the distance d is generated at the electrode 122 and this voltage is amplified by the amplifier 123, resulting in an output voltage Vo proportional to the distance d. When the ground state of the electrode pattern 101 is cut off, an effect such that the distance d to the target surface is infinite is obtained and the output voltage Vo rises to the maximum value.

6 illustrates a method of inspecting the electrode pattern 101 by using a single contactless method using the operating characteristics of the capacitive proximity sensor probe 120.

First, in the case of the method as shown in FIG. 4, two rolling wire probes 110 and 110 ′ are disposed at one end of the panel 100 on which the electrode pattern 101 is formed, and at the other end of the capacitance. Type proximity sensor probe 120. The rolling wire probes 110 and 110 'are provided with the rolling wires 118 and 118', respectively. The rolling wires 118 and 118 'are provided by the above-described loading / unloading actuators. While rotating at a constant speed, it is controlled to make a rolling contact on the electrode pattern 101. At this time, the rolling wires 118 and 118 are grounded through the switches SW1 and SW2. When the open state of the electrode pattern 101 is checked in this state, the control unit 20 controls the control unit 20. When the switch SW1 is connected, the ground effect is obtained by the width of the corresponding electrode pattern 101, so that the output voltage Vo of the capacitive proximity sensor probe 120 is reduced by a certain size. If the middle of the electrode pattern 101 is open, the electrode pattern 101 on the target surface is not grounded even though the rolling wire 118 of the rolling wire probe 110 is grounded through the switch SW1. The output voltage Vo does not change. Therefore, the controller 20 detects the change in the output voltage Vo to determine whether the electrode pattern 101 is open and displays it on the display unit 22.

When the short circuit state of the electrode pattern 101 is examined, both the switches SW1 and SW2 are connected. Therefore, since the electrode patterns adjacent to each other are grounded through the rolling wires 118 and 118 ', the grounded area of the target surface of the capacitive proximity sensor probe 120 is increased. Therefore, when the adjacent electrode pattern is normal, the output voltage Vo becomes smaller. If the two electrode patterns are short-circuited with each other, the same output voltage Vo is generated even when only one rolling wire probe is grounded. You can check for shorts between patterns.

Using the precise and expensive capacitive proximity sensor probe as described above, there is a problem in that it takes a lot of cost to measure only the change in the capacitance value of the short-circuit state and the open state of the PDP electrode pattern.

The present invention was created to solve the above problems, and an object of the present invention is to provide a low-cost device when measuring the electrical characteristics of the PDP electrode pattern by a timer IC that changes the frequency value according to the change in capacitance Non-contact scan type PDP using non-contact probe by timer IC that measures whether the PDP electrode pattern is open by using a non-contact probe and measures the voltage value measured by applying power to the adjacent electrode pattern. An electrode pattern inspection apparatus and method are provided.

FIG. 1 is a view illustrating electrode patterns formed on a top glass and a bottom glass of a general PDP.

2 is a conventional test pin block for inspecting electrical characteristics of a PDP electrode pattern.

Figure 3 is a block diagram showing a non-contact scan type inspection apparatus using a non-contact probe by a timer IC according to the prior art.

FIG. 4 shows a combined arrangement of the capacitive proximity sensor probe and the rolling wire probe in FIG. 3.

FIG. 5 illustrates a configuration of the capacitive proximity sensor probe of FIG. 3.

6 illustrates a method of inspecting an electrode pattern by combining the capacitive proximity sensor probe and the rolling wire probe of FIG. 3.

7 is a view showing a non-contact scan type PDP electrode pattern inspection apparatus using a non-contact probe by a timer IC according to the present invention.

8 is a block diagram illustrating a non-contact probe by the timer IC of FIG. 7.

9 is a diagram showing a test sequence according to the present invention.

-Explanation of symbols for the main parts of the drawings-

10 top glass 11 bottom glass

20: control unit 110110 ': rolling wire probe

81: timer IC 82: resistance

83: capacitor portion 84: ground shield portion

120: capacitive proximity sensor probe

121: AC power 123: Amplifier

10a, 10b, 11a, 11b: electrode pattern

TP1, TP2, TP3, TP4: 1st to 4th probe

CP1, CP2: first to second non-contact probe

C1, C2, C3, C4: Connector electrode

P1, P2, P3, P4: Electrode Pattern

IS, IIS, IIIS, IVS: 1st to 4th Power Switch

ⅠG: first ground switch ⅢG: third ground switch

The present invention for achieving the above object is to provide a grounding condition to at least one non-contact probe and the other end of the electrode pattern to generate an output voltage according to the electrical state of the electrode pattern while scanning one end of the electrode pattern in a non-contact manner A PDP electrode pattern inspection apparatus of a scanning method using a non-contact probe comprising a control unit for determining electrical characteristics of PDP electrode patterns through a contact probe; The non-contact probe is formed of a capacitor portion provided at intervals with an electrode pattern, a timer IC for RC oscillation by a set resistance value receiving an output value of the capacitor portion, and a ground shield portion for shielding the timer IC and the capacitor portion; The first probe of the contact probes is provided with a first power switch for applying a power voltage to the first connector electrode and a first ground switch for applying a ground voltage, so as to measure the state of the first connector electrode. The second probe has a second power switch for applying a power supply voltage to the third connector electrode, and is configured to measure a state of the third connector electrode.

In addition, the PDP electrode pattern inspection method of the scanning method using a non-contact probe by the timer IC according to the present invention scans the electrode pattern in the state in which the non-contact probe is close to one end of the electrode pattern formed on the PDP and the other end of the electrode pattern In the PDP electrode pattern inspection method of the scanning method using a non-contact probe to inspect the electrical characteristics of the electrode pattern on the basis of the change of the output value of the capacitive proximity sensor by providing a grounding condition, the other end of the electrode pattern is grounded It is characterized by measuring the change in the frequency of the non-contact probe by applying a condition to check whether the open, and applying a power supply voltage to the adjacent electrode pattern and measuring the voltage to measure whether the short circuit.

Therefore, the capacitance value of the non-contact probe is measured according to the ground voltage supplied through the probe to the electrode pattern, and the change of the frequency value that changes according to the change of the capacitance value in the timer IC is measured to determine whether the electrode pattern is opened. After applying power voltage, measure the voltage value and measure the short circuit.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the present embodiment is not intended to limit the scope of the present invention, but is presented by way of example only and the same parts as in the conventional configuration using the same reference numerals and names.

7 is a view showing a non-contact scan type inspection apparatus using a non-contact probe by a timer IC according to the present invention.

As shown here, the first probe TP1 is installed on the first connector electrode C1 extending from the left side of the first electrode pattern P1, and the second probe extending from the right side of the second electrode pattern P2. The third probe TP3 is installed at the connector electrode C2. The second probe TP2 is installed on the third connector electrode C3 extending from the left side of the third electrode pattern P3, and the fourth connector electrode C4 extending from the right side of the fourth electrode pattern P4. ), The fourth probe TP4 is installed.

In addition, the second non-contact probe CP2 and the second electrode pattern P2 and the fourth electrode pattern P4 for measuring the capacitance on the right side of the first electrode pattern P1 and the third electrode pattern P3. On the left side, first non-contact probes CP1 for measuring capacitance are provided.

The first probe TP1 is provided with a first power switch IS for applying a power voltage to the first connector electrode C1 and a first ground switch IG for applying a ground voltage. It is configured to measure the state of the connector electrode (C1). In addition, the second probe TP2 is provided with a second power switch IIS for applying a power voltage to the third connector electrode C3, and is configured to measure the state of the third connector electrode C3. . In addition, the third probe TP3 is provided with a third power switch IIIS for applying a power supply voltage to the second connector electrode C2 and a third ground switch IIIG for applying a ground voltage. It is configured to measure the state of the connector electrode (C2). In addition, the fourth probe TP4 is provided with a fourth power switch IVS for applying a power voltage to the fourth connector electrode C4, and is configured to measure the state of the fourth connector electrode C4. .

In addition, the first non-contact probe CP1 is configured to detect a change in capacitance changed by the second electrode pattern P2 and the fourth electrode pattern P4, and the second non-contact probe CP2 is configured to detect the first electrode pattern. And a change in capacitance changed by P1 and the fourth electrode pattern P4.

As described above, the first to fourth probes TP1, TP2, TP3 and TP4 and the first to second non-contact probes CP1 and CP2 form a pair to inspect the electrode pattern of the PDP.

FIG. 8 is a diagram illustrating a structure of a non-contact probe by the first to second timer ICs of FIG. 7.

As shown here, a timer IC for RC oscillation is performed by the capacitor section 83 provided at intervals with the electrode pattern, the output value C of the capacitor section 83, and the resistance value R of the resistor 82. 81 and a ground shield portion 84 for shielding between the timer IC 81 and the capacitor portion 83.

In the above, the output frequency f of the timer IC 81 is inversely proportional to the product of the capacitance value C measured by the capacitor portion 83 and the resistance value R of the timer IC 81. When the capacitance value C of 83 is changed, since the resistance value R of the resistor 82 is fixed, the output frequency f of the timer IC 81 is inversely proportional to the capacitance value C.

Therefore, even when the ground voltage GND is supplied through the probe TP, when the output frequency f of the timer IC 81 is not changed, it is determined that the corresponding electrode pattern is open. If the output frequency f drops, it is determined to be normal.

As described above, the state of the electrode pattern of the plasma display panel is inspected with four test probes TP1, TP2, TP3, and TP4 and two non-contact probes CP1 and CP2 installed on the electrode pattern.

9 is a diagram showing a test sequence according to the present invention.

As shown here, a test is performed while sequentially scanning a cycle consisting of steps I to V. FIG.

First, in step I, the reference value is measured. The output frequency f of the first to second non-contact probes CP1 and CP2 without supplying the ground voltage GND and the power supply voltage VC to the first to fourth probes TP1, TP2, TP3, and TP4. Measure

Next, in step II, the first electrode pattern P1 is opened. The first ground switch IG is turned on to apply the ground voltage GND to the first connector electrode C1. The change of the output frequency f measured by the non-contact probe CP2 determines whether the first electrode pattern P1 is short-circuited. In other words, when the capacitance value C measured by the second non-contact probe CP2 is equal to the reference value, the output frequency f of the timer IC 81 is not changed and the first electrode pattern P1 is disconnected. If it is determined that the measured capacitance value C is larger than the reference value, it is determined that the output frequency f of the timer IC 81 is high and is normal.

Next, in step III, a short-circuit state is measured between the first electrode pattern P1 and the second, third and fourth electrode patterns P2, P3, and P4. With the ground voltage GND applied to the connector electrode C1, the second, third and fourth power switches IIS, IIIS and IVS are turned on to the second, third and fourth connector electrodes C2, C3 and C4. When the voltage is measured at the second, third, and fourth probes TP2, TP3, and TP4 while the power supply voltage VC is applied, all of them are normal, but the second, third, and fourth probes TP2 are normal. When the ground voltage GND is measured by at least one of the probes TP3 and TP4, the current path is formed by the ground voltage GND applied to the first electrode pattern P1. ) And the second, third and fourth electrode patterns P2, P3, and P4 are short circuited with at least one of the electrode patterns.

Next, in step IV, the opening of the second electrode pattern P2 is measured. The third ground switch IIIG is turned on to apply the ground voltage GND to the second connector electrode C2. The short circuit of the second electrode pattern P2 is determined by the change in the capacitance value C measured by the one-contact probe CP1. In other words, when the capacitance C measured by the first non-contact probe CP1 is equal to the reference value, the output frequency f of the timer IC 81 is also the same, so that the second electrode pattern P2 is disconnected. If the measured capacitance value C is larger than the reference value, it is determined that the output frequency f of the timer IC 81 is high, and thus it is normal.

Next, in step V, a short-circuit state between the second electrode pattern P2 and the first, third and fourth electrode patterns P1, P3, and P4 is measured. The first, third and fourth connector electrodes C1, C3 and C4 are turned on by turning on the first, second and fourth power switches IS, IIS and IVS while the ground voltage GND is applied to the connector electrode C2. If the power supply voltage VC is measured by measuring the voltage at the first, second, and fourth probes TP1, TP2, and TP4 while applying power, all of the first, second, and fourth probes are the first, second, and fourth probes TP1, TP2, TP4. In the case where the ground voltage is measured by at least one of the probes, the current path is formed by the ground voltage applied to the second electrode pattern P2. Thus, the second electrode pattern P2 and the first, third and fourth electrode patterns are formed. At least one of (P1, P3, P4) is determined as a short circuit state with the electrode pattern.

In this manner, the first to fourth probes TP1, TP2, TP3, and TP4 are used as a pair to measure whether the first electrode pattern P1 and the second electrode pattern P2 are short-circuited and short-circuited for one cycle. After moving the first to fourth probes TP1, TP2, TP3, and TP4 to the next electrode pattern, again measuring whether the third electrode pattern P3 and the fourth electrode pattern P4 are short-circuited and short-circuited. You will repeat the work.

As described above, the present invention can measure the openness of the PDP electrode pattern by using a non-contact probe composed of a low-cost timer IC whose frequency value changes according to the capacitance change when measuring the electrical characteristics of the PDP electrode pattern. This has the advantage of reducing the cost of testing.

In addition, by measuring the voltage value measured by applying power to the adjacent electrode pattern to measure whether or not the short-circuit of the PDP electrode pattern can be measured without using an expensive capacitive proximity sensor probe. .

On the other hand, by using a non-contact probe can be used universally even if the shape of the electrode pattern is changed can reduce the burden of manufacturing cost increase.

In addition, since the inspection can be made with a non-contact probe, it is possible to exclude the occurrence of scratches and to inspect the electrical properties of the electrode pattern even after the additional thin film work on the electrode pattern can increase the yield of the product.

Claims (2)

One end of the electrode pattern is scanned in a non-contact manner and at least one non-contact probe generating an output voltage according to the electrical state of the electrode patterns, and the other end of the electrode pattern through a contact probe that gives a grounding condition to the PDP electrode patterns In the PDP electrode pattern inspection apparatus of the scanning method using a non-contact probe made of a control unit for determining the electrical characteristics; The non-contact probe is formed of a capacitor unit provided at intervals with the electrode pattern, a timer IC for receiving the output value of the capacitor unit RC oscillated by the set resistance value, and a ground shield unit for shielding the timer IC and the capacitor unit; The first probe of the contact probes is provided with a first power switch for applying a power voltage to the first connector electrode and a first ground switch for applying a ground voltage, so as to measure a state of the first connector electrode. The second probe has a second power switch for applying a power voltage to the second connector electrode and is configured to measure the state of the second connector electrode. Scan type PDP electrode pattern inspection device using a non-contact probe by a timer IC. One end of the electrode pattern formed on the PDP scans the electrode pattern while the non-contact probe is in close proximity and gives the grounding condition to the other end of the electrode pattern, thereby the electrical characteristics of the electrode pattern based on the change in the output value of the non-contact probe. In the PDP electrode pattern inspection method of the scanning method using a non-contact probe for inspecting; A ground condition is applied to the other end of the electrode pattern to measure the frequency change value of the non-contact probe to check whether it is open, and apply a power supply voltage to an adjacent electrode pattern, and measure the voltage to measure whether a short circuit occurs. Scanning method of the PDP electrode pattern of the scan method using a non-contact probe by a timer IC.