KR20010101803A - 레이저 처리 전력 출력 안정화 - Google Patents
레이저 처리 전력 출력 안정화 Download PDFInfo
- Publication number
- KR20010101803A KR20010101803A KR1020017009935A KR20017009935A KR20010101803A KR 20010101803 A KR20010101803 A KR 20010101803A KR 1020017009935 A KR1020017009935 A KR 1020017009935A KR 20017009935 A KR20017009935 A KR 20017009935A KR 20010101803 A KR20010101803 A KR 20010101803A
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- South Korea
- Prior art keywords
- pulse
- laser
- workpiece
- repetition rate
- processing
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Laser Surgery Devices (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
Claims (10)
- 처리 제어 시스템이, 고체 레이저로 하여금 광 펄스를 방출하도록 하고, 위치 결정(positioning) 시스템으로 하여금 작업 대상 재료(workpiece)와 관련된 광 펄스 방출의 움직임을 제어하도록 하여, 상기 광 펄스가 작업 대상 재료 상에서 처리하기 위한 목표 위치에 충돌(impinge)하도록 하는, 레이저 기반(laser-based) 작업 대상 재료 처리 시스템에서, 상기 작업 대상 재료 상에서 처리하고자 하는 다수의 목표 위치 상에 연속적으로 충돌하는 일정한 펄스 에너지의 광 펄스 제공 방법으로서,상기 처리 제어 시스템에 응답하여 오토펄스(autopulse)의 펄스 반복율에서 일련의 레이저 광 펄스 방출을 생성시키기 위해 작업 대상 재료의 비처리(nonprocessing) 모드를 개시하는 단계와,상기 작업 대상 재료 상에 충돌하는 것으로부터 상기 오토펄스의 펄스 반복율로 방출하는 상기 광 펄스를 차단하는 단계와,상기 작업 대상 재료 비처리 모드로부터 작업 대상 재료 처리 모드로 스위칭하는 단계로서, 상기 작업 대상 재료 비처리 모드에서, 상기 처리 제어 시스템은, 위치 결정 메커니즘이 위치 결정 비율에서 이동하도록 하는 펄스 위치 제어 신호를 상기 위치 결정 메커니즘에 인가하며(direct), 상기 펄스 위치 제어 신호는, 작업 대상 재료 목표 위치와, 연속적인 작업 대상 재료 목표 위치 사이의 작업 대상 재료 중간 위치에 대응하는 이격된 레이저 펄스 방출 명령 좌표를 나타내고, 상기 처리 제어 시스템은, 상기 위치 결정 메커니즘이 상기 위치 결정 비율에서 이동함에 따라 상기 레이저 펄스 방출 명령 좌표와, 상기 작업 대상 재료 타깃 및 작업 대상 재료 중간 위치 사이의 일치(coincidences)에 의해 결정된 목표 위치 펄스 반복율에서 상기 레이저 광 펄스 방출을 야기하는, 상기 작업 대상 재료 비처리 모드로부터 작업 대상 재료 처리 모드로 스위칭하는 단계와,상기 오토펄스 및 목표 위치 펄스 반복율로 광 펄스 방출을 연속적으로 생성시키는 결과로서, 일정한 펄스 에너지의 광 펄스를 상기 작업 대상 재료 목표 위치에 제공하기 위해, 상기 레이저 펄스 방출 명령 좌표가 상기 작업 대상 재료 목표 위치와 일치할 때 상기 레이저 광 펄스 방출을 전달하지만, 그렇지 않을 때는, 상기 레이저 광 펄스 방출의 전달을 차단하는, 상기 레이저 광 펄스 방출을 전달하는 단계를포함하는, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 고체 레이저는 적외선 레이저를 포함하는, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 고체 레이저는, 약 500nm 미만의 파장에서 상기 레이저 펄스를 생성시키기 위해 비선형 고조파 생성 모드에서 동작하는 적외선 레이저를 포함하는, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 오토펄스의 펄스 반복율 및 상기 목표 위치 펄스 반복율은 실질적으로 동일한, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 오토펄스의 펄스 반복율 및 상기 목표 위치의 펄스 반복율 중 적어도 하나는 미리 결정된 펄스 반복율로 사용자 설정가능한, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 4항에 있어서, 상기 오토펄스의 펄스 반복율 및 상기 목표 위치의 펄스 반복율은 상기 고체 레이저의 최대 펄스 반복율과 실질적으로 동일한, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 작업 대상 재료 비처리 모드로부터 작업 대상 재료 처리 모드로의 상기 스위칭 하는 단계는 광 펄스 방출이 생성되는 중간 천이 기간을 발생시키며, 상기 방법은, 상기 중간 천이 기간 동안 생성되는 상기 광 펄스 방출을 상기 작업 대상 재료 상에 충돌하는 것을 차단하는 단계를 더 포함하는, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 작업 대상 재료는 상기 위치 결정 시스템 상에 지지되는(supported), 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 작업 대상 재료는 고정되고, 상기 위치 결정 시스템은 상기 레이저 광 펄스 방출을 이동시키는, 일정한 펄스 에너지의 광 펄스 제공 방법.
- 제 1항에 있어서, 상기 작업 대상 재료는 고정된 제 1 축 방향으로 이동하고, 상기 레이저 광 펄스 방출은 제 2 축 방향으로 이동하는, 일정한 펄스 에너지의 광 펄스 제공 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/248,071 US6172325B1 (en) | 1999-02-10 | 1999-02-10 | Laser processing power output stabilization apparatus and method employing processing position feedback |
US09/248,071 | 1999-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010101803A true KR20010101803A (ko) | 2001-11-14 |
KR100589496B1 KR100589496B1 (ko) | 2006-06-14 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020017009935A KR100589496B1 (ko) | 1999-02-10 | 2000-02-10 | 균일한 펄스 에너지의 광 펄스를 제공하는 방법 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6172325B1 (ko) |
EP (1) | EP1150797B1 (ko) |
JP (1) | JP5033281B2 (ko) |
KR (1) | KR100589496B1 (ko) |
CN (1) | CN1158161C (ko) |
AT (1) | ATE306352T1 (ko) |
AU (1) | AU3999000A (ko) |
CA (1) | CA2362173C (ko) |
DE (1) | DE60023112T2 (ko) |
HK (1) | HK1043557B (ko) |
WO (1) | WO2000047361A1 (ko) |
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US7846847B2 (en) | 2004-03-29 | 2010-12-07 | J.P. Sercel Associates Inc. | Method of separating layers of material |
US8986497B2 (en) | 2009-12-07 | 2015-03-24 | Ipg Photonics Corporation | Laser lift off systems and methods |
US10297503B2 (en) | 2009-12-07 | 2019-05-21 | Ipg Photonics Corporation | Laser lift off systems and methods |
US10974494B2 (en) | 2009-12-07 | 2021-04-13 | Ipg Photonics Corporation | Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated |
US11239116B2 (en) | 2009-12-07 | 2022-02-01 | Ipg Photonics Corporation | Laser lift off systems and methods |
Also Published As
Publication number | Publication date |
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EP1150797B1 (en) | 2005-10-12 |
HK1043557B (zh) | 2006-07-14 |
KR100589496B1 (ko) | 2006-06-14 |
CA2362173A1 (en) | 2000-08-17 |
JP5033281B2 (ja) | 2012-09-26 |
WO2000047361A1 (en) | 2000-08-17 |
EP1150797A1 (en) | 2001-11-07 |
CN1339995A (zh) | 2002-03-13 |
HK1043557A1 (en) | 2002-09-20 |
JP2002536188A (ja) | 2002-10-29 |
AU3999000A (en) | 2000-08-29 |
DE60023112D1 (de) | 2006-02-23 |
US6172325B1 (en) | 2001-01-09 |
ATE306352T1 (de) | 2005-10-15 |
DE60023112T2 (de) | 2006-07-20 |
CN1158161C (zh) | 2004-07-21 |
CA2362173C (en) | 2007-03-27 |
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