KR20010040649A - 간섭 방사선을 차폐할 수 있는 지지물을 제조하는 방법과차폐 재료 - Google Patents
간섭 방사선을 차폐할 수 있는 지지물을 제조하는 방법과차폐 재료 Download PDFInfo
- Publication number
- KR20010040649A KR20010040649A KR1020007008521A KR20007008521A KR20010040649A KR 20010040649 A KR20010040649 A KR 20010040649A KR 1020007008521 A KR1020007008521 A KR 1020007008521A KR 20007008521 A KR20007008521 A KR 20007008521A KR 20010040649 A KR20010040649 A KR 20010040649A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- plastic substrate
- metal
- shielding
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000463 material Substances 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000005855 radiation Effects 0.000 title abstract description 9
- 230000002452 interceptive effect Effects 0.000 title abstract description 3
- 239000004033 plastic Substances 0.000 claims abstract description 62
- 229920003023 plastic Polymers 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 42
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 56
- 229910052718 tin Inorganic materials 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000005260 corrosion Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000000593 degrading effect Effects 0.000 abstract description 2
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 2
- 239000011135 tin Substances 0.000 description 34
- 239000010408 film Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 2
- 229920004142 LEXAN™ Polymers 0.000 description 2
- 239000004418 Lexan Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Air Bags (AREA)
- Developing Agents For Electrophotography (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Catalysts (AREA)
- Buffer Packaging (AREA)
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photoreceptors In Electrophotography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1008197A NL1008197C2 (nl) | 1998-02-04 | 1998-02-04 | Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal. |
| NL1008197 | 1998-02-04 | ||
| PCT/NL1999/000056 WO1999040770A1 (en) | 1998-02-04 | 1999-02-03 | Method of fabricating a support provided with shielding against interfering radiation, and shielding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010040649A true KR20010040649A (ko) | 2001-05-15 |
Family
ID=19766459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020007008521A Ceased KR20010040649A (ko) | 1998-02-04 | 1999-02-03 | 간섭 방사선을 차폐할 수 있는 지지물을 제조하는 방법과차폐 재료 |
Country Status (22)
| Country | Link |
|---|---|
| EP (1) | EP1051891B1 (enExample) |
| JP (1) | JP2002502729A (enExample) |
| KR (1) | KR20010040649A (enExample) |
| CN (2) | CN101119629A (enExample) |
| AT (1) | ATE218031T1 (enExample) |
| AU (1) | AU752537B2 (enExample) |
| BR (1) | BR9909093A (enExample) |
| CA (1) | CA2319322A1 (enExample) |
| DE (1) | DE69901537T2 (enExample) |
| DK (1) | DK1051891T3 (enExample) |
| ES (1) | ES2178379T3 (enExample) |
| HU (1) | HU222659B1 (enExample) |
| ID (1) | ID28255A (enExample) |
| NL (1) | NL1008197C2 (enExample) |
| NO (1) | NO20003942L (enExample) |
| PL (1) | PL342037A1 (enExample) |
| PT (1) | PT1051891E (enExample) |
| RU (1) | RU2217887C2 (enExample) |
| TR (1) | TR200002277T2 (enExample) |
| TW (1) | TW445205B (enExample) |
| WO (1) | WO1999040770A1 (enExample) |
| ZA (1) | ZA99881B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001241847A1 (en) * | 2000-02-28 | 2001-09-12 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
| CA2401168A1 (en) | 2000-02-28 | 2001-09-07 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| US6376281B1 (en) | 2000-10-27 | 2002-04-23 | Honeywell International, Inc. | Physical vapor deposition target/backing plate assemblies |
| US7026060B2 (en) | 2001-07-03 | 2006-04-11 | N.V. Bekaert S.A. | Layered structure providing shielding characteristics |
| US6818291B2 (en) * | 2002-08-17 | 2004-11-16 | 3M Innovative Properties Company | Durable transparent EMI shielding film |
| KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
| CN100418394C (zh) * | 2006-09-14 | 2008-09-10 | 同济大学 | 一类无机非金属导电、电磁屏蔽粉体及其制备方法和应用 |
| DE102007051482A1 (de) * | 2007-10-25 | 2009-04-30 | Evonik Röhm Gmbh | Verfahren zur Herstellung von beschichteten Formkörpern |
| CN101998817A (zh) * | 2009-08-12 | 2011-03-30 | 鸿富锦精密工业（深圳）有限公司 | 抗电磁干扰模塑件及其制备方法 |
| WO2014055732A2 (en) * | 2012-10-04 | 2014-04-10 | Whaley Brian A | Shieldings for metal detector heads and manufacturing methods thereof |
| WO2020055415A1 (en) * | 2018-09-14 | 2020-03-19 | Hewlett-Packard Development Company, L.P. | Electronic devices with emi protection films |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB766257A (en) * | 1953-08-25 | 1957-01-16 | Edison Swan Electric Co Ltd | Improvements relating to the coating of plastic material |
| US4403004A (en) * | 1981-10-23 | 1983-09-06 | Transfer Print Foils, Inc. | Sandwich metalized resin laminate |
| JPS61205110A (ja) * | 1985-03-08 | 1986-09-11 | Dainippon Printing Co Ltd | 電磁波シ−ルド性成型品の製造方法 |
| SU1473098A1 (ru) * | 1987-08-03 | 1989-04-15 | Предприятие П/Я М-5783 | Устройство дл экранировани от электромагнитных полей |
| JPH0218996A (ja) * | 1988-07-06 | 1990-01-23 | Mishima Kosan Co Ltd | 金属めっきを施したアモルファス合金材料及びめっき方法 |
| SU1667279A1 (ru) * | 1989-07-10 | 1991-07-30 | Предприятие П/Я М-5632 | Экранированный корпус |
| DE69317035T2 (de) * | 1992-11-09 | 1998-06-10 | Chugai Ings Co | Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer Abschirmung |
| RU2055450C1 (ru) * | 1993-08-27 | 1996-02-27 | Владимир Иванович Капитонов | Материал для экранирования от электромагнитного излучения |
| SE504039C2 (sv) * | 1994-06-14 | 1996-10-21 | Ericsson Telefon Ab L M | Sätt att formspruta plast |
| DE19611137A1 (de) * | 1996-03-21 | 1997-09-25 | Lpw Anlagen Gmbh | Verfahren zur galvanotechnischen Direktmetallisierung einer Kunststoffoberfläche |
-
1998
- 1998-02-04 NL NL1008197A patent/NL1008197C2/nl not_active IP Right Cessation
-
1999
- 1999-02-03 PT PT99902935T patent/PT1051891E/pt unknown
- 1999-02-03 KR KR1020007008521A patent/KR20010040649A/ko not_active Ceased
- 1999-02-03 EP EP99902935A patent/EP1051891B1/en not_active Expired - Lifetime
- 1999-02-03 ID IDW20001487A patent/ID28255A/id unknown
- 1999-02-03 TR TR2000/02277T patent/TR200002277T2/xx unknown
- 1999-02-03 ES ES99902935T patent/ES2178379T3/es not_active Expired - Lifetime
- 1999-02-03 AT AT99902935T patent/ATE218031T1/de not_active IP Right Cessation
- 1999-02-03 CA CA002319322A patent/CA2319322A1/en not_active Abandoned
- 1999-02-03 AU AU23023/99A patent/AU752537B2/en not_active Ceased
- 1999-02-03 BR BR9909093-7A patent/BR9909093A/pt not_active IP Right Cessation
- 1999-02-03 HU HU0102091A patent/HU222659B1/hu not_active IP Right Cessation
- 1999-02-03 CN CNA2007101386841A patent/CN101119629A/zh active Pending
- 1999-02-03 CN CN99802682A patent/CN1290473A/zh active Pending
- 1999-02-03 WO PCT/NL1999/000056 patent/WO1999040770A1/en not_active Ceased
- 1999-02-03 DE DE69901537T patent/DE69901537T2/de not_active Expired - Fee Related
- 1999-02-03 RU RU2000122838/09A patent/RU2217887C2/ru not_active IP Right Cessation
- 1999-02-03 JP JP2000531048A patent/JP2002502729A/ja active Pending
- 1999-02-03 DK DK99902935T patent/DK1051891T3/da active
- 1999-02-03 PL PL99342037A patent/PL342037A1/xx unknown
- 1999-02-04 ZA ZA9900881A patent/ZA99881B/xx unknown
- 1999-03-09 TW TW088103589A patent/TW445205B/zh not_active IP Right Cessation
-
2000
- 2000-08-03 NO NO20003942A patent/NO20003942L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1051891A1 (en) | 2000-11-15 |
| TW445205B (en) | 2001-07-11 |
| DE69901537T2 (de) | 2002-10-17 |
| CN101119629A (zh) | 2008-02-06 |
| HUP0102091A3 (en) | 2001-10-29 |
| HU222659B1 (hu) | 2003-09-29 |
| TR200002277T2 (tr) | 2000-11-21 |
| NL1008197C2 (nl) | 1999-08-05 |
| HUP0102091A2 (hu) | 2001-09-28 |
| NO20003942D0 (no) | 2000-08-03 |
| NO20003942L (no) | 2000-10-04 |
| ATE218031T1 (de) | 2002-06-15 |
| AU2302399A (en) | 1999-08-23 |
| PT1051891E (pt) | 2002-09-30 |
| DE69901537D1 (de) | 2002-06-27 |
| DK1051891T3 (da) | 2002-09-09 |
| ZA99881B (en) | 1999-08-05 |
| CN1290473A (zh) | 2001-04-04 |
| CA2319322A1 (en) | 1999-08-12 |
| RU2217887C2 (ru) | 2003-11-27 |
| JP2002502729A (ja) | 2002-01-29 |
| ES2178379T3 (es) | 2002-12-16 |
| BR9909093A (pt) | 2000-12-05 |
| AU752537B2 (en) | 2002-09-19 |
| WO1999040770A1 (en) | 1999-08-12 |
| PL342037A1 (en) | 2001-05-21 |
| ID28255A (id) | 2001-05-10 |
| EP1051891B1 (en) | 2002-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20000804 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20031205 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20050817 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20060207 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20050817 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |