KR20000045485A - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor device Download PDFInfo
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- KR20000045485A KR20000045485A KR1019980062043A KR19980062043A KR20000045485A KR 20000045485 A KR20000045485 A KR 20000045485A KR 1019980062043 A KR1019980062043 A KR 1019980062043A KR 19980062043 A KR19980062043 A KR 19980062043A KR 20000045485 A KR20000045485 A KR 20000045485A
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- film
- insulating film
- interlayer insulating
- forming
- etching
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 150000004767 nitrides Chemical class 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000008569 process Effects 0.000 claims abstract description 30
- 125000006850 spacer group Chemical group 0.000 claims abstract description 16
- 239000011229 interlayer Substances 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 48
- 238000005530 etching Methods 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 239000012535 impurity Substances 0.000 claims description 6
- 239000005380 borophosphosilicate glass Substances 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 125
- 229920002120 photoresistant polymer Polymers 0.000 description 19
- 238000002955 isolation Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4983—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET with a lateral structure, e.g. a Polysilicon gate with a lateral doping variation or with a lateral composition variation or characterised by the sidewalls being composed of conductive, resistive or dielectric material
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823475—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type interconnection or wiring or contact manufacturing related aspects
Abstract
Description
본 발명은 반도체소자의 제조방법에 관한 것으로서, 특히 주변회로영역 상의 질화막이 적층되어 있는 게이트 전극에서 콘택으로 예정되는 부분의 질화막을 먼저 제거한 다음, 반도체기판의 셀영역 및 주변회로영역에서 콘택공정을 실시함으로써 식각공정시 상기 셀영역의 활성영역이 손상되는 것을 방지하여 소자의 특성 및 신뢰성이 저하되는 것을 방지하는 반도체소자의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device. In particular, a nitride film of a portion intended to be contacted is first removed from a gate electrode on which a nitride film is stacked on a peripheral circuit region, and then a contact process is performed in a cell region and a peripheral circuit region of a semiconductor substrate. The present invention relates to a method for manufacturing a semiconductor device by preventing the active area of the cell region from being damaged during the etching process, thereby preventing deterioration of characteristics and reliability of the device.
최근의 반도체장치의 고집적화 추세는 미세 패턴 형성 기술의 발전에 큰 영향을 받고 있으며, 반도체장치의 제조공정 중에서 식각 또는 이온주입 공정 등의 마스크로 매우 폭 넓게 사용되는 감광막 패턴의 미세화가 필수 요건이다.The recent trend of high integration of semiconductor devices has been greatly influenced by the development of fine pattern formation technology, and the miniaturization of photoresist patterns, which are widely used as masks such as etching or ion implantation processes, is essential in the manufacturing process of semiconductor devices.
상기 감광막 패턴의 분해능(R)은 축소노광장치의 광원의 파장(λ) 및 공정 변수(k)에 비례하고, 노광 장치의 렌즈 구경(numerical aperture : NA, 개구수)에 반비례한다.The resolution R of the photoresist pattern is proportional to the wavelength λ of the light source of the reduction exposure apparatus and the process variable k, and inversely proportional to the numerical aperture NA of the exposure apparatus.
[ R = k*λ/NA, R=해상도, λ=광원의 파장, NA=개구수][R = k * λ / NA, R = resolution, λ = wavelength of light source, NA = number of apertures]
여기서, 상기 축소노광장치의 광분해능을 향상시키기 위하여 광원의 파장을 감소시키게 되며, 예를 들어 파장이 436 및 365nm인 G-라인 및 i-라인 축소노광장치는 공정 분해능이 각각 약 0.7, 0.5㎛ 정도가 한계이고, 0.5㎛이하의 미세 패턴을 형성하기 위해 파장이 작은 원자외선(deep ultra violet ; DUV), 예를 들어 파장이 248㎚인 KrF 레이저나 193㎚인 ArF 레이저를 광원으로 사용하는 노광장치를 이용하거나, 공정상의 방법으로는 노광마스크(photo mask)를 위상 반전 마스크(phase shift mask)를 사용하는 방법과, 이미지 콘트라스트를 향상시킬 수 있는 별도의 박막을 웨이퍼 상에 형성하는 씨.이.엘.(contrast enhancement layer, 이하 CEL이라 함)방법이나 두 층의 감광막 사이에 SOG 등의 중간층을 개재시킨 삼층레지스트(tri layer resist, TLR) 방법 또는 감광막의 상측에 선택적으로 실리콘을 주입시키는 실리레이션 방법 등이 개발되어 분해능 한계치를 낮추고 있다.Here, the wavelength of the light source is reduced in order to improve the optical resolution of the reduced exposure apparatus. For example, the G-line and i-line reduced exposure apparatus having wavelengths of 436 and 365 nm have a process resolution of about 0.7 and 0.5 µm, respectively. Exposure using a light source of deep ultra violet (DUV), for example, KrF laser having a wavelength of 248 nm or ArF laser having a wavelength of 193 nm, to form a fine pattern of 0.5 µm or less. As an apparatus or process method, a photo mask is used as a phase shift mask, and a separate thin film is formed on the wafer to improve image contrast. L. (contrast enhancement layer, CEL) method, tri-layer resist (TLR) method in which an intermediate layer such as SOG is interposed between two layers of photoresist, or selectively on top of the photoresist. Silicate methods for injecting cones have been developed to lower the resolution limit.
또한 상하의 도전배선을 연결하는 콘택홀은 소자가 고집적화되어감에 따라 자체의 크기와 주변배선과의 간격이 감소되고, 콘택홀의 지름과 깊이의 비인 에스펙트비(aspect ratio)가 증가한다. 따라서, 다층의 도전배선을 구비하는 고집적 반도체소자에서는 콘택을 형성하기 위하여 제조 공정에서의 마스크들간의 정확하고 엄격한 정렬이 요구되어 공정여유도가 감소된다.In addition, the contact hole connecting the upper and lower conductive wirings has a high integration of the device, and the size of the contact holes decreases, and the distance between the peripheral wirings is reduced, and the aspect ratio, which is the ratio of the diameter and the depth of the contact hole, increases. Therefore, in a highly integrated semiconductor device having multiple conductive wirings, accurate and tight alignment between masks in a manufacturing process is required to form a contact, thereby reducing process margin.
이러한 콘택홀은 간격유지를 위하여 마스크 정렬시 오배열의 여유(misalignment tolerance), 노광공정시의 렌즈 왜곡(lens distortion), 마스크 제작 및 사진식각 공정시의 임계크기 변화(critical dimension variation), 마스크간의 정합(registration) 등과 같은 요인들을 고려하여 마스크를 형성한다.These contact holes have misalignment tolerance when aligning the mask, lens distortion during the exposure process, critical dimension variation during the mask fabrication and photolithography process, and between masks to maintain the spacing. The mask is formed by considering factors such as registration.
그리고, 콘택홀 형성시 리소그래피(lithography)공정의 한계를 극복하기 위하여 자기 정렬 방법으로 콘택홀을 형성하는 자기정렬콘택(self aligned contact, 이하 SAC 라 함)기술이 개발되었다.In order to overcome the limitations of the lithography process in forming the contact holes, a self aligned contact (SAC) technology for forming contact holes by a self alignment method has been developed.
상기 SAC 방법은 식각장벽층으로 사용하는 물질에 따라 다결정실리콘층이나 질화막 또는 산화질화막 등을 사용하는 것으로 나눌 수 있으며, 가장 유망한 것으로 질화막을 식각방어막으로 사용하는 방법이 있다.The SAC method may be divided into a polysilicon layer, a nitride film, or an oxynitride film according to the material used as the etch barrier layer, and the most promising method is to use a nitride film as an etch barrier.
도시되어 있지는 않으나, 종래 반도체소자의 SAC 제조방법에 관하여 살펴보면 다음과 같다.Although not shown, the SAC manufacturing method of the conventional semiconductor device will be described as follows.
먼저, 반도체기판 상에 소정의 하부구조물, 예를 들어 소자분리 절연막과 게이트 절연막, 마스크 산화막 패턴과 중첩되어 있는 게이트 전극 및 소오스/드레인영역 등의 모스 전계효과 트랜지스터(MOS field effect transistor : 이하 MOS FET 라 함) 등을 형성한 후, 상기 구조의 전표면에 식각방지막과 산화막 재질의 층간절연막을 순차적으로 형성한다.First, a MOS field effect transistor (MOS FET) such as a gate electrode and a source / drain region overlapping a predetermined substructure, for example, a device isolation insulating film, a gate insulating film, and a mask oxide film pattern on a semiconductor substrate. And the like, and then sequentially form an etch stop film and an interlayer insulating film made of an oxide film on the entire surface of the structure.
그 다음, 상기 반도체기판에서 저장전극이나 비트라인 등의 콘택으로 예정되어 있는 부분 상의 층간절연막을 노출시키는 감광막 패턴을 형성한 후, 상기 감광막 패턴에 의해 노출되어 있는 층간절연막을 건식식각하여 식각방지막을 노출시키고, 다시 식각방지막을 식각하여 콘택홀을 형성한다.Next, a photoresist pattern is formed on the semiconductor substrate to expose an interlayer insulating film on a portion of the semiconductor substrate, which is intended to be a contact such as a storage electrode or a bit line. Then, the interlayer insulating film exposed by the photosensitive film pattern is dry-etched to form an etching prevention film. It exposes and etches an etch stop layer again, and forms a contact hole.
상기에서 식각방지막을 다결정실리콘으로 사용하는 경우, 이는 다시 식각방지막을 전면에 형성하는 방법과 콘택홀이 형성될 지역에만 다결정실리콘층 패드를 형성하는 방법으로 나누어지는데, 이러한 다결정실리콘 SAC 방법은 산화막과는 다른 식각기구를 가지는 다결정실리콘을 식각방지막으로 사용하므로 산화막과는 높은 식각선택비차를 얻을 수 있으나, 전면 증착 방법은 콘택홀간의 절연 신뢰성이 떨어지고, 패드를 형성하는 방법은 콘택 패드와 실리콘기판간의 오정렬 발생시 기판에 손상이 발생되는데, 이를 방지하기 위하여 스페이서 또는 폴리머를 사용하여 콘택 패드를 확장시키는 방법이 제시되고 있으나, 이 역시 0.18㎛ 이하의 디자인룰을 실현할 수 없는 문제점이 있다.When the etch barrier is used as polysilicon, it is divided into a method of forming an etch barrier on the front surface and a method of forming a polysilicon layer pad only in a region where a contact hole is to be formed. Such a polysilicon SAC method is characterized in that Since polycrystalline silicon having different etching mechanisms is used as an etch stopper, it is possible to obtain a high etching selectivity difference from an oxide film. However, in the case of the front deposition method, the insulation reliability between contact holes is inferior, and the pad forming method is used between the contact pad and the silicon substrate. When misalignment occurs, damage occurs to the substrate. In order to prevent this, a method of expanding a contact pad using a spacer or a polymer has been proposed, but this also has a problem in that a design rule of 0.18 μm or less can not be realized.
상기와 같은 문제점을 해결하기 위하여 제시되고있는 것이 질화막을 식각방지막으로 사용하는 SAC방법이다.In order to solve the above problems, the SAC method using a nitride film as an etch stop layer is proposed.
상기와 같이 종래기술에 따른 반도체소자의 제조방법은, 소자가 고집적화되어감에 따라 셀영역과 주변회로영역 사이에 단차가 증가하여 콘택을 형성하기 위한 식각공정시 단차가 낮은 주변회로부 상에 형성되어 있는 게이트 전극 상부의 질화막이 식각되지 않아 콘택홀이 완전히 오픈되지 않거나, 상기 질화막이 완전히 식각되는 동안 반도체기판의 접합영역이 손상을 받아 누설전류가 발생하여 공정수율 및 소자동작의 신뢰성을 떨어드리는 문제점이 있다.As described above, the semiconductor device manufacturing method according to the related art is formed on a peripheral circuit portion having a low step during an etching process for forming a contact by increasing a step between a cell region and a peripheral circuit region as the device is highly integrated. The contact hole is not fully opened because the nitride film on the upper gate electrode is not etched, or the junction area of the semiconductor substrate is damaged while the nitride film is completely etched, resulting in a leakage current, thereby lowering process yield and reliability of device operation. There is this.
본 발명은 상기한 종래기술의 문제점을 해결하기 위하여, 콘택형성시 주변회로영역 상의 질화막을 제거한 다음, 반도체기판의 셀영역 및 주변회로영역에서 콘택으로 예정되는 부분을 노출시키는 콘택홀을 형성함으로써 콘택공정시 식각정지 현상 또는 반도체기판의 손상을 방지하여 후속공정을 용이하게 하고 접합 누설전류의 발생을 방지하여 반도체소자의 특성 및 신뢰성을 향상시키는 반도체소자의 제조방법을 제공하는데 그 목적이 있다.The present invention, in order to solve the above problems of the prior art, by removing the nitride film on the peripheral circuit area when forming the contact, and then forming a contact hole for exposing the predetermined portion of the contact in the cell region and the peripheral circuit region of the semiconductor substrate It is an object of the present invention to provide a method for manufacturing a semiconductor device which improves the characteristics and reliability of the semiconductor device by preventing an etch stop phenomenon or damage to the semiconductor substrate during the process, thereby facilitating subsequent processes and preventing generation of a junction leakage current.
도 1a 내지 도 1h 는 본 발명의 제1실시예에 따른 반도체소자의 제조방법을 도시한 단면도.1A to 1H are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with a first embodiment of the present invention.
도 2a 내지 도 2k 는 본 발명의 제2실시예에 따른 반도체소자의 제조방법을 도시한 단면도.2A through 2K are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with a second embodiment of the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
11, 31 : 반도체기판 12, 32 : 소자분리 절연막11, 31: semiconductor substrate 12, 32: device isolation insulating film
13, 33 : 게이트 절연막 14, 34 : 도전층13, 33: gate insulating film 14, 34: conductive layer
15, 35 : 버퍼산화막 16, 36 : 질화막15, 35: buffer oxide film 16, 36: nitride film
17, 37 : 제1감광막 패턴 18, 39 : 제2감광막 패턴17, 37: First photosensitive film pattern 18, 39: Second photosensitive film pattern
19, 40 : 절연막 스페이서 20 : 층간절연막19, 40 insulating film spacer 20 interlayer insulating film
21, 43 : 제3감광막 패턴 22, 44 : 콘택플러그21 and 43: third photosensitive film pattern 22, 44: contact plug
38 : 제1층간절연막 23, 41 : 패드질화막38: first interlayer insulating film 23, 41: pad nitride film
42 : 제2층간절연막42: second interlayer insulating film
이상의 목적을 달성하기 위하여 본 발명에 따른 반도체소자의 제조방법은,In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention,
반도체기판 상부에 게이트 절연막, 도전층, 버퍼산화막 및 질화막의 적층구조를 형성하는 공정과,Forming a stacked structure of a gate insulating film, a conductive layer, a buffer oxide film, and a nitride film on the semiconductor substrate;
게이트 전극으로 예정되는 부분을 보호하는 게이트 전극 마스크를 식각마스크로 사용하여상기 질화막과 버퍼산화막을 건식식각하는 공정과,Dry etching the nitride film and the buffer oxide film using a gate electrode mask that protects a portion intended as a gate electrode as an etching mask;
상기 반도체기판의 셀영역을 보호하는 셀마스크를 식각마스크로 사용하여 상기 반도체기판의 주변회로영역 상의 질화막을 건식식각하는 공정과,Dry etching the nitride film on the peripheral circuit region of the semiconductor substrate using a cell mask protecting the cell region of the semiconductor substrate as an etching mask;
상기 반도체기판의 셀영역상에 질화막과 상기 반도체기판의 주변회로영역상의 버퍼산화막을 식각마스크로 사용하여 상기 도전층을 식각하는 공정과,Etching the conductive layer using an nitride film on the cell region of the semiconductor substrate and a buffer oxide film on the peripheral circuit region of the semiconductor substrate as an etching mask;
상기 셀영역의 제1층간절연막과 적층구조 및 상기 주변회로영역의 제1층간절연막과 버퍼산화막 및 도전층의 식각면에 절연막 스페이서를 형성하는 공정과,Forming an insulating film spacer on an etching surface of the first interlayer insulating film and the stacked structure of the cell region and the first interlayer insulating film, the buffer oxide film and the conductive layer of the peripheral circuit region;
상기 셀영역상에 패드질화막을 형성하고, 상기 절연막 스페이서의 양쪽 반도체기판에 소오스/드레인영역을 형성하는 공정과,Forming a pad nitride film on the cell region, and forming a source / drain region on both semiconductor substrates of the insulating film spacer;
전체표면 상부에 제2층간절연막을 형성한 다음, 콘택으로 예정되는 부분을 노출시키는 콘택마스크를 식각마스크로 사용하여 상기 셀영역상의 제2층간절연막과 패드질화막을 제거하고, 상기 주변회로영역 상의 제2층간절연막, 제1층간절연막 및 버퍼산화막을 제거하여 콘택홀을 형성하는 공정과,After forming a second interlayer insulating film over the entire surface, using a contact mask that exposes a portion intended to be a contact as an etch mask, the second interlayer insulating film and the pad nitride film on the cell region are removed, and the second interlayer insulating film on the peripheral circuit region is removed. Forming a contact hole by removing the interlayer insulating film, the first interlayer insulating film, and the buffer oxide film;
상기 콘택홀을 매립하는 콘택플러그를 형성하는 공정을 포함하는 것을 제1특징으로 한다.It is a 1st characteristic that the process includes forming the contact plug which fills the said contact hole.
이상의 목적을 달성하기 위하여 본 발명에 따른 반도체소자의 제조방법은,In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention,
반도체기판 상부에 게이트 절연막, 도전층, 버퍼산화막 및 질화막의 적층구조를 형성하고, 상기 반도체기판의 셀영역을 보호하는 셀마스크를 식각마스크로 사용하여 상기 질화막을 식각하는 공정과,Forming a stacked structure of a gate insulating film, a conductive layer, a buffer oxide film, and a nitride film on the semiconductor substrate, and etching the nitride film using a cell mask protecting the cell region of the semiconductor substrate as an etching mask;
전체표면 상부에 제1층간절연막을 형성한 다음, 상기 반도체기판의 셀영역과 주변회로영역 간에 단차를 제거하는 평탄화공정과,A planarization process of forming a first interlayer insulating film over the entire surface and then removing a step between the cell region and the peripheral circuit region of the semiconductor substrate;
게이트 전극으로 예정되는 부분을 보호하는 게이트 전극 마스크를 식각마스크로사용하여 상기 셀영역의 상기 제1층간절연막과 적층구조 및 상기 주변회로영역의 제1층간절연막과 버퍼산화막 및 도전층을 식각하는 공정과,Etching the first interlayer insulating film and the stacked structure of the cell region and the first interlayer insulating film, the buffer oxide film and the conductive layer of the peripheral circuit region by using a gate electrode mask that protects a portion intended as a gate electrode as an etching mask. and,
상기 셀영역의 제1층간절연막과 적층구조 및 상기 주변회로영역의 제1층간절연막과 버퍼산화막 및 도전층의 식각면에 절연막 스페이서를 형성하는 공정과,Forming an insulating film spacer on an etching surface of the first interlayer insulating film and the stacked structure of the cell region and the first interlayer insulating film, the buffer oxide film and the conductive layer of the peripheral circuit region;
상기 셀영역 상부에 패드질화막을 형성한 다음, 상기 절연막 스페이서 양쪽 반도체기판에 불순물을 이온주입하여 소오스/드레인영역을 형성하는 공정과,Forming a pad nitride film over the cell region, and then implanting impurities into both semiconductor substrates of the insulating film spacer to form a source / drain region;
전체표면 상부에 제2층간절연막을 형성하고, 콘택으로 예정되는 부분을 노출시키는 콘택마스크를 식각마스크로 사용하여 상기 셀영역의 제2층간절연막 및 패드질화막과, 상기 주변회로영역의 제2층간절연막, 제1층간절연막 및 버퍼산화막을 제거하여 콘택홀을 형성하는 공정과,A second interlayer insulating film and a pad nitride film of the cell region and a second interlayer insulating film of the peripheral circuit region are formed by forming a second interlayer insulating film over the entire surface and using a contact mask that exposes a portion intended for contact as an etch mask. Forming a contact hole by removing the first interlayer insulating film and the buffer oxide film;
상기 콘택홀을 매립하는 콘택플러그를 형성하는 공정을 포함하는 것을 제2특징으로 한다.It is a 2nd characteristic that it includes the process of forming the contact plug which fills the said contact hole.
이하, 첨부된 도면을 참고로 하여 본 발명의 제1실시예에 대하여 설명하기로 한다.Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings.
도 1a 내지 도 1h 는 본 발명의 제1실시예에 따른 반도체소자의 제조방법을 도시한 단면도이다.1A to 1H are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with a first embodiment of the present invention.
먼저, 셀영역(Ⅰ)과 주변회로영역(Ⅱ)이 구분되어 있는 반도체기판(11)의 원하는 부분에 원하는 불순물의 종류를 이온주입하여 웰과 트랜지스터의 채널 부분 및 소자분리 영역의 아래 부분에 원하는 형태로 불순물이 존재하도록 한 후, 상기 반도체기판(11)에서 소자분리 영역으로 예정되어 있는 부분상에 소자분리 절연막(12)을 형성하고, 나머지 반도체기판(11)에 게이트 절연막(13)을 형성한다.First, a desired type of impurity is ion-implanted into a desired portion of the semiconductor substrate 11 where the cell region I and the peripheral circuit region II are separated, thereby forming a desired portion in the channel portion of the well and the transistor and the lower portion of the device isolation region. After the impurity is present in the form, the device isolation insulating film 12 is formed on the portion of the semiconductor substrate 11 that is intended as the device isolation region, and the gate insulating film 13 is formed on the remaining semiconductor substrate 11. do.
그 다음, 상기 게이트 절연막(13) 상부에 도전층(14), 버퍼산화막(15) 및 질화막(16)의 적층구조를 순차적으로 형성한다. 이때, 상기 도전층(14)은 텅스텐 실리사이드층으로 형성하고, 상기 버퍼산화막(15)은 USG(undoped silicate glass) 또는 중온산화막(middle temperature oxide, MTO)를 사용하여 100 ∼ 2000Å 두께로 형성하고, 상기 질화막(16)도 100 ∼ 2000Å 두께로 형성한다. (도 1a참조)Next, a stacked structure of the conductive layer 14, the buffer oxide film 15, and the nitride film 16 is sequentially formed on the gate insulating film 13. In this case, the conductive layer 14 is formed of a tungsten silicide layer, the buffer oxide film 15 is formed to a thickness of 100 ~ 2000Å by using a undoped silicate glass (USG) or middle temperature oxide (MTO), The nitride film 16 is also formed to a thickness of 100 to 2000 mm 3. (See FIG. 1A)
다음, 상기 질화막(16) 상부에 게이트 전극으로 예정되는 부분으로 보호하는 제1감광막 패턴(17)을 형성하고, 상기 제1감광막 패턴(17)을 식각마스크로 사용하여 상기 질화막(16)과 버퍼산화막(15)을 건식식각한다. (도 1b참조)Next, a first photoresist layer pattern 17 is formed on the nitride layer 16 to protect the portion of the nitride layer 16 as a gate electrode, and the first photoresist layer pattern 17 is used as an etch mask. The oxide film 15 is dry etched. (See FIG. 1B)
그 후, 상기 제1감광막 패턴(17)을 제거한다.Thereafter, the first photoresist pattern 17 is removed.
그 다음, 상기 반도체기판(11)의 셀영역(Ⅰ)을 보호하는 제2감광막 패턴(18)을 형성한다. (도 1c참조)Next, a second photosensitive film pattern 18 is formed to protect the cell region I of the semiconductor substrate 11. (See FIG. 1C)
다음, 상기 제2감광막 패턴(18)을 식각마스크로 사용하여 상기 주변회로영역(Ⅱ) 상의 질화막(16)을 제거한다. (도 1d참조)Next, the nitride film 16 on the peripheral circuit region II is removed using the second photoresist pattern 18 as an etching mask. (See FIG. 1D)
그 다음, 상기 제2감광막 패턴(18)을 제거한다.Next, the second photoresist pattern 18 is removed.
다음, 상기 셀영역(Ⅰ) 상에서는 질화막(16)을 식각마스크로 사용하여 상기 도전층(14)을 건식식각하고, 상기 주변회로영역(Ⅱ) 상에서는 버퍼산화막(15)을 식각마스크로 사용하여 상기 도전층(14)을 건식식각한다. (도 1d참조)Next, the conductive layer 14 is dry-etched using the nitride film 16 as an etch mask on the cell region I, and the buffer oxide film 15 is used as an etch mask on the peripheral circuit region II. The conductive layer 14 is dry etched. (See FIG. 1D)
그 다음, 전체표면 상부에 절연막을 형성한 후, 전면식각공정을 실시하여 상기 셀영역(Ⅰ)의 질화막(16), 버퍼산화막(15) 및 도전층(14)의 식각면과, 상기 주변회로영역(Ⅱ)의 버퍼산화막(15)과 도전층(14)의 식각면에 절연막 스페이서(19)를 형성한 후, 상기 셀영역(Ⅰ) 상에만 패드질화막(23)을 형성한다. 그 후, 상기 절연막 스페이서(19) 양측의 반도체기판(11)에 불순물을 이온주입하여 소오스/드레인영역(도시안됨)을 형성한다.Then, after the insulating film is formed over the entire surface, an entire surface etching process is performed to etch the etching surface of the nitride film 16, the buffer oxide film 15, and the conductive layer 14 in the cell region I and the peripheral circuit. After forming the insulating film spacer 19 on the etching surface of the buffer oxide film 15 and the conductive layer 14 in the region (II), the pad nitride film 23 is formed only on the cell region (I). Thereafter, impurities are implanted into the semiconductor substrate 11 on both sides of the insulating film spacer 19 to form a source / drain region (not shown).
다음, 전체표면 상부에 층간절연막(20)을 형성하고, 상기 층간절연막(20) 상부에 콘택으로 예정되는 부분을 노출시키는 제3감광막 패턴(21)을 형성한다.Next, an interlayer insulating film 20 is formed on the entire surface, and a third photoresist pattern 21 is formed on the interlayer insulating film 20 to expose a portion to be contacted.
그 다음, 상기 제3감광막 패턴(21)을 식각마스크로 사용하여 상기 셀영역(Ⅰ)의 층간절연막(20)과 패드질화막(23)을 제거하고, 상기 주변회로영역(Ⅱ)의 층간절연막(20)과 버퍼산화막(15)을 제거하여 콘택홀(도시안됨)을 형성한다.Next, the interlayer insulating film 20 and the pad nitride film 23 of the cell region I are removed using the third photoresist pattern 21 as an etching mask, and the interlayer insulating film of the peripheral circuit region II is removed. 20) and the buffer oxide film 15 are removed to form a contact hole (not shown).
그 후, 전체표면 상부에 상기 콘택홀을 매립하는 제2도전층을 형성한 다음, 상기 제2도전층을 전면식각(etch back) 또는 화학적 기계적 연마(chemical mechanical polishing, 이하 CMP 라 함)공정으로 제거하여 콘택플러그(22)를 형성한다.Thereafter, a second conductive layer filling the contact hole is formed on the entire surface, and the second conductive layer is etched back or chemical mechanical polishing (hereinafter referred to as CMP). To form a contact plug 22.
이하, 본 발명의 제2실시예에 대하여 설명하기로 한다.Hereinafter, a second embodiment of the present invention will be described.
도 2a 내지 도 2k 는 본 발명의 제2실시예에 따른 반도체소자의 제조방법을 도시한 단면도이다.2A through 2K are cross-sectional views illustrating a method of manufacturing a semiconductor device in accordance with a second embodiment of the present invention.
먼저, 제1실시에의 도 1a 까지의 공정을 실시하고, 질화막(36)의 상부에 반도체기판(31)의 셀영역(Ⅰ)을 보호하는 제1감광막 패턴(37)을 형성한다. (도 2a, 도 2b참조)First, the process up to FIG. 1A according to the first embodiment is carried out, and the first photosensitive film pattern 37 for protecting the cell region I of the semiconductor substrate 31 is formed on the nitride film 36. (See FIG. 2A, FIG. 2B)
다음, 상기 제1감광막 패턴(37)을 식각마스크로 사용하여 상기 질화막(36)을 식각하고, 상기 제1감광막 패턴(37)을 제거한다. (도 2c참조)Next, the nitride film 36 is etched using the first photoresist pattern 37 as an etch mask, and the first photoresist pattern 37 is removed. (See FIG. 2C)
그 다음, 상기 구조 전표면 상부에 PSG(phospho silicate glass)막, BPSG(borophospho silicate glass)막 또는 USG막으로 제1층간절연막(38)을 500 ∼ 10000Å 두께로 형성한다. 여기서, 상기 주변회로영역(Ⅱ) 상에는 질화막(36)이 없기 때문에 셀영역(Ⅰ)과 주변회로영역(Ⅱ) 간에 단차가 발생한다. (도 2d참조)Subsequently, a first interlayer insulating film 38 is formed on the entire surface of the structure by using a PSG (phospho silicate glass) film, a borophospho silicate glass (BPSG) film, or a USG film. Here, since there is no nitride film 36 on the peripheral circuit region II, a step occurs between the cell region I and the peripheral circuit region II. (See FIG. 2D)
그 후, 상기 제1층간절연막(38)을 CMP 또는 전면식각공정으로 상기 셀영역(Ⅰ)과 주변회로영역(Ⅱ) 간에 발생한 단차를 제거하되, 상기 셀영역(Ⅰ) 상의 질화막(36) 상부에 상기 제1층간절연막(38)이 100 ∼ 1000Å 두께가 남을 때까지 실시한다. (도 2e참조)Thereafter, the step between the cell region I and the peripheral circuit region II is removed by using the first interlayer insulating layer 38 by CMP or a full surface etching process, and the upper portion of the nitride layer 36 on the cell region I is removed. In the first interlayer insulating film 38 until the thickness of 100 to 1000 Å remains. (See Figure 2E)
다음, 상기 제1층간절연막(38) 상부에 게이트 전극으로 예정되는 부분을 보호하는 제2감광막 패턴(39)을 형성한다.Next, a second photoresist layer pattern 39 is formed on the first interlayer insulating layer 38 to protect a portion of the first interlayer insulating layer 38.
그 다음, 상기 제2감광막 패턴(39)을 식각마스크로 사용하여 상기 셀영역(Ⅰ) 상에 제1층간절연막(38), 질화막(36), 버퍼산화막(35) 및 도전층(34)의 제1적층구조를 식각하고, 상기 주변회로영역(Ⅱ) 상에 제1층간절연막(38), 버퍼산화막(35) 및 도전층(34)의 제2적층구조를 식각한 다음, 상기 제2감광막 패턴(39)을 제거한다. (도 2g참조)Next, the first interlayer insulating film 38, the nitride film 36, the buffer oxide film 35, and the conductive layer 34 are formed on the cell region I using the second photoresist pattern 39 as an etching mask. After etching the first stacked structure, the second stacked structure of the first interlayer insulating film 38, the buffer oxide film 35, and the conductive layer 34 is etched on the peripheral circuit region II. The pattern 39 is removed. (See Fig. 2g)
다음, 전체표면 상부에 절연막을 형성한 후, 전면식각공정을 실시하여 상기 제1적층구조 및 제2적층구조의 식각면에 절연막 스페이서(40)를 형성한 다음, 상기 셀영역(Ⅰ) 상에 패드질화막(41)을 형성한다.Next, after the insulating film is formed over the entire surface, an entire surface etching process is performed to form the insulating film spacer 40 on the etching surfaces of the first stacked structure and the second stacked structure, and then on the cell region (I). The pad nitride film 41 is formed.
그 후, 상기 절연막 스페이서(40) 양측의 반도체기판(31)에 불순물을 이온주입하여 소오스/드레인영역(도시안됨)을 형성한다. (도 2h참조)Thereafter, impurities are implanted into the semiconductor substrate 31 on both sides of the insulating film spacer 40 to form a source / drain region (not shown). (See Fig. 2h)
그 다음, 상기 구조 전표면에 BPSG막으로 제2층간절연막(42)을 형성한다. (도 2i참조)Next, a second interlayer insulating film 42 is formed of a BPSG film on the entire surface of the structure. (See Figure 2i)
그리고, 상기 제2층간절연막(42) 상부에 콘택으로 예정되는 부분을 노출시키는 제3감광막 패턴(43)을 형성한다. (도 2j참조)A third photoresist pattern 43 is formed on the second interlayer insulating layer 42 to expose a portion to be contacted. (See Figure 2j)
그 다음, 상기 제3감광막 패턴(43)을 식각마스크로 사용하여 상기 셀영역(Ⅰ) 상의 제2층간절연막(42)과 패드질화막(41)을 식각하고, 상기 주변회로영역(Ⅱ) 상의 제2층간절연막(42), 제1층간절연막(38) 및 버퍼산화막(35)을 식각하여 콘택홀을 형성한다.Subsequently, the second interlayer insulating film 42 and the pad nitride film 41 on the cell region I are etched using the third photoresist pattern 43 as an etch mask, and the second image on the peripheral circuit region II is etched. The two-layer insulating film 42, the first interlayer insulating film 38, and the buffer oxide film 35 are etched to form contact holes.
그 후, 상기 제3감광막 패턴(43)을 제거하고, 전체표면 상부에 제2도전층을 형성한 후, 전면식각 또는 CMP공정을 실시하여 상기 콘택홀을 매립하는 콘택플러그(44)를 형성한다. (도 2k참조)Thereafter, the third photoresist layer pattern 43 is removed, a second conductive layer is formed on the entire surface, and a contact plug 44 for filling the contact hole is formed by performing an entire surface etching or CMP process. . (See Figure 2k)
이상에서 설명한 바와 같이 본 발명에 따른 반도체소자의 제조방법은, 반도체기판의 주변회로영역 상에 질화막이 적층되어 있는 게이트 전극 상에 콘택을 형성하는 공정에서, 콘택을 형성하기 위한 식각공정 전에 상기 주변회로영역 상의 질화막을 제거한 다음, 콘택공정을 실시함으로써 콘택홀을 형성하기 위한 식각공정시 주변회로부에서 식각정지현상이 발생하거나 과도식각에 의해 셀영역 상의 활성영역이 손상되는 것을 방지하여 접합 누설전류를 감소시키고, 그에 따른 반도체소자의 특성 및 신뢰성을 향상시키는 이점이 있다.As described above, in the method of manufacturing a semiconductor device according to the present invention, in the process of forming a contact on a gate electrode on which a nitride film is stacked on a peripheral circuit region of a semiconductor substrate, the peripheral area before the etching process for forming the contact is performed. After removing the nitride film on the circuit area, the contact process is performed to prevent the etch stop phenomenon from occurring in the peripheral circuit part during the etching process for forming the contact hole or to prevent damage to the active area on the cell area due to the transient etching. There is an advantage to reduce, thereby improving the characteristics and reliability of the semiconductor device.
Claims (6)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100390039B1 (en) * | 2000-09-04 | 2003-07-04 | 주식회사 하이닉스반도체 | Method for forming the self aligned contact |
| KR100685591B1 (en) * | 2000-12-11 | 2007-02-22 | 주식회사 하이닉스반도체 | A method for manufacturing a semiconductor device |
| KR100720262B1 (en) * | 2006-01-26 | 2007-05-23 | 주식회사 하이닉스반도체 | Method of fabricating semiconductor device |
| KR100745054B1 (en) * | 2001-06-19 | 2007-08-01 | 주식회사 하이닉스반도체 | Method for forming contact plug in semiconductor Device |
| KR20200145948A (en) * | 2019-06-21 | 2020-12-31 | 삼성전자주식회사 | Semiconductor device and fabrication method thereof |
-
1998
- 1998-12-30 KR KR1019980062043A patent/KR100546144B1/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100390039B1 (en) * | 2000-09-04 | 2003-07-04 | 주식회사 하이닉스반도체 | Method for forming the self aligned contact |
| KR100685591B1 (en) * | 2000-12-11 | 2007-02-22 | 주식회사 하이닉스반도체 | A method for manufacturing a semiconductor device |
| KR100745054B1 (en) * | 2001-06-19 | 2007-08-01 | 주식회사 하이닉스반도체 | Method for forming contact plug in semiconductor Device |
| KR100720262B1 (en) * | 2006-01-26 | 2007-05-23 | 주식회사 하이닉스반도체 | Method of fabricating semiconductor device |
| KR20200145948A (en) * | 2019-06-21 | 2020-12-31 | 삼성전자주식회사 | Semiconductor device and fabrication method thereof |
| US11222897B2 (en) | 2019-06-21 | 2022-01-11 | Samsung Electronics Co., Ltd. | Semiconductor device and a fabrication method thereof |
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