KR20000003127A - Control device of contact force between semiconductor device and tester socket - Google Patents

Abstract

PURPOSE: A control device of a contact force between a semiconductor device and a tester socket is provided to obtain an examined result of the semiconductor device improved with the stability and the reliability. CONSTITUTION: The control device(100) of the contact power between the semiconductor device and the tester socket comprises: an AC submotor assembly(110) to generate a certain pressure for a soft contact between the semiconductor device and the tester socket, and to minutely control the contact; a press unit assembly(200) having a screw assembly(210) and a driving assembly(220).

Description

Contact force control device between semiconductor device and tester socket

The present invention relates to a test unit of an inspection apparatus for inspecting the performance of a semiconductor device that has been produced. More particularly, the present invention relates to a test unit of an inspection apparatus for measuring the driving force of a motor when the semiconductor element to be tested is brought into contact with a socket of a tester. Properly controlled, the semiconductor element is moved to the contact position at high speed, and then the contact pressure between the socket of the tester and the semiconductor element is optimally adjusted according to the shape of the semiconductor element or the number of semiconductor element leads using an AC servo motor. The present invention relates to a contact force control device between a semiconductor element and a tester socket for removing unnecessary stress applied to the socket of the semiconductor element or the tester to maintain a smooth contact.

In the recent electronics industry, while the output and function of electronic devices such as integrated circuits and semiconductor chips are rapidly increasing, various efforts have been made to reduce their size and unit manufacturing cost. One such method is to increase the test speed of electronic devices by simultaneously testing a plurality of electronic devices in an inspection process for inspecting the characteristics and performance of manufactured electronic devices.

To this end, a new type of automatic inspection device has been developed that increases the test speed of a plurality of electronic devices. In a new type of inspection device, a plurality of electronic devices to be tested are placed on a test tray so that they can be combined with a test head plate having a plurality of test contactors. At this time, each electronic device, for example one semiconductor element, is made small and delicately and is housed in a carrier module in order to prevent the risk of damage during handling and to maintain the position for the characteristic test correctly. Carrier modules holding semiconductor elements are arranged in a test tray in the longitudinal and transverse directions, and the test trays are conveyed near the test head by horizontal feeders for inspection of the semiconductor devices.

The semiconductor element carried near the test head is transferred from the test tray onto a socket on a performance board (PB) disposed on the test head by a carrier device having a chuck unit capable of reciprocating in the vertical direction. The semiconductor device is subjected to a performance test on the socket, again lifted from the socket by the carrier in the vertical direction, and then transferred to a desired position by a horizontal conveying device.

Figure 4a is a view showing a relationship between the air chuck unit and the test tray according to the prior art, Figure 4b is a view showing a relationship between the air chuck unit and the tester socket according to the prior art.

4A and 4B, the carrier device 10 includes a drive head 12. Two air chuck units 14a and 14b are mounted on the drive head 12. The air chuck units 14a and 14b are each provided with an air cylinder 16. The air cylinder 16 has a rod 18 extending downward from the air cylinder 16 and a suction pad 20 attached to the lower end of the rod 18. The suction pad 20 is made of an elastic material such as rubber and has a disk shape. A plurality of air inlets 22a and 22b and air intakes 24 are formed at one side of the air cylinder 16, respectively. An air inlet 24 is formed between the air inlets 22a and 22b and is connected to an air pump (not shown) for sucking air from the center of the suction pad 20.

Meanwhile, as shown in FIG. 4A, the carrier device 10 may be positioned to face the test tray 26 in a vertical direction. On the test tray 26, the carrier modules 28 holding the semiconductor elements 50 are arranged at regular intervals. In addition, as shown in FIG. 4B, the carrier device 10 may be positioned opposite the inspection table (PB) 32 disposed on the test head 30. On the test table 32, a plurality of sockets 34 are arranged side by side at regular intervals. Within the socket 34 is a socket terminal 36 which is in contact with the lead 52 of the semiconductor element 50 to be inspected. The socket terminal 36 is electrically connected to a tester (not shown) via the terminal connection wire 38.

First, a process of lifting the semiconductor device 50 from the carrier module 28 of the test tray 26 using the carrier device 10 configured as described above will be briefly described.

As shown in FIG. 4A, when the test tray 26 holding the semiconductor element 50 is transferred to a predetermined position by a transfer device (not shown), the carrier device 10 is placed above the test tray 26. Move. At this time, in order to lift the semiconductor device 50 from the carrier module 28 of the test tray 26 using the carrier device 10 to check the performance of the semiconductor device 50, one side of the air cylinder 16 is provided. Air is supplied into the air cylinder 16 through the formed air inlet 22a. The rod 18 then extends downward, whereby the adsorption pad 20 approaches the semiconductor element 50 and abuts on the surface of the semiconductor element 50. At this time, the semiconductor element 50 is adsorbed on the adsorption pad 20.

Under this condition, when the pressurized air is supplied into the air cylinder 16 through the air inlet 22b, the rod 18 moves upward. As a result, the semiconductor element 50 is lifted from the carrier module 28 of the test tray 26. Under this condition, the air chuck units 14a and 14b are moved to the test head 30 by the drive head 12, and then positioned perpendicularly to the inspection table PB 32 disposed on the test head 30. do.

Next, the process of loading the semiconductor device 50 into the socket 34 on the inspection table (PB) 32 using the carrier device 10 as described above will be briefly described.

First, in order to position the semiconductor device 50 in the socket 34 using the carrier device 10, air is supplied into the air cylinder 16 through an air inlet 22a formed at one side of the air cylinder 16. . The rod 18 then extends downward. At this time, the adsorption pad 20 which temporarily adsorbs the semiconductor element 50 includes a socket terminal 36 in which the lead 52 of the semiconductor element 50 is provided in the socket 34 on the inspection table (PB) 32. Progressive access is made toward the socket 34 until contact is made. When the lead 52 of the semiconductor element 50 comes into contact with the socket terminal 36, the operation of the air pump connected to the air inlet 24 of the air cylinder 16 is stopped. Then, the semiconductor element 50 is left in the socket 34 and the rod 18 moves upward.

When the performance test of the semiconductor device 50 is completed on the inspection table (PB) 32 disposed on the test head 30, the semiconductor device 50 is transferred from the carrier module 28 of the test tray 26 to the semiconductor device ( 50 is lifted from the socket 34 in the same manner as the lifting method, and is transported by the conveying device onto an initial position on the test tray 26 or on another test tray.

By the way, when loading the semiconductor element 50 into the socket 34 on the test stand PB 32 using the carrier apparatus 10 comprised as mentioned above, air chuck units 14a and 14b which consist of air cylinders. In this case, the semiconductor element 50 is brought into contact with the socket 34 at a fixed pressure. Therefore, there is a drawback that the semiconductor devices of different types cannot be properly responded to. In addition, when the semiconductor element 50 and the socket 34 are not in a parallel state, since the contact pressure is transmitted only to a predetermined portion of the semiconductor element 50, a stress is applied to the semiconductor element 50 so that the semiconductor element 50 is provided. There is a problem that the socket 34 causes deformation. As a result, wrong results can be produced that are different from the desired results.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a test apparatus for inspecting the characteristics and performance of a semiconductor device, the contact of when the semiconductor device to be tested is brought into contact with the socket of the tester. Faster speed reduces the indexing time of the inspection device and minimizes the stress on the semiconductor device and the socket, thereby preventing damage to the semiconductor device or the socket, thereby increasing the stability and reliability of the semiconductor device. It is to provide a contact force control device.

1 is a perspective view of a contact force control device between a semiconductor device and a tester socket according to a preferred embodiment of the present invention;

Figure 2 is an exploded perspective view of the contact force control device shown in Figure 1,

3 is a view showing a state in which the contact force control device shown in FIG. 1 is positioned to face perpendicular to the tester socket;

4A is a view showing a relationship between an air chuck unit and a test tray according to the prior art; and

Figure 4b is a view showing the relationship between the air chuck unit and the tester socket according to the prior art.

<Explanation of symbols for main parts of drawing>

10 carrier device 12 drive head

14a, 14b: Air chuck unit 30,250: Test head

32,152: Inspection table 34,154: Socket

50 semiconductor device 100 contact force control device

102: AC servo motor 106: motor pulley

108: belt 110: AC servo motor assembly

200: press unit assembly 210: screw assembly

211: pulley 212: ball screw

214: support bracket 216: ball screw nut

220: drive assembly 222: horizontal plate

224: vertical axis 226: shaft guide housing

228: join block 230: pressure plate

232: tray pusher 234: contact position correction device

236: stopper 240: test tray

In order to achieve the above object, the present invention,

An AC servo motor, a first power transmission means connected to the AC servo motor and rotating, and a fixing bracket for fixing the AC servo motor and the first power transmission means, and operating based on a pre-input control value. And an AC servo motor assembly for generating rotational kinetic energy suitable for quickly and smoothly contacting the semiconductor device to be tested to the tester socket;

A press unit assembly configured to receive the rotational kinetic energy generated from the AC servo motor assembly to quickly and smoothly contact the semiconductor device with the tester socket; And

A second power transmission means disposed between the first power transmission means of the AC servo motor assembly and the press unit assembly, the second power transmission means for transferring the rotational kinetic energy generated from the AC servo motor assembly to the press unit assembly. It provides a contact force control device between the semiconductor device and the tester socket.

As described above, according to the present invention, by using a press unit assembly which generates rotational kinetic energy suitable for quickly and smoothly contacting a semiconductor element to a tester socket through an AC servo motor assembly, and operates according to the rotational kinetic energy. The semiconductor device is optimally brought into contact with the tester socket.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a contact force control device between a semiconductor device and a tester socket according to a preferred embodiment of the present invention, Figure 2 is an exploded perspective view of the contact force control device shown in FIG.

1 and 2, the contact force control device 100 between the semiconductor device and the tester socket according to the present invention mainly includes an AC servo motor assembly 110 and a press unit assembly 200.

First, the AC servo motor assembly 110 generates a predetermined pressure for smooth contact between the semiconductor element and the tester socket and precisely controls the contact therebetween. To this end, the AC servo motor assembly 110 includes an AC servo motor 102. The AC servo motor 102 is fixed by the motor bracket 104, and the motor pulley 106 is connected to the upper portion of the AC servo motor 102 to rotate. The AC servo motor 102 is connected to the press unit assembly 200 through a belt 108 that is connected to the motor pulley 106. The AC servo motor 102 controls the operation of the press unit assembly 200 through the belt 108 on the basis of the previously input control value.

Next, the press unit assembly 200 mainly includes a screw assembly 210 and a drive assembly 220. The screw assembly 210 receives the rotational kinetic energy from the AC servo motor 102 and converts the rotational kinetic energy into linear kinetic energy to move the driving assembly 220 up and down. To this end, the screw assembly 210 has a pulley 211, a ball screw 212, a support bracket 214 and a ball screw nut 216 for supporting the pulley 211 and the ball screw 212.

The belt 108 is connected to the pulley 211 of the screw assembly 210. Accordingly, the belt 108 extends between the motor pulley 106 of the AC servo motor 102 and the pulley 211 of the screw assembly 210 and screws the rotational kinetic energy generated by the AC servo motor assembly 110. Transfer to assembly 210. The ball screw 212 receives the rotational kinetic energy provided from the AC servo motor assembly 110 through the belt 108 and the pulley 211. The ball screw 212 moves the ball screw nut 216 while rotating with the pulley 211 by the transmitted rotational kinetic energy. The ball screw nut 216 is fixed to the horizontal plate 222 of the drive assembly 220 and receives the ball screw 212 to guide the vertical movement of the ball screw 212. That is, the ball screw nut 216 moves the drive assembly 220 up and down when the ball screw 212 is raised or lowered simultaneously with the rotation in the ball screw nut 216.

The drive assembly 220 includes a horizontal plate 222, a vertical shaft 224, a shaft guide housing 226, a join block 228, a pressure plate 230, a tray pusher 232, and a contact position correcting device 234 of a semiconductor device. ).

The horizontal plate 222 is connected to and fixed to the ball screw nut 214 of the screw assembly 210. The horizontal plate 222 pushes or lifts the vertical axis 224 downward according to the movement of the ball screw 212 in the ball screw nut 214. The vertical axis 224 extends between the horizontal plate 222 and the join block 228 and serves as a support. The shaft guide housing 226 has a vertical shaft 224 therein, and interrupts vertical movement of the vertical shaft 224. The join block 228 extends horizontally between the vertical shafts 224, supports the vertical shafts 224, and connects the vertical shafts 224 and the pressure plate 230 to each other. The pressure plate 230 is connected to the join block 228 and the contact position correcting device 234 of the semiconductor element, and transmits a lifting pressure to the stopper 236 of the contact position correcting device 234.

3 is a view showing a state in which the contact force control device shown in FIG. 1 is positioned to face perpendicular to the tester socket.

Referring to FIG. 3, tray pushers 232 are mounted at both ends of the pressure plate 230 and extend downward by a predetermined length. The tray pusher 232 is a press unit with a tray 240 holding a semiconductor element (not shown) under the tray pusher 232 by a transfer device (not shown) to check the characteristics and performance of the semiconductor element. When the assembly 200 is operating, it is lowered vertically to press the upper surface of the tray 240.

The operation process of the contact force control device 100 between the semiconductor device configured as described above and the tester socket will be described briefly as follows.

First, a test tray 240 holding a semiconductor device (not shown) is used to inspect the characteristics and performance of the finished semiconductor device by means of a transfer device (not shown). When transferred to a predetermined position perpendicular to the socket 254 located on the 252, the AC servo motor 102 of the AC servo motor assembly 110 is based on the pre-input control value and the semiconductor element and the socket. Generate rotational kinetic energy for contact between 254.

The generated rotational kinetic energy is transmitted to the screw assembly 210 of the press unit assembly 200 through the belt 108 connected to the motor pulley 106. At this time, the AC servo motor 102 rotates the motor pulley 106 clockwise, and accordingly, the pulley 211 of the screw assembly 210 connected to the motor pulley 106 through the belt 108 also rotates clockwise. Done. Then, the ball screw 212 supported by the support bracket 214 receives the rotational kinetic energy provided from the AC servo motor assembly 110 through the belt 108 and the pulley 211. Thereby, the ball screw 212 moves the ball screw nut 214 while rotating clockwise with the pulley 211. At this time, the rotational kinetic energy provided from the AC servo motor assembly 110 is converted into linear kinetic energy.

Next, the ball screw nut 214 fixed to the horizontal plate 222 of the drive assembly 220 pushes the horizontal plate 222 downward. Then, the vertical axis 224 extending between the horizontal plate 222 and the join block 228 is lowered. When the vertical axis 224 is lowered, the pressure plate 230 connected to the vertical axis 224 by the join block 228 is also lowered, the tray pusher 232 mounted at both ends of the pressure plate 230 is the test tray 240 Press) downward. At the same time, the contact position correction device 234 mounted on the pressure plate 230 is the upper surface of the carrier module (not shown) loaded on the test tray 240 through the pusher 268 as the pressure plate 230 is lowered Press.

As a result, the semiconductor device accommodated in the carrier module of the test tray 240 is positioned on the socket 254 of the test head 250 to be inspected. When the performance test of the semiconductor device is completed in the test table (PB) 252 disposed on the test head 250, the press unit assembly 200 of the contact force control device 100 moves upward from the test table (PB) 252. The test tray 240 holding the semiconductor element is removed from the inspection table (PB) 252 by the transfer device. That is, the AC servo motor 102 of the AC servo motor assembly 110 rotates the motor pulley 106 counterclockwise, so that the pulley 211 of the screw assembly 210 also rotates counterclockwise.

Then, the ball screw 212 supported by the support bracket 214 receives the rotational kinetic energy provided from the AC servo motor assembly 110 through the belt 108 and the pulley 211. Thereby, the ball screw 212 moves upward in the ball screw nut 214 while rotating counterclockwise with the pulley 211. At this time, the rotational kinetic energy provided from the AC servo motor assembly 110 is converted into linear kinetic energy.

Thus, the vertical axis 224 extending between the horizontal plate 222 and the join block 228 is raised. When the vertical axis 224 rises, the pressure plate 230 connected to the vertical axis 224 by the join block 228 also rises. Then, the tray pushers 232 mounted at both ends of the pressure plate 230 are raised to move away from the test tray 240.

As mentioned above, according to the present invention, the AC servo motor assembly 110 and the AC generate a rotational kinetic energy suitable for quick and smooth contact of the semiconductor element with the tester socket while operating based on a pre-input control value. The press unit assembly 200 for receiving the rotational kinetic energy generated from the servo motor assembly 110 to quickly and smoothly contact the semiconductor element with the tester socket, thereby inspecting the semiconductor element for the characteristics and performance of the manufactured semiconductor element. When the contact with the socket of the tester to advance the semiconductor device to the contact position at high speed can reduce the index time of the semiconductor device inspection equipment.

In addition, since the driving force of the AC servo motor can be properly controlled when the semiconductor element is in contact with the tester socket, it can be applied to other types of semiconductor elements such as μBGA, and the contact pressure is distributed according to the number of leads of the semiconductor element. By applying an equal contact pressure to the entire semiconductor device, it is possible to minimize the stress transmitted to the semiconductor device to prevent damage and deformation of the semiconductor device or the socket, and to perform a highly reliable and reliable inspection.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

Claims (6)

An AC servo motor, a first power transmission means connected to the AC servo motor and rotating, and a fixing bracket for fixing the AC servo motor and the first power transmission means, and operating based on a pre-input control value. And an AC servo motor assembly for generating rotational kinetic energy suitable for quickly and smoothly contacting the semiconductor device to be tested to the tester socket; A press unit assembly configured to receive the rotational kinetic energy generated from the AC servo motor assembly to quickly and smoothly contact the semiconductor device with the tester socket; And A second power transmission means disposed between the first power transmission means of the AC servo motor assembly and the press unit assembly, the second power transmission means for transferring the rotational kinetic energy generated from the AC servo motor assembly to the press unit assembly. A contact force control device between the semiconductor device and the tester socket. The press unit assembly of claim 1, wherein the press unit assembly comprises: a screw assembly for converting the rotational kinetic energy into linear kinetic energy; and receiving the linear kinetic energy from the screw assembly and vertically moving the semiconductor element to the tester socket. A contact force control device between a semiconductor device and a tester socket comprising a drive assembly for contacting. 3. The screw assembly of claim 2, wherein the screw assembly comprises: a third power transmission means connected to the first power transmission means through the second power transmission means, a ball screw connected to the third power transmission means and rotating; 3, a contact bracket for supporting the ball screw and a ball screw nut for receiving the ball screw and guiding the up and down movement of the ball screw. . 4. The drive assembly according to claim 3, wherein the drive assembly is provided with a horizontal plate for fixing the ball screw nut, installed downwardly from the bottom of the ball screw nut, and in accordance with the movement of the ball screw in the ball screw nut. A plurality of vertical shafts vertically moving by the horizontal plate, a plurality of shaft guide housings for embedding the vertical shafts and intermittent vertical movements of the vertical shafts, join blocks extending horizontally between the vertical shafts and supporting the vertical shafts; A semiconductor device comprising a contact plate correction device of a semiconductor device is inserted into the fixing plate formed in the pressing plate, the pressure plate is connected to the vertical axis by a join block, and receives the lifting pressure through the pressure plate. Contact force control between the tester and the tester socket. The apparatus of claim 4, wherein the pressure plate includes tray pushers mounted at both ends of the lower side of the pressure plate and extended downwardly by a predetermined length, and the tray pushers are disposed by the transfer device for inspection of the semiconductor device. And pressing down the upper surface of the tray when the press unit assembly is operated while the tray holding the semiconductor element is positioned under the pusher. 4. The semiconductor device and tester socket of claim 3, wherein the first power transmission means comprises a motor pulley, the second power transmission means comprises a belt, and the third power transmission means comprises a pulley. Contact force control device.