KR19990033219A - Leadframe of Semiconductor Package - Google Patents
Leadframe of Semiconductor Package Download PDFInfo
- Publication number
- KR19990033219A KR19990033219A KR1019970054514A KR19970054514A KR19990033219A KR 19990033219 A KR19990033219 A KR 19990033219A KR 1019970054514 A KR1019970054514 A KR 1019970054514A KR 19970054514 A KR19970054514 A KR 19970054514A KR 19990033219 A KR19990033219 A KR 19990033219A
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- lead
- dam bar
- thickness
- semiconductor package
- mounting plate
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 반도체 패키지의 리드프레임에 관한 것으로, 리드프레임의 댐바 두께를 리드의 두께 보다 얇게 형성하여 반도체 패키지의 몰딩 공정시 에어가 빠져나갈 수 있는 에어벤트의 역할을 할 수 있도록 함으로서 보이드의 발생을 방지하여 불량을 없애고, 신뢰성을 향상 시킬 수 있도록 된 것이다.The present invention relates to a lead frame of a semiconductor package, wherein the dam bar thickness of the lead frame is formed to be thinner than the thickness of the lead, so that the voids can be generated by acting as an air vent through which air can escape during the molding process of the semiconductor package. It prevents defects and improves reliability.
Description
본 발명은 반도체 패키지의 리드프레임에 관한 것으로, 더욱 상세하게는 반도체 패키지의 몰딩 공정시 에어가 빠져나갈 수 있는 에어벤트의 역할을 할 수 있도록 리드프레임의 댐바 두께를 리드의 두께 보다 얇게 형성함으로서 보이드의 발생을 방지하여 불량을 없애고, 신뢰성을 향상 시킬 수 있도록 된 것이다.The present invention relates to a lead frame of a semiconductor package, and more particularly, to form a dam bar thickness of the lead frame to be thinner than the lead thickness so as to act as an air vent through which air can escape during the molding process of the semiconductor package. This prevents the occurrence of defects and improves reliability.
일반적으로 반도체 패키지의 리드프레임은 도 1과 도 2에 도시된 바와 같이 중앙부에 반도체칩(1)이 부착될 수 있도록 형성된 탑재판(2)과, 상기 탑재판(2)의 각 모서리부에 일체로 형성되어 탑재판(2)을 지지 고정하는 타이바(3)와, 상기 탑재판(2)의 외부 둘레에 배열되어 반도체칩(1)의 신호를 전달하도록 와이어로 연결되는 내부리드(4a) 및 상기 내부리드(4a)로 전달된 신호를 외부로 전달하도록 상기한 내부리드(4a)의 외측으로 연장된 외부리드(4b)로 이루어진 복수개의 리드(4)와, 상기한 리드(4)의 외부리드(4b)와 내부리드(4a)의 경계선상에 위치되며 몰딩 공정시 봉지재의 누출을 방지하도록 리드(4)의 두께와 동일한 두께로 각 리드(4)와 리드(4) 사이에 연결 형성된 댐바(5)로 이루어진다.In general, the lead frame of the semiconductor package includes a mounting plate 2 formed to attach the semiconductor chip 1 to a central portion thereof, as shown in FIGS. 1 and 2, and integrated at each corner of the mounting plate 2. A tie bar 3 formed to support and fix the mounting plate 2, and an inner lead 4a arranged around the outer periphery of the mounting plate 2 and connected by a wire to transmit a signal of the semiconductor chip 1; And a plurality of leads 4 made up of an outer lead 4b extending outward of the inner lead 4a so as to transmit a signal transmitted to the inner lead 4a to the outside, It is located on the boundary between the outer lead 4b and the inner lead 4a and is connected between each lead 4 and the lead 4 in the same thickness as the lead 4 to prevent leakage of the encapsulant during the molding process. It consists of a dam bar (5).
이와 같이 리드(4)와 리드(4) 사이에 연결 형성된 댐바(5)는 리드(4)를 잡아줄 수 있게 하고, 반도체 패키지의 제조 공정 중 취급 부주의에 의한 리드(4)의 변형을 방지할 수 있는 것이다. 또한, 상기한 댐바(5)는 봉지재를 이용하여 외부의 충격 및 접촉으로부터 보호하고 외관상 제품의 형태를 만들기 위해 일정한 모양으로 성형하는 몰딩 공정에서 상기한 봉지재가 패키지의 성형부위 외곽(패키지가 성형되는 영역의 외부)으로 누출되는 것을 차단시키는 댐(Dam)의 역할을 하는 것이다. 즉, 상기한 댐바(5)는 리드(4)와 리드(4) 사이로 충진되는 봉지재의 누출을 차단시키는 것이다.Thus, the dam bar 5 formed between the lead 4 and the lead 4 can hold the lead 4 and prevent deformation of the lead 4 due to careless handling during the manufacturing process of the semiconductor package. It can be. In addition, the dam bar (5) in the molding process to protect from the impact and contact from the outside using an encapsulant and to form a certain shape in order to make the appearance of the product appearance of the encapsulant (package is molded) It acts as a dam to block leakage to the outside of the area). That is, the dam bar 5 blocks the leakage of the encapsulant filled between the lead 4 and the lead 4.
또한, 봉지재에 의해 패키지의 성형이 완료된 반도체 패키지는 반도체칩(1)의 회로적 신호가 리드(4)를 통해 외부로 출력될 때 각 리드(4)와 리드(4) 사이에 연결되어진 댐바(5)에 의해 쇼트(Short)되는 것을 방지하기 위하여 트림 공정에서 상기한 댐바(5)를 제거시키는 것이다.In addition, the semiconductor package in which the molding of the package is completed by the encapsulant has a dam bar connected between the leads 4 and the leads 4 when the circuit signal of the semiconductor chip 1 is output to the outside through the leads 4. The dam bar 5 is removed in the trimming process in order to prevent shorting by (5).
상기와 같이 봉지재로 몰딩시 상금형(6a)과 하금형(6b)의 내부에 위치한 에어를 외부로 빼내기 위해서는 에어벤트가 형성되는데, 종래에는 상기한 에어벤트를 형성하기 위한 공간이 한정되었던 것이다. 따라서, 봉지재로 몰딩시 상금형(6a)과 하금형(6b)의 내부에 위치한 에어가 용이하게 빠지지 못하여 패키지지 성형후 보이드가 발생되어 불량이 생기는 문제점이 있었던 것이다.As described above, an air vent is formed to draw out the air located inside the upper mold 6a and the lower mold 6b to the outside when molding with an encapsulant, and the space for forming the air vent is limited in the related art. . Therefore, the air inside the upper mold (6a) and the lower mold (6b) is not easily released when molding with the encapsulant, there is a problem that a void occurs after molding the package is generated.
본 발명의 목적은 이와 같은 문제점을 해소하기 위하여 발명된 것으로서, 리드프레임의 댐바 두께를 리드의 두께 보다 얇게 형성하여 반도체 패키지의 몰딩 공정시 에어가 빠져나갈 수 있는 에어벤트의 역할을 할 수 있도록 함으로서 보이드의 발생을 방지하여 불량을 없애고, 신뢰성을 향상 시킬 수 있도록 된 반도체 패키지의 리드프레임을 제공함에 있다.An object of the present invention is to invent such a problem, by forming the thickness of the dam bar of the lead frame thinner than the thickness of the lead to act as an air vent that can escape the air during the molding process of the semiconductor package It is to provide a lead frame of a semiconductor package that can prevent the generation of voids to eliminate defects and improve reliability.
도 1은 일반적인 리드프레임 구조를 나타낸 평면도1 is a plan view showing a typical leadframe structure
도 2는 도 1의 "A"부를 확대한 사시도2 is an enlarged perspective view of part “A” of FIG. 1;
도 3은 종래 반도체 패키지의 몰딩 상태를 설명하는 도면3 is a view illustrating a molding state of a conventional semiconductor package.
도 4는 본 발명에 따른 리드프레임 구조의 요부를 나타낸 사시도Figure 4 is a perspective view showing the main portion of the lead frame structure according to the present invention
도 5는 도 4의 B-B선 단면도5 is a cross-sectional view taken along the line B-B of FIG.
도 6은 본 발명에 따른 리드프레임의 실시예를 나타낸 단면도6 is a cross-sectional view showing an embodiment of a lead frame according to the present invention.
도 7은 본 발명에 따른 리드프레임의 다른 실시예를 나타낸 단면도Figure 7 is a cross-sectional view showing another embodiment of a lead frame according to the present invention
도 8은 본 발명에 따른 반도체 패키지의 몰딩 상태를 설명하기 위한 도면8 is a view for explaining a molding state of a semiconductor package according to the present invention.
- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-
1 - 반도체칩 2 - 탑재판1-semiconductor chip 2-mounting plate
3 - 타이바 4a - 내부리드3-tie bar 4a-internal lead
4b - 외부리드 4 - 리드4b-External Lead 4-Lead
5 - 댐바 5' - 공간부5-Dambar 5 '-Space
6a - 상금형 6b - 하금형6a-Upper die 6b-Lower die
이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 발명에 따른 반도체 패키지의 리드프레임은 중앙부에 반도체칩(1)이 부착될 수 있도록 형성된 탑재판(2)과, 상기 탑재판(2)의 각 모서리부에 일체로 형성되어 탑재판(2)을 지지 고정하는 타이바(3)와, 상기 탑재판(2)의 외부 둘레에 배열되어 반도체칩(1)의 신호를 전달하도록 와이어로 연결되는 내부리드(4a) 및 상기 내부리드(4a)로 전달된 신호를 외부로 전달하도록 상기한 내부리드(4a)의 외측으로 연장된 외부리드(4b)로 이루어진 복수개의 리드(4)와, 상기한 리드(4)의 외부리드(4b)와 내부리드(4a)의 경계선상에 위치되며 몰딩 공정시 봉지재의 누출을 방지하도록 각 리드(4)와 리드(4) 사이에 연결 형성된 댐바(5)로 이루어진 반도체 패키지의 리드프레임에 있어서, 상기한 댐바(5)는 반도체 패키지의 몰딩 공정시 에어가 빠져나갈 수 있는 에어벤트의 역할을 할 수 있도록 댐바(5)의 두께를 리드(4)의 두께 보다 얇게 형성하여서 된 것이다.The lead frame of the semiconductor package according to the present invention includes a mounting plate 2 formed to attach the semiconductor chip 1 to a central portion thereof, and a mounting plate 2 integrally formed at each corner of the mounting plate 2. A tie bar 3 for supporting and fixing the inner rod 4a and an inner lead 4a arranged around an outer circumference of the mounting plate 2 and connected by wires so as to transmit a signal of the semiconductor chip 1. A plurality of leads 4 made of an outer lead 4b extending outwardly of the inner lead 4a so as to transmit a transmitted signal to the outside, and an outer lead 4b and an inner lead of the lead 4 A lead frame of a semiconductor package comprising a dam bar 5 positioned on the boundary of 4 a and connected between each lead 4 and the lead 4 so as to prevent leakage of an encapsulant during a molding process, wherein the dam bar ( 5) acts as an air vent that can escape the air during the molding process of the semiconductor package The thickness of the dam bar 5 is formed to be thinner than the thickness of the lead 4 so that it can be.
이와 같이 상기한 댐바(5)의 두께를 리드(4)의 두께 보다 얇게 형성하는 것은 도 4와 도 5에서와 같이 상기한 댐바(5)의 상.하부를 스탬핑(Stamping)이나 하프 에칭(Half Etching)하여 공간부(5')를 형성함으로서 리드(4)의 두께 보다 얇게 형성할 수 있다. 또한, 도 6에서와 같이 상기한 댐바(5)의 상부만을 하프 에칭하여 공간부(5')를 형성할 수 있고, 도 7에서와 같이 상기한 댐바(5)의 하부만을 하프 에칭하여 공간부(5')를 형성할 수 있다.As described above, forming the thickness of the dam bar 5 to be thinner than the thickness of the lead 4 may be stamped or half-etched on the upper and lower portions of the dam bar 5 as shown in FIGS. 4 and 5. It can be formed thinner than the thickness of the lead 4 by forming the space portion (5 ') by etching. In addition, as shown in FIG. 6, only the upper portion of the dam bar 5 may be half-etched to form the space portion 5 ′. As shown in FIG. 7, only the lower portion of the dam bar 5 may be half-etched to form the space portion. (5 ') can be formed.
이와 같이 스탬핑이나 하프 에칭에 의해 형성된 댐바(5)의 공간부는 리드(4) 두께의 절반 정도로 형성되어 상금형(6a)과 하금형(6b)의 클램핑시에는 0.3∼2mil 이하가 되는 것이 바람직하다.Thus, it is preferable that the space portion of the dam bar 5 formed by stamping or half etching is formed to about half the thickness of the lead 4 so that the clamping of the upper mold 6a and the lower mold 6b is 0.3 to 2 mil or less. .
이러한 본 발명의 리드프레임은 봉지재로 몰딩시 상금형(6a)과 하금형(6b)의 내부에 위치한 에어를 외부로 빼내기 위해서는 에어벤트가 형성되어 있으며, 본 발명에 따른 리드프레임을 사용하게 되면 도 8에 도시된 바와 같이 상기한 댐바(5)의 공간부(5')로 에어는 빠지고, 봉지재는 누출되지 않음으로서 에어벤트의 역할과 댐(Dam)의 역할을 동시에 수행할 수 있는 것이다. 즉, 봉지재로 몰딩시 상금형(6a)과 하금형(6b)의 내부에 위치한 에어가 상기한 댐바(5)의 공간부(5')로 용이하게 빠져나감으로서 패키지 성형후 보이드의 발생을 방지할 수 있는 것이다.The lead frame of the present invention is formed with an air vent in order to withdraw the air located in the upper mold (6a) and the lower mold (6b) to the outside when molding with an encapsulant, and when using the lead frame according to the present invention As shown in FIG. 8, the air is discharged to the space portion 5 ′ of the dam bar 5, and the encapsulant does not leak, thereby simultaneously serving as the air vent and the dam. That is, when molding with an encapsulant, the air located inside the upper mold 6a and the lower mold 6b easily escapes into the space 5 'of the dam bar 5, thereby preventing the generation of voids after package molding. It can be prevented.
이와 같이 댐바(5)의 공간부(5')로 에어는 빠지고, 봉지재는 누출되지 않는 것은 상기한 봉지재의 성분 중에는 점성을 높여주는 물질이 함유되어 있어서 상금형(6a)과 하금형(6b)의 클램핑시에 상기한 댐바(5)의 공간부(5')에 의해 형성되는 0.3∼2mil 이하의 공간부로는 이러한 봉지재의 누출을 차단할 수 있는 것이다.In this way, the air is released to the space portion 5 'of the dam bar 5, and the encapsulant does not leak. The components of the encapsulant include a material that improves viscosity, and thus the upper mold 6a and the lower mold 6b. At the time of clamping, the space portion of 0.3 to 2 mils or less formed by the space portion 5 'of the dam bar 5 can prevent leakage of such encapsulant.
또한, 봉지재에 의해 패키지의 성형이 완료된 반도체 패키지는 반도체칩(1)의 회로적 신호가 리드(4)를 통해 외부로 출력될 때 각 리드(4)와 리드(4) 사이에 연결되어진 댐바(5)에 의해 쇼트(Short)되는 것을 방지하기 위하여 트림 공정에서 상기한 댐바(5)를 제거시킬 때 상기한 댐바(5)의 두께가 얇음으로서 보다 용이하게 댐바(5)를 제거할 수 있는 것이다.In addition, the semiconductor package in which the molding of the package is completed by the encapsulant has a dam bar connected between the leads 4 and the leads 4 when the circuit signal of the semiconductor chip 1 is output to the outside through the leads 4. When the dam bar 5 is removed in the trimming process in order to prevent shorting by (5), the thickness of the dam bar 5 is thin so that the dam bar 5 can be easily removed. will be.
이상의 설명에서 알 수 있듯이 본 발명에 따른 반도체 패키지의 리드프레임에 의하면, 리드프레임의 댐바 두께를 리드의 두께 보다 얇게 형성함으로서 몰딩 공정시 에어벤트의 역할을 할 수 있도록 하여 보이드의 발생을 방지하고, 불량을 없애며, 신뢰성을 향상시킬 수 있는 효과가 있다.As can be seen from the above description, according to the lead frame of the semiconductor package according to the present invention, by forming a thickness of the dam bar of the lead frame to be smaller than the thickness of the lead, it is possible to act as an air vent during the molding process, thereby preventing the generation of voids, Eliminates defects and has the effect of improving reliability.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970054514A KR100273698B1 (en) | 1997-10-23 | 1997-10-23 | Lead frame of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970054514A KR100273698B1 (en) | 1997-10-23 | 1997-10-23 | Lead frame of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990033219A true KR19990033219A (en) | 1999-05-15 |
| KR100273698B1 KR100273698B1 (en) | 2000-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970054514A KR100273698B1 (en) | 1997-10-23 | 1997-10-23 | Lead frame of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100273698B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102514564B1 (en) * | 2021-06-28 | 2023-03-29 | 해성디에스 주식회사 | Lead frame including grooved lead |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637231A (en) * | 1992-07-17 | 1994-02-10 | Hitachi Ltd | Lead frame and resin molded semiconductor device using the same |
| JPH0846130A (en) * | 1994-07-29 | 1996-02-16 | Toppan Printing Co Ltd | Lead frame |
-
1997
- 1997-10-23 KR KR1019970054514A patent/KR100273698B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
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| KR100273698B1 (en) | 2000-12-15 |
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