KR19990031361A - Semiconductor wafer - Google Patents

Semiconductor wafer Download PDF

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Publication number
KR19990031361A
KR19990031361A KR1019970052045A KR19970052045A KR19990031361A KR 19990031361 A KR19990031361 A KR 19990031361A KR 1019970052045 A KR1019970052045 A KR 1019970052045A KR 19970052045 A KR19970052045 A KR 19970052045A KR 19990031361 A KR19990031361 A KR 19990031361A
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KR
South Korea
Prior art keywords
semiconductor wafer
scrap line
device name
present
dies
Prior art date
Application number
KR1019970052045A
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Korean (ko)
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KR100266013B1 (en
Inventor
홍순호
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구본준
엘지반도체 주식회사
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Application filed by 구본준, 엘지반도체 주식회사 filed Critical 구본준
Priority to KR1019970052045A priority Critical patent/KR100266013B1/en
Publication of KR19990031361A publication Critical patent/KR19990031361A/en
Application granted granted Critical
Publication of KR100266013B1 publication Critical patent/KR100266013B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Dicing (AREA)

Abstract

본 발명에 따른 반도체 웨이퍼는 특정회로나 메모리가 형성된 다수개의 다이와, 상기 각각의 다이를 구분지어주는 스크랩 라인이 형성되며, 상기 반도체 웨이퍼 전면의 스크랩 라인을 이용하여 소자명칭을 형성하여 반도체 생산공정중 작업자가 정상 시력으로도 소자의 종류를 쉽게 확인할 수 있으므로 다음공정으로의 진행이 원할하여 작업능률을 향상 시킬수 있다.In the semiconductor wafer according to the present invention, a plurality of dies in which a specific circuit or a memory is formed and a scrap line for distinguishing each die are formed, and a device name is formed by using a scrap line on the front surface of the semiconductor wafer. The operator can easily check the type of device even with normal eyesight, so it is easy to proceed to the next process, thereby improving work efficiency.

Description

반도체 웨이퍼Semiconductor wafer

본 발명은 반도체 웨이퍼에 관한 것으로서, 특히, 현미경을 사용하지 않은 정상의 시력으로도 제조되는 반도체소자의 종류를 쉽게 확인할 수 있는 반도체 웨이퍼에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, and more particularly, to a semiconductor wafer capable of easily identifying the kind of semiconductor device manufactured even under normal vision without using a microscope.

제 1 도는 종래의 반도체 웨이퍼의 평면도이고, 제 2 도는 제 1도의 소자명칭 확대도이다.1 is a plan view of a conventional semiconductor wafer, and FIG. 2 is an enlarged view of device names of FIG.

종래의 반도체 웨이퍼(10)는 특정회로나 메모리가 형성된 다수개의 다이(11)와, 상기 각각의 다이(11)를 구분지어주는 스크랩 라인(12)과, 반도체 웨이퍼(10)의 하부에 현미경으로 확대하여야 확인이 가능한 작은 글자로 소자명칭(13)을 형성한다.The conventional semiconductor wafer 10 includes a plurality of dies 11 formed with a specific circuit or memory, a scrap line 12 separating the dies 11, and a microscope under the semiconductor wafer 10. Form the device name 13 in small letters that can be confirmed by expanding.

그러나 상기 종래의 반도체 웨이퍼는 반도체 생산공정중 작업자가 제품의 종류를 확인하기 위해서는 현미경을 사용해야만 하므로 여러가지 다른 제품의 반도체 웨이퍼를 분류하기에 번거러우며 작업능률이 떨어지는 문제점을 가진다.However, the conventional semiconductor wafer has a problem in that it is cumbersome to classify the semiconductor wafers of various other products and the work efficiency is low because the operator must use a microscope to check the type of the product during the semiconductor production process.

따라서, 본 발명의 목적은 상기 종래의 문제점을 해결하여 정상의 시력으로도 여러가지 다른 제품의 반도체 웨이퍼를 분류할 수 있도록 소자명칭을 표기하는 반도체 웨이퍼를 제공함에 있다.Accordingly, an object of the present invention is to provide a semiconductor wafer in which the device name is indicated so that the conventional problems can be solved and the semiconductor wafers of various other products can be classified even with normal vision.

상기 목적을 달성하기 위한 본 발명에 따른 반도체 웨이퍼는 특정회로나 메모리가 형성된 다수개의 다이와, 상기 각각의 다이를 구분지어주는 스크랩 라인이 형성되며, 상기 반도체 웨이퍼 전면의 스크랩 라인을 이용하여 소자명칭을 형성한다.In order to achieve the above object, a semiconductor wafer according to the present invention includes a plurality of dies on which a specific circuit or a memory is formed, and a scrap line for distinguishing each die is formed, and the device name is defined using a scrap line on the front surface of the semiconductor wafer. Form.

제 1 도는 종래의 반도체 웨이퍼의 평면도1 is a plan view of a conventional semiconductor wafer

제 2 도는 제 1도의 소자명칭 확대도2 is an enlarged view of device names of FIG. 1

제 3 도는 본 발명에 따른 반도체 웨이퍼의 평면도3 is a plan view of a semiconductor wafer according to the present invention.

제 4 도는 제 3 도의 A부분 확대도4 is an enlarged view of portion A of FIG.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 종래의 반도체 웨이퍼 20 본 발명에 따른 반도체 웨이퍼10 Conventional semiconductor wafer 20 Semiconductor wafer according to the present invention

11, 21 다이 12, 22 스크랩 라인11, 21 die 12, 22 scrap lines

13, 23 소자명칭 24 금속13, 23 Device name 24 Metal

이하, 첨부한 도면을 참고하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

제 3 도는 본 발명에 따른 반도체 웨이퍼의 평면도이고, 제 4 도는 제 3 도의 A부분 확대도이다.3 is a plan view of a semiconductor wafer according to the present invention, and FIG. 4 is an enlarged view of portion A of FIG.

본 발명의 반도체 웨이퍼(20)는 특정회로나 메모리가 형성된 다수개의 다이(21)와, 상기 각각의 다이(21)를 구분지어주는 스크랩 라인(22)이 형성되며, 상기 반도체 웨이퍼 전면의 스크랩 라인(22)을 이용하여 정상 시력으로도 확인 할 수 있는 크기의 글자로 소자명칭(23)을 형성한다.In the semiconductor wafer 20 of the present invention, a plurality of dies 21 in which a specific circuit or a memory is formed and a scrap line 22 that separates the dies 21 are formed, and a scrap line in front of the semiconductor wafer is formed. Using (22) to form a device name (23) with letters of the size that can be confirmed even in normal vision.

상기 소자명칭(23)은 스크랩 라인(22)의 중앙에 다이(21)와는 전기적으로 분리되도록 금속(24)을 사용하여 형성한다.The device name 23 is formed using a metal 24 at the center of the scrap line 22 to be electrically separated from the die 21.

따라서 본 발명에 따른 반도체 웨이퍼는 반도체 생산공정중 작업자가 정상 시력으로도 제품의 종류를 쉽게 확인할 수 있으므로 다음공정으로의 진행이 원할하여 작업능률을 향상 시킬수 있는 잇점을 가진다.Therefore, the semiconductor wafer according to the present invention has the advantage that the operator can easily check the type of the product even in normal vision during the semiconductor production process, the progress to the next process is desired to improve the work efficiency.

Claims (2)

특정회로나 메모리가 형성된 다수개의 다이와, 상기 각각의 다이를 구분지어주는 스크랩 라인이 형성된 반도체 웨이퍼에서,In a semiconductor wafer in which a plurality of dies in which a specific circuit or a memory is formed and a scrap line separating each die are formed, 상기 반도체 웨이퍼 전면의 스크랩 라인을 이용하여 정상 시력으로도 확인 할 수 있는 크기의 글자로 소자명칭의 형성하는 것이 특징인 반도체 웨이퍼.The semiconductor wafer, characterized in that the device name is formed of letters of a size that can be confirmed even in normal vision by using the scrap line on the front surface of the semiconductor wafer. 청구항 1에 있어서 상기 소자명칭은,The device name of claim 1, 상기 스크랩 라인의 중앙에 다이와는 전기적으로 분리되도록 금속을 사용하여 형성하는 것이 특징인 반도체 웨이퍼.And forming a metal at the center of the scrap line so as to be electrically separated from the die.
KR1019970052045A 1997-10-10 1997-10-10 Semiconductor wafer KR100266013B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970052045A KR100266013B1 (en) 1997-10-10 1997-10-10 Semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970052045A KR100266013B1 (en) 1997-10-10 1997-10-10 Semiconductor wafer

Publications (2)

Publication Number Publication Date
KR19990031361A true KR19990031361A (en) 1999-05-06
KR100266013B1 KR100266013B1 (en) 2000-09-15

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KR1019970052045A KR100266013B1 (en) 1997-10-10 1997-10-10 Semiconductor wafer

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Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204101A (en) * 1992-12-28 1994-07-22 Kawasaki Steel Corp Semiconductor wafer

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