KR19980083964A - Plasma spraying device and method for manufacturing PDP bulkhead using the same - Google Patents

Abstract

The present invention relates to a plasma spraying apparatus and a method for manufacturing a plasma display panel (PDP) partition wall using the same, wherein after forming mask patterns having a predetermined interval in a predetermined region on the substrate, the substrate on which the mask pattern is formed is plasma sprayed. After fixing to the holder of the Ying apparatus, a plasma is generated by applying a voltage to the electrode while injecting the reaction gas into the gas pipe of the plasma spraying apparatus. By supplying a barrier material to the plasma while injecting the plasma into the substrate to form a partition on the substrate between the mask patterns, and removing the mask patterns, the process time is short, manufacturing cost is reduced, and the precision and characteristics of the partition are very high. Since it is good, productivity and a yield are improved.

Description

Plasma spraying device and method for manufacturing PDP bulkhead using the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PDP manufacturing method, and more particularly, to a plasma spraying device and a PDP partition wall manufacturing method using the same.

In general, a plasma display provides an image using light emitted from a plasma generated during gas discharge, and the discharged plasma is separated by a fine partition wall to constitute a unit cell.

An image is realized by selectively emitting light of a unit cell formed by a fine partition wall by a driving circuit. It is quite difficult to form a unit cell of about 100 μm on a glass substrate when fabricating an actual plasma display.

Recently, a screen print method, a sand blast method, a photosensitive paste method, an additive method, and the like are used to form a fine partition wall of such a plasma display.

Screen printing is a process of printing and drying the glass paste on the substrate by repeating about 7-8 times as shown in FIG.

However, during mass production, the manufacturing time is very long and the partition wall precision is not good.

In the sand blasting method, after applying and drying the glass paste on the substrate as shown in Fig. 1B, a predetermined region of the glass paste is removed by sanding treatment using a resist as a mask. In addition, the process of manufacturing the partition wall by firing the glass paste after removing the resist, although the manufacturing time is relatively short, there is a lot of material loss, and the waste generated during the sanding process is a pollution material, so there is a burden of cost for environmental treatment. .

In the photosensitive paste method, the photosensitive paste is coated on a substrate as shown in FIG. 1C and dried, and then the photosensitive paste is exposed and developed using a mask. In addition, the barrier rib is formed by the process of etching the photosensitive paste about 10 times, but precise dimension adjustment is possible, but the disadvantage is that the cost of the photosensitive glass paste is high and the production time is long.

The addition method applies a register on the substrate as shown in FIG. 1D, exposes and develops the resistor, and then applies, dries and polishes the glass paste between the developed resistors. In addition, the process of forming a partition by removing and firing the resistor has a disadvantage in that it takes a lot of manufacturing time and cost.

The prior art PD barrier manufacturing method has the following problems.

First, the production time is long and the burden of the production cost is high.

Second, the productivity and yield are low due to the poor precision and characteristics of the bulkhead.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma spraying device and a method for manufacturing a PD barrier rib using the same, which can reduce manufacturing time and manufacturing cost and improve the precision and characteristics of the barrier rib.

Figure 1a to 1d is a cross-sectional view showing a manufacturing process PDPD according to the prior art

2 shows a plasma spraying device according to the present invention;

Figure 3a to 3c is a cross-sectional view showing a manufacturing process of the PD barrier using the plasma spraying device according to the present invention

Explanation of symbols for main parts of the drawings

1 cooling tube 2 anode electrode

3: cathode electrode 4: gas pipe

5: nozzle 6: feeder

7: plasma frame 8: holder

9,11 substrate 12 mask pattern

13: bulkhead

Plasma spraying apparatus according to the present invention for achieving the above object is formed so as to surround the first electrode, the first electrode and having a nozzle at one end, between the first electrode and the second electrode It is composed of a gas pipe for forming the gas to be formed and supplied into a plasma state and spraying it to the outside through the nozzle, and a feeder for supplying a substance formed on one side of the nozzle and to be sprayed to the outside through the nozzle. There is a characteristic.

In the method for manufacturing a PD barrier using a plasma spraying apparatus according to the present invention, a step of forming mask patterns having a predetermined interval in a predetermined region on a substrate is formed, and a barrier is formed on the substrate between the mask patterns by using a plasma spraying system. It is characterized by consisting of a step for removing and removing the mask patterns.

According to the present invention, there is provided a method for manufacturing a PD barrier rib using a plasma spraying apparatus, the method comprising: forming mask patterns having a predetermined interval in a predetermined region on a substrate; fixing the substrate on which the mask pattern is formed to a holder of the plasma spraying apparatus; Generating a plasma by applying a voltage to an electrode while injecting a reactive gas into a gas pipe of the plasma spraying device, and supplying a barrier material to the plasma while injecting the plasma into the substrate to form a partition on the substrate between the mask patterns. And a step of removing the mask patterns.

Referring to the accompanying drawings, a plasma spraying apparatus and a method for manufacturing a PD barrier rib using the same according to the present invention having such characteristics are as follows.

2 is a view showing a plasma spraying apparatus according to the present invention for forming a PDP partition wall, Figures 3a to 3c is a process cross-sectional view showing a manufacturing process of a plasma barrier using a plasma spraying device according to the present invention.

First, referring to a plasma spraying apparatus for forming a PD barrier of the present invention, as shown in FIG. 2, an anode electrode 2 having a cooling tube 1 filled with cooling water therein is shown. And a cathode electrode 3 formed to surround the anode electrode 2 and having a cooling tube 1 filled with cooling water therein, and between the anode electrode 2 and the cathode electrode 3; It consists of a gas pipe 4 which is a passage of a reaction gas, a nozzle 5 formed at one end of the cathode electrode 3, and a feeder 6 formed at one side of the nozzle 5.

Looking at the principle of the plasma spraying device configured as described above, first, argon (Ar), helium (He), hydrogen (H ₂ ) to the gas pipe (4) while applying a direct current to the cathode electrode 3 and the anode electrode ( ₂ ) When a reaction gas such as this is injected, the reaction gas expands by heating and decomposition, causes ionization, and becomes a plasma state having high energy, and the plasma having such high energy is sprayed out through the nozzle 5 at high speed.

At this time, the ceramic powder supplied through the feeder 6 is melted in a high temperature plasma flame 7 which is about 4000 to 10000 ° C. sprayed to the outside, and is 1 to 2 times the speed of sound. The film is formed on the substrate 9 by colliding with the plasma frame 7 at a high speed to collide with the substrate 9 to be deposited on the holder 8.

As illustrated in FIG. 3A, first, a plurality of masks having a pattern of strips having a width of 100 μm and a depth of about 200 μm continuously patterned as shown in FIG. 3A are described. A mask pattern 12 is formed on the substrate 11 at regular intervals.

Here, the mask pattern 12 is formed of any one of glass, aluminum foil, and sheet metal.

Subsequently, the substrate 11 on which the mask pattern 12 is formed is fixed to a holder, and a voltage of 40 to 80 KW is applied between the cathode electrode and the anode electrode while injecting the reaction gas into the gas pipe of the plasma spraying device. High-energy plasma is injected onto the substrate 11 fixed to the holder.

After a while, when the plasma is stabilized, a ceramic powder for PD barrier ribs having a particle size of 10 to 30 µm is supplied through a feeder.

As shown in FIG. 3B, the particles of the ceramic powder collide with the substrate 11 at a very high speed while melting in a hot plasma.

Particles impinging on the substrate 11 are sequentially stacked on the substrate 11 on which the mask pattern 12 is not formed to form the partition wall 13.

Here, it is very important that the substrate should be maintained at an angle of 90 ° with respect to the plasma flame in order to obtain a high binding force to the substrate and a dense partition.

In addition, as the particle diameter of the ceramic powder is smaller, the acceleration rate and the temperature increase rate are increased, so that the bulkhead can be obtained.However, because of the high stress, the process variable and the particle diameter must be carefully determined, and the particle shape and mass flow rate of plasma Should be taken into account.

Subsequently, as shown in FIG. 3C, when formation of the barrier ribs 13 is completed between the mask patterns 12 on the substrate 11, the mask pattern 12 is removed to form a strip on the substrate 11. The bulkhead 13 of the phase is completed.

Plasma spraying apparatus according to the present invention and a method for producing PD partition wall using the same has the following effects.

First, because the process is simple, the process time is short and the manufacturing cost is reduced.

Second, since the partition walls have very good precision and characteristics, productivity and yield are improved.

Claims (12)

A first electrode; A second electrode formed to surround the first electrode and having a nozzle at one end; A gas pipe which is formed between the first electrode and the second electrode and supplies a gas into a plasma state and sprays the gas to the outside through the nozzle; And And a feeder formed on one side of the nozzle and supplying a material to be formed at a desired position to the plasma injected to the outside through the nozzle. The apparatus of claim 1, wherein the first electrode is an anode and the second electrode is a cathode. The apparatus of claim 1, wherein a direct current is supplied to the first electrode and the second electrode. The plasma spraying apparatus of claim 1, wherein a cooling tube is formed in the first electrode and the second electrode. Forming mask patterns having a predetermined interval in a predetermined region on the substrate; Forming a partition on the substrate between the mask patterns by using a plasma spraying device; And And a step of removing the mask patterns. The method of claim 5, wherein the mask pattern is formed of any one of glass, aluminum foil, and sheet metal. The method of claim 5, wherein the mask pattern is formed by successively patterning the plasma patterning device. Forming mask patterns having a predetermined interval in a predetermined region on the substrate; Fixing the substrate on which the mask pattern is formed to a holder of a plasma spraying device; Generating a plasma by applying a voltage to an electrode while injecting a reaction gas into a gas pipe of the plasma spraying device; Supplying a barrier material to the plasma while injecting the plasma onto the substrate to form a barrier on the substrate between the mask patterns; And And a step of removing the mask patterns. 10. The method of claim 8, wherein the barrier material is ceramic powder. 10. The method of claim 8, wherein the substrate maintains a 90 ° angle with respect to the spray angle of the plasma. 9. The method of claim 8, wherein the particle diameter of the barrier material is 10 to 30 [mu] m. The method of claim 8, wherein the mask pattern is formed of any one of glass, aluminum foil, and sheet metal.