KR19980037830U - Wafer Chucking Device for Semiconductor Surf Scan Equipment - Google Patents
Wafer Chucking Device for Semiconductor Surf Scan Equipment Download PDFInfo
- Publication number
- KR19980037830U KR19980037830U KR2019960050876U KR19960050876U KR19980037830U KR 19980037830 U KR19980037830 U KR 19980037830U KR 2019960050876 U KR2019960050876 U KR 2019960050876U KR 19960050876 U KR19960050876 U KR 19960050876U KR 19980037830 U KR19980037830 U KR 19980037830U
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- wafer
- chucking device
- surf scan
- chuck
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000000694 effects Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 반도체 서프스캔장비의 웨이퍼 척킹장치에 관한 것으로, 종래에는 웨이퍼를 이송하거나 고정시 뒷면에 면접촉을 하여 이물질이 많이 부착되는 문제점이 있었다. 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치는 핸들러(12)와 척(11)의 상면에 4개의 지지핀(12b)(11b)을 설치하고, 그 지지핀(12b)(11b)의 상면에 웨이퍼가 흡착고정되도록 함으로서, 종래와 같이 웨이퍼가 면접촉을 하는 것을 방지하게 되어 이물질의 부착이 감소되는 효과가 있다.The present invention relates to a wafer chucking device of a semiconductor surf scan device, and has conventionally had a problem in that a lot of foreign matters are attached by making a surface contact on the back side when transferring or fixing a wafer. In the wafer chucking device of the semiconductor surf scan device of the present invention, four support pins 12b and 11b are provided on the upper surface of the handler 12 and the chuck 11, and the wafer is provided on the upper surface of the support pins 12b and 11b. By adsorbing and fixing, the wafer is prevented from being in surface contact as in the prior art, thereby reducing the adhesion of foreign matter.
Description
본 고안은 반도체 서프스캔(SUFSCAN)장비의 웨이퍼 척킹(WAFER CHUCKING)장치에 관한 것으로, 특히 웨이퍼의 뒷면에 이물질이 부착하는 것을 감소시키도록 하는데 적합한 반도체 서프스캔장비의 웨이퍼 척킹장치에 관한 것이다.The present invention relates to a wafer chucking device for semiconductor surf scan (SUFSCAN) equipment, and more particularly to a wafer chucking device for semiconductor surf scan equipment suitable for reducing the adhesion of foreign matter on the back surface of the wafer.
일반적으로 서프스캔(SUFSCAN)장비는 레이저(LASER)의 스캐터링(SCATTERING)을 이용하여 웨이퍼 상의 이물질(PARTICLE)을 디택트(DETECT)하는 장치이다. 이와 같은 서프스캔장비에서 웨이퍼를 이동하여 고정하는 척킹장치가 도 1에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In general, SUFSCAN equipment is a device that detects PARTICLE on a wafer by using SCATTERING of a laser. A chucking device for moving and fixing a wafer in such a surf scan apparatus is shown in FIG. 1, which will be described briefly as follows.
도 1은 종래 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 평면도이고,1 is a plan view showing the structure of a wafer chucking device of a conventional semiconductor surf scan equipment,
도 2는 종래 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 단면도이다.2 is a cross-sectional view illustrating a structure of a wafer chucking device of a conventional semiconductor surf scan device.
도시된 바와 같이, 종래 반도체 서프스캔장비의 웨이퍼 척킹장치는 웨이퍼를 버큠(VACUUM)으로 고정하기 위한 척(1)과, 그 척(1)에 웨이퍼를 이동시키기 위한 핸들러(HANDLER)(2)로 구성되어 있다.As shown, the wafer chucking apparatus of the conventional semiconductor surf scan equipment has a chuck 1 for fixing the wafer with a VACUUM and a handler HANDLER 2 for moving the wafer to the chuck 1. Consists of.
그리고, 상기 척(1) 상면에 2개의 버큠홀(VACUUM HOLE)(1a)이 형성되어 있고, 그 버큠홀(1a)에 연결되도록 상기 척(1)의 상면에 다수개의 버큠라인(VACUUM LINE)(1b)이 형성되어 있으며, 상기 버큠홀(1a)의 하방으로는 버큠호스(VACUUM HOSE)(1c)가 연결설치되어 있다.In addition, two vacuum holes 1a are formed on the upper surface of the chuck 1, and a plurality of vacuum lines are formed on the upper surface of the chuck 1 so as to be connected to the vacuum holes 1a. (1b) is formed, and a plume hose (1c) is connected below the vent hole (1a).
또한, 상기 핸들러(2)의 중앙에는 버큠홀(2a)이 형성되어 있고, 그 버큠홀(1a)에 연결되도록 상기 핸들러(2)의 상면에 X자형의 버큠라인(2b)이 형성되어 있다.Further, a burr hole 2a is formed in the center of the handler 2, and an X-shaped burr line 2b is formed on the upper surface of the handler 2 so as to be connected to the burr hole 1a.
상기와 같이 구성되어 있는 종래 반도체 서프스캔장비의 웨이퍼 척킹장치는 핸들러(2)의 상면에 버큠을 이용하여 웨이퍼를 흡착하고, 이와 같이 흡착된 웨이퍼를 이동하여 척(1)의 상면으로 이동시킨 다음, 척(1)에 형성된 버큠홀(1a)과 버큠라인(1b)에 형성되는 버큠을 이용하여 웨이퍼를 흡착고정하게 된다.The wafer chucking device of the conventional semiconductor surf scan device configured as described above adsorbs the wafer using the pressure on the upper surface of the handler 2, and moves the absorbed wafer to the upper surface of the chuck 1. The wafer is sucked and fixed by using the burr holes 1a formed in the chuck 1 and the burrs formed in the burr lines 1b.
그러나, 상기와 같은 종래 핸들러(2)와 척(1)은 웨이퍼를 이동시 버큠홀(1a)(2a)과 버큠라인(1b)(2b)을 제외한 나머지 상면에 면접촉한 상태로 이동되기 때문에 웨이퍼의 뒷면에 이물질이 많이 부착되는 문제점이 있었다. 이와 같이 웨이퍼의 뒷면에 부착된 이물질들은 후공정에서 카세트(CASSETTE)로 이동시 다른 웨이퍼의 앞면을 오염시키게된다.However, the conventional handler 2 and the chuck 1 as described above are moved in surface contact with the rest of the upper surface except for the vacuum holes 1a, 2a, and vacuum lines 1b, 2b. There was a problem that a lot of foreign matter attached to the back. As such, foreign matters attached to the back side of the wafer contaminate the front side of another wafer when moved to the cassette in a later process.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 웨이퍼의 뒷면에 이물질이 부착되는 것을 감소키기도록 하는데 적합한 반도체 서프스캔장비의 웨이퍼 척킹장치를 제공함에 있다.An object of the present invention devised in view of the above problems is to provide a wafer chucking device of a semiconductor surfscan equipment suitable for reducing the adhesion of foreign matter on the back of the wafer.
도 1은 종래 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 평면도.1 is a plan view showing the structure of a wafer chucking device of a conventional semiconductor surf scan equipment.
도 2는 종래 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 단면도.Figure 2 is a cross-sectional view showing the structure of a wafer chucking device of a conventional semiconductor surf scan equipment.
도 3은 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 평면도.Figure 3 is a plan view showing the structure of a wafer chucking device of the present invention semiconductor surf scan equipment.
도 4는 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 단면도.Figure 4 is a cross-sectional view showing the structure of the wafer chucking device of the semiconductor surf scan device of the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
11 : 척11a,12a : 버큠홀11: Chuck 11a, 12a: Hold Hole
11b,12b : 지지핀11c : 버큠호스11b, 12b: support pin 11c: hose
12 : 핸들러12: handler
상기와같은 본 고안의 목적을 달성하기 위하여 척의 상면에 버큠홀이 구비된 수개의 지지핀을 설치하고, 상기 버큠홀의 하부로 버큠호스를 연결설치하며, 핸들러의 상면에 버큠홀이 구비된 수개의 지지핀을 설치하여, 웨이퍼를 이송하거나 고정시 상기 지지핀의 상면에 웨이퍼의 뒷면이 접촉되도록 한 것을 특징으로 하는 반도체 서프스캔장비의 웨이퍼 척킹장치가 제공된다.In order to achieve the object of the present invention as described above, a plurality of support pins having burr holes are installed on the upper surface of the chuck, and the burr hoses are connected to the lower part of the burr holes, and the burr holes are provided on the upper surface of the handler. By installing a support pin, a wafer chucking device of a semiconductor surf scan device is provided so that the back surface of the wafer is brought into contact with the top surface of the support pin when the wafer is transported or fixed.
이하, 상기와 같이 구성되는 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치를 검부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the wafer chucking device of the inventive semiconductor surf scan device configured as described above will be described in more detail with reference to an embodiment of the found drawings.
도 3은 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 평면도이고, 도 4는 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치의 구조를 보인 단면도이다.3 is a plan view showing the structure of the wafer chucking device of the semiconductor surf scan device of the present invention, Figure 4 is a cross-sectional view showing the structure of the wafer chucking device of the semiconductor surf scan device of the present invention.
도시된 바와 같이, 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치는 척(11)의 상면에 버큠홀(11a)이 구비된 4개의 사각형 지지핀(11b)을 설치하고, 상기 버큠홀(11a)의 하부로 버큠호스(11c)를 연결설치하며, 핸들러(12)의 상면에 버큠홀(12a)이 구비된 4개의 지지핀(12b)을 설치하였다.As shown, the wafer chucking device of the inventive semiconductor surf scan equipment is provided with four rectangular support pins 11b provided with a vent hole 11a on the upper surface of the chuck 11, The hose hose 11c was connected to the lower portion, and four support pins 12b provided with the hose holes 12a were installed on the upper surface of the handler 12.
즉, 상기 지지핀(11b)(12b)의 상면에 웨이퍼의 뒷면이 접촉되도록 한 상태에서, 웨이퍼를 이송하거나 웨이퍼를 흡착공정할 수 있도록 구성된 것이다.That is, in the state in which the back surface of the wafer is in contact with the top surface of the support pins 11b and 12b, the wafer may be transferred or the wafer may be adsorbed.
상기 지지핀(11b)(12b)의 상면은 사각형으로 되어 있으나, 이는 원형으로 하여도 무방하고, 기타 다른형태로 하여도 무방하다. 다만, 웨이퍼의 접촉면적을 최소화시키기 위하여 크기를 최대한 작게 하는 것이 바람직하다.The upper surfaces of the support pins 11b and 12b are rectangular, but may be circular or other shapes. However, in order to minimize the contact area of the wafer, it is desirable to minimize the size.
상기와 같이 구성되는 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치는 핸들러(12)의 상면에 설치되어 있는 4개의 지지핀(12b) 상면에 웨이퍼가 얹혀진 상태에서 버큠홀(12a)에 버큠을 작동하여 웨이퍼를 흡착한다. 이와 같은 상태에서 웨이퍼를 이송하여 척(11)의 상면에 설치되어 있는 4개의 지지핀(11b)의 상면에 웨이퍼를 얹어 놓고, 핸들러(12)는 버큠이 제거된 상태로 이동한다. 그런 다음, 상기 척(11)에 형성된 버큠홀(11a)에 버큠이 작동되도록 하여 척(11)의 상면에 형성된 4개의 지지핀(12b) 상면에 웨이퍼를 흡착고정한다.The wafer chucking device of the present invention semiconductor surf scan device configured as described above operates the chuck on the support hole 12a in a state where the wafer is placed on the upper surface of the four support pins 12b installed on the upper surface of the handler 12. Adsorb the wafer. In this state, the wafer is transferred and the wafer is placed on the upper surfaces of the four support pins 11b provided on the upper surface of the chuck 11, and the handler 12 moves in a state where the bucket is removed. Then, the chuck 11 is fixed to the upper surface of the four support pins 12b formed on the upper surface of the chuck 11 by actuating the button on the chuck 11.
이상에서 상세히 설명한 바와 같이 본 고안 반도체 서프스캔장비의 웨이퍼 척킹장치는 핸들러와 척의 상면에 4개의 지지핀을 설치하고, 그 지지핀의 상면에 웨이퍼가 흡착고정되도록 함으로서, 종래와 같이 웨이퍼가 면접촉을 하는 것을 방지하게 되어 이물질의 부착이 감소되는 효과가 있다.As described in detail above, the wafer chucking device of the inventive semiconductor surf scan equipment is provided with four support pins on the upper surface of the handler and the chuck, and the wafer is sucked and fixed on the upper surface of the support pin, so that the wafer is in surface contact as in the prior art. It is prevented to have the effect of reducing the adhesion of foreign matter.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960050876U KR19980037830U (en) | 1996-12-18 | 1996-12-18 | Wafer Chucking Device for Semiconductor Surf Scan Equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960050876U KR19980037830U (en) | 1996-12-18 | 1996-12-18 | Wafer Chucking Device for Semiconductor Surf Scan Equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980037830U true KR19980037830U (en) | 1998-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960050876U KR19980037830U (en) | 1996-12-18 | 1996-12-18 | Wafer Chucking Device for Semiconductor Surf Scan Equipment |
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| Country | Link |
|---|---|
| KR (1) | KR19980037830U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100442778B1 (en) * | 2001-05-24 | 2004-08-04 | 주식회사 제일 | Finger for wafer transference |
-
1996
- 1996-12-18 KR KR2019960050876U patent/KR19980037830U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100442778B1 (en) * | 2001-05-24 | 2004-08-04 | 주식회사 제일 | Finger for wafer transference |
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