KR19980036861U - Wafer fixing device for semiconductor device exposure equipment - Google Patents
Wafer fixing device for semiconductor device exposure equipment Download PDFInfo
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- KR19980036861U KR19980036861U KR2019960049874U KR19960049874U KR19980036861U KR 19980036861 U KR19980036861 U KR 19980036861U KR 2019960049874 U KR2019960049874 U KR 2019960049874U KR 19960049874 U KR19960049874 U KR 19960049874U KR 19980036861 U KR19980036861 U KR 19980036861U
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- South Korea
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- chuck
- hole
- wafer
- holes
- air
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 239000002245 particle Substances 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 40
- 230000007423 decrease Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
본 고안은 반도체소자 노광장비의 웨이퍼 고정장치에 관한 것으로서, 좀더 구체적으로는 상기 웨이퍼 고정장치의 구조를 개선하여 척상에 고정되는 웨이퍼가 상기 척상에 부착된 파티클 등의 이물로 인해 불량처리 되지 않도록 한 것이다.The present invention relates to a wafer holding device of a semiconductor device exposure apparatus, and more particularly, to improve the structure of the wafer holding device so that the wafer fixed on the chuck is not treated poorly due to foreign matter such as particles attached to the chuck. will be.
이를 위해, 적어도 3개 이상의 에어홀(5)이 원주방향을 이루며 상부면으로 노출된 스테이지(1)와, 상기 에어홀(5)과 연결된 진공펌프(7)와, 상기 각 에어홀(5)을 감싸도록 스테이지(1)의 상부면에 설치되어 둘레면을 따라 복수개의 제1통공(8a)이 형성된 제1척(8)과, 상기 각 제1척의 외측둘레에 설치된 제2척(9)과, 상기 각 제2척의 둘레면을 따라 제1통공(8a)보다는 작은 크기를 가진 제2통공(9a)을 상기 제1통공(8a)과 연통되도록 형성하여 진공펌프(7)의 작동에 의해 발생된 흡입력이 에어홀(5)을 거쳐 제1통공(8a)과 제2통공(9a) 및 상기 각 제1, 2척(8)(9)의 상부면에 전달될 때 외부의 공기가 제2통공(9a)을 거쳐 제1통공(8a)으로 지남에 따라 점차적으로 저압이 되도록 한 것이다.To this end, at least three or more air holes 5 are formed in a circumferential direction and exposed to an upper surface thereof, a vacuum pump 7 connected to the air holes 5, and each of the air holes 5. A first chuck 8 provided on an upper surface of the stage 1 to surround the first chuck 8 having a plurality of first through holes 8a formed along a circumferential surface thereof, and a second chuck 9 provided on an outer circumference of the first chuck. And a second through hole 9a having a smaller size than the first through hole 8a along the circumferential surface of each of the second chucks so as to communicate with the first through hole 8a, by the operation of the vacuum pump 7. When the generated suction force is transmitted to the first through hole 8a and the second through hole 9a and the upper surface of each of the first and second chucks 8 and 9 through the air hole 5, As it passes through the two through holes 9a to the first through holes 8a, the pressure is gradually reduced.
Description
본 고안은 반도체소자 노광장비의 웨이퍼 고정장치에 관한 것으로서, 좀더 구체적으로는 상기 웨이퍼 고정장치의 구조를 개선하여 척상에 고정되는 웨이퍼가 상기 척상에 부착된 파티클 등의 이물로 인해 불량처리 되지 않도록 한 것이다.The present invention relates to a wafer holding device of a semiconductor device exposure apparatus, and more particularly, to improve the structure of the wafer holding device so that the wafer fixed on the chuck is not treated poorly due to foreign matter such as particles attached to the chuck. will be.
일반적으로 반도체소자 노광장비는 웨이퍼의 표면에 빛을 노출시켜 상기 웨이퍼를 일정한 패턴으로 형성시키기 위한 반도체 장비로서, 이와같은 반도체 장비는 크게 웨이퍼를 고정시키는 고정장치와 상기 고정된 웨이퍼에 빛을 노출시키는 노광장치로 나눌 수 있다.In general, a semiconductor device exposure apparatus is a semiconductor device for forming the wafer in a predetermined pattern by exposing light on the surface of the wafer, such a semiconductor device is largely a fixture for fixing the wafer and to expose the light to the fixed wafer It can be divided into exposure apparatus.
여기서 웨이퍼를 고정시키기 위한 종래의 고정장치의 구성을 첨부된 도 1을 참고로 하여 설명하면 다음과 같다.Herein, the configuration of a conventional fixing device for fixing a wafer will be described with reference to FIG. 1.
도 1은 종래 고정장치의 척상에 웨이퍼가 안착되는 상태를 나타낸 종단면도로서, 종래에는 고정장치를 이루는 스테이지(1) 상부에 웨이퍼(2)가 안착되는 척(3)이 설치 되어있고, 상기 척(3)내에는 복수개의 핀(4)이 이송장치(도시는 생략함)에 의해 이송가능하게 설치되어 있다.1 is a longitudinal sectional view showing a state in which a wafer is seated on a chuck of a conventional fixing device. In the related art, a chuck 3 on which a wafer 2 is seated is mounted on an upper stage 1 of the fixing device. In (3), a plurality of pins 4 are provided to be transportable by a transfer device (not shown).
따라서 웨이퍼(2)를 고정장치에 고정시키기 위해서는 먼저 상기 웨이퍼를 이송장치를 이용해 척(3)의 상부에 위치시킨다음 상기 척내에 이송가능하게 설치된 복수개의 핀(4)을 상승시켜 웨이퍼(2)의 저면에 접촉시킨다.Therefore, in order to fix the wafer 2 to the fixing device, the wafer is first placed on the upper part of the chuck 3 using the transfer device, and then the plurality of pins 4 installed in the chuck are lifted to raise the wafer 2. Touch the bottom of the
이와같이 웨이퍼의 저면에 복수개의 핀(4)이 접촉되면 상기 이송장치의 구동을 중단한 다음 이송장치를 웨이퍼(2)로부터 제거하고 다시 핀(4)을 하강시켜 웨이퍼(2)가 척(3)의 상부면에 안착되도록 한다.When the plurality of pins 4 are in contact with the bottom of the wafer as described above, the driving of the transfer device is stopped, and then the transfer device is removed from the wafer 2 and the pins 4 are lowered again so that the wafer 2 is lowered to the chuck 3. Allow it to rest on the top surface of the
그리고, 상기 웨이퍼(2)의 고정이 완료되면 노광장치를 이용해 웨이퍼의 표면에 노광을 실시하면 된다.When the fixing of the wafer 2 is completed, the surface of the wafer may be exposed using an exposure apparatus.
그러나 종래에는 척의 상부면이나 핀의 상부면에 묻은 파티클 등의 이물이 제대로 소거되지 않은 상태에서 웨이퍼를 안착시켜 노광을 할 경우에 척상에 안착되는 웨이퍼가 수평을 이루지 못함에 따라 상기 웨이퍼가 노광불량되는 문제점이 있었다.However, in the related art, when the wafer is exposed by placing the wafer in a state in which foreign matter such as particles on the upper surface of the chuck or the upper surface of the pin is not erased properly, the wafer that is seated on the chuck is not leveled. There was a problem.
본 고안은 종래의 이와같은 문제점을 해결하기 위해 안출한 것으로서, 웨이퍼 고정장치의 구조를 개선하여 척상에 고정되는 웨이퍼가 상기 척상에 부착된 파티클 등의 이물로 인해 불량처리 되지 않도록 하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art, and the object of the present invention is to improve the structure of the wafer holding device so that the wafer fixed to the chuck is not treated poorly due to foreign matter such as particles attached to the chuck. .
상기 목적을 달성하기 위한 본 고안의 형태에 따르면 적어도 3개 이상의 에이홀이 원주방향을 이루며 상부면으로 노출된 스테이지와, 상기 에어홀과 연결된 진공펌프와, 상기 각 제어홀을 감싸도록 스테이지의 상부면에 설치되어 둘레면을 따라 복수개의 제1통공이 형성된 제1척과, 상기 각 제1척의 외측둘레에 설치된 제2척과, 상기 각 제2척의 둘레면을 따라 제1통공보다는 작은 크기를 가진 제2통공을 상기 제1통공과 연통되도록 형성하여 진공펌프의 작동에 의해 발생된 흡입력이 에어홀을 거쳐 제1통공과 제2통공 및 상기 제1, 2척의 상부면에 전달될 때 외부의 공기가 제2통공을 거쳐 제1통공으로 지남에 따라 점차적으로 저압이 되도록 함을 특징으로 하는 반도체소자의 노광장비의 웨이퍼 고정장치가 제공된다.According to an aspect of the present invention for achieving the above object, a stage in which at least three or more A-holes are circumferentially exposed to the upper surface, a vacuum pump connected to the air holes, and an upper portion of the stage to surround the respective control holes. A first chuck installed on the surface and having a plurality of first holes formed along a circumferential surface thereof, a second chuck provided on an outer circumference of the first chuck, and having a smaller size than the first through the circumferential surface of each of the second chucks; The external air is formed when the suction hole generated by the operation of the vacuum pump is transmitted to the first through hole and the second through hole and the upper surface of the first and second chucks through the air hole. Provided is a wafer holding device for exposure apparatus of a semiconductor device, characterized in that the pressure gradually decreases as it passes through the second through the first through.
도 1은 종래 고정장치의 척상에 웨이퍼가 안착되는 상태를 나타낸 종단면도1 is a longitudinal sectional view showing a state in which a wafer is seated on a chuck of a conventional fixing device;
도 2는 본 고안을 구성하는 척을 나타낸 분해 사시도Figure 2 is an exploded perspective view showing the chuck constituting the present invention
도 3은 본 고안을 구성하는 척이 스테이지상에 설치된 상태를 개략적으로 나타낸 평면도3 is a plan view schematically showing a state in which the chuck constituting the present invention is installed on a stage;
도 4는 본 고안 장치의 요부를 나타낸 종단면도Figure 4 is a longitudinal sectional view showing the main part of the device
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
1: 스테이지5: 에어홀1: stage 5: air hole
7: 진공펌프8: 제1척7: vacuum pump 8: first chuck
8a: 제1통공9: 제2척8a: first airway 9: second ship
9a: 제2통공10: 제3척9a: second airway 10: third ship
10a: 제3통공10a: third through
이하, 본 고안을 일 실시예로 나타낸 첨부된 도 2 내지 도 4를 참고로 하여 더욱 구체적으로 설명하면 다음과 같다.Hereinafter, with reference to the accompanying Figures 2 to 4 showing the present invention as an embodiment in more detail as follows.
도 2는 본 고안을 구성하는 척을 나타낸 분해 사시도이고, 도 3은 본 고안을 구성하는 척이 스테이지상에 설치된 상태를 개략적으로 나타낸 평면도이며. 도 4는 본 고안 장치의 요부를 나타내 종단면도로서, 본 고안은 스테이지(1)내에 원주방향을 이루며 상부면으로 노출된 4개의 에어홀(5)이 형성되어 있고, 상기 스테이지(1)의 하부에는 각 에어홀(5)과 연결호스(6)로 연결된 진공펌프(7)가 설치되어 있으며, 상기 스테이지(1)의 상부면에는 각 에어홀(5)을 감싸도록 외측 둘레면을 따라 제1통공(8a)이 형성된 제1척(8)이 설치되어 있고, 상기 각 제1척(8)의 외측 둘레에는 상기 제1통공(8a)과 연통되도록 함과 함께 제1통공보다는 크기가 작도록 제2통공(9a)이 형성된 제2척(9)이 설치되어 있으며, 상기 각 제2척의 외측둘레에는 제2통공(9a)과 연통되도록 함과 함께 제2통공보다는 크기가 작도록 제3통공(10a)이 형성된 제3척(10)이 설치되어 있다.Figure 2 is an exploded perspective view showing a chuck constituting the subject innovation, Figure 3 is a plan view schematically showing a state in which the chuck constituting the subject innovation is installed on a stage. FIG. 4 is a longitudinal sectional view showing the main part of the device of the present invention. In the present invention, four air holes 5 circumferentially and exposed to the upper surface are formed in the stage 1, and the lower part of the stage 1 is formed. The air pump 5 is connected to each air hole 5 and the connection hose 6 is installed, the upper surface of the stage (1) along the outer circumferential surface to surround each air hole (5) A first chuck 8 having a through hole 8a is provided, and the outer circumference of each of the first chucks 8 communicates with the first through hole 8a and is smaller in size than the first through hole. A second chuck 9 having a second through hole 9a is provided, and a third through hole is provided at the outer circumference of each second chuck so as to communicate with the second through hole 9 a and smaller in size than the second through hole. The 3rd chuck | zipper 10 in which 10a was formed is provided.
따라서 웨이퍼(2)를 고정시키기 위해서는 먼저 상기 웨이퍼를 이송장치를 이용해 원주방향으로 설치된 복수개의 제1,2,3척(8)(9)(10)상부면에 근접 위치시킨다음 진공펌프(7)를 작동시키면 이에 따라 발생된 흡입력이 연결호스(6)를 통하여 각 에어홀(5)을 따라 각 제1,2,3 척(8)(9)(10)의 제1,2,3 통공(8a)(9a)(10a)측으로 차례로 전달됨과 함께 상기 제1,2,3 척(8)(9)(10)의 상부면 웨이퍼(2)의 저면에 전달되는데, 이때 상기 전달된 흡입력은 웨이퍼의 저면측 공기를 흡입함과 동시에 외부의 공기를 제3,2,1통공(10a)(9a)(8a)을 차례로 거치도록 하면서 점차로 저압화시키며 에어홀(5)을 통하여 연결호스(6)를 거쳐 흡입하게 된다.Therefore, in order to fix the wafer 2, the wafer is first placed close to the upper surface of the plurality of first, second and third chucks 8, 9, 10, which are installed in the circumferential direction using a transfer apparatus, and then the vacuum pump 7 ), The suction force generated by this is transferred to the first, second and third chucks of the first, second and third chucks (8) (9) and (10) along the respective air holes (5) through the connection hose (6). (8a) (9a) and in turn are delivered to the (10a) side and the first, second, third chuck (8) (9) is transferred to the bottom surface of the wafer (2) of the upper surface of the wafer (9), wherein the transferred suction force While suctioning the bottom side air of the wafer and passing the outside air through the third, second, and first through holes 10a, 9a, and 8a in sequence, the pressure is gradually reduced, and the connection hose 6 is connected through the air hole 5. Inhalation).
한편, 상기 웨이퍼(2)의 저면이나 제1,2,3 척(8)(9)(10)상부면에 묻는 파티클 등의 이물은 진공펌프(7)의 흡입력에 의해 제3,2,1,통공(10a)(9a)(8a)을 차례로 통과하는 저압화되는 공기의 흡입력으로 상기 제3,2,1 통공측을 차례로 통과하여 에어홀(5)을 통해 흡입되거나 상기 각 제1,2,3 척(8)(9)(10)의 공간사이로 흡입되어 외부로 배출된다.On the other hand, foreign substances such as particles buried on the bottom surface of the wafer 2 and the upper surfaces of the first, second, and third chucks 8, 9, and 10 may be removed by the suction force of the vacuum pump 7. The suction force of the low-pressure air passing through the through holes 10a, 9a, and 8a in turn passes through the third, second, and first through sides, and is sucked through the air holes 5, or the first and second ones, respectively. It is sucked between the spaces of the three chucks 8, 9 and 10 and discharged to the outside.
이와같이 상기 제1,2,3 척(8)(9)(10)의 상부면이나 웨이퍼(2)의 저면에 묻은 파티클 등의 이물이 제거가 되면 이송장치를 이송시켜 상기 웨이퍼(2)를 각 척상에 안착시키는데, 이때 상기 웨이퍼는 진공펌프(7)의 흡입력에 의해 각 척상에 고정되게 된다.In this way, when foreign matter such as particles on the upper surface of the first, second, and third chucks 8, 9, and 10 or the bottom surface of the wafer 2 is removed, the transfer device is transferred to transfer the wafer 2. It is seated on the chuck, in which the wafer is fixed on each chuck by the suction force of the vacuum pump 7.
이상에서와 같이 본 고안은 작업자가 일일이 척상에 묻은 파티클을 깨끗이 제거하지 않아도 고정전에 상기 파티클을 제거하므로 척상에 고정되는 웨이퍼가 항상 수평이 유지가 되어 양품의 노광된 웨이퍼를 제작할 수 있음은 물론 노광 작업중에도 항상 부유중인 파티클 등의 이물을 흡입하므로 상기 부유중인 파티클 등의 이물이 다시 웨이퍼의 표면에 되 묻지 않아 웨이퍼가 불량처리 되지 않는다.As described above, the present invention removes the particles before fixing even if the worker does not remove the particles on the chuck one by one, so that the wafer fixed on the chuck is always kept horizontal so that a good quality wafer can be manufactured. During the operation, foreign matters such as suspended particles are always sucked in, so that foreign matters such as suspended particles do not get back on the surface of the wafer so that the wafers are not defectively processed.
또한 상기 웨이퍼를 항상 일정한 흡입력으로 흡입하여 척상에 고정을 시켜 노광작업중에는 웨이퍼가 유동되지 않는 효과가 있다.In addition, the wafer is always sucked with a constant suction force to be fixed on the chuck, so that the wafer does not flow during the exposure operation.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960049874U KR19980036861U (en) | 1996-12-16 | 1996-12-16 | Wafer fixing device for semiconductor device exposure equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960049874U KR19980036861U (en) | 1996-12-16 | 1996-12-16 | Wafer fixing device for semiconductor device exposure equipment |
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| Publication Number | Publication Date |
|---|---|
| KR19980036861U true KR19980036861U (en) | 1998-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960049874U KR19980036861U (en) | 1996-12-16 | 1996-12-16 | Wafer fixing device for semiconductor device exposure equipment |
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| Country | Link |
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| KR (1) | KR19980036861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102817317A (en) * | 2012-08-24 | 2012-12-12 | 成都市新筑路桥机械股份有限公司 | Rotary lifting maintenance platform |
-
1996
- 1996-12-16 KR KR2019960049874U patent/KR19980036861U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102817317A (en) * | 2012-08-24 | 2012-12-12 | 成都市新筑路桥机械股份有限公司 | Rotary lifting maintenance platform |
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