JPH0714649U - Vacuum suction chuck - Google Patents
Vacuum suction chuckInfo
- Publication number
- JPH0714649U JPH0714649U JP4828893U JP4828893U JPH0714649U JP H0714649 U JPH0714649 U JP H0714649U JP 4828893 U JP4828893 U JP 4828893U JP 4828893 U JP4828893 U JP 4828893U JP H0714649 U JPH0714649 U JP H0714649U
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- wafer
- work
- suction
- vacuum suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】
【目的】ウェハーとチャックとの間に異物等をはさみ込
んでも損傷の入る懸念がないチャック構造とするもので
ある。
【構成】半導体装置の製造などに供するワークを固定す
るチャックにおいて、このチャックの内部に前記ワーク
と接触しない座ぐりを設け、この座ぐりの外縁にはワー
クを固定するための吸着用の孔を設けたことにある。
(57) [Summary] [Purpose] A chuck structure that does not cause damage even if foreign matter or the like is inserted between the wafer and the chuck. In a chuck for fixing a work to be used for manufacturing a semiconductor device or the like, a counterbore which does not come into contact with the work is provided inside the chuck, and a suction hole for fixing the work is provided at an outer edge of the counterbore. There is something.
Description
【０００１】[0001]
本考案は半導体装置の製造，特性測定および検査、その他、微細な損傷をきら う材料に加工を施す真空吸着チャックに関するものである。 The present invention relates to a vacuum suction chuck for manufacturing semiconductor devices, measuring and inspecting characteristics, and for processing materials that are not susceptible to minute damage.
【０００２】[0002]
一般に、真空吸着チャックとして種々なものがあるが、ここでは半導体装置の 製造におけるフォトリソグラフィー工程での露光工程を例にとって説明する。 この露光工程とは、ワークの一例であるウェハーに感光性の物質を塗布し、フ ォトマスクに準じたパターンを形成する工程である。 図２は従来の真空吸着チャックの一例を示し、ワークであるウェハー２を、チ ャック13に真空吸着固定し、フォトマスク１を介して光を照射している。ウェハ ー２の平面度を保つため、また、ウェハー２のソリを矯正するため、吸着溝４が 設けられている。この吸着溝４は固定に必要な最小限の面積しか確保しない様に 形成され、複数のリングを有し、溝底には吸着用の孔4aが各リングの溝の部分に 複数箇所設けられ、この孔4aによって真空引きを行っている。 Generally, there are various kinds of vacuum suction chucks, but here, an explanation will be given by taking an exposure process in a photolithography process in manufacturing a semiconductor device as an example. The exposure step is a step of applying a photosensitive substance to a wafer, which is an example of a work, to form a pattern according to a photomask. FIG. 2 shows an example of a conventional vacuum suction chuck, in which a wafer 2, which is a workpiece, is vacuum suction-fixed to a chuck 13 and light is emitted through a photomask 1. A suction groove 4 is provided to maintain the flatness of the wafer 2 and to correct the warp of the wafer 2. The suction groove 4 is formed so as to secure only the minimum area necessary for fixing, has a plurality of rings, and has a plurality of suction holes 4a at the groove bottom at the groove portion of each ring. Vacuuming is performed by this hole 4a.
【０００３】[0003]
しかし、かようなチャックにおいて、ウェハー２とチャック13との間に異物等 をはさみ込んでそのまま真空吸着すると、吸着圧によって、異物をウェハー２で 押しつぶす様な形になり、ウェハー側から見ると、その箇所にマイクロクラック 等の損傷の入る懸念があった。 また、それを避け様として、吸着溝を広範囲の面積を持った構造とすると、吸 着圧により、ウェハー２が変形してしまい、平面度が保てない。また、損傷を避 けようとして吸着圧を落とすと、十分な固定が得られず精度の低下等を招く。こ の様な問題を解決しようとするのが、この考案の目的である。 本考案は上述した点に鑑みて創案されたもので、その目的とするところは、か ような欠点を解消した真空吸着チャックを得るものである。 However, in such a chuck, when foreign matter or the like is sandwiched between the wafer 2 and the chuck 13 and vacuum-adsorbed as it is, the foreign matter is crushed by the wafer 2 due to the suction pressure, and when viewed from the wafer side, There was a concern that damage such as microcracks would occur at that location. In order to avoid this, if the suction groove has a structure having a wide area, the wafer 2 is deformed by the suction pressure, and the flatness cannot be maintained. Further, if the adsorption pressure is reduced in order to avoid damage, sufficient fixation cannot be obtained, leading to a decrease in accuracy. It is the purpose of this invention to try to solve such problems. The present invention has been made in view of the above-mentioned points, and an object of the present invention is to obtain a vacuum suction chuck that solves such drawbacks.
【０００４】[0004]
つまり、その目的を達成するための手段は、チャックにウェハーを、吸着溝に よって真空吸着固定し、フォトマスクを介して光を照射する。この時、吸着溝及 びウェハーとチャックが接触する部分は、ウェハー内の不要部分となる様にし、 最終的にデバイスとなる部分には座ぐりを設け、一切、ウェハーと接触しない様 にする。また座ぐり部には大気開放の穴を設け、真空のリークによる座ぐり部の 圧力低下、即ち、この箇所でのウェハーのソリ、吸着等を避けるものである。 That is, the means for achieving the object is to irradiate light through the photomask by vacuum-fixing the wafer on the chuck by the suction groove. At this time, the suction groove and the part where the wafer and the chuck come into contact with each other should be an unnecessary part in the wafer, and the part to be the final device should be provided with a spot facing so as not to come into contact with the wafer at all. Further, a hole for opening to the atmosphere is provided in the spot facing portion to avoid a pressure drop in the spot facing portion due to a vacuum leak, that is, a warp and a suction of the wafer at this portion.
【０００５】[0005]
その作用は、次に述べる実施例と併せて説明する。 以下本考案の一実施例を、図面に基づいて詳述する。 The operation will be described in combination with the embodiment described below. An embodiment of the present invention will be described in detail below with reference to the drawings.
【０００６】[0006]
図１は本考案の一実施例を示す説明図であり、ワークの一例であるウェハー２ を固定するチャック３において、このチャック３の内部にウェハー２の裏面と接 触しない程度の深さの座ぐり3aが設けられている。この座ぐり3aの外縁3bには、 ウェハー２を固定するための吸着用の孔3cが設けられている。 FIG. 1 is an explanatory view showing an embodiment of the present invention. In a chuck 3 for fixing a wafer 2 which is an example of a work, a seat having a depth such that the back surface of the wafer 2 is not contacted inside the chuck 3. A bob 3a is provided. At the outer edge 3b of the spot facing 3a, a suction hole 3c for fixing the wafer 2 is provided.
【０００７】 この孔3cはウェハー２がチャック３上づ移動しないために複数箇所設けられて いる。また、チャック３は種々の形状のものがあり、例えば円柱状のものに座ぐ り3aが設けられ、その外縁（外周）3bには複数箇所の孔3cが設けられている。そ して、この孔3cは１箇所にざぐられ、真空ポンプ（図示せず）によって真空引き されるよう構成されている。The holes 3c are provided at a plurality of positions so that the wafer 2 does not move on the chuck 3. The chuck 3 has various shapes. For example, a counterbore 3a is provided in a cylindrical shape, and a plurality of holes 3c are provided in the outer edge (outer circumference) 3b thereof. Then, the hole 3c is formed in one place and is evacuated by a vacuum pump (not shown).
【０００８】 次に、その作用を説明する。 台５には透明ガラス５が乗せられており、この透明ガラス５の真下にウェハー ２を乗せたチャック３が備えられる。このとき、透明ガラス面とウェハー面とは 平行を保つよう調整される。 ウェハー２の裏面2aは、従来のチャックのようにチャックの表面とは外周を除 いた部分以外は接触しておらず、仮に異物がウェハー２の裏面2aに付着していて も、座ぐり3aによって押しつぶされることがない。またウェハー２の外縁3b部分 に異物が付着していてこの部分のウェハー２が損傷しても、この部分は仕上げ時 にカットされるので問題はない。Next, the operation will be described. A transparent glass 5 is placed on the table 5, and a chuck 3 having a wafer 2 placed directly below the transparent glass 5 is provided. At this time, the transparent glass surface and the wafer surface are adjusted so as to be parallel to each other. Unlike the conventional chuck, the back surface 2a of the wafer 2 is not in contact with the surface of the chuck except the part except the outer periphery, and even if foreign matter is attached to the back surface 2a of the wafer 2, it is It will not be crushed. Even if foreign matter is attached to the outer edge 3b of the wafer 2 and the wafer 2 in this portion is damaged, this portion will be cut at the time of finishing, so there is no problem.
【０００９】[0009]
以上説明したように本考案によれば、ウェハーのデバイス部分はチャックに対 し、完全な非接触となるので、異物をはさみ込だとしても、マイクロクラック等 の入る恐れが全くない。また、座ぐり部は大気開放としてあるので、真空がリー クしても、座ぐり部の圧力低下は起こらず、ウェハーのソリや、不要な吸着が起 こらない。更に損傷以外にも、非接触という事により汚染の機会が減少する。 As described above, according to the present invention, the device portion of the wafer is completely in non-contact with the chuck, so that even if foreign matter is inserted, there is no risk of microcracks or the like. Further, since the spot facing portion is open to the atmosphere, even if the vacuum is leaked, the pressure drop in the spot facing portion does not occur, and the warp of the wafer and unnecessary suction do not occur. In addition to damage, non-contact reduces the chance of contamination.
【図１】図１は本考案の一実施例を示す説明図である。FIG. 1 is an explanatory view showing an embodiment of the present invention.
【図２】図２は従来の一例を示す説明図である。FIG. 2 is an explanatory diagram showing a conventional example.
【符号の説明】 １ 透明ガラス ２ ウェハー ３ チャック ４ 孔 ５ 台 3a 座ぐり 3b 外縁 3c 孔 4a 孔[Explanation of symbols] 1 transparent glass 2 wafer 3 chuck 4 holes 5 units 3a counterbore 3b outer edge 3c hole 4a hole
Claims (1)
固定するチャックにおいて、このチャックの内部に前記
ワークと接触しない座ぐりを設け、この座ぐりの外縁に
はワークを固定するための吸着用の孔を設けたことを特
徴とする真空吸着チャック。1. A chuck for fixing a work to be used for manufacturing a semiconductor device or the like, wherein a counterbore which does not come into contact with the work is provided inside the chuck, and a suction hole for fixing the work is provided at an outer edge of the counterbore. The vacuum suction chuck is characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4828893U JPH0714649U (en) | 1993-08-12 | 1993-08-12 | Vacuum suction chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4828893U JPH0714649U (en) | 1993-08-12 | 1993-08-12 | Vacuum suction chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0714649U true JPH0714649U (en) | 1995-03-10 |
Family
ID=12799257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4828893U Pending JPH0714649U (en) | 1993-08-12 | 1993-08-12 | Vacuum suction chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0714649U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51103833U (en) * | 1975-02-18 | 1976-08-19 | ||
| JPS51126620U (en) * | 1975-04-08 | 1976-10-13 | ||
| JPS523025U (en) * | 1975-06-23 | 1977-01-10 | ||
| JPH046979U (en) * | 1990-05-10 | 1992-01-22 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6267519A (en) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | Liquid crystal display panel and its production |
| JPS62148859A (en) * | 1985-12-23 | 1987-07-02 | Nitsusui Seiyaku Kk | Immunological measurement method for bacillus retained in bacterial exosporium |
| JPS63253638A (en) * | 1987-04-10 | 1988-10-20 | Nec Corp | Supporting member for wafer |
| JPH01304732A (en) * | 1988-06-01 | 1989-12-08 | Nec Corp | Semiconductor wafer washer |
| JPH03145715A (en) * | 1989-10-31 | 1991-06-20 | Sony Corp | Spin-coated film forming device |
| JPH0430417A (en) * | 1990-05-28 | 1992-02-03 | Hitachi Ltd | Semiconductor wafer retaining and rotating device |
| JPH04289864A (en) * | 1991-03-19 | 1992-10-14 | Fujitsu Ltd | Reticule stage |
| JP3123572B2 (en) * | 1992-04-30 | 2001-01-15 | いすゞ自動車株式会社 | Body attitude control device |
-
1993
- 1993-08-12 JP JP4828893U patent/JPH0714649U/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6267519A (en) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | Liquid crystal display panel and its production |
| JPS62148859A (en) * | 1985-12-23 | 1987-07-02 | Nitsusui Seiyaku Kk | Immunological measurement method for bacillus retained in bacterial exosporium |
| JPS63253638A (en) * | 1987-04-10 | 1988-10-20 | Nec Corp | Supporting member for wafer |
| JPH01304732A (en) * | 1988-06-01 | 1989-12-08 | Nec Corp | Semiconductor wafer washer |
| JPH03145715A (en) * | 1989-10-31 | 1991-06-20 | Sony Corp | Spin-coated film forming device |
| JPH0430417A (en) * | 1990-05-28 | 1992-02-03 | Hitachi Ltd | Semiconductor wafer retaining and rotating device |
| JPH04289864A (en) * | 1991-03-19 | 1992-10-14 | Fujitsu Ltd | Reticule stage |
| JP3123572B2 (en) * | 1992-04-30 | 2001-01-15 | いすゞ自動車株式会社 | Body attitude control device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51103833U (en) * | 1975-02-18 | 1976-08-19 | ||
| JPS51126620U (en) * | 1975-04-08 | 1976-10-13 | ||
| JPS523025U (en) * | 1975-06-23 | 1977-01-10 | ||
| JPH046979U (en) * | 1990-05-10 | 1992-01-22 |
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