KR102922776B1 - 폴리이미드 전구체 조성물 및, 폴리이미드 - Google Patents

폴리이미드 전구체 조성물 및, 폴리이미드

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Publication number
KR102922776B1
KR102922776B1 KR1020237023012A KR20237023012A KR102922776B1 KR 102922776 B1 KR102922776 B1 KR 102922776B1 KR 1020237023012 A KR1020237023012 A KR 1020237023012A KR 20237023012 A KR20237023012 A KR 20237023012A KR 102922776 B1 KR102922776 B1 KR 102922776B1
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KR
South Korea
Prior art keywords
polyimide
polyimide precursor
precursor composition
bis
dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237023012A
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English (en)
Korean (ko)
Other versions
KR20230146002A (ko
Inventor
나오부미 기노시타
요시노리 기타하라
타케히토 오구라
Original Assignee
제이에프이 케미칼 가부시키가이샤
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Publication of KR20230146002A publication Critical patent/KR20230146002A/ko
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Publication of KR102922776B1 publication Critical patent/KR102922776B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020237023012A 2022-04-08 2022-12-28 폴리이미드 전구체 조성물 및, 폴리이미드 Active KR102922776B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022064437 2022-04-08
JPJP-P-2022-064437 2022-04-08
PCT/JP2022/048476 WO2023195206A1 (ja) 2022-04-08 2022-12-28 ポリイミド前駆体組成物、及び、ポリイミド

Publications (2)

Publication Number Publication Date
KR20230146002A KR20230146002A (ko) 2023-10-18
KR102922776B1 true KR102922776B1 (ko) 2026-02-03

Family

ID=88242650

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023012A Active KR102922776B1 (ko) 2022-04-08 2022-12-28 폴리이미드 전구체 조성물 및, 폴리이미드

Country Status (5)

Country Link
JP (1) JPWO2023195206A1 (https=)
KR (1) KR102922776B1 (https=)
CN (1) CN117203264A (https=)
TW (1) TW202340326A (https=)
WO (1) WO2023195206A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003330167A (ja) * 2002-05-14 2003-11-19 Hitachi Chemical Dupont Microsystems Ltd 耐熱感光性樹脂組成物、パターン製造法及び半導体デバイス
WO2019188306A1 (ja) * 2018-03-28 2019-10-03 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206825A (ja) * 2005-01-31 2006-08-10 Jfe Chemical Corp 芳香族ポリイミド樹脂前駆体及び芳香族ポリイミド樹脂
JP2006282884A (ja) 2005-03-31 2006-10-19 Kaneka Corp ポリイミド樹脂
KR20100004659A (ko) * 2008-07-04 2010-01-13 연세대학교 산학협력단 초음파 자극기 및 초음파 자극 방법
US8668992B2 (en) * 2011-06-01 2014-03-11 Brewer Science Inc. Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients
JP2015028106A (ja) 2013-07-30 2015-02-12 三井化学株式会社 ポリイミド前駆体ワニス、ポリイミド樹脂、およびそれらの用途
CN105315462B (zh) * 2014-07-24 2018-09-14 中国石油化工股份有限公司 聚酰胺酸组合物及其制备方法和应用
JP6638654B2 (ja) * 2014-12-04 2020-01-29 コニカミノルタ株式会社 ポリイミドフィルムとその製造方法、フレキシブルプリント基板、フレキシブルディスプレイ用基材、フレキシブルディスプレイ用前面板、ｌｅｄ照明装置及び有機エレクトロルミネッセンス表示装置
KR102004659B1 (ko) * 2018-10-31 2019-10-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름
CN111087619B (zh) * 2019-12-31 2023-01-17 北京欣奕华科技有限公司 一种聚酰胺酸溶液、聚酰亚胺薄膜及其应用
CN112500569B (zh) * 2021-02-04 2021-05-25 武汉柔显科技股份有限公司 聚酰亚胺前体组合物、聚酰亚胺薄膜、层叠膜及显示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003330167A (ja) * 2002-05-14 2003-11-19 Hitachi Chemical Dupont Microsystems Ltd 耐熱感光性樹脂組成物、パターン製造法及び半導体デバイス
WO2019188306A1 (ja) * 2018-03-28 2019-10-03 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Also Published As

Publication number Publication date
KR20230146002A (ko) 2023-10-18
WO2023195206A1 (ja) 2023-10-12
TW202340326A (zh) 2023-10-16
JPWO2023195206A1 (https=) 2023-10-12
CN117203264A (zh) 2023-12-08

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