KR102881233B1 - 세정용 지그, 도포 장치 및 세정 방법 - Google Patents

세정용 지그, 도포 장치 및 세정 방법

Info

Publication number
KR102881233B1
KR102881233B1 KR1020227036063A KR20227036063A KR102881233B1 KR 102881233 B1 KR102881233 B1 KR 102881233B1 KR 1020227036063 A KR1020227036063 A KR 1020227036063A KR 20227036063 A KR20227036063 A KR 20227036063A KR 102881233 B1 KR102881233 B1 KR 102881233B1
Authority
KR
South Korea
Prior art keywords
cleaning
peripheral edge
cleaning jig
jig
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227036063A
Other languages
English (en)
Korean (ko)
Other versions
KR20220158755A (ko
Inventor
사토시 심무라
고지 다카야나기
겐타 시바사키
히로이치 이나다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20220158755A publication Critical patent/KR20220158755A/ko
Application granted granted Critical
Publication of KR102881233B1 publication Critical patent/KR102881233B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/67051—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H01L21/6715—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2209/00—Details of machines or methods for cleaning hollow articles
    • B08B2209/08—Details of machines or methods for cleaning containers, e.g. tanks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020227036063A 2020-03-27 2021-03-15 세정용 지그, 도포 장치 및 세정 방법 Active KR102881233B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020057079 2020-03-27
JPJP-P-2020-057079 2020-03-27
PCT/JP2021/010392 WO2021193200A1 (ja) 2020-03-27 2021-03-15 洗浄用治具、塗布装置及び洗浄方法

Publications (2)

Publication Number Publication Date
KR20220158755A KR20220158755A (ko) 2022-12-01
KR102881233B1 true KR102881233B1 (ko) 2025-11-04

Family

ID=77892119

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227036063A Active KR102881233B1 (ko) 2020-03-27 2021-03-15 세정용 지그, 도포 장치 및 세정 방법

Country Status (6)

Country Link
US (1) US12257611B2 (https=)
JP (2) JPWO2021193200A1 (https=)
KR (1) KR102881233B1 (https=)
CN (2) CN115298801A (https=)
TW (1) TWI891745B (https=)
WO (1) WO2021193200A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298801A (zh) * 2020-03-27 2022-11-04 东京毅力科创株式会社 清洗用治具、涂布装置以及清洗方法
CN115228864B (zh) * 2022-09-05 2024-08-30 宁波润华全芯微电子设备有限公司 一种旋涂废液收集杯清洗盘及旋涂装置
US20240153811A1 (en) * 2022-11-07 2024-05-09 Samsung Electronics Co., Ltd. Substrate processing apparatus and method for fabricating semiconductor device using the same
KR20240076309A (ko) 2022-11-23 2024-05-30 주식회사 엘지에너지솔루션 전지 팩 및 이를 포함하는 디바이스
KR102769538B1 (ko) * 2022-12-29 2025-02-17 세메스 주식회사 기판 처리 장치
CN118357191A (zh) * 2023-01-17 2024-07-19 苏州太阳井新能源有限公司 一种清洗机及清洗方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016315A (ja) * 2008-07-07 2010-01-21 Tokyo Electron Ltd 回転塗布装置の洗浄用治具および洗浄方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02252232A (ja) * 1989-03-25 1990-10-11 Tokyo Electron Ltd レジスト塗布装置
JP2814184B2 (ja) * 1993-08-23 1998-10-22 東京エレクトロン株式会社 塗布装置
TW418452B (en) 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
JP2006272259A (ja) * 2005-03-30 2006-10-12 Seiko Epson Corp 塗布装置
JP6017338B2 (ja) * 2012-07-11 2016-10-26 東京エレクトロン株式会社 液処理装置、洗浄用治具および洗浄方法
CN115298801A (zh) * 2020-03-27 2022-11-04 东京毅力科创株式会社 清洗用治具、涂布装置以及清洗方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016315A (ja) * 2008-07-07 2010-01-21 Tokyo Electron Ltd 回転塗布装置の洗浄用治具および洗浄方法

Also Published As

Publication number Publication date
US12257611B2 (en) 2025-03-25
KR20220158755A (ko) 2022-12-01
WO2021193200A1 (ja) 2021-09-30
TWI891745B (zh) 2025-08-01
TW202141576A (zh) 2021-11-01
CN115298801A (zh) 2022-11-04
JPWO2021193200A1 (https=) 2021-09-30
JP2024113023A (ja) 2024-08-21
JP7665837B2 (ja) 2025-04-21
US20240207908A1 (en) 2024-06-27
CN215466779U (zh) 2022-01-11

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