KR102871736B1 - 수지 입자, 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents

수지 입자, 도전성 입자, 도전 재료 및 접속 구조체

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Publication number
KR102871736B1
KR102871736B1 KR1020217029565A KR20217029565A KR102871736B1 KR 102871736 B1 KR102871736 B1 KR 102871736B1 KR 1020217029565 A KR1020217029565 A KR 1020217029565A KR 20217029565 A KR20217029565 A KR 20217029565A KR 102871736 B1 KR102871736 B1 KR 102871736B1
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KR
South Korea
Prior art keywords
conductive
particles
resin
particle
resin particles
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KR1020217029565A
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English (en)
Korean (ko)
Other versions
KR20210144695A (ko
Inventor
히로유키 모리타
다케시 와키야
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20210144695A publication Critical patent/KR20210144695A/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020217029565A 2019-03-19 2020-03-18 수지 입자, 도전성 입자, 도전 재료 및 접속 구조체 Active KR102871736B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019050770 2019-03-19
JPJP-P-2019-050770 2019-03-19
JP2019224683 2019-12-12
JPJP-P-2019-224683 2019-12-12
PCT/JP2020/011870 WO2020189697A1 (ja) 2019-03-19 2020-03-18 樹脂粒子、導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
KR20210144695A KR20210144695A (ko) 2021-11-30
KR102871736B1 true KR102871736B1 (ko) 2025-10-17

Family

ID=72520160

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217029565A Active KR102871736B1 (ko) 2019-03-19 2020-03-18 수지 입자, 도전성 입자, 도전 재료 및 접속 구조체

Country Status (6)

Country Link
US (1) US11884782B2 (enExample)
JP (2) JP7411553B2 (enExample)
KR (1) KR102871736B1 (enExample)
CN (1) CN113614142A (enExample)
TW (2) TW202045626A (enExample)
WO (1) WO2020189697A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020189697A1 (ja) * 2019-03-19 2020-09-24 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
CN114207025B (zh) * 2019-08-08 2025-02-25 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料以及连接结构体
KR102535911B1 (ko) 2022-08-12 2023-05-30 오컴퍼니 주식회사 활성도막이 형성된 솔더 입자, 이를 포함한 접속용 필름을 제조하기 위한 혼합물 및 접속용 필름

Citations (2)

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JP2016183300A (ja) 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
WO2018016138A1 (ja) 2016-07-19 2018-01-25 ダイセル・エボニック株式会社 ポリアミド粒子及びその製造方法、樹脂組成物並びに成形品

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JPH0347877A (ja) * 1990-05-31 1991-02-28 Toray Ind Inc エポキシ系球状粒子状接着剤及びその製造方法
KR101086358B1 (ko) 2005-01-25 2011-11-23 아사히 가세이 이-매터리얼즈 가부시키가이샤 도전성 페이스트
JP5731110B2 (ja) * 2009-09-18 2015-06-10 積水化学工業株式会社 発泡粒子、発泡性組成物、及び、発泡成形体の製造方法
WO2012067072A1 (ja) 2010-11-15 2012-05-24 日産化学工業株式会社 熱硬化樹脂軟質化粒子
JP5653737B2 (ja) * 2010-12-08 2015-01-14 株式会社日本触媒 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
WO2013025303A2 (en) 2011-08-18 2013-02-21 Dow Global Technologies Llc Curable resin compositions
JP5323284B1 (ja) * 2012-03-26 2013-10-23 積水化学工業株式会社 導電材料及び接続構造体
US9490046B2 (en) 2013-05-23 2016-11-08 Sekisui Chemical Co., Ltd. Conductive material and connected structure
JP6739988B2 (ja) * 2015-04-30 2020-08-12 積水化学工業株式会社 基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体
JP5854248B1 (ja) * 2015-05-27 2016-02-09 東洋インキＳｃホールディングス株式会社 導電性接着剤、ならびにそれを用いた導電性接着シートおよび電磁波シールドシート
US10557001B2 (en) * 2015-08-24 2020-02-11 Cytec Industries Inc. Composite material and resin composition containing metastable particles
EP3467015B1 (en) * 2015-10-07 2025-06-11 Polyplastics-Evonik Corporation Process for producing a resin composition
JP2019019248A (ja) * 2017-07-19 2019-02-07 住友ベークライト株式会社 熱硬化性樹脂組成物
JP6532575B2 (ja) * 2018-06-07 2019-06-19 デクセリアルズ株式会社 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法
WO2020189697A1 (ja) * 2019-03-19 2020-09-24 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
CN114207025B (zh) 2019-08-08 2025-02-25 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料以及连接结构体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016183300A (ja) 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
WO2018016138A1 (ja) 2016-07-19 2018-01-25 ダイセル・エボニック株式会社 ポリアミド粒子及びその製造方法、樹脂組成物並びに成形品

Also Published As

Publication number Publication date
JPWO2020189697A1 (enExample) 2020-09-24
TW202045626A (zh) 2020-12-16
US11884782B2 (en) 2024-01-30
KR20210144695A (ko) 2021-11-30
WO2020189697A1 (ja) 2020-09-24
TW202419582A (zh) 2024-05-16
JP2024038074A (ja) 2024-03-19
US20220213279A1 (en) 2022-07-07
JP7411553B2 (ja) 2024-01-11
TW202419583A (zh) 2024-05-16
CN113614142A (zh) 2021-11-05

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