JP7411553B2 - 樹脂粒子、導電性粒子、導電材料及び接続構造体 - Google Patents

樹脂粒子、導電性粒子、導電材料及び接続構造体 Download PDF

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JP7411553B2
JP7411553B2 JP2020538868A JP2020538868A JP7411553B2 JP 7411553 B2 JP7411553 B2 JP 7411553B2 JP 2020538868 A JP2020538868 A JP 2020538868A JP 2020538868 A JP2020538868 A JP 2020538868A JP 7411553 B2 JP7411553 B2 JP 7411553B2
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conductive
particles
resin
resin particles
conductive particles
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JPWO2020189697A1 (enExample
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弘幸 森田
武司 脇屋
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2020538868A 2019-03-19 2020-03-18 樹脂粒子、導電性粒子、導電材料及び接続構造体 Active JP7411553B2 (ja)

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JP2023217633A JP2024038074A (ja) 2019-03-19 2023-12-25 樹脂粒子、導電性粒子、導電材料及び接続構造体

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JP2019050770 2019-03-19
JP2019050770 2019-03-19
JP2019224683 2019-12-12
JP2019224683 2019-12-12
PCT/JP2020/011870 WO2020189697A1 (ja) 2019-03-19 2020-03-18 樹脂粒子、導電性粒子、導電材料及び接続構造体

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JP7411553B2 true JP7411553B2 (ja) 2024-01-11

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JP2023217633A Pending JP2024038074A (ja) 2019-03-19 2023-12-25 樹脂粒子、導電性粒子、導電材料及び接続構造体

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US (1) US11884782B2 (enExample)
JP (2) JP7411553B2 (enExample)
KR (1) KR102871736B1 (enExample)
CN (1) CN113614142A (enExample)
TW (2) TW202045626A (enExample)
WO (1) WO2020189697A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024038074A (ja) * 2019-03-19 2024-03-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114207025B (zh) * 2019-08-08 2025-02-25 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料以及连接结构体
KR102535911B1 (ko) 2022-08-12 2023-05-30 오컴퍼니 주식회사 활성도막이 형성된 솔더 입자, 이를 포함한 접속용 필름을 제조하기 위한 혼합물 및 접속용 필름

Citations (7)

* Cited by examiner, † Cited by third party
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WO2006080247A1 (ja) 2005-01-25 2006-08-03 Fujikura Kasei Co., Ltd. 導電性ペースト
JP2011063761A (ja) 2009-09-18 2011-03-31 Sekisui Chem Co Ltd 発泡粒子、発泡性組成物、及び、発泡成形体の製造方法
JP2012124035A (ja) 2010-12-08 2012-06-28 Nippon Shokubai Co Ltd 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
WO2014189028A1 (ja) 2013-05-23 2014-11-27 積水化学工業株式会社 導電材料及び接続構造体
JP2016183300A (ja) 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
WO2018016138A1 (ja) 2016-07-19 2018-01-25 ダイセル・エボニック株式会社 ポリアミド粒子及びその製造方法、樹脂組成物並びに成形品
JP2018142552A (ja) 2018-06-07 2018-09-13 デクセリアルズ株式会社 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法

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JPH0347877A (ja) * 1990-05-31 1991-02-28 Toray Ind Inc エポキシ系球状粒子状接着剤及びその製造方法
WO2012067072A1 (ja) 2010-11-15 2012-05-24 日産化学工業株式会社 熱硬化樹脂軟質化粒子
WO2013025303A2 (en) 2011-08-18 2013-02-21 Dow Global Technologies Llc Curable resin compositions
JP5323284B1 (ja) * 2012-03-26 2013-10-23 積水化学工業株式会社 導電材料及び接続構造体
JP6739988B2 (ja) * 2015-04-30 2020-08-12 積水化学工業株式会社 基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体
JP5854248B1 (ja) * 2015-05-27 2016-02-09 東洋インキＳｃホールディングス株式会社 導電性接着剤、ならびにそれを用いた導電性接着シートおよび電磁波シールドシート
US10557001B2 (en) * 2015-08-24 2020-02-11 Cytec Industries Inc. Composite material and resin composition containing metastable particles
EP3467015B1 (en) * 2015-10-07 2025-06-11 Polyplastics-Evonik Corporation Process for producing a resin composition
JP2019019248A (ja) * 2017-07-19 2019-02-07 住友ベークライト株式会社 熱硬化性樹脂組成物
WO2020189697A1 (ja) * 2019-03-19 2020-09-24 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体
CN114207025B (zh) 2019-08-08 2025-02-25 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料以及连接结构体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080247A1 (ja) 2005-01-25 2006-08-03 Fujikura Kasei Co., Ltd. 導電性ペースト
JP2011063761A (ja) 2009-09-18 2011-03-31 Sekisui Chem Co Ltd 発泡粒子、発泡性組成物、及び、発泡成形体の製造方法
JP2012124035A (ja) 2010-12-08 2012-06-28 Nippon Shokubai Co Ltd 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
WO2014189028A1 (ja) 2013-05-23 2014-11-27 積水化学工業株式会社 導電材料及び接続構造体
JP2016183300A (ja) 2015-03-26 2016-10-20 富士ゼロックス株式会社 熱硬化性粉体塗料、熱硬化性粉体塗料の製造方法、塗装品、及び塗装品の製造方法
WO2018016138A1 (ja) 2016-07-19 2018-01-25 ダイセル・エボニック株式会社 ポリアミド粒子及びその製造方法、樹脂組成物並びに成形品
JP2018142552A (ja) 2018-06-07 2018-09-13 デクセリアルズ株式会社 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024038074A (ja) * 2019-03-19 2024-03-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

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JPWO2020189697A1 (enExample) 2020-09-24
KR102871736B1 (ko) 2025-10-17
TW202045626A (zh) 2020-12-16
US11884782B2 (en) 2024-01-30
KR20210144695A (ko) 2021-11-30
WO2020189697A1 (ja) 2020-09-24
TW202419582A (zh) 2024-05-16
JP2024038074A (ja) 2024-03-19
US20220213279A1 (en) 2022-07-07
TW202419583A (zh) 2024-05-16
CN113614142A (zh) 2021-11-05

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