KR102869537B1 - 워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법 - Google Patents

워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법

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Publication number
KR102869537B1
KR102869537B1 KR1020227035590A KR20227035590A KR102869537B1 KR 102869537 B1 KR102869537 B1 KR 102869537B1 KR 1020227035590 A KR1020227035590 A KR 1020227035590A KR 20227035590 A KR20227035590 A KR 20227035590A KR 102869537 B1 KR102869537 B1 KR 102869537B1
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KR
South Korea
Prior art keywords
polishing
workpiece
model
estimated
torque
Prior art date
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Active
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KR1020227035590A
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English (en)
Korean (ko)
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KR20220155340A (ko
Inventor
노리카즈 스즈키
호즈미 야스다
요시히로 모치즈키
요헤이 하시모토
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
고쿠리츠 다이가쿠 호우징 도우카이 고쿠리츠 다이가쿠 기코우
도쿠리츠다이가쿠호징 가나자와다이가쿠
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Application filed by 가부시키가이샤 에바라 세이사꾸쇼, 고쿠리츠 다이가쿠 호우징 도우카이 고쿠리츠 다이가쿠 기코우, 도쿠리츠다이가쿠호징 가나자와다이가쿠 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20220155340A publication Critical patent/KR20220155340A/ko
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Publication of KR102869537B1 publication Critical patent/KR102869537B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020227035590A 2020-03-24 2021-03-10 워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법 Active KR102869537B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-052046 2020-03-24
JP2020052046A JP7465498B2 (ja) 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
PCT/JP2021/009516 WO2021193063A1 (ja) 2020-03-24 2021-03-10 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法

Publications (2)

Publication Number Publication Date
KR20220155340A KR20220155340A (ko) 2022-11-22
KR102869537B1 true KR102869537B1 (ko) 2025-10-13

Family

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Family Applications (1)

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KR1020227035590A Active KR102869537B1 (ko) 2020-03-24 2021-03-10 워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법

Country Status (6)

Country Link
US (1) US20230043639A1 (https=)
JP (1) JP7465498B2 (https=)
KR (1) KR102869537B1 (https=)
CN (1) CN115397612B (https=)
TW (1) TWI883149B (https=)
WO (1) WO2021193063A1 (https=)

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KR102624869B1 (ko) * 2021-10-05 2024-01-15 울산대학교 산학협력단 디지털 트윈을 기반으로 하는 양면 연삭 공정 제어 시스템 및 그 방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム
TWI817853B (zh) * 2022-11-29 2023-10-01 環球晶圓股份有限公司 晶圓研磨參數優化方法及電子裝置
CN115771102B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种应用于双面研磨工艺的数字孪生系统
CN116967926A (zh) * 2023-09-11 2023-10-31 北京晶亦精微科技股份有限公司 基于修整器的扫描电机扭矩的抛光垫使用寿命监测方法
KR20250041367A (ko) 2023-09-18 2025-03-25 삼성전자주식회사 기판 처리 방법
JP2025103220A (ja) 2023-12-27 2025-07-09 株式会社荏原製作所 ワークピースの化学機械研磨システムおよび化学機械研磨方法
CN121893161A (zh) * 2024-12-19 2026-04-21 华海清科股份有限公司 防护装置、晶圆磨削模块、减薄设备及方法、处理设备

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JP2012056029A (ja) 2010-09-09 2012-03-22 Ebara Corp 研磨装置
JP2012074574A (ja) 2010-09-29 2012-04-12 Hitachi Ltd 加工装置制御システムおよび加工装置制御方法
JP2013118404A (ja) * 2002-03-14 2013-06-13 Nikon Corp 加工形状の予測方法、加工条件の決定方法、加工量予測方法、加工形状予測システム、加工条件決定システム、加工システム、加工形状予測計算機プログラム、加工条件決定計算機プログラム、プログラム記録媒体、及び半導体デバイスの製造方法
JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

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DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
TW200536662A (en) * 2004-03-04 2005-11-16 Trecenti Technologies Inc Method and system of chemicalmechanical polishing and manufacturing method of semiconductor device
JP2007281026A (ja) * 2006-04-03 2007-10-25 Renesas Technology Corp 半導体装置の研磨方法
WO2008072300A1 (ja) * 2006-12-11 2008-06-19 Renesas Technology Corp. 半導体装置の製造方法、およびウェハの研磨方法
JP2010087135A (ja) * 2008-09-30 2010-04-15 Nec Corp 半導体装置の製造方法およびｃｍｐ装置
JP2011148036A (ja) * 2010-01-21 2011-08-04 Nec Corp データ処理装置、研磨装置、研磨レートの推定方法およびプログラム
CN102390036B (zh) * 2011-10-28 2014-04-02 中国科学院微电子研究所 基于浅沟道隔离技术的化学机械研磨终点检测方法及系统
JP6034717B2 (ja) * 2013-02-22 2016-11-30 株式会社荏原製作所 ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置
JP6293519B2 (ja) * 2014-03-05 2018-03-14 株式会社荏原製作所 研磨装置および研磨方法
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JP6782145B2 (ja) * 2016-10-18 2020-11-11 株式会社荏原製作所 基板処理制御システム、基板処理制御方法、およびプログラム
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JP2013118404A (ja) * 2002-03-14 2013-06-13 Nikon Corp 加工形状の予測方法、加工条件の決定方法、加工量予測方法、加工形状予測システム、加工条件決定システム、加工システム、加工形状予測計算機プログラム、加工条件決定計算機プログラム、プログラム記録媒体、及び半導体デバイスの製造方法
JP2012056029A (ja) 2010-09-09 2012-03-22 Ebara Corp 研磨装置
CN102398210A (zh) 2010-09-09 2012-04-04 株式会社荏原制作所 研磨装置
JP2012074574A (ja) 2010-09-29 2012-04-12 Hitachi Ltd 加工装置制御システムおよび加工装置制御方法
JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

Also Published As

Publication number Publication date
CN115397612B (zh) 2024-06-07
TWI883149B (zh) 2025-05-11
CN115397612A (zh) 2022-11-25
TW202140197A (zh) 2021-11-01
US20230043639A1 (en) 2023-02-09
KR20220155340A (ko) 2022-11-22
WO2021193063A1 (ja) 2021-09-30
JP7465498B2 (ja) 2024-04-11
JP2021146493A (ja) 2021-09-27

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