JP7465498B2 - ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 - Google Patents

ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 Download PDF

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Publication number
JP7465498B2
JP7465498B2 JP2020052046A JP2020052046A JP7465498B2 JP 7465498 B2 JP7465498 B2 JP 7465498B2 JP 2020052046 A JP2020052046 A JP 2020052046A JP 2020052046 A JP2020052046 A JP 2020052046A JP 7465498 B2 JP7465498 B2 JP 7465498B2
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Japan
Prior art keywords
polishing
model
workpiece
torque
estimated
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JP2020052046A
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Japanese (ja)
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JP2021146493A5 (https=
JP2021146493A (ja
Inventor
教和 鈴木
穂積 安田
宣宏 望月
洋平 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Kanazawa University NUC
Tokai National Higher Education and Research System NUC
Original Assignee
Ebara Corp
Kanazawa University NUC
Tokai National Higher Education and Research System NUC
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Priority to JP2020052046A priority Critical patent/JP7465498B2/ja
Application filed by Ebara Corp, Kanazawa University NUC, Tokai National Higher Education and Research System NUC filed Critical Ebara Corp
Priority to CN202180022839.3A priority patent/CN115397612B/zh
Priority to PCT/JP2021/009516 priority patent/WO2021193063A1/ja
Priority to KR1020227035590A priority patent/KR102869537B1/ko
Priority to US17/911,947 priority patent/US20230043639A1/en
Priority to TW110110227A priority patent/TWI883149B/zh
Publication of JP2021146493A publication Critical patent/JP2021146493A/ja
Publication of JP2021146493A5 publication Critical patent/JP2021146493A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2020052046A 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 Active JP7465498B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020052046A JP7465498B2 (ja) 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
PCT/JP2021/009516 WO2021193063A1 (ja) 2020-03-24 2021-03-10 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
KR1020227035590A KR102869537B1 (ko) 2020-03-24 2021-03-10 워크피스의 화학 기계 연마 시스템, 연산 시스템, 및 화학 기계 연마의 시뮬레이션 모델을 작성하는 방법
US17/911,947 US20230043639A1 (en) 2020-03-24 2021-03-10 Chemical mechanical polishing system for a workpiece, arithmetic system, and method of producing simulation model for chemical mechanical polishing
CN202180022839.3A CN115397612B (zh) 2020-03-24 2021-03-10 工件的化学机械研磨系统、演算系统、及化学机械研磨的模拟模型的制作方法
TW110110227A TWI883149B (zh) 2020-03-24 2021-03-22 工件之化學機械研磨系統、演算系統、及化學機械研磨之模擬模式之作成方法

Applications Claiming Priority (1)

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JP2020052046A JP7465498B2 (ja) 2020-03-24 2020-03-24 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法

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JP2021146493A JP2021146493A (ja) 2021-09-27
JP2021146493A5 JP2021146493A5 (https=) 2023-03-28
JP7465498B2 true JP7465498B2 (ja) 2024-04-11

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US (1) US20230043639A1 (https=)
JP (1) JP7465498B2 (https=)
KR (1) KR102869537B1 (https=)
CN (1) CN115397612B (https=)
TW (1) TWI883149B (https=)
WO (1) WO2021193063A1 (https=)

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KR102624869B1 (ko) * 2021-10-05 2024-01-15 울산대학교 산학협력단 디지털 트윈을 기반으로 하는 양면 연삭 공정 제어 시스템 및 그 방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム
TWI817853B (zh) * 2022-11-29 2023-10-01 環球晶圓股份有限公司 晶圓研磨參數優化方法及電子裝置
CN115771102B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种应用于双面研磨工艺的数字孪生系统
CN116967926A (zh) * 2023-09-11 2023-10-31 北京晶亦精微科技股份有限公司 基于修整器的扫描电机扭矩的抛光垫使用寿命监测方法
KR20250041367A (ko) 2023-09-18 2025-03-25 삼성전자주식회사 기판 처리 방법
JP2025103220A (ja) 2023-12-27 2025-07-09 株式会社荏原製作所 ワークピースの化学機械研磨システムおよび化学機械研磨方法
CN121893161A (zh) * 2024-12-19 2026-04-21 华海清科股份有限公司 防护装置、晶圆磨削模块、减薄设备及方法、处理设备

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JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

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DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
TW200536662A (en) * 2004-03-04 2005-11-16 Trecenti Technologies Inc Method and system of chemicalmechanical polishing and manufacturing method of semiconductor device
JP2007281026A (ja) * 2006-04-03 2007-10-25 Renesas Technology Corp 半導体装置の研磨方法
WO2008072300A1 (ja) * 2006-12-11 2008-06-19 Renesas Technology Corp. 半導体装置の製造方法、およびウェハの研磨方法
JP2010087135A (ja) * 2008-09-30 2010-04-15 Nec Corp 半導体装置の製造方法およびｃｍｐ装置
JP2011148036A (ja) * 2010-01-21 2011-08-04 Nec Corp データ処理装置、研磨装置、研磨レートの推定方法およびプログラム
JP5511600B2 (ja) 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
JP2012074574A (ja) * 2010-09-29 2012-04-12 Hitachi Ltd 加工装置制御システムおよび加工装置制御方法
CN102390036B (zh) * 2011-10-28 2014-04-02 中国科学院微电子研究所 基于浅沟道隔离技术的化学机械研磨终点检测方法及系统
JP6034717B2 (ja) * 2013-02-22 2016-11-30 株式会社荏原製作所 ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置
JP6293519B2 (ja) * 2014-03-05 2018-03-14 株式会社荏原製作所 研磨装置および研磨方法
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JP2013118404A (ja) 2002-03-14 2013-06-13 Nikon Corp 加工形状の予測方法、加工条件の決定方法、加工量予測方法、加工形状予測システム、加工条件決定システム、加工システム、加工形状予測計算機プログラム、加工条件決定計算機プログラム、プログラム記録媒体、及び半導体デバイスの製造方法
JP2016124063A (ja) 2014-12-26 2016-07-11 株式会社荏原製作所 研磨装置およびその制御方法

Also Published As

Publication number Publication date
CN115397612B (zh) 2024-06-07
TWI883149B (zh) 2025-05-11
CN115397612A (zh) 2022-11-25
TW202140197A (zh) 2021-11-01
US20230043639A1 (en) 2023-02-09
KR20220155340A (ko) 2022-11-22
WO2021193063A1 (ja) 2021-09-30
KR102869537B1 (ko) 2025-10-13
JP2021146493A (ja) 2021-09-27

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