KR102865140B1 - 임프린트 방법, 임프린트 장치 및 물품의 제조 방법 - Google Patents

임프린트 방법, 임프린트 장치 및 물품의 제조 방법

Info

Publication number
KR102865140B1
KR102865140B1 KR1020220011171A KR20220011171A KR102865140B1 KR 102865140 B1 KR102865140 B1 KR 102865140B1 KR 1020220011171 A KR1020220011171 A KR 1020220011171A KR 20220011171 A KR20220011171 A KR 20220011171A KR 102865140 B1 KR102865140 B1 KR 102865140B1
Authority
KR
South Korea
Prior art keywords
light
imprint material
curing
imprint
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020220011171A
Other languages
English (en)
Korean (ko)
Other versions
KR20220110106A (ko
Inventor
요시히로 마츠오카
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20220110106A publication Critical patent/KR20220110106A/ko
Application granted granted Critical
Publication of KR102865140B1 publication Critical patent/KR102865140B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating
    • B29C2037/903—Measuring, controlling or regulating by means of a computer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020220011171A 2021-01-29 2022-01-26 임프린트 방법, 임프린트 장치 및 물품의 제조 방법 Active KR102865140B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-013598 2021-01-29
JP2021013598A JP7591933B2 (ja) 2021-01-29 2021-01-29 インプリント方法、インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20220110106A KR20220110106A (ko) 2022-08-05
KR102865140B1 true KR102865140B1 (ko) 2025-09-29

Family

ID=82612168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220011171A Active KR102865140B1 (ko) 2021-01-29 2022-01-26 임프린트 방법, 임프린트 장치 및 물품의 제조 방법

Country Status (3)

Country Link
US (1) US12330349B2 (https=)
JP (1) JP7591933B2 (https=)
KR (1) KR102865140B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431659B2 (ja) * 2020-05-01 2024-02-15 キヤノン株式会社 インプリント方法、インプリント装置および物品製造方法
JP7804454B2 (ja) * 2021-12-20 2026-01-22 キヤノン株式会社 インプリント方法、インプリント装置および物品製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190079391A1 (en) 2017-09-11 2019-03-14 Toshiba Memory Corporation Imprint apparatus and imprint method
JP2019102735A (ja) * 2017-12-06 2019-06-24 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
US20190212645A1 (en) 2018-01-05 2019-07-11 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method
US20190358863A1 (en) * 2018-05-24 2019-11-28 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method for manufacturing product

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100547279B1 (ko) * 2003-10-21 2006-01-31 학교법인 포항공과대학교 Ｕｖ경화성수지의 실시간 경화도 측정시스템
JP6632270B2 (ja) 2014-09-08 2020-01-22 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190079391A1 (en) 2017-09-11 2019-03-14 Toshiba Memory Corporation Imprint apparatus and imprint method
JP2019102735A (ja) * 2017-12-06 2019-06-24 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
US20190212645A1 (en) 2018-01-05 2019-07-11 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method
US20190358863A1 (en) * 2018-05-24 2019-11-28 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method for manufacturing product

Also Published As

Publication number Publication date
US12330349B2 (en) 2025-06-17
KR20220110106A (ko) 2022-08-05
JP2022117092A (ja) 2022-08-10
JP7591933B2 (ja) 2024-11-29
US20220242013A1 (en) 2022-08-04

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