KR102851236B1 - 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법 - Google Patents

가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법

Info

Publication number
KR102851236B1
KR102851236B1 KR1020247031651A KR20247031651A KR102851236B1 KR 102851236 B1 KR102851236 B1 KR 102851236B1 KR 1020247031651 A KR1020247031651 A KR 1020247031651A KR 20247031651 A KR20247031651 A KR 20247031651A KR 102851236 B1 KR102851236 B1 KR 102851236B1
Authority
KR
South Korea
Prior art keywords
assembly
enclosure
printhead
gas
various embodiments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247031651A
Other languages
English (en)
Korean (ko)
Other versions
KR20240146089A (ko
Inventor
저스틴 마욱
알렉산더 소우-캉 코
에리야후 브론스키
샨돈 알더슨
Original Assignee
카티바, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/802,304 external-priority patent/US9048344B2/en
Application filed by 카티바, 인크. filed Critical 카티바, 인크.
Publication of KR20240146089A publication Critical patent/KR20240146089A/ko
Application granted granted Critical
Publication of KR102851236B1 publication Critical patent/KR102851236B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/02—Framework
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12—Guards, shields or dust excluders
    • B41J29/13—Cases or covers
    • H01L21/54—
    • H01L21/6719—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Facsimiles In General (AREA)
KR1020247031651A 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법 Active KR102851236B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/802,304 US9048344B2 (en) 2008-06-13 2013-03-13 Gas enclosure assembly and system
US13/802,304 2013-03-13
KR1020227040440A KR20220162809A (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
PCT/US2014/023820 WO2014164932A2 (en) 2013-03-13 2014-03-11 Gas enclosure systems and methods utilizing an auxiliary enclosure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227040440A Division KR20220162809A (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법

Publications (2)

Publication Number Publication Date
KR20240146089A KR20240146089A (ko) 2024-10-07
KR102851236B1 true KR102851236B1 (ko) 2025-08-26

Family

ID=51659308

Family Applications (6)

Application Number Title Priority Date Filing Date
KR1020247031651A Active KR102851236B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020227040440A Ceased KR20220162809A (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020157027963A Active KR101903226B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020187027231A Active KR102098613B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020207009581A Active KR102267858B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020217018547A Active KR102470120B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법

Family Applications After (5)

Application Number Title Priority Date Filing Date
KR1020227040440A Ceased KR20220162809A (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020157027963A Active KR101903226B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020187027231A Active KR102098613B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020207009581A Active KR102267858B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
KR1020217018547A Active KR102470120B1 (ko) 2013-03-13 2014-03-11 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법

Country Status (5)

Country Link
EP (2) EP2973676B1 (https=)
JP (5) JP6349382B2 (https=)
KR (6) KR102851236B1 (https=)
CN (2) CN105190860B (https=)
WO (1) WO2014164932A2 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US9604245B2 (en) 2008-06-13 2017-03-28 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
KR102851236B1 (ko) * 2013-03-13 2025-08-26 카티바, 인크. 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
EP3007900A4 (en) * 2013-06-10 2017-05-10 Kateeva, Inc. Low-particle gas enclosure systems and methods
WO2015100375A1 (en) 2013-12-26 2015-07-02 Kateeva, Inc. Thermal treatment of electronic devices
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
KR102850075B1 (ko) 2014-04-30 2025-08-25 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
CN106489212B (zh) * 2014-07-18 2019-07-12 科迪华公司 利用多区域循环及过滤的气体封闭系统和方法
WO2016086192A1 (en) * 2014-11-26 2016-06-02 Kateeva, Inc. Environmentally controlled coating systems
JP6254108B2 (ja) * 2015-01-07 2017-12-27 住友化学株式会社 有機ｅｌパネルの製造方法
FR3055108A1 (fr) * 2016-08-16 2018-02-23 Dover Europe Sarl Procede et dispositif de filtrage de l'atmosphere recyclee d'une tete d'impression
JP6544658B2 (ja) * 2017-02-17 2019-07-17 株式会社ウエイト東海 載置物の転倒防止装置
JP7178937B2 (ja) * 2019-03-20 2022-11-28 ローランドディー．ジー．株式会社 プリンタ
CN111038108B (zh) * 2019-12-10 2021-11-23 Tcl华星光电技术有限公司 喷墨打印用墨盒的存储装置及其存储方法
JP7555022B2 (ja) * 2020-05-19 2024-09-24 パナソニックＩｐマネジメント株式会社 インクジェット印刷装置
CN112319045B (zh) * 2020-09-10 2022-05-31 季华实验室 一种玻璃基板的加工方法和喷墨打印设备
DE102020215072A1 (de) * 2020-11-30 2022-06-02 Ekra Automatisierungssysteme Gmbh Lagersystem und Drucksystem
KR102473786B1 (ko) 2021-01-07 2022-12-06 (주)유니젯 인클로저 시스템
CN115871332B (zh) * 2021-09-28 2025-10-31 广东聚华印刷显示技术有限公司 一种喷墨打印装置、喷墨打印方法及喷墨打印系统
CN114103454B (zh) * 2021-11-22 2023-01-10 Tcl华星光电技术有限公司 喷墨打印系统及喷头维护方法
CN118181360B (zh) * 2024-05-15 2024-07-16 成都德力斯实业有限公司 一种在役核手套箱及其改造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130040061A1 (en) * 2011-08-09 2013-02-14 Kateeva, Inc. Face-down printing apparatus and method

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5029518A (en) * 1989-10-16 1991-07-09 Clean Air Technology, Inc. Modular clean room structure
US5651625A (en) * 1995-04-10 1997-07-29 Security Operating Systems, Inc. Printer enclosure and controller unit
US6089282A (en) * 1998-05-08 2000-07-18 Aeronex, Inc. Method for recovery and reuse of gas
US6023899A (en) * 1998-11-03 2000-02-15 Climatecraft Technologies, Inc. Wall panel assembly with airtight joint
JP4827294B2 (ja) * 1999-11-29 2011-11-30 株式会社半導体エネルギー研究所 成膜装置及び発光装置の作製方法
US6375304B1 (en) * 2000-02-17 2002-04-23 Lexmark International, Inc. Maintenance mist control
JP3868280B2 (ja) 2001-12-04 2007-01-17 株式会社美和製作所 有機電界発光素子の製造装置
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
JP4008387B2 (ja) * 2002-08-02 2007-11-14 セイコーエプソン株式会社 液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器
JP2004146369A (ja) * 2002-09-20 2004-05-20 Semiconductor Energy Lab Co Ltd 製造装置および発光装置の作製方法
AU2003263609A1 (en) * 2002-09-20 2004-04-08 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
JP2004247111A (ja) * 2003-02-12 2004-09-02 Seiko Epson Corp 長尺体配設構造、液滴吐出装置、電気光学装置、電気光学装置の製造方法および電子機器
KR100505061B1 (ko) * 2003-02-12 2005-08-01 삼성전자주식회사 기판 이송 모듈
TWI225008B (en) * 2003-12-31 2004-12-11 Ritdisplay Corp Ink-jet printing apparatus
JP2005218899A (ja) * 2004-02-03 2005-08-18 Toshiba Corp 塗布装置及びこれを備えた表示装置製造装置
US7354845B2 (en) * 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
JP2006120382A (ja) * 2004-10-20 2006-05-11 Seiko Epson Corp 有機ｅｌ装置の製造装置及び方法、並びに電気光学装置及び電子機器
US7908885B2 (en) * 2004-11-08 2011-03-22 New Way Machine Components, Inc. Non-contact porous air bearing and glass flattening device
CN101243543A (zh) * 2005-07-13 2008-08-13 富士胶片迪麦提克斯公司 流体沉积组合设备工具
US20070026151A1 (en) 2005-07-13 2007-02-01 Higginson John A Fluid Deposition Cluster Tool
JP2007253043A (ja) 2006-03-22 2007-10-04 Toshiba Corp 液滴噴射装置及び塗布体の製造方法
JP2008047340A (ja) * 2006-08-11 2008-02-28 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
WO2008069259A1 (en) * 2006-12-05 2008-06-12 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
JP2008246435A (ja) 2007-03-30 2008-10-16 Shibaura Mechatronics Corp 溶液の塗布方法及び装置
CN101682954B (zh) * 2007-05-16 2014-10-29 株式会社爱发科 有机el装置的制造装置
KR101592443B1 (ko) 2007-05-18 2016-02-18 무사시 엔지니어링 가부시키가이샤 액체 재료 토출 방법 및 장치
CN101754859B (zh) * 2007-06-14 2012-05-30 麻省理工学院 用于沉积膜的方法和设备
JP4600483B2 (ja) * 2008-01-28 2010-12-15 セイコーエプソン株式会社 液滴吐出装置、吐出方法、カラーフィルタの製造方法、有機ｅｌ装置の製造方法
US8383202B2 (en) * 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
JP2010211045A (ja) 2009-03-11 2010-09-24 Seiko Epson Corp 圧力調整弁およびこれを備えた液滴吐出装置
JP2010267399A (ja) * 2009-05-12 2010-11-25 Panasonic Corp 塗布装置
JP2011088101A (ja) 2009-10-26 2011-05-06 Seiko Epson Corp 液滴吐出装置
JP5492289B2 (ja) * 2010-03-26 2014-05-14 シャープ株式会社 成膜装置および成膜方法
US20110318503A1 (en) * 2010-06-29 2011-12-29 Christian Adams Plasma enhanced materials deposition system
CN103620812B (zh) * 2011-07-01 2018-05-04 科迪华公司 用于将载体液体蒸汽从墨分离的设备和方法
US9120344B2 (en) * 2011-08-09 2015-09-01 Kateeva, Inc. Apparatus and method for control of print gap
KR102851236B1 (ko) * 2013-03-13 2025-08-26 카티바, 인크. 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
CN107264083B (zh) * 2013-10-02 2019-11-19 科迪华公司 用于控制打印间隙的设备和方法
CN103832094B (zh) * 2014-02-24 2016-07-06 苏州志东岚自动化设备有限公司 标牌激光打标自动送料机

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130040061A1 (en) * 2011-08-09 2013-02-14 Kateeva, Inc. Face-down printing apparatus and method

Also Published As

Publication number Publication date
WO2014164932A3 (en) 2015-02-26
JP7177521B2 (ja) 2022-11-24
JP6831046B2 (ja) 2021-02-17
CN105190860B (zh) 2018-09-21
EP3474317B1 (en) 2022-06-22
KR20210077007A (ko) 2021-06-24
CN109130549B (zh) 2021-02-26
KR20150131111A (ko) 2015-11-24
KR102098613B1 (ko) 2020-04-08
JP7454878B2 (ja) 2024-03-25
KR20240146089A (ko) 2024-10-07
CN109130549A (zh) 2019-01-04
JP2018041744A (ja) 2018-03-15
JP2021035678A (ja) 2021-03-04
KR102267858B1 (ko) 2021-06-22
EP2973676B1 (en) 2018-11-28
KR20200038326A (ko) 2020-04-10
KR20180107319A (ko) 2018-10-01
WO2014164932A2 (en) 2014-10-09
KR20220162809A (ko) 2022-12-08
EP3474317A1 (en) 2019-04-24
JP2023010755A (ja) 2023-01-20
JP2019091702A (ja) 2019-06-13
KR102470120B1 (ko) 2022-11-22
JP2016518675A (ja) 2016-06-23
EP2973676A4 (en) 2017-07-19
KR101903226B1 (ko) 2018-10-01
JP6463827B2 (ja) 2019-02-06
EP2973676A2 (en) 2016-01-20
JP6349382B2 (ja) 2018-06-27
CN105190860A (zh) 2015-12-23

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