CN105190860B - 气体封闭系统和利用辅助封闭装置的方法 - Google Patents

气体封闭系统和利用辅助封闭装置的方法 Download PDF

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Publication number
CN105190860B
CN105190860B CN201480027671.5A CN201480027671A CN105190860B CN 105190860 B CN105190860 B CN 105190860B CN 201480027671 A CN201480027671 A CN 201480027671A CN 105190860 B CN105190860 B CN 105190860B
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CN
China
Prior art keywords
enclosure
assembly
gas
gas enclosure
printhead
Prior art date
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Active
Application number
CN201480027671.5A
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English (en)
Chinese (zh)
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CN105190860A (zh
Inventor
J.莫克
A.S-K.高
E.弗龙斯基
S.阿尔德森
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Kateeva Inc
Original Assignee
Kateeva Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/802,304 external-priority patent/US9048344B2/en
Application filed by Kateeva Inc filed Critical Kateeva Inc
Priority to CN201811010130.8A priority Critical patent/CN109130549B/zh
Publication of CN105190860A publication Critical patent/CN105190860A/zh
Application granted granted Critical
Publication of CN105190860B publication Critical patent/CN105190860B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/02—Framework
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12—Guards, shields or dust excluders
    • B41J29/13—Cases or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H10W76/05—Providing fillings in containers, e.g. gas filling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Facsimiles In General (AREA)
CN201480027671.5A 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法 Active CN105190860B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811010130.8A CN109130549B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/802,304 US9048344B2 (en) 2008-06-13 2013-03-13 Gas enclosure assembly and system
US13/802304 2013-03-13
PCT/US2014/023820 WO2014164932A2 (en) 2013-03-13 2014-03-11 Gas enclosure systems and methods utilizing an auxiliary enclosure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811010130.8A Division CN109130549B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Publications (2)

Publication Number Publication Date
CN105190860A CN105190860A (zh) 2015-12-23
CN105190860B true CN105190860B (zh) 2018-09-21

Family

ID=51659308

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480027671.5A Active CN105190860B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法
CN201811010130.8A Active CN109130549B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201811010130.8A Active CN109130549B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Country Status (5)

Country Link
EP (2) EP2973676B1 (https=)
JP (5) JP6349382B2 (https=)
KR (6) KR102851236B1 (https=)
CN (2) CN105190860B (https=)
WO (1) WO2014164932A2 (https=)

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US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US9604245B2 (en) 2008-06-13 2017-03-28 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
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EP3007900A4 (en) * 2013-06-10 2017-05-10 Kateeva, Inc. Low-particle gas enclosure systems and methods
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CN111038108B (zh) * 2019-12-10 2021-11-23 Tcl华星光电技术有限公司 喷墨打印用墨盒的存储装置及其存储方法
JP7555022B2 (ja) * 2020-05-19 2024-09-24 パナソニックＩｐマネジメント株式会社 インクジェット印刷装置
CN112319045B (zh) * 2020-09-10 2022-05-31 季华实验室 一种玻璃基板的加工方法和喷墨打印设备
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CN115871332B (zh) * 2021-09-28 2025-10-31 广东聚华印刷显示技术有限公司 一种喷墨打印装置、喷墨打印方法及喷墨打印系统
CN114103454B (zh) * 2021-11-22 2023-01-10 Tcl华星光电技术有限公司 喷墨打印系统及喷头维护方法
CN118181360B (zh) * 2024-05-15 2024-07-16 成都德力斯实业有限公司 一种在役核手套箱及其改造方法

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Also Published As

Publication number Publication date
WO2014164932A3 (en) 2015-02-26
JP7177521B2 (ja) 2022-11-24
JP6831046B2 (ja) 2021-02-17
EP3474317B1 (en) 2022-06-22
KR20210077007A (ko) 2021-06-24
CN109130549B (zh) 2021-02-26
KR20150131111A (ko) 2015-11-24
KR102098613B1 (ko) 2020-04-08
JP7454878B2 (ja) 2024-03-25
KR102851236B1 (ko) 2025-08-26
KR20240146089A (ko) 2024-10-07
CN109130549A (zh) 2019-01-04
JP2018041744A (ja) 2018-03-15
JP2021035678A (ja) 2021-03-04
KR102267858B1 (ko) 2021-06-22
EP2973676B1 (en) 2018-11-28
KR20200038326A (ko) 2020-04-10
KR20180107319A (ko) 2018-10-01
WO2014164932A2 (en) 2014-10-09
KR20220162809A (ko) 2022-12-08
EP3474317A1 (en) 2019-04-24
JP2023010755A (ja) 2023-01-20
JP2019091702A (ja) 2019-06-13
KR102470120B1 (ko) 2022-11-22
JP2016518675A (ja) 2016-06-23
EP2973676A4 (en) 2017-07-19
KR101903226B1 (ko) 2018-10-01
JP6463827B2 (ja) 2019-02-06
EP2973676A2 (en) 2016-01-20
JP6349382B2 (ja) 2018-06-27
CN105190860A (zh) 2015-12-23

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GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Gas sealing system and method of using auxiliary sealing device

Effective date of registration: 20210112

Granted publication date: 20180921

Pledgee: Shaoxing Binhai New Area integrated circuit industry equity investment fund partnership (L.P.)

Pledgor: KATEEVA, Inc.

Registration number: Y2021990000035

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20221210

Granted publication date: 20180921

Pledgee: Shaoxing Binhai New Area integrated circuit industry equity investment fund partnership (L.P.)

Pledgor: KATEEVA, Inc.

Registration number: Y2021990000035

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Gas Closed system and method of using auxiliary closed device

Effective date of registration: 20230625

Granted publication date: 20180921

Pledgee: Xinji Co.,Ltd.

Pledgor: KATEEVA, Inc.

Registration number: Y2023990000311