KR102840818B1 - 감시 시스템 - Google Patents

감시 시스템

Info

Publication number
KR102840818B1
KR102840818B1 KR1020200140103A KR20200140103A KR102840818B1 KR 102840818 B1 KR102840818 B1 KR 102840818B1 KR 1020200140103 A KR1020200140103 A KR 1020200140103A KR 20200140103 A KR20200140103 A KR 20200140103A KR 102840818 B1 KR102840818 B1 KR 102840818B1
Authority
KR
South Korea
Prior art keywords
laser sensor
casing
substrate processing
processing device
detection result
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020200140103A
Other languages
English (en)
Korean (ko)
Other versions
KR20210056234A (ko
Inventor
쇼타 가네코
시게미 오오노
노리히데 사가라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20210056234A publication Critical patent/KR20210056234A/ko
Application granted granted Critical
Publication of KR102840818B1 publication Critical patent/KR102840818B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H01L21/67259—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by monitoring or safety
    • H01L21/67017—
    • H01L21/67225—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/188—Capturing isolated or intermittent images triggered by the occurrence of a predetermined event, e.g. an object reaching a predetermined position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Emergency Alarm Devices (AREA)
  • Alarm Systems (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020200140103A 2019-11-08 2020-10-27 감시 시스템 Active KR102840818B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-202929 2019-11-08
JP2019202929A JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム

Publications (2)

Publication Number Publication Date
KR20210056234A KR20210056234A (ko) 2021-05-18
KR102840818B1 true KR102840818B1 (ko) 2025-08-01

Family

ID=75751021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200140103A Active KR102840818B1 (ko) 2019-11-08 2020-10-27 감시 시스템

Country Status (4)

Country Link
US (1) US12243758B2 (enExample)
JP (1) JP7365200B2 (enExample)
KR (1) KR102840818B1 (enExample)
CN (1) CN112786434B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024168431A (ja) 2023-05-24 2024-12-05 東京エレクトロン株式会社 基板処理装置、保守方法及び記憶媒体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064300A (ja) * 2000-08-22 2002-02-28 Nikon Corp 基板処理装置
JP2019140379A (ja) * 2018-02-09 2019-08-22 東京エレクトロン株式会社 基板処理装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JPH1050800A (ja) * 1996-08-05 1998-02-20 Canon Sales Co Inc 処理装置
JPH10208170A (ja) * 1997-01-20 1998-08-07 Kyoshin Ryutsu Deberotsupaa Kk 自主警備及び在宅動静システム及びセンサ
JP2000069459A (ja) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd 監視システム
JP2001326162A (ja) 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
JP2003102858A (ja) * 2001-09-28 2003-04-08 Nohmi Bosai Ltd 閉鎖空間の防火システム
JP2007088485A (ja) 2001-12-25 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP3979135B2 (ja) 2002-03-20 2007-09-19 セイコーエプソン株式会社 チャンバ装置、これを備えた電気光学装置および有機ｅｌ装置
JP2005327917A (ja) * 2004-05-14 2005-11-24 Nikon Corp 光学式計測装置
US7816152B2 (en) * 2007-04-11 2010-10-19 WaferMaster, Inc. In situ, ex situ and inline process monitoring, optimization and fabrication
TWI411289B (zh) * 2009-03-31 2013-10-01 E Pin Optical Industry Co Ltd Ｕ形光程掃瞄成像方法及其影像掃瞄模組
JP2012094822A (ja) * 2010-09-30 2012-05-17 Shibaura Mechatronics Corp 密閉型容器及び半導体製造装置
US9025019B2 (en) * 2010-10-18 2015-05-05 Rockwell Automation Technologies, Inc. Time of flight (TOF) sensors as replacement for standard photoelectric sensors
SG11201400958XA (en) * 2012-01-25 2014-04-28 Adept Technology Inc Autonomous mobile robot for handling job assignments in a physical environment inhabited by stationary and non-stationary obstacles
JP6087161B2 (ja) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
US10176625B2 (en) * 2014-09-25 2019-01-08 Faro Technologies, Inc. Augmented reality camera for use with 3D metrology equipment in forming 3D images from 2D camera images
US20180361585A1 (en) * 2015-01-06 2018-12-20 Discovery Robotics Robotic platform with multi-function service module
US10254749B2 (en) * 2015-03-27 2019-04-09 Rockwell Automation Technologies, Inc. Systems and methods for virtually tagging and securing industrial equipment
WO2017085762A1 (ja) * 2015-11-16 2017-05-26 オプテックス株式会社 レーザースキャンセンサ
CN108474731B (zh) * 2016-01-21 2021-09-21 东京毅力科创株式会社 异物检测装置和异物检测方法
US11226199B2 (en) * 2017-01-17 2022-01-18 Trimble Navigation Limited Point layout system using single laser transmitter
JP6789187B2 (ja) * 2017-07-07 2020-11-25 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
US11274929B1 (en) * 2017-10-17 2022-03-15 AI Incorporated Method for constructing a map while performing work
CN110137121B (zh) 2018-02-09 2024-03-26 东京毅力科创株式会社 基板处理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064300A (ja) * 2000-08-22 2002-02-28 Nikon Corp 基板処理装置
JP2019140379A (ja) * 2018-02-09 2019-08-22 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
CN112786434A (zh) 2021-05-11
CN112786434B (zh) 2025-09-12
US20210143033A1 (en) 2021-05-13
JP2021077759A (ja) 2021-05-20
TW202125587A (zh) 2021-07-01
KR20210056234A (ko) 2021-05-18
JP7365200B2 (ja) 2023-10-19
US12243758B2 (en) 2025-03-04

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