JP7365200B2 - 監視システム - Google Patents

監視システム Download PDF

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Publication number
JP7365200B2
JP7365200B2 JP2019202929A JP2019202929A JP7365200B2 JP 7365200 B2 JP7365200 B2 JP 7365200B2 JP 2019202929 A JP2019202929 A JP 2019202929A JP 2019202929 A JP2019202929 A JP 2019202929A JP 7365200 B2 JP7365200 B2 JP 7365200B2
Authority
JP
Japan
Prior art keywords
laser sensor
monitoring system
substrate processing
detection result
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019202929A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021077759A (ja
JP2021077759A5 (enExample
Inventor
翔太 金子
繁実 大野
典秀 相良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2019202929A priority Critical patent/JP7365200B2/ja
Priority to TW109137005A priority patent/TWI918613B/zh
Priority to KR1020200140103A priority patent/KR102840818B1/ko
Priority to CN202011180793.1A priority patent/CN112786434B/zh
Priority to US17/084,934 priority patent/US12243758B2/en
Publication of JP2021077759A publication Critical patent/JP2021077759A/ja
Publication of JP2021077759A5 publication Critical patent/JP2021077759A5/ja
Application granted granted Critical
Publication of JP7365200B2 publication Critical patent/JP7365200B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by monitoring or safety
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/188—Capturing isolated or intermittent images triggered by the occurrence of a predetermined event, e.g. an object reaching a predetermined position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Emergency Alarm Devices (AREA)
  • Alarm Systems (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2019202929A 2019-11-08 2019-11-08 監視システム Active JP7365200B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019202929A JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム
TW109137005A TWI918613B (zh) 2019-11-08 2020-10-26 監視系統
KR1020200140103A KR102840818B1 (ko) 2019-11-08 2020-10-27 감시 시스템
CN202011180793.1A CN112786434B (zh) 2019-11-08 2020-10-29 监视系统
US17/084,934 US12243758B2 (en) 2019-11-08 2020-10-30 Monitoring system for a sealing apparatus having a substrate treatment apparatus in a housing utilizing a laser sensor installed in a space between the housing and the substrate treatment apparatus and that scans a detection region therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019202929A JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム

Publications (3)

Publication Number Publication Date
JP2021077759A JP2021077759A (ja) 2021-05-20
JP2021077759A5 JP2021077759A5 (enExample) 2022-08-16
JP7365200B2 true JP7365200B2 (ja) 2023-10-19

Family

ID=75751021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019202929A Active JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム

Country Status (4)

Country Link
US (1) US12243758B2 (enExample)
JP (1) JP7365200B2 (enExample)
KR (1) KR102840818B1 (enExample)
CN (1) CN112786434B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024168431A (ja) 2023-05-24 2024-12-05 東京エレクトロン株式会社 基板処理装置、保守方法及び記憶媒体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326162A (ja) 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
JP2002064300A (ja) 2000-08-22 2002-02-28 Nikon Corp 基板処理装置
JP2003272847A (ja) 2002-03-20 2003-09-26 Seiko Epson Corp チャンバ装置、これを備えた電気光学装置および有機ｅｌ装置
US20190252223A1 (en) 2018-02-09 2019-08-15 Tokyo Electron Limited Substrate processing apparatus
JP2019140379A (ja) 2018-02-09 2019-08-22 東京エレクトロン株式会社 基板処理装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JPH1050800A (ja) * 1996-08-05 1998-02-20 Canon Sales Co Inc 処理装置
JPH10208170A (ja) * 1997-01-20 1998-08-07 Kyoshin Ryutsu Deberotsupaa Kk 自主警備及び在宅動静システム及びセンサ
JP2000069459A (ja) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd 監視システム
JP2003102858A (ja) * 2001-09-28 2003-04-08 Nohmi Bosai Ltd 閉鎖空間の防火システム
JP2007088485A (ja) 2001-12-25 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2005327917A (ja) * 2004-05-14 2005-11-24 Nikon Corp 光学式計測装置
US7816152B2 (en) * 2007-04-11 2010-10-19 WaferMaster, Inc. In situ, ex situ and inline process monitoring, optimization and fabrication
TWI411289B (zh) * 2009-03-31 2013-10-01 E Pin Optical Industry Co Ltd Ｕ形光程掃瞄成像方法及其影像掃瞄模組
JP2012094822A (ja) * 2010-09-30 2012-05-17 Shibaura Mechatronics Corp 密閉型容器及び半導体製造装置
US9025019B2 (en) * 2010-10-18 2015-05-05 Rockwell Automation Technologies, Inc. Time of flight (TOF) sensors as replacement for standard photoelectric sensors
SG11201400958XA (en) * 2012-01-25 2014-04-28 Adept Technology Inc Autonomous mobile robot for handling job assignments in a physical environment inhabited by stationary and non-stationary obstacles
JP6087161B2 (ja) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
US10176625B2 (en) * 2014-09-25 2019-01-08 Faro Technologies, Inc. Augmented reality camera for use with 3D metrology equipment in forming 3D images from 2D camera images
US20180361585A1 (en) * 2015-01-06 2018-12-20 Discovery Robotics Robotic platform with multi-function service module
US10254749B2 (en) * 2015-03-27 2019-04-09 Rockwell Automation Technologies, Inc. Systems and methods for virtually tagging and securing industrial equipment
WO2017085762A1 (ja) * 2015-11-16 2017-05-26 オプテックス株式会社 レーザースキャンセンサ
CN108474731B (zh) * 2016-01-21 2021-09-21 东京毅力科创株式会社 异物检测装置和异物检测方法
US11226199B2 (en) * 2017-01-17 2022-01-18 Trimble Navigation Limited Point layout system using single laser transmitter
JP6789187B2 (ja) * 2017-07-07 2020-11-25 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
US11274929B1 (en) * 2017-10-17 2022-03-15 AI Incorporated Method for constructing a map while performing work

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326162A (ja) 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
US20020006675A1 (en) 2000-05-17 2002-01-17 Toshiyuki Shigaraki Semiconductor manufacturing apparatus and method of manufacturing semiconductor devices
JP2002064300A (ja) 2000-08-22 2002-02-28 Nikon Corp 基板処理装置
JP2003272847A (ja) 2002-03-20 2003-09-26 Seiko Epson Corp チャンバ装置、これを備えた電気光学装置および有機ｅｌ装置
US20190252223A1 (en) 2018-02-09 2019-08-15 Tokyo Electron Limited Substrate processing apparatus
JP2019140379A (ja) 2018-02-09 2019-08-22 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
CN112786434A (zh) 2021-05-11
CN112786434B (zh) 2025-09-12
US20210143033A1 (en) 2021-05-13
JP2021077759A (ja) 2021-05-20
TW202125587A (zh) 2021-07-01
KR20210056234A (ko) 2021-05-18
KR102840818B1 (ko) 2025-08-01
US12243758B2 (en) 2025-03-04

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