JP2021077759A5 - - Google Patents

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Publication number
JP2021077759A5
JP2021077759A5 JP2019202929A JP2019202929A JP2021077759A5 JP 2021077759 A5 JP2021077759 A5 JP 2021077759A5 JP 2019202929 A JP2019202929 A JP 2019202929A JP 2019202929 A JP2019202929 A JP 2019202929A JP 2021077759 A5 JP2021077759 A5 JP 2021077759A5
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JP
Japan
Prior art keywords
monitoring system
outline
shows
flow chart
explanatory drawing
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JP2019202929A
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English (en)
Japanese (ja)
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JP2021077759A (ja
JP7365200B2 (ja
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Priority claimed from JP2019202929A external-priority patent/JP7365200B2/ja
Priority to JP2019202929A priority Critical patent/JP7365200B2/ja
Priority to TW109137005A priority patent/TWI918613B/zh
Priority to KR1020200140103A priority patent/KR102840818B1/ko
Priority to CN202011180793.1A priority patent/CN112786434B/zh
Priority to US17/084,934 priority patent/US12243758B2/en
Publication of JP2021077759A publication Critical patent/JP2021077759A/ja
Publication of JP2021077759A5 publication Critical patent/JP2021077759A5/ja
Publication of JP7365200B2 publication Critical patent/JP7365200B2/ja
Application granted granted Critical
Active legal-status Critical Current
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JP2019202929A 2019-11-08 2019-11-08 監視システム Active JP7365200B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019202929A JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム
TW109137005A TWI918613B (zh) 2019-11-08 2020-10-26 監視系統
KR1020200140103A KR102840818B1 (ko) 2019-11-08 2020-10-27 감시 시스템
CN202011180793.1A CN112786434B (zh) 2019-11-08 2020-10-29 监视系统
US17/084,934 US12243758B2 (en) 2019-11-08 2020-10-30 Monitoring system for a sealing apparatus having a substrate treatment apparatus in a housing utilizing a laser sensor installed in a space between the housing and the substrate treatment apparatus and that scans a detection region therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019202929A JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム

Publications (3)

Publication Number Publication Date
JP2021077759A JP2021077759A (ja) 2021-05-20
JP2021077759A5 true JP2021077759A5 (enExample) 2022-08-16
JP7365200B2 JP7365200B2 (ja) 2023-10-19

Family

ID=75751021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019202929A Active JP7365200B2 (ja) 2019-11-08 2019-11-08 監視システム

Country Status (4)

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US (1) US12243758B2 (enExample)
JP (1) JP7365200B2 (enExample)
KR (1) KR102840818B1 (enExample)
CN (1) CN112786434B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024168431A (ja) 2023-05-24 2024-12-05 東京エレクトロン株式会社 基板処理装置、保守方法及び記憶媒体

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JPH1050800A (ja) * 1996-08-05 1998-02-20 Canon Sales Co Inc 処理装置
JPH10208170A (ja) * 1997-01-20 1998-08-07 Kyoshin Ryutsu Deberotsupaa Kk 自主警備及び在宅動静システム及びセンサ
JP2000069459A (ja) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd 監視システム
JP2001326162A (ja) 2000-05-17 2001-11-22 Canon Inc 半導体製造装置および半導体デバイス製造方法
JP2002064300A (ja) 2000-08-22 2002-02-28 Nikon Corp 基板処理装置
JP2003102858A (ja) * 2001-09-28 2003-04-08 Nohmi Bosai Ltd 閉鎖空間の防火システム
JP2007088485A (ja) 2001-12-25 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP3979135B2 (ja) 2002-03-20 2007-09-19 セイコーエプソン株式会社 チャンバ装置、これを備えた電気光学装置および有機ｅｌ装置
JP2005327917A (ja) * 2004-05-14 2005-11-24 Nikon Corp 光学式計測装置
US7816152B2 (en) * 2007-04-11 2010-10-19 WaferMaster, Inc. In situ, ex situ and inline process monitoring, optimization and fabrication
TWI411289B (zh) * 2009-03-31 2013-10-01 E Pin Optical Industry Co Ltd Ｕ形光程掃瞄成像方法及其影像掃瞄模組
JP2012094822A (ja) * 2010-09-30 2012-05-17 Shibaura Mechatronics Corp 密閉型容器及び半導体製造装置
US9025019B2 (en) * 2010-10-18 2015-05-05 Rockwell Automation Technologies, Inc. Time of flight (TOF) sensors as replacement for standard photoelectric sensors
SG11201400958XA (en) * 2012-01-25 2014-04-28 Adept Technology Inc Autonomous mobile robot for handling job assignments in a physical environment inhabited by stationary and non-stationary obstacles
JP6087161B2 (ja) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
US10176625B2 (en) * 2014-09-25 2019-01-08 Faro Technologies, Inc. Augmented reality camera for use with 3D metrology equipment in forming 3D images from 2D camera images
US20180361585A1 (en) * 2015-01-06 2018-12-20 Discovery Robotics Robotic platform with multi-function service module
US10254749B2 (en) * 2015-03-27 2019-04-09 Rockwell Automation Technologies, Inc. Systems and methods for virtually tagging and securing industrial equipment
WO2017085762A1 (ja) * 2015-11-16 2017-05-26 オプテックス株式会社 レーザースキャンセンサ
CN108474731B (zh) * 2016-01-21 2021-09-21 东京毅力科创株式会社 异物检测装置和异物检测方法
US11226199B2 (en) * 2017-01-17 2022-01-18 Trimble Navigation Limited Point layout system using single laser transmitter
JP6789187B2 (ja) * 2017-07-07 2020-11-25 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
US11274929B1 (en) * 2017-10-17 2022-03-15 AI Incorporated Method for constructing a map while performing work
CN110137121B (zh) 2018-02-09 2024-03-26 东京毅力科创株式会社 基板处理装置
JP7358044B2 (ja) 2018-02-09 2023-10-10 東京エレクトロン株式会社 基板処理装置

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