KR102823944B1 - 도전성 페이스트, 전극 및 칩 저항기 - Google Patents

도전성 페이스트, 전극 및 칩 저항기 Download PDF

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Publication number
KR102823944B1
KR102823944B1 KR1020227026685A KR20227026685A KR102823944B1 KR 102823944 B1 KR102823944 B1 KR 102823944B1 KR 1020227026685 A KR1020227026685 A KR 1020227026685A KR 20227026685 A KR20227026685 A KR 20227026685A KR 102823944 B1 KR102823944 B1 KR 102823944B1
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KR
South Korea
Prior art keywords
conductive paste
electrode
weight
glass frit
present
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KR1020227026685A
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Korean (ko)
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KR20220123286A (ko
Inventor
요시아키 요시이
Original Assignee
나믹스 가부시끼가이샤
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Publication of KR20220123286A publication Critical patent/KR20220123286A/ko
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Publication of KR102823944B1 publication Critical patent/KR102823944B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
KR1020227026685A 2020-01-16 2021-01-07 도전성 페이스트, 전극 및 칩 저항기 Active KR102823944B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-005224 2020-01-16
JP2020005224 2020-01-16
PCT/JP2021/000345 WO2021145269A1 (ja) 2020-01-16 2021-01-07 導電性ペースト、電極及びチップ抵抗器

Publications (2)

Publication Number Publication Date
KR20220123286A KR20220123286A (ko) 2022-09-06
KR102823944B1 true KR102823944B1 (ko) 2025-06-24

Family

ID=76864627

Family Applications (1)

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KR1020227026685A Active KR102823944B1 (ko) 2020-01-16 2021-01-07 도전성 페이스트, 전극 및 칩 저항기

Country Status (5)

Country Link
JP (1) JP7687687B2 (https=)
KR (1) KR102823944B1 (https=)
CN (1) CN114930467B (https=)
TW (1) TWI857203B (https=)
WO (1) WO2021145269A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7335671B1 (ja) 2022-08-26 2023-08-30 ナミックス株式会社 導電性ペースト、電極、電子部品及び電子機器
CN119654687A (zh) 2022-08-26 2025-03-18 纳美仕有限公司 导电性糊剂、电极、电子部件及电子设备
WO2024042764A1 (ja) 2022-08-26 2024-02-29 ナミックス株式会社 導電性ペースト、電極、電子部品及び電子機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101002694B1 (ko) * 2009-11-09 2010-12-21 한수광 태양전지 전극용 페이스트
CN103177789A (zh) * 2011-12-20 2013-06-26 比亚迪股份有限公司 一种晶体硅太阳电池导电浆料及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428108A (ja) * 1990-05-23 1992-01-30 Asahi Chem Ind Co Ltd 銀系導電性ペースト並びに該ペーストを用いた導電体
JP2003115216A (ja) 2001-07-19 2003-04-18 Toray Ind Inc 導電ペースト
JP2005244119A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト及びこれを用いた抵抗体
JP4918994B2 (ja) * 2005-05-30 2012-04-18 住友電気工業株式会社 金属被膜の形成方法および金属配線
JP2007105723A (ja) 2005-09-14 2007-04-26 Mizushoo Kk 流体磁気処理装置及び磁石ユニット
WO2008078374A1 (ja) 2006-12-25 2008-07-03 Namics Corporation 太陽電池用導電性ペースト
JP5160813B2 (ja) * 2007-05-25 2013-03-13 パナソニック株式会社 導電性ペーストおよび基板
US8257619B2 (en) * 2008-04-18 2012-09-04 E I Du Pont De Nemours And Company Lead-free resistive composition
JP5426241B2 (ja) * 2009-06-10 2014-02-26 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー チップ抵抗器の表電極および裏電極
TWI552975B (zh) * 2011-10-25 2016-10-11 賀利氏貴金屬北美康舍霍肯有限責任公司 含有金屬奈米顆粒之導電膠組合物
US9034417B2 (en) * 2012-08-20 2015-05-19 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film conductor compositions
WO2014157958A1 (ko) 2013-03-27 2014-10-02 제일모직 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
JP6350127B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
JP2017041627A (ja) * 2015-08-17 2017-02-23 信越化学工業株式会社 導電性ペースト、その製造方法及びそれを用いた太陽電池電極
JP6396964B2 (ja) * 2015-09-29 2018-09-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法
US11183315B2 (en) * 2016-08-03 2021-11-23 Shoei Chemical Inc. Conductive paste
JP7132591B2 (ja) * 2018-03-28 2022-09-07 ナミックス株式会社 導電性ペースト及び焼成体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101002694B1 (ko) * 2009-11-09 2010-12-21 한수광 태양전지 전극용 페이스트
CN103177789A (zh) * 2011-12-20 2013-06-26 比亚迪股份有限公司 一种晶体硅太阳电池导电浆料及其制备方法

Also Published As

Publication number Publication date
TW202146592A (zh) 2021-12-16
JP7687687B2 (ja) 2025-06-03
CN114930467B (zh) 2025-11-11
TWI857203B (zh) 2024-10-01
CN114930467A (zh) 2022-08-19
WO2021145269A1 (ja) 2021-07-22
JPWO2021145269A1 (https=) 2021-07-22
KR20220123286A (ko) 2022-09-06

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