CN114930467B - 导电性膏、电极以及贴片电阻器 - Google Patents

导电性膏、电极以及贴片电阻器

Info

Publication number
CN114930467B
CN114930467B CN202180009442.0A CN202180009442A CN114930467B CN 114930467 B CN114930467 B CN 114930467B CN 202180009442 A CN202180009442 A CN 202180009442A CN 114930467 B CN114930467 B CN 114930467B
Authority
CN
China
Prior art keywords
electrode
conductive paste
alloy particles
weight
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180009442.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114930467A (zh
Inventor
吉井喜昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN114930467A publication Critical patent/CN114930467A/zh
Application granted granted Critical
Publication of CN114930467B publication Critical patent/CN114930467B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
CN202180009442.0A 2020-01-16 2021-01-07 导电性膏、电极以及贴片电阻器 Active CN114930467B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-005224 2020-01-16
JP2020005224 2020-01-16
PCT/JP2021/000345 WO2021145269A1 (ja) 2020-01-16 2021-01-07 導電性ペースト、電極及びチップ抵抗器

Publications (2)

Publication Number Publication Date
CN114930467A CN114930467A (zh) 2022-08-19
CN114930467B true CN114930467B (zh) 2025-11-11

Family

ID=76864627

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180009442.0A Active CN114930467B (zh) 2020-01-16 2021-01-07 导电性膏、电极以及贴片电阻器

Country Status (5)

Country Link
JP (1) JP7687687B2 (https=)
KR (1) KR102823944B1 (https=)
CN (1) CN114930467B (https=)
TW (1) TWI857203B (https=)
WO (1) WO2021145269A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7335671B1 (ja) 2022-08-26 2023-08-30 ナミックス株式会社 導電性ペースト、電極、電子部品及び電子機器
CN119654687A (zh) 2022-08-26 2025-03-18 纳美仕有限公司 导电性糊剂、电极、电子部件及电子设备
WO2024042764A1 (ja) 2022-08-26 2024-02-29 ナミックス株式会社 導電性ペースト、電極、電子部品及び電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244119A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト及びこれを用いた抵抗体
CN101990522A (zh) * 2008-04-18 2011-03-23 E.I.内穆尔杜邦公司 具有氧化钌的无铅电阻器组合物
CN103177789A (zh) * 2011-12-20 2013-06-26 比亚迪股份有限公司 一种晶体硅太阳电池导电浆料及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428108A (ja) * 1990-05-23 1992-01-30 Asahi Chem Ind Co Ltd 銀系導電性ペースト並びに該ペーストを用いた導電体
JP2003115216A (ja) 2001-07-19 2003-04-18 Toray Ind Inc 導電ペースト
JP4918994B2 (ja) * 2005-05-30 2012-04-18 住友電気工業株式会社 金属被膜の形成方法および金属配線
JP2007105723A (ja) 2005-09-14 2007-04-26 Mizushoo Kk 流体磁気処理装置及び磁石ユニット
WO2008078374A1 (ja) 2006-12-25 2008-07-03 Namics Corporation 太陽電池用導電性ペースト
JP5160813B2 (ja) * 2007-05-25 2013-03-13 パナソニック株式会社 導電性ペーストおよび基板
JP5426241B2 (ja) * 2009-06-10 2014-02-26 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー チップ抵抗器の表電極および裏電極
KR101002694B1 (ko) * 2009-11-09 2010-12-21 한수광 태양전지 전극용 페이스트
TWI552975B (zh) * 2011-10-25 2016-10-11 賀利氏貴金屬北美康舍霍肯有限責任公司 含有金屬奈米顆粒之導電膠組合物
US9034417B2 (en) * 2012-08-20 2015-05-19 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film conductor compositions
WO2014157958A1 (ko) 2013-03-27 2014-10-02 제일모직 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
JP6350127B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
JP2017041627A (ja) * 2015-08-17 2017-02-23 信越化学工業株式会社 導電性ペースト、その製造方法及びそれを用いた太陽電池電極
JP6396964B2 (ja) * 2015-09-29 2018-09-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法
US11183315B2 (en) * 2016-08-03 2021-11-23 Shoei Chemical Inc. Conductive paste
JP7132591B2 (ja) * 2018-03-28 2022-09-07 ナミックス株式会社 導電性ペースト及び焼成体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244119A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト及びこれを用いた抵抗体
CN101990522A (zh) * 2008-04-18 2011-03-23 E.I.内穆尔杜邦公司 具有氧化钌的无铅电阻器组合物
CN103177789A (zh) * 2011-12-20 2013-06-26 比亚迪股份有限公司 一种晶体硅太阳电池导电浆料及其制备方法

Also Published As

Publication number Publication date
TW202146592A (zh) 2021-12-16
JP7687687B2 (ja) 2025-06-03
TWI857203B (zh) 2024-10-01
CN114930467A (zh) 2022-08-19
WO2021145269A1 (ja) 2021-07-22
KR102823944B1 (ko) 2025-06-24
JPWO2021145269A1 (https=) 2021-07-22
KR20220123286A (ko) 2022-09-06

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