KR102820933B1 - 기판 처리 장치의 제조 프로세스 판정 장치, 기판 처리 시스템, 기판 처리 장치의 제조 프로세스 판정 방법, 학습 모델군, 학습 모델군의 생성 방법 및 프로그램 - Google Patents

기판 처리 장치의 제조 프로세스 판정 장치, 기판 처리 시스템, 기판 처리 장치의 제조 프로세스 판정 방법, 학습 모델군, 학습 모델군의 생성 방법 및 프로그램 Download PDF

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KR102820933B1
KR102820933B1 KR1020217003991A KR20217003991A KR102820933B1 KR 102820933 B1 KR102820933 B1 KR 102820933B1 KR 1020217003991 A KR1020217003991 A KR 1020217003991A KR 20217003991 A KR20217003991 A KR 20217003991A KR 102820933 B1 KR102820933 B1 KR 102820933B1
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가쓰지 하나다
유키 후지와라
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에스피피 테크놀로지스 컴퍼니 리미티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
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    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
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    • G06N3/0464—Convolutional networks [CNN, ConvNet]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting

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  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
KR1020217003991A 2019-03-04 2020-03-02 기판 처리 장치의 제조 프로세스 판정 장치, 기판 처리 시스템, 기판 처리 장치의 제조 프로세스 판정 방법, 학습 모델군, 학습 모델군의 생성 방법 및 프로그램 Active KR102820933B1 (ko)

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JPPCT/JP2019/008393 2019-03-04
PCT/JP2019/008393 WO2020178945A1 (ja) 2019-03-04 2019-03-04 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法及び学習モデル群
PCT/JP2020/008659 WO2020179729A1 (ja) 2019-03-04 2020-03-02 基板処理装置の製造プロセス判定装置、基板処理システム、基板処理装置の製造プロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム

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KR20210134298A KR20210134298A (ko) 2021-11-09
KR102820933B1 true KR102820933B1 (ko) 2025-06-16

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EP (1) EP3819930A4 (enExample)
JP (2) JP6696059B1 (enExample)
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CN (1) CN112655077B (enExample)
WO (2) WO2020178945A1 (enExample)

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JP7176143B2 (ja) * 2021-03-31 2022-11-21 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデル群、学習モデル群の生成方法及びプログラム
JP7041773B1 (ja) 2021-05-26 2022-03-24 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデルの生成方法及びプログラム
JP7041776B1 (ja) 2021-06-30 2022-03-24 Ｓｐｐテクノロジーズ株式会社 基板処理装置のプロセス判定装置、基板処理システム、基板処理装置のプロセス判定方法、学習モデルの生成方法及びプログラム
TW202310131A (zh) * 2021-08-24 2023-03-01 日商東京威力科創股份有限公司 基板處理裝置、模型資料產生裝置、基板處理方法、及模型資料產生方法
KR102673673B1 (ko) * 2021-12-09 2024-06-07 한국핵융합에너지연구원 Rf 신호를 이용한 플라즈마 상태 감지 장치 및 이를 이용한 플라즈마 상태 감지 방법
JP7750775B2 (ja) * 2022-03-02 2025-10-07 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
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WO2020178945A1 (ja) 2020-09-10
JP7504863B2 (ja) 2024-06-24
KR20210134298A (ko) 2021-11-09
JPWO2020178945A1 (ja) 2021-03-18
CN112655077B (zh) 2023-10-20
WO2020179729A1 (ja) 2020-09-10
EP3819930A4 (en) 2021-10-27
CN112655077A (zh) 2021-04-13
JP6696059B1 (ja) 2020-05-20
US20220114484A1 (en) 2022-04-14
EP3819930A1 (en) 2021-05-12
JPWO2020179729A1 (enExample) 2020-09-10

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