KR102812765B1 - 차아염소산 제4급 알킬 암모늄 용액 - Google Patents

차아염소산 제4급 알킬 암모늄 용액 Download PDF

Info

Publication number
KR102812765B1
KR102812765B1 KR1020247015510A KR20247015510A KR102812765B1 KR 102812765 B1 KR102812765 B1 KR 102812765B1 KR 1020247015510 A KR1020247015510 A KR 1020247015510A KR 20247015510 A KR20247015510 A KR 20247015510A KR 102812765 B1 KR102812765 B1 KR 102812765B1
Authority
KR
South Korea
Prior art keywords
solution
alkyl ammonium
quaternary alkyl
hypochlorite
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247015510A
Other languages
English (en)
Korean (ko)
Other versions
KR20240073135A (ko
Inventor
타카후 시모다
유키 킥카와
타카유키 네기시
세이지 토노
Original Assignee
가부시키가이샤 도쿠야마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도쿠야마 filed Critical 가부시키가이샤 도쿠야마
Publication of KR20240073135A publication Critical patent/KR20240073135A/ko
Application granted granted Critical
Publication of KR102812765B1 publication Critical patent/KR102812765B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B11/00—Oxides or oxyacids of halogens; Salts thereof
    • C01B11/04—Hypochlorous acid
    • C01B11/06—Hypochlorites
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C209/00—Preparation of compounds containing amino groups bound to a carbon skeleton
    • C07C209/68—Preparation of compounds containing amino groups bound to a carbon skeleton from amines, by reactions not involving amino groups, e.g. reduction of unsaturated amines, aromatisation, or substitution of the carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C209/00—Preparation of compounds containing amino groups bound to a carbon skeleton
    • C07C209/82—Purification; Separation; Stabilisation; Use of additives
    • C07C209/90—Stabilisation; Use of additives
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C211/00—Compounds containing amino groups bound to a carbon skeleton
    • C07C211/62—Quaternary ammonium compounds
    • C07C211/63—Quaternary ammonium compounds having quaternised nitrogen atoms bound to acyclic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • H01L21/02041—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020247015510A 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액 Active KR102812765B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2018099223 2018-05-23
JPJP-P-2018-099223 2018-05-23
JP2018099224 2018-05-23
JPJP-P-2018-099224 2018-05-23
JP2018116832 2018-06-20
JPJP-P-2018-116832 2018-06-20
PCT/JP2019/019898 WO2019225541A1 (ja) 2018-05-23 2019-05-20 次亜塩素酸第４級アルキルアンモニウム溶液、その製造方法および半導体ウエハの洗浄方法
KR1020207033481A KR102764031B1 (ko) 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 세정 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207033481A Division KR102764031B1 (ko) 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 세정 방법

Publications (2)

Publication Number Publication Date
KR20240073135A KR20240073135A (ko) 2024-05-24
KR102812765B1 true KR102812765B1 (ko) 2025-05-26

Family

ID=68616734

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247015510A Active KR102812765B1 (ko) 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액
KR1020207033481A Active KR102764031B1 (ko) 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 세정 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207033481A Active KR102764031B1 (ko) 2018-05-23 2019-05-20 차아염소산 제4급 알킬 암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 세정 방법

Country Status (7)

Country Link
US (1) US11572533B2 (https=)
EP (1) EP3798207A4 (https=)
JP (3) JP6982686B2 (https=)
KR (2) KR102812765B1 (https=)
CN (2) CN117567296A (https=)
TW (2) TWI818024B (https=)
WO (1) WO2019225541A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102769981B1 (ko) 2019-11-22 2025-02-18 가부시끼가이샤 도꾸야마 차아염소산 제 4 급 알킬암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 처리 방법
KR102582791B1 (ko) * 2020-02-25 2023-09-25 가부시끼가이샤 도꾸야마 루테늄의 반도체용 처리액
JP7031073B1 (ja) * 2020-04-17 2022-03-07 株式会社トクヤマ ハロゲン酸素酸溶液の製造方法
JP7797124B2 (ja) 2020-06-25 2026-01-13 株式会社トクヤマ ハロゲン酸素酸溶液の製造方法及び製造装置
WO2022024636A1 (ja) 2020-07-31 2022-02-03 富士フイルム株式会社 薬液、薬液収容体、基板の処理方法
CN112337419B (zh) * 2020-10-27 2022-05-13 浙江花蝶染料化工有限公司 一种4-(1-羟基-1-甲基乙基)-2-丙基咪唑-5-羧酸乙酯的制备方法
KR102352780B1 (ko) 2021-04-30 2022-01-18 김을환 차아염소산 및 그 이온을 포함하는 잔류염소 생성용 전극 및 이를 구비하는 차아염소산 및 그 이온을 포함하는 잔류염소 생성 장치
CN115916741B (zh) * 2021-06-07 2025-08-08 株式会社德山 卤素含氧酸的制造方法及其制造装置
WO2025143006A1 (ja) * 2023-12-28 2025-07-03 株式会社トクヤマ 次亜臭素酸第四級アルキルアンモニウム溶液の製造方法及び半導体ウエハの処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005227749A (ja) * 2004-02-11 2005-08-25 Mallinckrodt Baker Inc ハロゲン酸素酸、その塩及び誘導体含有、マイクロエレクトロニクス洗浄組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2256958A (en) * 1939-05-13 1941-09-23 Pittsburgh Plate Glass Co Quaternary ammonium hypohalites and method of making same
AU572896B2 (en) * 1983-11-09 1988-05-19 Sumitomo Chemical Company, Limited 2-phenylbenzotriazoles
JP3585437B2 (ja) 2000-11-22 2004-11-04 株式会社荏原製作所 ルテニウム膜のエッチング方法
JP2003119494A (ja) 2001-10-05 2003-04-23 Nec Corp 洗浄組成物およびこれを用いた洗浄方法と洗浄装置
JP2009081247A (ja) 2007-09-26 2009-04-16 Panasonic Corp ルテニウム膜のエッチング方法
JP5405129B2 (ja) * 2009-01-05 2014-02-05 三菱マテリアル株式会社 ペルフルオロアルキルスルホン酸塩の製造方法
WO2011102276A1 (ja) * 2010-02-22 2011-08-25 Jx日鉱日石金属株式会社 高純度スルホン酸銅水溶液及びその製造方法
WO2014034681A1 (ja) * 2012-08-31 2014-03-06 ライオン株式会社 ポリオキシエチレンアルキルエーテル硫酸塩の製造方法
JP2014062297A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 処理装置、処理液の製造方法、および電子デバイスの製造方法
JP5848690B2 (ja) 2012-11-26 2016-01-27 三洋化成工業株式会社 第四級塩溶液の製造方法
JP6401491B2 (ja) * 2013-08-28 2018-10-10 オルガノ株式会社 分離膜のスライム抑制方法、逆浸透膜またはナノろ過膜用スライム抑制剤組成物、および分離膜用スライム抑制剤組成物の製造方法
CN111684570B (zh) * 2018-01-16 2024-02-27 株式会社德山 含有次氯酸根离子的半导体晶圆的处理液
KR102769981B1 (ko) * 2019-11-22 2025-02-18 가부시끼가이샤 도꾸야마 차아염소산 제 4 급 알킬암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 처리 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005227749A (ja) * 2004-02-11 2005-08-25 Mallinckrodt Baker Inc ハロゲン酸素酸、その塩及び誘導体含有、マイクロエレクトロニクス洗浄組成物

Also Published As

Publication number Publication date
US20210309942A1 (en) 2021-10-07
WO2019225541A1 (ja) 2019-11-28
US11572533B2 (en) 2023-02-07
TW202400554A (zh) 2024-01-01
JP7480397B2 (ja) 2024-05-09
TWI876529B (zh) 2025-03-11
JP6982686B2 (ja) 2021-12-17
JP2023126263A (ja) 2023-09-07
JP2022003132A (ja) 2022-01-11
KR20240073135A (ko) 2024-05-24
JP7303268B2 (ja) 2023-07-04
TWI818024B (zh) 2023-10-11
CN117567296A (zh) 2024-02-20
KR102764031B1 (ko) 2025-02-07
JPWO2019225541A1 (ja) 2021-02-12
CN112189006B (zh) 2023-11-21
EP3798207A4 (en) 2022-03-23
TW202003446A (zh) 2020-01-16
KR20210015796A (ko) 2021-02-10
CN112189006A (zh) 2021-01-05
EP3798207A1 (en) 2021-03-31

Similar Documents

Publication Publication Date Title
KR102812765B1 (ko) 차아염소산 제4급 알킬 암모늄 용액
KR102769981B1 (ko) 차아염소산 제 4 급 알킬암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 처리 방법
JP7311477B2 (ja) 次亜塩素酸イオンを含む半導体ウェハの処理液
JP7797124B2 (ja) ハロゲン酸素酸溶液の製造方法及び製造装置
JP7819114B2 (ja) 半導体ウェハの処理液及びその製造方法
TWI798681B (zh) 鹵素含氧酸溶液之製造方法
WO2025143006A1 (ja) 次亜臭素酸第四級アルキルアンモニウム溶液の製造方法及び半導体ウエハの処理方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000