KR102812583B1 - 온 더 플라이 산란계측 오버레이 계측 타겟 - Google Patents
온 더 플라이 산란계측 오버레이 계측 타겟 Download PDFInfo
- Publication number
- KR102812583B1 KR102812583B1 KR1020237021572A KR20237021572A KR102812583B1 KR 102812583 B1 KR102812583 B1 KR 102812583B1 KR 1020237021572 A KR1020237021572 A KR 1020237021572A KR 20237021572 A KR20237021572 A KR 20237021572A KR 102812583 B1 KR102812583 B1 KR 102812583B1
- Authority
- KR
- South Korea
- Prior art keywords
- pattern elements
- sample
- overlay
- sample layer
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/119,536 US11378394B1 (en) | 2020-12-11 | 2020-12-11 | On-the-fly scatterometry overlay metrology target |
| US17/119,536 | 2020-12-11 | ||
| PCT/US2021/061296 WO2022125340A1 (en) | 2020-12-11 | 2021-11-30 | On-the-fly scatterometry overlay metrology target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230116841A KR20230116841A (ko) | 2023-08-04 |
| KR102812583B1 true KR102812583B1 (ko) | 2025-05-23 |
Family
ID=81942344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237021572A Active KR102812583B1 (ko) | 2020-12-11 | 2021-11-30 | 온 더 플라이 산란계측 오버레이 계측 타겟 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11378394B1 (https=) |
| EP (1) | EP4251980A4 (https=) |
| JP (1) | JP7569938B2 (https=) |
| KR (1) | KR102812583B1 (https=) |
| CN (1) | CN116583742A (https=) |
| TW (1) | TWI884321B (https=) |
| WO (1) | WO2022125340A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12032300B2 (en) | 2022-02-14 | 2024-07-09 | Kla Corporation | Imaging overlay with mutually coherent oblique illumination |
| US12422363B2 (en) | 2022-03-30 | 2025-09-23 | Kla Corporation | Scanning scatterometry overlay metrology |
| US12487190B2 (en) | 2022-03-30 | 2025-12-02 | Kla Corporation | System and method for isolation of specific fourier pupil frequency in overlay metrology |
| US12235588B2 (en) | 2023-02-16 | 2025-02-25 | Kla Corporation | Scanning overlay metrology with high signal to noise ratio |
| US12560548B2 (en) | 2023-09-06 | 2026-02-24 | Kla Corporation | Spectral angular metrology |
| US12373936B2 (en) | 2023-12-08 | 2025-07-29 | Kla Corporation | System and method for overlay metrology using a phase mask |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7068833B1 (en) | 2000-08-30 | 2006-06-27 | Kla-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
| US7541201B2 (en) | 2000-08-30 | 2009-06-02 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
| US20030002043A1 (en) | 2001-04-10 | 2003-01-02 | Kla-Tencor Corporation | Periodic patterns and technique to control misalignment |
| US7440105B2 (en) * | 2002-12-05 | 2008-10-21 | Kla-Tencor Technologies Corporation | Continuously varying offset mark and methods of determining overlay |
| WO2004053426A1 (en) * | 2002-12-05 | 2004-06-24 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| US7671990B1 (en) * | 2006-07-28 | 2010-03-02 | Kla-Tencor Technologies Corporation | Cross hatched metrology marks and associated method of use |
| KR101652133B1 (ko) * | 2008-09-29 | 2016-08-29 | 케이엘에이-텐코어 코오포레이션 | 계측 시스템의 조명 서브시스템들, 계측 시스템들 및 계측 측정들을 위한 표본을 조명하기 위한 방법들 |
| US9927718B2 (en) * | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| KR101185992B1 (ko) | 2011-01-03 | 2012-09-26 | 에스케이하이닉스 주식회사 | 오버레이 모니터링 패턴 및 이를 이용한 반도체 소자의 정렬도 측정방법 |
| EP3779598B1 (en) | 2011-04-06 | 2022-12-21 | Kla-Tencor Corporation | Method for providing a set of process tool correctables |
| US9709903B2 (en) * | 2011-11-01 | 2017-07-18 | Kla-Tencor Corporation | Overlay target geometry for measuring multiple pitches |
| NL2011816A (en) * | 2012-11-30 | 2014-06-04 | Asml Netherlands Bv | Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method. |
| US9885961B1 (en) * | 2013-05-29 | 2018-02-06 | Kla-Tencor Corporation | Partly disappearing targets |
| WO2014194095A1 (en) | 2013-05-30 | 2014-12-04 | Kla-Tencor Corporation | Combined imaging and scatterometry metrology |
| US9214317B2 (en) | 2013-06-04 | 2015-12-15 | Kla-Tencor Corporation | System and method of SEM overlay metrology |
| TWI648515B (zh) | 2013-11-15 | 2019-01-21 | 美商克萊譚克公司 | 計量目標及其計量量測、目標設計檔案、計量方法及以電腦為基礎之設備 |
| US9784690B2 (en) * | 2014-05-12 | 2017-10-10 | Kla-Tencor Corporation | Apparatus, techniques, and target designs for measuring semiconductor parameters |
| WO2015196168A1 (en) | 2014-06-21 | 2015-12-23 | Kla-Tencor Corporation | Compound imaging metrology targets |
| CN105511238B (zh) | 2014-09-26 | 2017-11-03 | 中芯国际集成电路制造(上海)有限公司 | 光刻对准标记结构及形成方法、半导体结构的形成方法 |
| WO2016078862A1 (en) | 2014-11-21 | 2016-05-26 | Asml Netherlands B.V. | Metrology method and apparatus |
| WO2017176314A1 (en) * | 2016-04-04 | 2017-10-12 | Kla-Tencor Corporation | Process compatibility improvement by fill factor modulation |
| CN109075090B (zh) | 2016-06-27 | 2020-11-06 | 科磊股份有限公司 | 用于测量图案放置及图案大小的设备及方法及其计算机程序 |
| US11248905B2 (en) * | 2017-08-16 | 2022-02-15 | Kla-Tencor Corporation | Machine learning in metrology measurements |
| US10705435B2 (en) | 2018-01-12 | 2020-07-07 | Globalfoundries Inc. | Self-referencing and self-calibrating interference pattern overlay measurement |
| KR102637420B1 (ko) * | 2019-03-25 | 2024-02-15 | 케이엘에이 코포레이션 | 계측에 사용하기 위한 개선된 자체 모아레 격자 설계 |
-
2020
- 2020-12-11 US US17/119,536 patent/US11378394B1/en active Active
-
2021
- 2021-10-04 TW TW110136808A patent/TWI884321B/zh active
- 2021-11-30 WO PCT/US2021/061296 patent/WO2022125340A1/en not_active Ceased
- 2021-11-30 KR KR1020237021572A patent/KR102812583B1/ko active Active
- 2021-11-30 JP JP2023534382A patent/JP7569938B2/ja active Active
- 2021-11-30 CN CN202180081102.9A patent/CN116583742A/zh active Pending
- 2021-11-30 EP EP21904129.0A patent/EP4251980A4/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116583742A (zh) | 2023-08-11 |
| US20220187062A1 (en) | 2022-06-16 |
| WO2022125340A1 (en) | 2022-06-16 |
| EP4251980A4 (en) | 2024-11-13 |
| KR20230116841A (ko) | 2023-08-04 |
| US11378394B1 (en) | 2022-07-05 |
| JP7569938B2 (ja) | 2024-10-18 |
| TW202240323A (zh) | 2022-10-16 |
| EP4251980A1 (en) | 2023-10-04 |
| TWI884321B (zh) | 2025-05-21 |
| JP2023553053A (ja) | 2023-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20230626 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20240829 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20241118 Patent event code: PE09021S01D |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20250327 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20250521 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20250521 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration |