CN116583742A - 实时散射叠加计量目标 - Google Patents

实时散射叠加计量目标 Download PDF

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Publication number
CN116583742A
CN116583742A CN202180081102.9A CN202180081102A CN116583742A CN 116583742 A CN116583742 A CN 116583742A CN 202180081102 A CN202180081102 A CN 202180081102A CN 116583742 A CN116583742 A CN 116583742A
Authority
CN
China
Prior art keywords
pattern elements
sample
overlay
metrology
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180081102.9A
Other languages
English (en)
Chinese (zh)
Inventor
Y·帕斯卡维尔
I·戈多尔
Y·卢巴舍夫斯基
V·莱温斯基
A·沃尔夫曼
Y·于齐耶尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN116583742A publication Critical patent/CN116583742A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202180081102.9A 2020-12-11 2021-11-30 实时散射叠加计量目标 Pending CN116583742A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/119,536 US11378394B1 (en) 2020-12-11 2020-12-11 On-the-fly scatterometry overlay metrology target
US17/119,536 2020-12-11
PCT/US2021/061296 WO2022125340A1 (en) 2020-12-11 2021-11-30 On-the-fly scatterometry overlay metrology target

Publications (1)

Publication Number Publication Date
CN116583742A true CN116583742A (zh) 2023-08-11

Family

ID=81942344

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081102.9A Pending CN116583742A (zh) 2020-12-11 2021-11-30 实时散射叠加计量目标

Country Status (7)

Country Link
US (1) US11378394B1 (https=)
EP (1) EP4251980A4 (https=)
JP (1) JP7569938B2 (https=)
KR (1) KR102812583B1 (https=)
CN (1) CN116583742A (https=)
TW (1) TWI884321B (https=)
WO (1) WO2022125340A1 (https=)

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* Cited by examiner, † Cited by third party
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US12032300B2 (en) 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio
US12560548B2 (en) 2023-09-06 2026-02-24 Kla Corporation Spectral angular metrology
US12373936B2 (en) 2023-12-08 2025-07-29 Kla Corporation System and method for overlay metrology using a phase mask

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US20050195398A1 (en) * 2002-12-05 2005-09-08 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
US20130107259A1 (en) * 2011-11-01 2013-05-02 Kla-Tencor Corporation Overlay target geometry for measuring multiple pitches
CN104823113A (zh) * 2012-11-30 2015-08-05 Asml荷兰有限公司 确定剂量和焦点的方法、检查设备、图案形成装置、衬底及器件制造方法
US20160146740A1 (en) * 2014-11-21 2016-05-26 Asml Netherlands B.V. Metrology method and apparatus
US20160179017A1 (en) * 2014-06-21 2016-06-23 Kla-Tencor Corporation Compound imaging metrology targets
WO2019035854A1 (en) * 2017-08-16 2019-02-21 Kla-Tencor Corporation MACHINE LEARNING IN RELATION TO METROLOGY MEASUREMENTS

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US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US20030002043A1 (en) 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
WO2004053426A1 (en) * 2002-12-05 2004-06-24 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7671990B1 (en) * 2006-07-28 2010-03-02 Kla-Tencor Technologies Corporation Cross hatched metrology marks and associated method of use
KR101652133B1 (ko) * 2008-09-29 2016-08-29 케이엘에이-텐코어 코오포레이션 계측 시스템의 조명 서브시스템들, 계측 시스템들 및 계측 측정들을 위한 표본을 조명하기 위한 방법들
US9927718B2 (en) * 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
KR101185992B1 (ko) 2011-01-03 2012-09-26 에스케이하이닉스 주식회사 오버레이 모니터링 패턴 및 이를 이용한 반도체 소자의 정렬도 측정방법
EP3779598B1 (en) 2011-04-06 2022-12-21 Kla-Tencor Corporation Method for providing a set of process tool correctables
US9885961B1 (en) * 2013-05-29 2018-02-06 Kla-Tencor Corporation Partly disappearing targets
WO2014194095A1 (en) 2013-05-30 2014-12-04 Kla-Tencor Corporation Combined imaging and scatterometry metrology
US9214317B2 (en) 2013-06-04 2015-12-15 Kla-Tencor Corporation System and method of SEM overlay metrology
TWI648515B (zh) 2013-11-15 2019-01-21 美商克萊譚克公司 計量目標及其計量量測、目標設計檔案、計量方法及以電腦為基礎之設備
US9784690B2 (en) * 2014-05-12 2017-10-10 Kla-Tencor Corporation Apparatus, techniques, and target designs for measuring semiconductor parameters
CN105511238B (zh) 2014-09-26 2017-11-03 中芯国际集成电路制造(上海)有限公司 光刻对准标记结构及形成方法、半导体结构的形成方法
WO2017176314A1 (en) * 2016-04-04 2017-10-12 Kla-Tencor Corporation Process compatibility improvement by fill factor modulation
CN109075090B (zh) 2016-06-27 2020-11-06 科磊股份有限公司 用于测量图案放置及图案大小的设备及方法及其计算机程序
US10705435B2 (en) 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
KR102637420B1 (ko) * 2019-03-25 2024-02-15 케이엘에이 코포레이션 계측에 사용하기 위한 개선된 자체 모아레 격자 설계

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050195398A1 (en) * 2002-12-05 2005-09-08 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
US20130107259A1 (en) * 2011-11-01 2013-05-02 Kla-Tencor Corporation Overlay target geometry for measuring multiple pitches
CN104823113A (zh) * 2012-11-30 2015-08-05 Asml荷兰有限公司 确定剂量和焦点的方法、检查设备、图案形成装置、衬底及器件制造方法
US20160179017A1 (en) * 2014-06-21 2016-06-23 Kla-Tencor Corporation Compound imaging metrology targets
US20160146740A1 (en) * 2014-11-21 2016-05-26 Asml Netherlands B.V. Metrology method and apparatus
WO2019035854A1 (en) * 2017-08-16 2019-02-21 Kla-Tencor Corporation MACHINE LEARNING IN RELATION TO METROLOGY MEASUREMENTS

Also Published As

Publication number Publication date
US20220187062A1 (en) 2022-06-16
WO2022125340A1 (en) 2022-06-16
EP4251980A4 (en) 2024-11-13
KR20230116841A (ko) 2023-08-04
US11378394B1 (en) 2022-07-05
JP7569938B2 (ja) 2024-10-18
TW202240323A (zh) 2022-10-16
KR102812583B1 (ko) 2025-05-23
EP4251980A1 (en) 2023-10-04
TWI884321B (zh) 2025-05-21
JP2023553053A (ja) 2023-12-20

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