KR102802574B1 - 패턴 에지 검출 방법 - Google Patents

패턴 에지 검출 방법 Download PDF

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KR102802574B1
KR102802574B1 KR1020207030084A KR20207030084A KR102802574B1 KR 102802574 B1 KR102802574 B1 KR 102802574B1 KR 1020207030084 A KR1020207030084 A KR 1020207030084A KR 20207030084 A KR20207030084 A KR 20207030084A KR 102802574 B1 KR102802574 B1 KR 102802574B1
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pattern
edge
image
edges
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KR20200135991A (ko
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마사히로 오야
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타스밋 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
    • G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/2431—Multiple classes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/401—Imaging image processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/50—Detectors
    • G01N2223/507—Detectors secondary-emission detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Computing Systems (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Quality & Reliability (AREA)
  • Databases & Information Systems (AREA)
  • Mathematical Physics (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020207030084A 2018-03-27 2019-03-04 패턴 에지 검출 방법 Active KR102802574B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018059802A JP6964031B2 (ja) 2018-03-27 2018-03-27 パターンエッジ検出方法
JPJP-P-2018-059802 2018-03-27
PCT/JP2019/008345 WO2019188009A1 (ja) 2018-03-27 2019-03-04 パターンエッジ検出方法

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KR20200135991A KR20200135991A (ko) 2020-12-04
KR102802574B1 true KR102802574B1 (ko) 2025-05-07

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US (1) US11436736B2 (https=)
JP (1) JP6964031B2 (https=)
KR (1) KR102802574B1 (https=)
CN (1) CN111902844B (https=)
TW (1) TWI798380B (https=)
WO (1) WO2019188009A1 (https=)

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US10522322B2 (en) 2017-04-13 2019-12-31 Fractilia, Llc System and method for generating and analyzing roughness measurements
US12142454B2 (en) 2017-04-13 2024-11-12 Fractilla, LLC Detection of probabilistic process windows
JP2020139905A (ja) * 2019-03-01 2020-09-03 セイコーエプソン株式会社 検査装置、検査方法、およびプログラム
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US12243237B2 (en) 2020-01-10 2025-03-04 Tasmit, Inc. Pattern-edge detection method, pattern-edge detection apparatus, and storage medium storing program for causing a computer to perform pattern-edge detection
US11416977B2 (en) * 2020-03-10 2022-08-16 Applied Materials, Inc. Self-measurement of semiconductor image using deep learning
WO2021192119A1 (ja) * 2020-03-25 2021-09-30 ソニーグループ株式会社 情報処理装置、プログラム、および方法
CA3078085A1 (en) * 2020-04-09 2021-10-09 Techinsights Inc. System and method for image segmentation from sparse particle impingement data
CN111612897B (zh) * 2020-06-05 2023-11-10 腾讯科技（深圳）有限公司 三维模型的融合方法、装置、设备及可读存储介质
JP7492389B2 (ja) * 2020-07-03 2024-05-29 株式会社ホロン 画像検査装置および画像検査方法
JP7690732B2 (ja) * 2020-12-23 2025-06-11 富士フイルムビジネスイノベーション株式会社 情報処理システム及びプログラム
TWI798650B (zh) * 2021-02-25 2023-04-11 環球晶圓股份有限公司 自動光學檢測方法、自動光學檢測系統及記錄媒體
JP7821013B2 (ja) * 2022-03-24 2026-02-26 株式会社Ｓｃｒｅｅｎホールディングス 検査システム、教師データ生成装置、教師データ生成方法およびプログラム
JP7711637B2 (ja) * 2022-06-15 2025-07-23 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ
DE102022118920A1 (de) * 2022-07-28 2024-02-08 Carl Zeiss Smt Gmbh Verfahren, Lithographiemaske, Verwendung einer Lithographiemaske und Bearbeitungsanordnung
KR20250034980A (ko) * 2022-09-08 2025-03-11 주식회사 히타치하이테크 치수 계측 시스템, 추정 시스템 및 치수 계측 방법
CN116168041B (zh) * 2023-04-26 2023-07-11 湖南隆深氢能科技有限公司 一种应用于贴合装置的实时检测方法及其系统

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Publication number Publication date
JP6964031B2 (ja) 2021-11-10
CN111902844B (zh) 2024-10-11
US11436736B2 (en) 2022-09-06
JP2019174940A (ja) 2019-10-10
US20210027473A1 (en) 2021-01-28
TWI798380B (zh) 2023-04-11
TW201942796A (zh) 2019-11-01
CN111902844A (zh) 2020-11-06
KR20200135991A (ko) 2020-12-04
WO2019188009A1 (ja) 2019-10-03

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