KR102800262B1 - 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 Download PDF

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Publication number
KR102800262B1
KR102800262B1 KR1020237031284A KR20237031284A KR102800262B1 KR 102800262 B1 KR102800262 B1 KR 102800262B1 KR 1020237031284 A KR1020237031284 A KR 1020237031284A KR 20237031284 A KR20237031284 A KR 20237031284A KR 102800262 B1 KR102800262 B1 KR 102800262B1
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KR
South Korea
Prior art keywords
sheet
vapor chamber
body surface
main body
wick
Prior art date
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Active
Application number
KR1020237031284A
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English (en)
Korean (ko)
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KR20230146587A (ko
Inventor
가즈노리 오다
다카유키 오타
신이치로 다카하시
도시히코 다케다
고헤이 오자와
히로시 고이
Original Assignee
다이니폰 인사츠 가부시키가이샤
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Priority to KR1020257012999A priority Critical patent/KR20250059546A/ko
Publication of KR20230146587A publication Critical patent/KR20230146587A/ko
Application granted granted Critical
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • H01L23/427
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
KR1020237031284A 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 Active KR102800262B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257012999A KR20250059546A (ko) 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2021-024532 2021-02-18
JP2021024553 2021-02-18
JPJP-P-2021-024553 2021-02-18
JP2021024532 2021-02-18
PCT/JP2022/006732 WO2022176985A1 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257012999A Division KR20250059546A (ko) 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Publications (2)

Publication Number Publication Date
KR20230146587A KR20230146587A (ko) 2023-10-19
KR102800262B1 true KR102800262B1 (ko) 2025-04-28

Family

ID=82930704

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237031284A Active KR102800262B1 (ko) 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
KR1020257012999A Pending KR20250059546A (ko) 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257012999A Pending KR20250059546A (ko) 2021-02-18 2022-02-18 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기

Country Status (5)

Country Link
US (1) US20240130081A1 (https=)
JP (2) JP7477039B2 (https=)
KR (2) KR102800262B1 (https=)
TW (2) TWI876132B (https=)
WO (1) WO2022176985A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4675213A1 (en) * 2023-02-28 2026-01-07 Kyocera Corporation Heat dissipation member and vapor chamber

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100065255A1 (en) * 2008-09-18 2010-03-18 Pegatron Corporation Vapor Chamber
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP4823994B2 (ja) 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2007266153A (ja) 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP5178274B2 (ja) 2008-03-26 2013-04-10 日本モレックス株式会社 ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP2010151352A (ja) * 2008-12-24 2010-07-08 Sony Corp 熱輸送デバイスの製造方法及び熱輸送デバイス
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
JP7206649B2 (ja) * 2018-06-29 2023-01-18 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
CN119812143A (zh) * 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
CN110779370A (zh) * 2019-12-06 2020-02-11 昆山联德电子科技有限公司 薄型均温板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100065255A1 (en) * 2008-09-18 2010-03-18 Pegatron Corporation Vapor Chamber
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure

Also Published As

Publication number Publication date
JP7816407B2 (ja) 2026-02-18
WO2022176985A1 (ja) 2022-08-25
JP2024096836A (ja) 2024-07-17
TWI876132B (zh) 2025-03-11
US20240130081A1 (en) 2024-04-18
JPWO2022176985A1 (https=) 2022-08-25
TW202238058A (zh) 2022-10-01
KR20250059546A (ko) 2025-05-02
TW202521909A (zh) 2025-06-01
KR20230146587A (ko) 2023-10-19
JP7477039B2 (ja) 2024-05-01

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