JP7477039B2 - ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 - Google Patents

ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Download PDF

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Publication number
JP7477039B2
JP7477039B2 JP2023500945A JP2023500945A JP7477039B2 JP 7477039 B2 JP7477039 B2 JP 7477039B2 JP 2023500945 A JP2023500945 A JP 2023500945A JP 2023500945 A JP2023500945 A JP 2023500945A JP 7477039 B2 JP7477039 B2 JP 7477039B2
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JP
Japan
Prior art keywords
sheet
main body
vapor chamber
body surface
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023500945A
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English (en)
Japanese (ja)
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JPWO2022176985A1 (https=
JPWO2022176985A5 (https=
Inventor
和範 小田
貴之 太田
伸一郎 高橋
利彦 武田
昂平 小澤
浩司 小井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JPWO2022176985A1 publication Critical patent/JPWO2022176985A1/ja
Publication of JPWO2022176985A5 publication Critical patent/JPWO2022176985A5/ja
Priority to JP2024062943A priority Critical patent/JP7816407B2/ja
Application granted granted Critical
Publication of JP7477039B2 publication Critical patent/JP7477039B2/ja
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
JP2023500945A 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Active JP7477039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024062943A JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021024553 2021-02-18
JP2021024532 2021-02-18
JP2021024553 2021-02-18
JP2021024532 2021-02-18
PCT/JP2022/006732 WO2022176985A1 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024062943A Division JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2022176985A1 JPWO2022176985A1 (https=) 2022-08-25
JPWO2022176985A5 JPWO2022176985A5 (https=) 2024-03-13
JP7477039B2 true JP7477039B2 (ja) 2024-05-01

Family

ID=82930704

Family Applications (2)

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JP2023500945A Active JP7477039B2 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
JP2024062943A Active JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024062943A Active JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Country Status (5)

Country Link
US (1) US20240130081A1 (https=)
JP (2) JP7477039B2 (https=)
KR (2) KR102800262B1 (https=)
TW (2) TWI876132B (https=)
WO (1) WO2022176985A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4675213A1 (en) * 2023-02-28 2026-01-07 Kyocera Corporation Heat dissipation member and vapor chamber

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266153A (ja) 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2009236362A (ja) 2008-03-26 2009-10-15 Fuchigami Micro:Kk ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
WO2020184620A1 (ja) 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP4823994B2 (ja) 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
JP2010151352A (ja) * 2008-12-24 2010-07-08 Sony Corp 熱輸送デバイスの製造方法及び熱輸送デバイス
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
CN110779370A (zh) * 2019-12-06 2020-02-11 昆山联德电子科技有限公司 薄型均温板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266153A (ja) 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2009236362A (ja) 2008-03-26 2009-10-15 Fuchigami Micro:Kk ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP2020003194A (ja) 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
WO2020184620A1 (ja) 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート

Also Published As

Publication number Publication date
JP7816407B2 (ja) 2026-02-18
WO2022176985A1 (ja) 2022-08-25
JP2024096836A (ja) 2024-07-17
TWI876132B (zh) 2025-03-11
US20240130081A1 (en) 2024-04-18
JPWO2022176985A1 (https=) 2022-08-25
TW202238058A (zh) 2022-10-01
KR20250059546A (ko) 2025-05-02
TW202521909A (zh) 2025-06-01
KR102800262B1 (ko) 2025-04-28
KR20230146587A (ko) 2023-10-19

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