JPWO2022176985A1 - - Google Patents

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Publication number
JPWO2022176985A1
JPWO2022176985A1 JP2023500945A JP2023500945A JPWO2022176985A1 JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1 JP 2023500945 A JP2023500945 A JP 2023500945A JP 2023500945 A JP2023500945 A JP 2023500945A JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023500945A
Other languages
Japanese (ja)
Other versions
JPWO2022176985A5 (https=
JP7477039B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176985A1 publication Critical patent/JPWO2022176985A1/ja
Publication of JPWO2022176985A5 publication Critical patent/JPWO2022176985A5/ja
Priority to JP2024062943A priority Critical patent/JP7816407B2/ja
Application granted granted Critical
Publication of JP7477039B2 publication Critical patent/JP7477039B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
JP2023500945A 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Active JP7477039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024062943A JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021024553 2021-02-18
JP2021024553 2021-02-18
JP2021024532 2021-02-18
JP2021024532 2021-02-18
PCT/JP2022/006732 WO2022176985A1 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024062943A Division JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2022176985A1 true JPWO2022176985A1 (https=) 2022-08-25
JPWO2022176985A5 JPWO2022176985A5 (https=) 2024-03-13
JP7477039B2 JP7477039B2 (ja) 2024-05-01

Family

ID=82930704

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023500945A Active JP7477039B2 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
JP2024062943A Active JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024062943A Active JP7816407B2 (ja) 2021-02-18 2024-04-09 ベーパーチャンバおよび電子機器

Country Status (5)

Country Link
US (1) US20240130081A1 (https=)
JP (2) JP7477039B2 (https=)
KR (2) KR20250059546A (https=)
TW (2) TW202521909A (https=)
WO (1) WO2022176985A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024181291A1 (ja) * 2023-02-28 2024-09-06 京セラ株式会社 放熱部材及びベイパーチャンバー

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2009236362A (ja) * 2008-03-26 2009-10-15 Fuchigami Micro:Kk ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP2020003194A (ja) * 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
WO2020184620A1 (ja) * 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4823994B2 (ja) 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
JP2010151352A (ja) * 2008-12-24 2010-07-08 Sony Corp 熱輸送デバイスの製造方法及び熱輸送デバイス
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
CN110779370A (zh) * 2019-12-06 2020-02-11 昆山联德电子科技有限公司 薄型均温板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP2009236362A (ja) * 2008-03-26 2009-10-15 Fuchigami Micro:Kk ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP2020003194A (ja) * 2018-06-29 2020-01-09 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
WO2020184620A1 (ja) * 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート

Also Published As

Publication number Publication date
KR20230146587A (ko) 2023-10-19
WO2022176985A1 (ja) 2022-08-25
TWI876132B (zh) 2025-03-11
TW202238058A (zh) 2022-10-01
US20240130081A1 (en) 2024-04-18
TW202521909A (zh) 2025-06-01
JP7816407B2 (ja) 2026-02-18
JP2024096836A (ja) 2024-07-17
KR20250059546A (ko) 2025-05-02
KR102800262B1 (ko) 2025-04-28
JP7477039B2 (ja) 2024-05-01

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