JPWO2022176985A1 - - Google Patents

Info

Publication number
JPWO2022176985A1
JPWO2022176985A1 JP2023500945A JP2023500945A JPWO2022176985A1 JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1 JP 2023500945 A JP2023500945 A JP 2023500945A JP 2023500945 A JP2023500945 A JP 2023500945A JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023500945A
Other versions
JP7477039B2 (ja
JPWO2022176985A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176985A1 publication Critical patent/JPWO2022176985A1/ja
Publication of JPWO2022176985A5 publication Critical patent/JPWO2022176985A5/ja
Priority to JP2024062943A priority Critical patent/JP2024096836A/ja
Application granted granted Critical
Publication of JP7477039B2 publication Critical patent/JP7477039B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023500945A 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 Active JP7477039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024062943A JP2024096836A (ja) 2021-02-18 2024-04-09 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021024532 2021-02-18
JP2021024553 2021-02-18
JP2021024532 2021-02-18
JP2021024553 2021-02-18
PCT/JP2022/006732 WO2022176985A1 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024062943A Division JP2024096836A (ja) 2021-02-18 2024-04-09 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2022176985A1 true JPWO2022176985A1 (ja) 2022-08-25
JPWO2022176985A5 JPWO2022176985A5 (ja) 2024-03-13
JP7477039B2 JP7477039B2 (ja) 2024-05-01

Family

ID=82930704

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023500945A Active JP7477039B2 (ja) 2021-02-18 2022-02-18 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
JP2024062943A Pending JP2024096836A (ja) 2021-02-18 2024-04-09 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024062943A Pending JP2024096836A (ja) 2021-02-18 2024-04-09 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器

Country Status (5)

Country Link
US (1) US20240130081A1 (ja)
JP (2) JP7477039B2 (ja)
KR (1) KR20230146587A (ja)
TW (1) TW202238058A (ja)
WO (1) WO2022176985A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024181291A1 (ja) * 2023-02-28 2024-09-06 京セラ株式会社 放熱部材及びベイパーチャンバー

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP4823994B2 (ja) 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP5178274B2 (ja) 2008-03-26 2013-04-10 日本モレックス株式会社 ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
JP7206649B2 (ja) 2018-06-29 2023-01-18 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
US20220120509A1 (en) 2019-03-11 2022-04-21 Dai Nippon Printing Co., Ltd. Vapor chamber, electronic device and sheet for vapor chamber

Also Published As

Publication number Publication date
TW202238058A (zh) 2022-10-01
WO2022176985A1 (ja) 2022-08-25
KR20230146587A (ko) 2023-10-19
JP7477039B2 (ja) 2024-05-01
US20240130081A1 (en) 2024-04-18
JP2024096836A (ja) 2024-07-17

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