JPWO2022176985A1 - - Google Patents
Info
- Publication number
- JPWO2022176985A1 JPWO2022176985A1 JP2023500945A JP2023500945A JPWO2022176985A1 JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1 JP 2023500945 A JP2023500945 A JP 2023500945A JP 2023500945 A JP2023500945 A JP 2023500945A JP WO2022176985 A1 JPWO2022176985 A1 JP WO2022176985A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2024062943A JP2024096836A (ja) | 2021-02-18 | 2024-04-09 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021024532 | 2021-02-18 | ||
JP2021024553 | 2021-02-18 | ||
JP2021024532 | 2021-02-18 | ||
JP2021024553 | 2021-02-18 | ||
PCT/JP2022/006732 WO2022176985A1 (ja) | 2021-02-18 | 2022-02-18 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024062943A Division JP2024096836A (ja) | 2021-02-18 | 2024-04-09 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022176985A1 true JPWO2022176985A1 (ja) | 2022-08-25 |
JPWO2022176985A5 JPWO2022176985A5 (ja) | 2024-03-13 |
JP7477039B2 JP7477039B2 (ja) | 2024-05-01 |
Family
ID=82930704
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023500945A Active JP7477039B2 (ja) | 2021-02-18 | 2022-02-18 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
JP2024062943A Pending JP2024096836A (ja) | 2021-02-18 | 2024-04-09 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024062943A Pending JP2024096836A (ja) | 2021-02-18 | 2024-04-09 | ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240130081A1 (ja) |
JP (2) | JP7477039B2 (ja) |
KR (1) | KR20230146587A (ja) |
TW (1) | TW202238058A (ja) |
WO (1) | WO2022176985A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024181291A1 (ja) * | 2023-02-28 | 2024-09-06 | 京セラ株式会社 | 放熱部材及びベイパーチャンバー |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10339591A (ja) * | 1997-06-10 | 1998-12-22 | Komatsu Ltd | ヒートパイプを利用した温度制御装置 |
JP4823994B2 (ja) | 2002-05-08 | 2011-11-24 | 古河電気工業株式会社 | 薄型シート状ヒートパイプ |
JP2007266153A (ja) * | 2006-03-28 | 2007-10-11 | Sony Corp | プレート型熱輸送装置及び電子機器 |
JP5178274B2 (ja) | 2008-03-26 | 2013-04-10 | 日本モレックス株式会社 | ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板 |
JP7206649B2 (ja) | 2018-06-29 | 2023-01-18 | 大日本印刷株式会社 | ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法 |
US20220120509A1 (en) | 2019-03-11 | 2022-04-21 | Dai Nippon Printing Co., Ltd. | Vapor chamber, electronic device and sheet for vapor chamber |
-
2022
- 2022-02-18 WO PCT/JP2022/006732 patent/WO2022176985A1/ja active Application Filing
- 2022-02-18 US US18/277,426 patent/US20240130081A1/en active Pending
- 2022-02-18 JP JP2023500945A patent/JP7477039B2/ja active Active
- 2022-02-18 KR KR1020237031284A patent/KR20230146587A/ko not_active Application Discontinuation
- 2022-02-18 TW TW111106097A patent/TW202238058A/zh unknown
-
2024
- 2024-04-09 JP JP2024062943A patent/JP2024096836A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TW202238058A (zh) | 2022-10-01 |
WO2022176985A1 (ja) | 2022-08-25 |
KR20230146587A (ko) | 2023-10-19 |
JP7477039B2 (ja) | 2024-05-01 |
US20240130081A1 (en) | 2024-04-18 |
JP2024096836A (ja) | 2024-07-17 |
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