KR102689455B1 - The Electro-conductive Contact Pin and Testing Device Having The Same - Google Patents

Abstract

The present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by providing an elastic portion at an end of the electrically conductive contact pin, and an inspection device including the same.

Description

Electrically conductive contact pin and testing device having the same {The Electro-conductive Contact Pin and Testing Device Having The Same}

The present invention relates to an electrically conductive contact pin and an inspection device having the same.

Figure 1 is a diagram schematically showing a probe card 1 according to the prior art.

In general, the probe card 1 includes a circuit board 2, a spatial converter 3 provided below the circuit board 2, and a probe head 7 provided below the spatial converter 3. do.

The probe head 7 includes guide plates 5 and 6 having a plurality of probe pins 7 and guide holes into which the probe pins 7 are inserted. The probe head 7 includes an upper guide plate 5 and a lower guide plate 6, and the upper guide plate 5 and lower guide plate 6 are fixedly installed through spacers. The probe pin 7 is a structure that elastically deforms between the upper guide plate 5 and the lower guide plate 6, and the vertical probe card 1 is formed by adopting the probe pin 7.

To test the electrical properties of a semiconductor device, the semiconductor wafer (W) is approached to the probe card (1) on which a plurality of probe pins (7) are formed, and each probe pin (7) is connected to a corresponding test object (semiconductor wafer (W)). This is performed by contacting the electrode pad (WP).

On the other hand, in recent LSI chip inspections, etc., there are cases where high-wave current flows. However, if a gap occurs between the probe pin (7) and the space converter (3) or between the probe pin (7) and the object to be inspected, a spark is generated, and the probe pin (7) and the connection object are damaged by the spark. Damage problems may occur.

Registration No. 10-1913355 Registered Patent Gazette

The present invention was made to solve the problems of the prior art described above. The present invention provides an electrically conductive contact that can prevent sparks from occurring by ensuring that at least one end of the electrically conductive contact pin is always in contact with the connection object. The purpose is to provide pins and inspection devices equipped with the same.

In addition, the present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by providing an elastic portion on at least one end of the electrically conductive contact pin, and an inspection device including the same. The purpose.

In order to achieve the object of the present invention, the inspection device according to the present invention includes an electrically conductive contact pin that has one end in contact with a connection pad of the inspection device and the other end in contact with a connection pad of the inspection object to inspect the inspection object; and a guide plate having a guide hole into which the electrically conductive contact pin is inserted; wherein, when the guide plate is installed on the inspection device side, the one end portion is compressed and deformed by being pressed by the connection pad of the inspection device. The one end is provided with an elastic portion between the guide plate and the connection pad of the inspection device so that the one end always remains in contact with the connection pad of the inspection device.

Additionally, the guide plate includes: an upper guide plate; and a lower guide plate provided to be spaced apart from the upper guide plate, wherein the electrically conductive contact pin is elastically deformed in a lateral direction between the upper guide plate and the lower guide plate.

In addition, the electrically conductive contact pin has a length in the longitudinal direction, a width in the transverse direction, and a thickness in a direction perpendicular to the longitudinal and transverse directions, and the thickness of one end including the elastic portion is greater than the thickness of the elastic portion excluding the elastic portion. It is equal to the thickness of the rest of the electrically conductive contact pins.

In addition, the elastic part is a closed elastic part that has an internal space penetrating in the thickness direction and is composed of a pillar part that entirely surrounds the internal space.

In addition, the elastic part is an open elastic part composed of a column part that has an internal space penetrating in the thickness direction and a top or side part is cut to partially surround the internal space.

Meanwhile, the electrically conductive contact pin according to the present invention is an electrically conductive contact pin that inspects the inspection object by having one end in contact with the connection pad of the inspection device and the other end in contact with the connection pad of the inspection object, wherein the electrically conductive contact pin With the pin installed on the inspection device side, the one end is compressed and deformed by being pressed by the connection pad of the inspection device, so that the one end is always in contact with the connection pad of the inspection device, and the one end is connected to the guide plate. An elastic portion is provided between connection pads of the inspection device.

Additionally, the one end portion is composed of a closed elastic portion provided with an internal space.

In addition, the one end portion is composed of a closed elastic portion provided with an internal space and a contact plane portion formed as a plane on the upper part of the elastic portion.

In addition, the one end is composed of an elastic part that has an internal space and has an upper part cut out to provide at least two contact areas.

In addition, the one end portion is composed of an elastic portion that has an internal space but is cut at the top to provide at least two contact portions, and a contact plane portion that is formed as a plane on the upper part of the elastic portion.

In addition, the one end is composed of an elastic portion with an internal space and a cut side.

In addition, the one end portion includes a locking protrusion formed larger than the size of the guide hole to prevent the one end portion from passing through the guide hole of the guide plate, and the elastic portion is located above the locking protrusion.

Additionally, the electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.

Additionally, the electrically conductive contact pin includes a fine trench provided on its side.

The present invention provides an electrically conductive contact pin that can prevent sparks from occurring by ensuring that at least one end of the electrically conductive contact pin is always in contact with a connection object, and an inspection device including the same.

In addition, the present invention provides an electrically conductive contact pin that prevents excessive pressure from being applied to a connection object in contact with the electrically conductive contact pin by providing an elastic portion on at least one end of the electrically conductive contact pin, and an inspection device including the same.

1 is a diagram schematically showing a probe card according to the prior art.
Figure 2 shows a probe head equipped with an electrically conductive contact pin according to a first preferred embodiment of the present invention.
Figure 3 is a diagram showing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
4 and 5 are views showing a modified example of the elastic portion of the electrically conductive contact pin according to the first preferred embodiment of the present invention.
Figure 6 is a diagram showing an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Figure 7 is a view showing a modified example of the elastic portion of an electrically conductive contact pin according to a second preferred embodiment of the present invention.
Figure 8 is a diagram showing an electrically conductive contact pin according to a third preferred embodiment of the present invention.
Figure 9 is a diagram showing an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
Figure 10 is a diagram showing an electrically conductive contact pin according to a fifth preferred embodiment of the present invention.
Figure 11 is a diagram showing an electrically conductive contact pin according to a sixth preferred embodiment of the present invention.
Figure 12 is a diagram for explaining a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention.
Figure 13 is a side view of an electrically conductive contact pin according to a preferred embodiment of the present invention.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-described purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective explanation of technical content. The form of the illustration may be modified depending on manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process. Technical terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “comprise” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, but are intended to indicate the presence of one or more other It should be understood that this does not exclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In describing various embodiments below, components that perform the same function will be given the same names and same reference numbers for convenience even if the embodiments are different. In addition, the configuration and operation already described in other embodiments will be omitted for convenience.

The electrically conductive contact pins according to each preferred embodiment of the present invention are provided in an inspection device to determine whether an inspection object is defective by applying electricity and are used to transmit an electrical signal by electrically and physically contacting the inspection object. It could be a contact pin. The inspection device may be an inspection device used in a semiconductor manufacturing process, and for example, it may be a probe card or a test socket. The electrically conductive contact pins may be probe pins provided on a probe card to inspect a semiconductor chip, or may be socket pins provided in a test socket for inspecting a packaged semiconductor package and inspected a semiconductor package.

Hereinafter, the first to sixth embodiments will be described separately, but embodiments that combine the components of each embodiment are also included in the preferred embodiment of the present invention.

The width direction of the electrically conductive contact pins described below is the ±x direction shown in the drawings, the length direction of the electrically conductive contact pins is the ±y direction shown in the drawings, and the thickness direction of the electrically conductive contact pins is the ±z direction shown in the drawings. am. The electrically conductive contact pin has an overall length dimension (L) in the longitudinal direction (±y direction), an overall thickness dimension (H) in a thickness direction perpendicular to the longitudinal direction (±z direction), and a vertical thickness dimension (H) in the longitudinal direction. It has an overall width dimension (W) in the width direction (±x direction).

Embodiment 1

Hereinafter, with reference to FIGS. 2 and 3, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention will be described.

The probe card according to a preferred embodiment of the present invention is used in an inspection process to inspect chips manufactured on a wafer during the semiconductor manufacturing process and is capable of responding to fine measurements. The probe card according to a preferred embodiment of the present invention is more useful for inspecting non-memory semiconductor chips such as microprocessors, microcontrollers, ASICs, etc.

A probe card according to a preferred embodiment of the present invention includes a spatial transducer (ST) having a connection pad (CP); Guide plates (GP1, FP2) provided below the space converter (ST) and spaced apart from the space converter (ST); and a probe pin 100 that is inserted and installed into the holes of the guide plates (GP1, GP2).

The guide plate includes an upper guide plate (GP1) and a lower guide plate (GP2) that is provided to be spaced apart from the upper guide plate (GP1). The electrically conductive contact pin 100 is inserted into the guide hole of the upper guide plate (GP1) and the guide hole of the lower guide plate (GP2). The electrically conductive contact pin 100 is elastically deformed in the lateral direction (x direction) between the upper guide plate (GP1) and the lower guide plate (GP2).

The pitch interval between the probe pins 100 installed on the guide plates (GP1, GP2) may be 50 ㎛ or more and 150 ㎛ or less, and the left and right widths of the probe pins 100 may be 40 ㎛ or more and 200 ㎛ or less, and the probe pins The thickness of (100) may be 40㎛ or more and 200㎛ or less.

One end of the electrically conductive contact pin 100 is connected to the connection pad (CP) of the inspection device (space transducer (ST)), and the other end of the electrically conductive contact pin 100 is connected to the connection pad of the inspection object. Here, the inspection object may be a semiconductor device.

The electrically conductive contact pin 100 has a length (L) in the longitudinal direction, a width (W) in the transverse direction, a thickness (H) in a direction perpendicular to the longitudinal and transverse directions, and an elastic portion (110a). The thickness (H) of one end including is the same as the thickness (H) of the rest of the electrically conductive contact pin 100 excluding the elastic portion (110a).

The electrically conductive contact pin 100 includes a body 150. The body 150 allows the electrically conductive contact pin 100 to be elastically deformed in the lateral direction and functions to form a current path between the connection objects (inspection device and object). Body 150 includes at least one curved portion 155. The body 150 can be deformed laterally through the configuration of the bent portion 155.

One end of the electrically conductive contact pin 100 is provided with an elastic portion 110a. More specifically, an elastic portion 110a is provided on one side of the body 150.

One end of the electrically conductive contact pin (100) is provided with an elastic portion (110a) between the guide plate (GP1) and the connection pad (CP) of the inspection device, thereby cushioning it when it comes into contact with the connection pad (CP) of the inspection device and With the conductive contact pin 100 installed on the inspection device side, one end is compressed and deformed by being pressed by the connection pad (CP) of the inspection device, so that one end always remains in contact with the connection pad (CP) of the inspection device. do.

The electrically conductive contact pin 100 is provided by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin 100. The plurality of metal layers includes a first metal layer 160 and a second metal layer 180. The first metal layer 160 is a metal with relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), and nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal with relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be.

The first metal layer 160 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160. For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of stacked layers consists of three or more layers. It can be.

The first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the elastic portion 110a. When the elastic portion 110a contacts the connection object, the first metal layer 160 and the second metal layer 180 come into contact with the connection object simultaneously, thereby ensuring high wear resistance and electrical conductivity at the contact area.

The body 150 of the electrically conductive contact pin 100 is sized to pass through the guide holes of the guide plates GP1 and GP2. The body 150 of the electrically conductive contact pin 100 has a square cross-sectional shape, and the guide holes of the guide plates GP1 and GP2 also have a square cross-sectional shape. Through this, after the electrically conductive contact pin 100 is inserted into the guide hole, the electrically conductive contact pin 100 does not rotate within the guide hole, so that the bending direction of the plurality of electrically conductive contact pins 100 remains constant. Make it possible.

At the lower part of the elastic portion 110a, a locking protrusion ( 130).

The locking protrusion 130 is provided to protrude in the width direction from at least one of both sides of the body 150 of the electrically conductive contact pin 100. The locking protrusion 130 is caught on the upper surface of the guide plate (more specifically, the upper guide plate (GP1)) to prevent the electrically conductive contact pin 100 from falling from the upper guide plate (GP1).

The multiple electrically conductive contact pins 100 have length differences due to errors in the manufacturing process, the flatness of the guide plates (GP1, GP2) and the spatial converter (ST) differ slightly, and the connection pads (CP) also have different lengths. There is bound to be a difference in height. Therefore, in order to ensure good electrical and mechanical contact for all electrically conductive contact pins 100, the electrically conductive contact pins 100 must be installed while being pressed toward the inspection device. In a state where the guide plates (GP1, GP2) on which the electrically conductive contact pins 100 are installed are installed on the inspection device side, the elastic portion 110a of the electrically conductive contact pins 100 is in close contact with the connection pad (CP) of the inspection device. and is compressed and deformed by pressure. Through this, the ends of all electrically conductive contact pins 100 are always kept in contact with the connection pad (CP) of the inspection device, thereby preventing sparks from occurring.

The elastic part 110a is a closed elastic part that has an internal space penetrating in the thickness direction and is composed of a pillar part that entirely surrounds the internal space. The closed elastic part is a structure that is elastically deformed when there is contact pressure with the connection object.

The elastic portion 110a has a circular or oval cross-sectional shape. The elastic part 110a is configured in the shape of a circular pillar in the thickness direction, so that it can be prevented from being damaged even when excessive contact pressure is applied. In addition, the first metal layer 160 and the second metal layer 180 are alternately provided on the pillar surface of the circular pillar, thereby ensuring high wear resistance and high electrical conductivity of the elastic portion 110a.

Looking at the assembly process of the probe card provided with the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention, first, the electrically conductive contact pin 100 is inserted into the guide plates (GP1, GP2) to install the probe head. Assemble. At this time, since the body 150 of the electrically conductive contact pin 100 is smaller than the guide hole, it passes through the guide hole and the locking protrusion 130 is caught on the upper surface of the upper guide plate GP1, causing the electrically conductive contact pin 100 to connect to the guide plate. It is not eliminated from (GP1, GP2). Next, fix the probe head to the spatial converter (ST) side. At this time, the elastic portion 110a of the electrically conductive contact pin 100 is in contact with the connection pad CP of the space converter ST, and the elastic portion 110a is elastically deformed. As the elastic portion 110a is elastically supported in contact with the connection object, one end of the plurality of electrically conductive contact pins 100 is always maintained in contact with the connection pad of the space transformer (ST). With the above assembly process completed, the inspection object is placed at the lower end of the electrically conductive contact pin 100 to inspect the inspection object.

4 and 5 are diagrams showing a modified example of the elastic portion 110a of the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention.

Referring to FIG. 4A, the elastic portion 110b shown in FIG. 4A is configured so that at least a portion of the internal space of the elastic portion 110b is provided at a position that overlaps the position of the locking protrusion 130. There is a difference from the configuration of the elastic portion 110a shown in 3. Through this, stress concentration can be prevented, thereby preventing damage due to deformation of the elastic portion 110d.

Referring to FIG. 4b, the elastic portion 110c shown in FIG. 4b is configured so that at least a portion of the internal space of the elastic portion 110c is provided at a position overlapping with the position of the locking protrusion 130, and the elastic It is different from the configuration of the elastic portion 110a shown in FIG. 3 in that it has a thick portion that makes the side surface of the portion 110c thicker. Through this, stress concentration can be prevented, thereby preventing damage due to deformation of the elastic portion 110d.

Referring to Figure 4c, the elastic part 110d shown in Figure 4c is different from the elastic part 110a shown in Figure 3 in that it is composed of a plurality of closed column parts. The cross-sectional shapes of the plurality of closed column parts may be the same or different from each other. Through this, stress concentration can be prevented, thereby preventing damage due to deformation of the elastic portion 110d.

Referring to FIG. 5A, the elastic portion 110e shown in FIG. 5A differs from the configuration of the elastic portion 110a shown in FIG. 3 in that the inner space is in the shape of a triangle and the shape of the closed pillar portion is triangular. There is.

Referring to FIG. 5B, the elastic portion 110f shown in FIG. 5B has an internal space in the shape of a diamond and the shape of the closed pillar portion is a diamond, which is the configuration of the elastic portion 110a shown in FIG. 3. There is a difference.

Referring to FIG. 5C, the elastic portion 110g shown in FIG. 5C differs from the configuration of the elastic portion 110a shown in FIG. 3 in that the internal space is in the form of a semicircle and the shape of the closed pillar portion is semicircular. There is.

The modification of the elastic portion 110a according to the first embodiment is not limited to the elastic portions 110b, 110c, 110d, 110e, 110f, and 110g of the modified examples described above, but is a closed elastic portion with an internal space. It can be said that everything that constitutes wealth is included.

Meanwhile, in the above description, one end provided with the elastic portion 110a is located on the inspection device side. However, as a modification, a configuration in which the elastic portion 110a is located on the inspection object side is also possible, and the elastic portion 110a A configuration in which the device is located on both sides of the inspection device and the inspection object is also possible.

In addition, although a probe card is shown as an example in FIG. 2, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is provided not only on the probe card but also on a test socket for inspecting a packaged semiconductor package to test the semiconductor package. It may be an electrically conductive contact pin 100 to be inspected.

Second embodiment

Next, we will look at the second embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 6, the electrically conductive contact pin 200 according to the second preferred embodiment of the present invention will be described. Figure 6 is a diagram showing an electrically conductive contact pin 200 according to a second preferred embodiment of the present invention.

The electrically conductive contact pin 200 according to the second preferred embodiment of the present invention has one end of a closed elastic portion 210a with an internal space and a contact plane portion composed of a flat surface on the upper part of the closed elastic portion 210. In that it is composed of (220), it is different from the configuration of the electrically conductive contact pin 100 according to the first embodiment without the contact plane portion 220.

The contact plane portion 220 provided on the upper part of the sealed elastic portion 210 is a portion that contacts the connection pad (CP) of the inspection device, which is the connection object, and is configured as a flat surface to improve connection reliability.

The closed elastic part 210 may be composed of the elastic parts 110a, 110b, 110c, 110d, 110e, 110f, and 110g according to the first preferred embodiment of the present invention described above.

As some examples, Figure 7 is a diagram showing a modified example of one end of the electrically conductive contact pin 200 according to the second preferred embodiment of the present invention. One end of the electrically conductive contact pin 200 shown in FIG. 7A has a contact plane portion 220 provided on the closed elastic portion 110e shown in FIG. 5A. One end of the electrically conductive contact pin 200 shown in FIG. 7B has a contact plane portion 220 on the upper part of the sealed elastic portion 110f shown in FIG. 5B. One end of the electrically conductive contact pin 200 shown in FIG. 7C has a structure in which a contact plane portion 220 is provided on the upper part of the sealed elastic portion 110g shown in FIG. 5C.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the closed elastic part 210 and the contact plane part 220. When the contact plane portion 220 is in contact with the connection object, the first metal layer 160 and the second metal layer 180 are simultaneously in contact with the connection object, thereby ensuring high wear resistance and electrical conductivity at the contact area.

Third embodiment

Next, we will look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 8, an electrically conductive contact pin 300 according to a third preferred embodiment of the present invention will be described. Figure 8 is a diagram showing an electrically conductive contact pin 300 according to a third preferred embodiment of the present invention.

The electrically conductive contact pin 300 according to the third preferred embodiment of the present invention is composed of an open elastic portion 310 having an internal space at one end and a cut at the top to provide at least two contact portions. In this respect, there is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment, which is composed of a closed elastic portion 110a.

The open elastic part 310 is provided with two elastic deformation parts having an arc-shaped cross section on both sides, thereby elastically deforming and forming at least two contact areas, thereby improving the reliability of the connection.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the open elastic portion 310 and the contact plane portion 220. When the open elastic portion 310 contacts the connection object, the first metal layer 160 and the second metal layer 180 are in contact with the connection object simultaneously, thereby ensuring high wear resistance and electrical conductivity at the contact area.

Embodiment 4

Next, we will look at the fourth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 9, the electrically conductive contact pin 400 according to the fourth preferred embodiment of the present invention will be described. Figure 9 is a diagram showing an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention.

The electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention includes an open elastic portion 410, one end of which has an internal space and the upper part is cut to provide at least two contact areas, and an open elastic portion. In that it is composed of a contact plane portion 420 composed of a plane on the upper part of the portion 410, the electrical conductivity according to the first embodiment is composed of a sealed elastic portion 110a and is not provided with the contact plane portion 420. There is a difference in the configuration of the contact pin 100.

The open elastic part 410 is provided with two elastic deformation parts having an arc-shaped cross section on both sides, and a contact plane part 420 is provided on the upper part of each elastic deformation part. Through this, the reliability of connection with the connection object is improved.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the open elastic portion 410 and the contact plane portion 420. When the contact plane portion 420 is in contact with the connection object, the first metal layer 160 and the second metal layer 180 are simultaneously in contact with the connection object, thereby ensuring high wear resistance and electrical conductivity at the contact area.

Embodiment 5

Next, we will look at the fifth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 10, the electrically conductive contact pin 500 according to the fifth preferred embodiment of the present invention will be described. Figure 10 is a diagram showing an electrically conductive contact pin 500 according to a fifth preferred embodiment of the present invention.

The electrically conductive contact pin 500 according to the fifth preferred embodiment of the present invention is composed of an open elastic portion that has an interior space penetrating in the thickness direction and a pillar portion that is cut at the side and partially surrounds the interior space. There is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment, which consists of a closed elastic portion 110a.

The electrically conductive contact pin 500 according to the fifth embodiment includes a tip 510, one end of which is in contact with the connection object, a proximal end 530 provided on the upper part of the body of the electrically conductive contact pin 500, and a tip ( 510 and the base end 530 are connected to each other to form an open elastic part consisting of a pillar part partially surrounding the internal space, including a connection part 520 that allows the tip part 510 to elastically contact the connection object.

The tip portion 510 is composed of a flat surface to improve the reliability of contact with the connection object.

The connection portion 520 is formed in a structure that can be elastically deformed when the connection object presses the tip portion 510, and may preferably be provided in an arc shape with a curvature.

The base end 530 includes a first base end 530a directly connected to the connection part 520, and a second base end 530b located on the opposite side of the connection part 520 and not directly connected to the connection part 520. It is composed. The first base end 530a is connected to the connection portion 520 and functions to support the connection portion 520, and may be configured as a flat surface. The first proximal end 530a is configured to protrude to the right of the body 150 of the electrically conductive contact pin 500, and the second proximal end 530b is configured to protrude to the left of the body 150 of the electrically conductive contact pin 500. The lower surfaces of each of the first base end 530a and the second base end 530b are supported on the upper surface of the upper guide plate GP1. Through this, the electrically conductive contact pin 500 is supported on the upper guide plate (GP1), thereby preventing the electrically conductive contact pin 500 from falling from the upper guide plate (GP1).

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the tip portion 510, the connection portion 520, and the proximal end portion 530. When the tip portion 510 contacts the connection object, the first metal layer 160 and the second metal layer 180 come into contact with the connection object simultaneously, thereby ensuring high wear resistance and electrical conductivity at the contact area.

Embodiment 6

Next, we will look at the sixth embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components that are the same or similar to the first embodiment will be omitted if possible.

Hereinafter, with reference to FIG. 11, the electrically conductive contact pin 600 according to the sixth preferred embodiment of the present invention will be described. Figure 11 is a diagram showing an electrically conductive contact pin 600 according to a sixth preferred embodiment of the present invention.

The electrically conductive contact pin 600 according to the sixth preferred embodiment of the present invention is composed of an open elastic portion that has an interior space penetrating in the thickness direction and a pillar portion that is cut at the side and partially surrounds the interior space. There is a difference from the configuration of the electrically conductive contact pin 100 according to the first embodiment, which consists of a closed elastic portion 110a.

The electrically conductive contact pin 600 according to the sixth embodiment is a cantilever having one end of the proximal end 630 provided on the upper part of the body 150, one end connected to the proximal end 630, and the other end being a free end. It constitutes an open elastic part consisting of a pillar part partially surrounding the internal space including the beam 610.

The base end 630 includes a portion protruding from one side of the body 150, and the protruding portion is supported on the upper surface of the upper guide plate (GP1) to prevent the electrically conductive contact pin 600 from falling off from the upper guide plate (GP1). It performs a blocking function to prevent it from happening.

The cantilever beam 610 is a structure that is elastically deformed when in contact with a connection object. One end of the cantilever beam 610 is connected to the base end 630 on one side of the base end 630 based on the width direction of the base end 630, and the other end is connected to the base end 630. It is constructed in a form that extends toward the other side of.

Meanwhile, the first metal layer 160 and the second metal layer 180 are formed not only on the body 150 but also on the base end 630 and the cantilever beam 610. When the cantilever beam 610 is in contact with the connection object, the first metal layer 160 and the second metal layer 180 are simultaneously in contact with the connection object, thereby ensuring high wear resistance and electrical conductivity at the contact area.

Manufacturing method

Hereinafter, a method of manufacturing the electrically conductive contact pins 100, 200, 300, 400, 500, and 600 according to preferred embodiments of the present invention will be described with reference to FIG. 12. However, the electrically conductive contact pin 100 shown in FIG. 12 is an illustration of the electrically conductive contact pin 100 according to the first embodiment, and the electrically conductive contact pins 200, 300, and 400 according to other embodiments. , 500, 600) are also manufactured by the same manufacturing method as the manufacturing method described below.

With reference to FIG. 12, a method of manufacturing the electrically conductive contact pin 100 according to a preferred embodiment of the present invention will be described.

FIG. 12A is a plan view of the mold M in which the etching space IH is formed, and FIG. 12B is a cross-sectional view taken along line A-A' of FIG. 8A. The mold (M) may be composed of an anodized film, photoresist, silicon wafer, or similar materials. However, the mold M according to a more preferred embodiment of the present invention may be made of an anodic oxide film material. Therefore, the electrically conductive contact pin 100 according to a preferred embodiment of the present invention has effects that are exhibited by being manufactured using a mold (M) made of an anodized film material in addition to the effects that are exhibited by structural advantages. Hereinafter, the preferred mold (M) will be described based on the mold (M) made of an anodized film material.

An anodic oxide film refers to a film formed by anodizing a base metal, and a pore refers to a hole formed in the process of anodizing a metal to form an anodic oxide film. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base material is anodized, an anodic oxide film made of aluminum oxide (Al ₂ 0 ₃ ) is formed on the surface of the base material. However, the base metal is not limited to this and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodic oxide film formed as above is a barrier layer in which no pores are formed vertically. It is divided into a porous layer with pores formed inside. When the base material is removed from a base material on which an anodic oxide film having a barrier layer and a porous layer is formed on the surface, only an anodic oxide film made of aluminum oxide (Al ₂ 0 ₃ ) remains. The anodic oxidation film may be formed in a structure that penetrates the top and bottom of the pore by removing the barrier layer formed during anodization, or may be formed in a structure that seals the top and bottom ends of the pore while the barrier layer formed during anodization remains intact.

The anodic oxide film has a thermal expansion coefficient of 2~3ppm/℃. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the production environment for the electrically conductive contact pin 100 is a high temperature environment, the electrically conductive contact pin 100 can be manufactured with precision without thermal deformation.

Since the electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using a mold (M) made of an anodized film material instead of the mold (M) made of photoresist material, the mold (M) made of photoresist material is It is possible to demonstrate the effect of realizing precise shapes and fine shapes, which had limitations in realizing them. In addition, in the case of a mold (M) made of an existing photoresist material, an electrically conductive contact pin with a thickness of about 40㎛ can be manufactured, but when a mold (M) made of an anodic oxide film is used, an electrically conductive contact pin with a thickness of 40㎛ or more to 200㎛ or less can be manufactured. It is possible to manufacture an electrically conductive contact pin 100.

A seed layer (SL) is provided on the lower surface of the mold (M). The seed layer SL may be provided on the lower surface of the mold M before forming the etching space IH in the mold M. Meanwhile, a support substrate (not shown) is formed at the bottom of the mold (M) to improve the handling of the mold (M). Also, in this case, the seed layer (SL) may be formed on the upper surface of the support substrate, and the mold (M) in which the etching space (IH) is formed may be used by combining the mold (M) with the support substrate. The seed layer SL may be made of copper (Cu) material and may be formed by a deposition method.

The etching space IH may be formed by wet etching a partial area of the mold M made of an anodized film. To this end, a photo resist is provided on the upper surface of the mold M and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form an etching space IH.

Next, an electroplating process is performed on the etching space (IH) of the mold (M) to form the electrically conductive contact pin 100. FIG. 12C is a plan view showing an electroplating process performed on the etching space IH, and FIG. 12D is a cross-sectional view taken along line A-A' of FIG. 12C.

Since the metal layer is formed while growing in the thickness direction of the mold (M), the shape of each cross section in the thickness direction of the electrically conductive contact pin 100 is the same. In addition, a plurality of metal layers are stacked in the thickness direction of the electrically conductive contact pin 100. The plurality of metal layers includes a first metal layer 160 and a second metal layer 180. The first metal layer 160 is a metal with relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), and nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 180 is a metal with relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be.

The first metal layer 160 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160. For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of stacked layers consists of three or more layers. It can be.

Meanwhile, after the plating process is completed, the first metal layer 160 and the second metal layer 180 can be made more dense by raising the temperature to a high temperature and applying pressure to press the metal layer on which the plating process has been completed. When using a photoresist material as the mold (M), the process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed. Differently, according to a preferred embodiment of the present invention, a mold M made of an anodized film is provided around the metal layer on which the plating process has been completed, so even if the temperature is raised to a high temperature, deformation is minimized due to the low thermal expansion coefficient of the anodized film. It is possible to densify the first metal layer 160 and the second metal layer 180. Therefore, it is possible to obtain a more dense first metal layer 160 and a second metal layer 180 compared to the technology using photoresist as the mold (M).

When the electroplating process is completed, a process to remove the mold (M) and the seed layer (SL) is performed. If the mold (M) is made of an anodic oxide film material, the mold (M) is removed using a solution that selectively reacts with the anodic oxide film material. Additionally, if the seed layer (SL) is made of copper (Cu), the seed layer (SL) is removed using a solution that selectively reacts with copper (Cu).

According to the technology of manufacturing pins by electroplating using photoresist as a mold (M), it is difficult to make the height of the mold (M) sufficiently high with only a single layer of photoresist. As a result, the thickness of the electrically conductive contact pin 100 cannot be sufficiently thick. Considering electrical conductivity, resilience, and brittle fracture, the electrically conductive contact pin 100 needs to be manufactured to a predetermined thickness or more. In order to increase the thickness of the electrically conductive contact pin 100, a mold (M) in which photoresist is stacked in multiple stages can be used. However, in this case, each layer of the photoresist sheet is slightly stepped, causing the problem that the side of the electrically conductive contact pin 100 is not formed vertically and a slightly stepped area remains. In addition, when photoresists are stacked in multiple stages, a problem arises in that it is difficult to precisely reproduce the shape of the electrically conductive contact pin 100 having a size range of several to tens of μm or less. In particular, the mold M made of photoresist material is provided with photoresist between its inner spaces. If the width of the photoresist provided between the inner spaces is less than 15㎛, the photoresist is not formed properly. In particular, when the height to width ratio is large, a problem occurs in which the standing state of the photoresist at the corresponding position is not properly maintained.

Referring to FIG. 13, the electrically conductive contact pin 100 according to a preferred embodiment of the present invention includes a fine trench 88 formed on its side. On the side of the electrically conductive contact pin 100, ridges and valleys with a depth of 20 nm or more and 1 μm or less are repeated along the side of the electrically conductive contact pin 100 in a direction perpendicular to the thickness direction of the electrically conductive contact pin 100. A fine trench 88 having a wrinkled shape is formed.

The fine trench 88 is formed to extend long from the side of the electrically conductive contact pin 100 in the thickness direction of the electrically conductive contact pin 100. In other words, the extension direction of the peaks and valleys of the micro trench 88 becomes the thickness direction of the electrically conductive contact pin 100. Here, the thickness direction of the electrically conductive contact pin 100 refers to the direction in which the metal filler grows during electroplating.

On the side of the plate-shaped plate constituting the electrically conductive contact pin 100, the micro trench 88 is formed in a wrinkled form in which peaks and valleys are repeated in a direction perpendicular to the thickness direction of the plate-shaped plate.

The fine trench 88 has a depth ranging from 20 nm to 1 μm, and its width also ranges from 20 nm to 1 μm. Here, since the fine trench 88 is caused by a pore formed during the manufacture of the anodic oxide mold (M), the width and depth of the fine trench 88 have values less than the range of the diameter of the pore of the anodic oxide mold (M). . Meanwhile, in the process of forming the etching space (IH) in the anodizing film mold (M), some of the pores of the anodizing film mold (M) are crushed by the etching solution, and the diameter of the pores formed during anodizing is larger than that of the pores. At least a portion of the fine trench 88 may be formed with a depth of .

The anodic oxide film mold (M) includes numerous pores, and at least a portion of the anodic oxide film mold (M) is etched to form an etching space (IH), and an electrically conductive contact pin (100) is formed by electroplating into the etching space (IH). ) is manufactured, the side of the electrically conductive contact pin 100 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold (M).

The fine trench 88 as described above has a wrinkled shape in which peaks and valleys with a depth of 20 nm or more and 1 ㎛ or less are repeated in the direction perpendicular to the thickness direction, so that the surface area on the side of the electrically conductive contact pin 100 can be increased. It has a possible effect. Through the configuration of the fine trench 88 formed on the side of the electrically conductive contact pin 100, the surface area through which the current flows according to the skin effect is increased, thereby increasing the density of the current flowing along the electrically conductive contact pin 100. can be increased to improve the electrical characteristics (particularly, high-frequency characteristics) of the electrically conductive contact pin 100. In addition, the configuration of the fine trench 88 allows the heat generated in the electrically conductive contact pin 100 to be quickly dissipated, thereby suppressing an increase in the temperature of the electrically conductive contact pin 100.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Alternatively, it can be carried out in modification.

100: electrically conductive contact pin 110a: elastic portion
130: Locking jaw 150: Body
155: Bend portion 160: First metal layer
180: second metal layer

Claims (14)

An electrically conductive contact pin that has one end in contact with the connection pad of the inspection device and the other end in contact with the connection pad of the inspection object to inspect the inspection object; and
Including a guide plate having a guide hole into which the electrically conductive contact pin is inserted,
In a state where the guide plate is installed on the inspection device side, the one end is compressed and deformed by being pressed by the connection pad of the inspection device, so that the one end is always maintained in contact with the connection pad of the inspection device. An elastic portion is provided between the plate and the connection pad of the inspection device,
The electrically conductive contact pin and the elastic portion include a first metal layer and a second metal layer that are stacked in the thickness direction,
The first metal layer is a metal with higher wear resistance than the second metal layer, and the second metal layer is a metal with higher electrical conductivity than the first metal layer,
The first metal layer and the second metal layer are simultaneously contacted with the inspection device, and the first metal layer and the second metal layer are simultaneously contacted with the inspection object.
According to paragraph 1,
The guide plate is,
upper guide plate; and
Including a lower guide plate provided to be spaced apart from the upper guide plate,
The electrically conductive contact pin is elastically deformed in the lateral direction between the upper guide plate and the lower guide plate.
According to paragraph 1,
The electrically conductive contact pin has a length in the longitudinal direction, a width in the transverse direction, and a thickness in a direction perpendicular to the longitudinal and transverse directions,
The thickness of one end including the elastic portion is the same as the thickness of the rest of the electrically conductive contact pin excluding the elastic portion.
According to paragraph 3,
The elastic part is a sealed elastic part that has an internal space penetrating in the thickness direction and is composed of a column part that entirely surrounds the internal space.
According to paragraph 3,
The elastic part is an open elastic part that has an internal space penetrating in the thickness direction and is composed of a pillar part that is cut at the top or side and partially surrounds the internal space.
In an electrically conductive contact pin that has one end in contact with the connection pad of an inspection device and the other end in contact with the connection pad of the inspection object to inspect the inspection object,
In a state where the electrically conductive contact pin is installed on the inspection device side, the one end portion is compressed and deformed by being pressed by the connection pad of the inspection device, so that the one end portion is always maintained in contact with the connection pad of the inspection device. An elastic portion is provided between the guide plate and the connection pad of the inspection device,
The electrically conductive contact pin and the elastic portion include a first metal layer and a second metal layer that are stacked in the thickness direction,
The first metal layer is a metal with higher wear resistance than the second metal layer, and the second metal layer is a metal with higher electrical conductivity than the first metal layer,
The first metal layer and the second metal layer are simultaneously in contact with an inspection device, and the first metal layer and the second metal layer are in simultaneous contact with an inspection object.
According to clause 6,
An electrically conductive contact pin, wherein the one end is comprised of a closed elastic portion with an internal space.
According to clause 6,
The one end portion is an electrically conductive contact pin composed of a sealed elastic portion provided with an internal space and a contact plane portion configured as a plane on an upper portion of the elastic portion.
According to clause 6,
An electrically conductive contact pin, wherein the one end is composed of an elastic portion having an internal space and an upper portion having at least two contact portions.
According to clause 6,
An electrically conductive contact pin, wherein the one end is composed of an elastic portion having an internal space and an upper portion having at least two contact portions, and a contact plane portion formed as a plane on the upper portion of the elastic portion.
According to clause 6,
An electrically conductive contact pin, wherein the one end is provided with an internal space and is composed of an elastic portion with a cut side.
According to clause 6,
The one end portion includes a locking protrusion larger than the size of the guide hole to prevent the one end portion from passing through the guide hole of the guide plate, and the elastic portion is located on an upper portion of the locking protrusion.
According to clause 6,
The electrically conductive contact pin is formed by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin.
According to clause 6,
The electrically conductive contact pin includes a fine trench provided on a side thereof.

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